MPC8308VMAFD

Freescale Semiconductor Document Number: MPC8308EC Rev. 3, 10/2011 MPC8308 PowerQUICC II Pro Processor Hardware Specification This document provides an overview of the MPC8308 features and its hardware specifications, including a block diagram showing the major functional components. The MPC8308 is a cost-effective, low-power, highly integrated host processor. The MPC8308 extends the PowerQUICC family, adding higher CPU performance, additional functionality, and faster interfaces while addressing the requirements related to time-to-market, price, power consumption, and package size. © Freescale Semiconductor, Inc., 2011. All rights reserved. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 2 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 6 Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . 8 DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Ethernet: Three-Speed Ethernet, MII Management . 15 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 25 PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Enhanced Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . 41 Enhanced Secure Digital Host Controller (eSDHC) . 44 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 59 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 System Design Information . . . . . . . . . . . . . . . . . . . 77 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 80 Document Revision History . . . . . . . . . . . . . . . . . . . 82 Overview 1 Overview This figure shows the major functional units within the MPC8308. The e300 core in the MPC8308, with its 16 Kbytes of instruction and 16 Kbytes of data cache, implements the Power Architecture user instruction set architecture and provides hardware and software debugging support. In addition, the MPC8308 offers a PCI Express controller, two three-speed 10, 100, 1000 Mbps Ethernet controllers (eTSEC), a DDR2 SDRAM memory controller, a SerDes block, an enhanced local bus controller (eLBC), an integrated programmable interrupt controller (IPIC), a general purpose DMA controller, two I2C controllers, dual UART (DUART), GPIOs, USB, general purpose timers, and an SPI controller. The high level of integration in the MPC8308 helps simplify board design and offers significant bandwidth and performance. This figure shows a block diagram of the device. e300c3 Core with Power Management DUART I2C Timers GPIO, SPI Enhanced Secure Digital Host Controller 16-Kbyte I-Cache Interrupt Controller 16-Kbyte D-Cache FPU DMA USB 2.0 HS Host/Device/OTG PCI Express x1 ULPI Enhanced Local Bus DDR2 Controller eTSEC1 eTSEC2 RGMII,MII RGMII,MII Figure 1. MPC8308 Block Diagram 2 Electrical Characteristics This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8308. The device is currently targeted to these specifications. Some of these specifications are independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer design specifications. 2.1 Overall DC Electrical Characteristics This section covers the ratings, conditions, and other characteristics. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 2 Freescale Semiconductor Electrical Characteristics 2.1.1 Absolute Maximum Ratings This table lists the absolute maximum ratings. Table 1. Absolute Maximum Ratings1 Characteristic Symbol Max Value Unit Notes Core supply voltage VDD –0.3 to 1.26 V — PLL supply voltage AVDD1, AVDD2 –0.3 to 1.26 V — DDR2 DRAM I/O voltage GVDD –0.3 to 1.9 V — Local bus, DUART, system control and power management, eSDHC, I2C, USB, Interrupt, Ethernet management, SPI, Miscellaneous and JTAG I/O voltage NVDD –0.3 to 3.6 V 7 SerDes PHY XCOREVDD, XPADVDD, SDAVDD –0.3 to 1.26 V — eTSEC I/O Voltage LVDD1, LVDD2 –0.3 to 2.75 or –0.3 to 3.6 V 6, 8 MVIN –0.3 to (GVDD + 0.3) V 2, 5 MVREF –0.3 to (GVDD + 0.3) V 2, 5 eTSEC LVIN –0.3 to (LVDD + 0.3) V 4, 5,8 Local bus, DUART, system control and power management, eSDHC, I2C, Interrupt, Ethernet management, SPI, Miscellaneous and JTAG I/O voltage OVIN –0.3 to (NVDD + 0.3) V 3, 5,7 TSTG –55 to 150 C — Input voltage DDR2 DRAM signals DDR2 DRAM reference Storage temperature range Notes: 1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device. 2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 3. Caution: OVIN must not exceed NVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 4. Caution: LVIN must not exceed LVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 5. (M, L, O)VIN and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2 6. The max value of supply voltage should be selected based on the RGMII mode. The lower range applies to RGMII mode. 7. NVDD here refers to NVDDA, NVDDB,NVDDG, NVDDH, NVDDJ, NVDDP_K from the ball map. 8. LVDD1 here refers to NVDDC and LVDD2 refers to NVDDF from the ball map 2.1.2 Power Supply Voltage Specification This table provides the recommended operating conditions for the device. Note that the values in this table are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 3 Electrical Characteristics Table 2. Recommended Operating Conditions Symbol Recommended Value1 Unit SerDes internal digital power XCOREVDD 1.0 V ± 50 mV V SerDes internal digital power XCOREVSS 0.0 V SerDes I/O digital power XPADVDD 1.0 V ± 50 mV V SerDes analog power for PLL SDAVDD 1.0 V ± 50 mV V SerDes analog power for PLL SDAVSS 0 V SerDes I/O digital power XPADVSS 0 V VDD 1.0 V ± 50 mV V Analog supply for e300 core APLL2 AVDD1 1.0 V ± 50 mV V Analog supply for system APLL2 AVDD2 1.0 V ± 50 mV V DDR2 DRAM I/O voltage GVDD 1.8 V ± 100 mV V Differential reference voltage for DDR controller MVREF GVDD/2 (0.49  GVDD to 0.51  GVDD) V Standard I/O voltage (Local bus, DUART, system control and power management, eSDHC, USB, I2C, Interrupt, Ethernet management, SPI, Miscellaneous and JTAG I/O voltage)3 NVDD 3.3 V ± 300 mV V LVDD1, LVDD2 2.5 V ± 125 mV 3.3 V ± 300 mV V VSS 0.0 V TA/TJ Standard = 0 to 105 Extended = -40 to 105 C Characteristic Core supply voltage eTSEC IO supply4,5 Analog and digital ground Operating temperature range6 Notes: 1 2 3 4 5 6 GVDD, NVDD, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or negative direction. This voltage is the input to the filter discussed in Section 23.2, “PLL Power Supply Filtering,” and not necessarily the voltage at the AVDD pin, which may be reduced from VDD by the filter. NVDD here refers to NVDDA, NVDDB,NVDDG, NVDDH, NVDDJ and NVDDP_K from the ball map. The max value of supply voltage should be selected based on the RGMII mode. The lower range applies to RGMII mode. LVDD1 here refers to NVDDC and LVDD2 refers to NVDDF from the ball map. Minimum temperature is specified with TA; Maximum temperature is specified with TJ. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 4 Freescale Semiconductor Electrical Characteristics This figure shows the undershoot and overshoot voltages at the interfaces of the device. G/L/NVDD + 20% G/L/NVDD + 5% G/L/NVDD VIH VSS VSS – 0.3 V VIL VSS – 0.7 V Not to Exceed 10% of tinterface1 Note: 1. tinterface refers to the clock period associated with the bus clock interface. Figure 2. Overshoot/Undershoot Voltage for GVDD/NVDD/LVDD 2.1.3 Output Driver Characteristics This table provides information on the characteristics of the output driver strengths. Table 3. Output Drive Capability Driver Type Output Impedance () Supply Voltage 42 NVDD = 3.3 V 18 GVDD = 1.8 V DUART, system control, I2C, JTAG, eSDHC, GPIO,SPI, USB 42 NVDD = 3.3 V eTSEC signals 42 LVDD = 2.5/3.3 V Local bus interface utilities signals DDR2 1 2.1.4 signals1 Output Impedance can also be adjusted through configurable options in DDR Control Driver Register (DDRCDR). For more information, see the MPC8308 PowerQUICC II Pro Processor Reference Manual. Power Sequencing It is required to apply the core supply voltage (VDD) before the I/O supply voltages (GVDD, LVDD, and NVDD) and assert PORESET before the power supplies fully ramp up. The core voltage supply must rise to 90% of its nominal value before the I/O supplies reach 0.7 V; see Figure 3. If this recommendation is not observed and I/O voltages are supplied before the core voltage, there might be a period of time that all input and output pins are actively driven and cause contention and excessive current. To overcome side effects of this condition, the application environment may require tuning of external pull-up or pull-down resistors on particular signals to lesser values. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 5 Power Characteristics The I/O power supply ramp-up slew rate should be slower than 4V/100 s, this requirement is for ESD circuit. Note that there is no specific power down sequence requirement for the device. I/O voltage supplies (GVDD, LVDD, and NVDD) do not have any ordering requirements with respect to one another. I/O Voltage (GVDD, LVDD, and NVDD) V Core Voltage (VDD) 0.7 V 90% t 0 PORESET >= 32  tSYS_CLK_IN Figure 3. Power-Up Sequencing Example 3 Power Characteristics The estimated typical power dissipation, not including I/O supply power for the device is shown in this table. Table 5 shows the estimated typical I/O power dissipation. Table 4. MPC8308 Power Dissipation1 Core Frequency (MHz) CSB Frequency (MHz) Typical2 Maximum 3 Unit 266 133 530 900 mW 333 133 565 950 mW 400 133 600 1000 mW Note: 1 The values do not include I/O supply power but do include core (VDD) and PLL (AVDD1, AVDD2, XCOREVDD, XPADVDD, and SDAVDD) 2 Typical power is based on best process, a voltage of V DD = 1.0 V and ambient temperature of TA = 25 C and an artificial smoker test. 3 Maximum power is estimated based on best process, a voltage of V DD = 1.05 V, a junction temperature of TJ = 105 C MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 6 Freescale Semiconductor Clock Input Timing This table describes a typical scenario where blocks with the stated percentage of utilization and impedances consume the amount of power described. 1 Table 5. MPC8308 Typical I/O Power Dissipation GVDD (1.8 V) NVDD (3.3 V) LVDD/ (3.3 V) LVDD (2.5 V) Unit Comments 250 MHz 32 bits+ECC 266 MHz 32 bits+ECC 0.302 — — — W — 62.5 MHz 66 MHZ — 0.038 0.040 — — W — MII, 25 MHz — — 0.008 — W 2 controllers RGMII, 125 MHz — — 0.078 0.044 W eSDHC IO Load = 40 pF 50 MHz — — 0.008 — W — USB IO Load = 20 pF 60 MHz — — 0.012 W — — — 0.017 — W — Interface Parameter DDR2 Rs = 22  Rt = 75  Local bus I/O load = 20 pF TSEC I/O load = 20 pF Other I/O 4 0.309 — Clock Input Timing This section provides the clock input DC and AC electrical characteristics for the device. 4.1 DC Electrical Characteristics This table provides the system clock input (SYS_CLK_IN) DC electrical specifications for the device. Table 6. SYS_CLK_IN DC Electrical Characteristics Parameter Condition Symbol Min Max Unit Input high voltage — VIH 2.4 NVDD + 0.3 V Input low voltage — VIL –0.3 0.4 V 0 V  VIN  NVDD IIN — ±10 A SYS_CLK_IN input current This table provides the RTC clock input (RTC_PIT_CLOCK) DC electrical specifications for the device. Table 7. RTC_PIT_CLOCK DC Electrical Characteristics Parameter 4.2 Condition Symbol Min Input high voltage — VIH 3.3 V – 400 mV Input low voltage — VIL 0 Max Unit V 0.4 V AC Electrical Characteristics The primary clock source for the device is SYS_CLK_IN. This table provides the system clock input (SYS_CLK_IN) AC timing specifications for the device. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 7 RESET Initialization Table 8. SYS_CLK_IN AC Timing Specifications Parameter/ Symbol Min Typ Max Unit Notes SYS_CLK_IN frequency fSYS_CLK_IN 24 — 66.67 MHz 1, 6 SYS_CLK_IN period tSYS_CLK_IN 15 — 41.67 ns — tKH, tKL 0.6 1.2 ns 2 tKHK/tSYS_CLK_IN 40 — 60 % 3 — — — ±150 ps 4, 5 SYS_CLK_IN rise and fall time SYS_CLK_IN duty cycle SYS_CLK_IN jitter Notes: 1. Caution: The system and core must not exceed their respective maximum or minimum operating frequencies. 2. Rise and fall times for SYS_CLK_IN are measured at 0.4 and 2.7 V. 3. Timing is guaranteed by design and characterization. 4. This represents the total input jitter—short term and long term—and is guaranteed by design. 5. The SYS_CLK_IN driver’s closed loop jitter bandwidth should be 1,000,000 baud 1 16 — 2 Oversample rate Notes: 1. Actual attainable baud rate is limited by the latency of interrupt processing. 2. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are sampled each 16th sample. 8 Ethernet: Three-Speed Ethernet, MII Management This section provides the AC and DC electrical characteristics for three-speed, 10/100/1000, and MII management. MPC8308 supports dual Ethernet controllers. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 15 Ethernet: Three-Speed Ethernet, MII Management 8.1 Enhanced Three-Speed Ethernet Controller (eTSEC) (10/100/1000 Mbps)—MII/RGMII Electrical Characteristics The electrical characteristics specified here apply to all the media independent interface (MII) and reduced gigabit media independent interface (RGMII), signals except management data input/output (MDIO) and management data clock (MDC). The RGMII interface is defined for 2.5 V, while the MII interface can be operated at 3.3 V. The RGMII interface follows the Hewlett-Packard reduced pin-count interface for Gigabit Ethernet Physical Layer Device Specification Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are specified in Section 8.3, “Ethernet Management Interface Electrical Characteristics.” 8.1.1 eTSEC DC Electrical Characteristics All MII and RGMII drivers and receivers comply with the DC parametric attributes specified in Table 21 and Table 22. The RGMII signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5. Table 21. MII DC Electrical Characteristics Parameter Symbol Conditions Min Max Unit Supply voltage 3.3 V LVDD — 3.0 3.6 V Output high voltage VOH IOH = –4.0 mA LVDD = Min 2.40 LVDD + 0.3 V Output low voltage VOL IOL = 4.0 mA LVDD= Min VSS 0.50 V Input high voltage VIH — — 2.1 LVDD + 0.3 V Input low voltage VIL — — –0.3 0.90 V Input high current IIH VIN = LVDD — 40 A Input low current IIL VIN 1 = VSS –600 — A 1 Note: 1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 16 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management Table 22. RGMII DC Electrical Characteristics Parameters Symbol Conditions Min Max Unit Supply voltage 2.5 V LVDD — 2.37 2.63 V Output high voltage VOH IOH = –1.0 mA LVDD = Min 2.00 LVDD + 0.3 V Output low voltage VOL IOL = 1.0 mA LVDD= Min VSS– 0.3 0.40 V Input high voltage VIH — LVDD = Min 1.7 LVDD + 0.3 V Input low voltage VIL — LVDD = Min –0.3 0.70 V Input high current IIH VIN 1 = LVDD — 15 A Input low current IIL VIN 1 = VSS –15 — A Note: 1. VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. 8.2 MII and RGMII AC Timing Specifications The AC timing specifications for MII and RGMII are presented in this section. 8.2.1 MII AC Timing Specifications This section describes the MII transmit and receive AC timing specifications. 8.2.1.1 MII Transmit AC Timing Specifications This table provides the MII transmit AC timing specifications. Table 23. MII Transmit AC Timing Specifications At recommended operating conditions with LVDDA/LVDDB /NVDD of 3.3 V ± 0.3V. Symbol 1 Min Typ Max Unit TX_CLK clock period 10 Mbps tMTX — 400 — ns TX_CLK clock period 100 Mbps tMTX — 40 — ns tMTXH/tMTX 35 — 65 % tMTKHDX 1 5 15 ns TX_CLK data clock rise VIL(min) to VIH(max) tMTXR 1.0 — 4.0 ns TX_CLK data clock fall VIH(max) to VIL(min) tMTXF 1.0 — 4.0 ns Parameter/Condition TX_CLK duty cycle TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 17 Ethernet: Three-Speed Ethernet, MII Management This figure shows the MII transmit AC timing diagram. tMTXR tMTX TX_CLK tMTXH tMTXF TXD[3:0] TX_EN TX_ER tMTKHDX Figure 8. MII Transmit AC Timing Diagram 8.2.1.2 MII Receive AC Timing Specifications This table provides the MII receive AC timing specifications. Table 24. MII Receive AC Timing Specifications At recommended operating conditions with LVDD /NVDD of 3.3 V ± 0.3V. Symbol 1 Min Typ Max Unit RX_CLK clock period 10 Mbps tMRX — 400 — ns RX_CLK clock period 100 Mbps tMRX — 40 — ns tMRXH/tMRX 35 — 65 % RXD[3:0], RX_DV, RX_ER setup time to RX_CLK tMRDVKH 10.0 — — ns RXD[3:0], RX_DV, RX_ER hold time to RX_CLK tMRDXKH 10.0 — — ns RX_CLK clock rise VIL(min) to VIH(max) tMRXR 1.0 — 4.0 ns RX_CLK clock fall time VIH(max) to VIL(min) tMRXF 1.0 — 4.0 ns Parameter/Condition RX_CLK duty cycle Note: 1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 18 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management This figure shows the MII receive AC timing diagram. tMRXR tMRX RX_CLK tMRXF tMRXH RXD[3:0] RX_DV RX_ER Valid Data tMRDVKH tMRDXKH Figure 9. MII Receive AC Timing Diagram RMII AC Timing Specifications This figure provides the AC test load. Z0 = 50  Output RL = 50  NVDD/2 or LVDD/2 Figure 10. AC Test Load 8.2.2 RGMII AC Timing Specifications This table presents the RGMII AC timing specifications. Table 25. RGMII AC Timing Specifications At recommended operating conditions with LVDD of 2.5 V ± 5%. Symbol 1 Min Typ Max Unit tSKRGT –0.6 — 0.6 ns tSKRGT 1.0 — 2.6 ns tRGT 7.2 8.0 8.8 ns tRGTH/tRGT 45 50 55 % tRGTH/tRGT 40 50 60 % Rise time (20%–80%) tRGTR — — 0.75 ns Fall time (20%–80%) tRGTF — — 0.75 ns Parameter/Condition Data to clock output skew (at transmitter) Data to clock input skew (at receiver) Clock cycle duration 2 3 Duty cycle for 1000Base-T 4, 5 Duty cycle for 10BASE-T and 100BASE-TX 3, 5 MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 19 Ethernet: Three-Speed Ethernet, MII Management Table 25. RGMII AC Timing Specifications (continued) At recommended operating conditions with LVDD of 2.5 V ± 5%. tG12 6 — 8.0 — ns tG125H/tG125 47 — 53 % GTX_CLK125 reference clock period GTX_CLK125 reference clock duty cycle Notes: 1. In general, the clock reference symbol representation for this section is based on the symbols RGT to represent RGMII timing. For example, the subscript of tRGT represents the RGMII receive (RX) clock. Note also that the notation for rise (R) and fall (F) times follows the clock symbol that is being represented. For symbols representing skews, the subscript is skew (SK) followed by the clock that is being skewed (RGT). 2. This implies that PC board design requires clocks to be routed such that an additional trace delay of greater than 1.5 ns is added to the associated clock signal. 3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively. 4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned between. 5. Duty cycle reference is 0.5*LVDD 6. This symbol is used to represent the external GTX_CLK125 and does not follow the original symbol naming convention. This figure shows the RGMII AC timing and multiplexing diagrams. tRGT tRGTH GTX_CLK (At Transmitter) tSKRGT TXD[8:5][3:0] TXD[7:4][3:0] TX_CTL TXD[3:0] TXD[8:5] TXD[7:4] TXD[4] TXEN TXD[9] TXERR tSKRGT TX_CLK (At PHY) RXD[8:5][3:0] RXD[7:4][3:0] RXD[8:5] RXD[3:0] RXD[7:4] tSKRGT RX_CTL RXD[4] RXDV RXD[9] RXERR tSKRGT RX_CLK (At PHY) Figure 11. RGMII AC Timing and Multiplexing Diagrams 8.3 Ethernet Management Interface Electrical Characteristics The electrical characteristics specified here apply to MII management interface signals MDIO (management data input/output) and MDC (management data clock). The electrical characteristics for MII MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 20 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management and RGMII are specified in Section 8.1, “Enhanced Three-Speed Ethernet Controller (eTSEC) (10/100/1000 Mbps)—MII/RGMII Electrical Characteristics.” 8.3.1 MII Management DC Electrical Characteristics The MDC and MDIO are defined to operate at a supply voltage of 3.3 V. This table provides the DC electrical characteristics for MDIO and MDC. Table 26. MII Management DC Electrical Characteristics When Powered at 3.3 V Parameter Symbol Conditions Min Max Unit Supply voltage (3.3 V) NVDD — 3.0 3.6 V Output high voltage VOH IOH = –1.0 mA NVDD = Min 2.10 NVDD + 0.3 V Output low voltage VOL IOL = 1.0 mA LVDD = Min VSS 0.50 V Input high voltage VIH — 2.0 — V Input low voltage VIL — — 0.80 V Input high current IIH NVDD = Max VIN 1 = 2.1 V — 40 A Input low current IIL NVDD = Max VIN = 0.5 V –600 — A Note: 1. VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. 8.3.2 MII Management AC Electrical Specifications This table provides the MII management AC timing specifications. Table 27. MII Management AC Timing Specifications At recommended operating conditions with LVDDA/LVDDB is 3.3 V ± 0.3V Symbol 1 Min Typ Max Unit Notes MDC frequency fMDC — 2.5 — MHz 2 MDC period tMDC — 400 — ns — MDC clock pulse width high tMDCH 32 — — ns — MDC to MDIO delay tMDKHDX 10 — 170 ns 3 MDIO to MDC setup time tMDDVKH 5 — — ns — MDIO to MDC hold time tMDDXKH 0 — — ns — tMDCR — — 10 ns — Parameter/Condition MDC rise time MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 21 Ethernet: Three-Speed Ethernet, MII Management Table 27. MII Management AC Timing Specifications (continued) At recommended operating conditions with LVDDA/LVDDB is 3.3 V ± 0.3V Parameter/Condition MDC fall time Symbol 1 Min Typ Max Unit Notes tMDHF — — 10 ns — Notes: 1. The symbols used for timing specifications Follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX symbolizes management data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are invalid (X) or data hold time. Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data input signals (D) reach the valid state (V) relative to the tMDC clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. This parameter is dependent on the csb_clk speed. (The MIIMCFG[Mgmt Clock Select] field determines the clock frequency of the Mgmt Clock EC_MDC.) 3. This parameter is dependent on the cbs_clk speed (that is, for a csb_clk of 133 MHz, the delay is 60 ns). This figure shows the MII management AC timing diagram. tMDCR tMDC MDC tMDCF tMDCH MDIO (Input) tMDDVKH tMDDXKH MDIO (Output) tMDKHDX Figure 12. MII Management Interface Timing Diagram 8.4 IEEE Std 1588™ Timer Specifications This section describes the DC and AC electrical specifications for the 1588 timer. 8.4.1 IEEE 1588 Timer DC Specifications This table provides the IEEE 1588 timer DC specifications. Table 28. GPIO DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –8.0 mA 2.4 — V Output low voltage VOL IOL = 8.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V Input high voltage VIH — 2.0 NVDD + 0.3 V MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 22 Freescale Semiconductor USB Table 28. GPIO DC Electrical Characteristics (continued) Characteristic Symbol Condition Min Max Unit Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V VIN NVDD — ±5 A 8.4.2 IEEE 1588 Timer AC Specifications This table provides the IEEE 1588 timer AC specifications. Table 29. IEEE 1588 Timer AC Specifications Parameter Symbol Min Max Unit Notes Timer clock cycle time tTMRCK 0 70 MHz 1 Input setup to timer clock tTMRCKS — — — 2, 3 Input hold from timer clock tTMRCKH — — — 2, 3 Output clock to output valid tGCLKNV 0 6 ns — Timer alarm to output valid tTMRAL — — — 2 Note: 1. The timer can operate on rtc_clock or tmr_clock. These clocks get muxed and any one of them can be selected. 2. Asynchronous signals. 3. Inputs need to be stable at least one TMR clock. 9 9.1 USB USB Dual-Role Controllers This section provides the AC and DC electrical specifications for the USB-ULPI interface. 9.1.1 USB DC Electrical Characteristics This table lists the DC electrical characteristics for the USB interface. Table 30. USB DC Electrical Characteristics Parameter Symbol Min Max Unit High-level input voltage VIH 2 LVDD + 0.3 V Low-level input voltage VIL –0.3 0.8 V Input current IIN — ±5 A High-level output voltage, IOH = –100 A VOH LVDD – 0.2 — V Low-level output voltage, IOL = 100 A VOL — 0.2 V Note: 1. The symbol VIN, in this case, represents the NVIN symbol referenced in Table 1 and Table 2. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 23 USB 9.1.2 USB AC Electrical Specifications This table lists the general timing parameters of the USB-ULPI interface. Table 31. USB General Timing Parameters Symbol 1 Min Max Unit Notes tUSCK 15 — ns 1, 2 Input setup to USB clock—all inputs tUSIVKH 4 — ns 1, 4 Input hold to USB clock—all inputs tUSIXKH 1 — ns 1, 4 USB clock to output valid—all outputs tUSKHOV — 9 ns 1 Output hold from USB clock—all outputs tUSKHOX 1 — ns 1 Parameter USB clock cycle time Notes: 1. The symbols used for timing specifications follow the pattern of t(First two letters of functional block)(signal)(state)(reference)(state) for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tUSIXKH symbolizes usb timing (US) for the input (I) to go invalid (X) with respect to the time the usb clock reference (K) goes high (H). Also, tUSKHOX symbolizes usb timing (US) for the usb clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time. 2. All timings are in reference to USB clock. 3. All signals are measured from NVDD/2 of the rising edge of USB clock to 0.4  NVDD of the signal in question for 3.3-V signaling levels. 4. Input timings are measured at the pin. 5. For purposes of active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. The following two figures provide the AC test load and signals for the USB, respectively. Z0 = 50  Output RL = 50  NVDD/2 Figure 13. USB AC Test Load USBDR_CLK tUSIVKH tUSIXKH Input Signals tUSKHOV tUSKHOX Output Signals Figure 14. USB Signals MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 24 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) 10 High-Speed Serial Interfaces (HSSI) This section describes the common portion of SerDes DC electrical specifications, which is the DC requirement for SerDes reference clocks. The SerDes data lane’s transmitter and receiver reference circuits are also shown. 10.1 Signal Terms Definition The SerDes utilizes differential signaling to transfer data across the serial link. This section defines terms used in the description and specification of differential signals. Figure 15 shows how the signals are defined. For illustration purpose, only one SerDes lane is used for description. The figure shows waveform for either a transmitter output (TXn and TXn) or a receiver input (RXn and RXn). Each signal swings between A Volts and B Volts where A > B. Using this waveform, the definitions are as follows. To simplify illustration, the following definitions assume that the SerDes transmitter and receiver operate in a fully symmetrical differential signaling environment. • Single-Ended Swing The transmitter output signals and the receiver input signals TXn, TXn, RXn, and RXn each have a peak-to-peak swing of A – B Volts. This is also referred as each signal wire’s single-ended swing. • Differential Output Voltage, VOD (or Differential Output Swing) The differential output voltage (or swing) of the transmitter, VOD, is defined as the difference of the two complimentary output voltages: VTXn – VTXn. The VOD value can be either positive or negative. • Differential Input Voltage, VID (or Differential Input Swing) The differential input voltage (or swing) of the receiver, VID, is defined as the difference of the two complimentary input voltages: VRXn – VRXn. The VID value can be either positive or negative. • Differential Peak Voltage, VDIFFp The peak value of the differential transmitter output signal or the differential receiver input signal is defined as Differential Peak Voltage, VDIFFp = |A – B| Volts. • Differential Peak-to-Peak, VDIFFp-p Since the differential output signal of the transmitter and the differential input signal of the receiver each range from A – B to –(A – B) Volts, the peak-to-peak value of the differential transmitter output signal or the differential receiver input signal is defined as differential peak-to-peak voltage, VDIFFp-p = 2*VDIFFp = 2 * |(A – B)| Volts, which is twice of differential swing in amplitude, or twice of the differential peak. For example, the output differential peak-peak voltage can also be calculated as VTX-DIFFp-p = 2*|VOD|. • Differential Waveform The differential waveform is constructed by subtracting the inverting signal (for example, TXn) from the non-inverting signal (for example, TXn) within a differential pair. There is only one signal trace curve in a differential waveform. The voltage represented in the differential waveform is not referenced to ground. Refer to Figure 24 as an example for differential waveform. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 25 High-Speed Serial Interfaces (HSSI) • Common Mode Voltage, Vcm The common mode voltage is equal to one-half of the sum of the voltages between each conductor of a balanced interchange circuit and ground. In this example, for SerDes output, Vcm_out = (VTXn + VTXn)/2 = (A + B) / 2, which is the arithmetic mean of the two complimentary output voltages within a differential pair. In a system, the common mode voltage may often differ from one component’s output to the other’s input. Sometimes, it may be even different between the receiver input and driver output circuits within the same component. It is also referred as the DC offset in some occasion. TXn or RXn A Volts Vcm = (A + B) / 2 TXn or RXn B Volts Differential Swing, VID or VOD = A – B Differential Peak Voltage, VDIFFp = |A – B| Differential Peak-Peak Voltage, VDIFFpp = 2*VDIFFp (not shown) Figure 15. Differential Voltage Definitions for Transmitter or Receiver To illustrate these definitions using real values, consider the case of a current mode logic (CML) transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing that goes between 2.5 V and 2.0 V. Using these values, the peak-to-peak voltage swing of each signal (TD or TD) is 500 mV p-p, which is referred as the single-ended swing for each signal. In this example, since the differential signaling environment is fully symmetrical, the transmitter output’s differential swing (VOD) has the same amplitude as each signal’s single-ended swing. The differential output signal ranges between 500 mV and –500 mV, in other words, VOD is 500 mV in one phase and –500 mV in the other phase. The peak differential voltage (VDIFFp) is 500 mV. The peak-to-peak differential voltage (VDIFFp-p) is 1000 mV p-p. 10.2 SerDes Reference Clocks The SerDes reference clock inputs are applied to an internal PLL whose output creates the clock used by the corresponding SerDes lanes. The SerDes reference clocks input is SD_REF_CLK and SD_REF_CLK for PCI Express. The following sections describe the SerDes reference clock requirements and some application information. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 26 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) 10.2.1 SerDes Reference Clock Receiver Characteristics Figure 16 shows a receiver reference diagram of the SerDes reference clocks. • The supply voltage requirements for XCOREVDD are specified in Table 1 and Table 2. • SerDes reference clock receiver reference circuit structure — The SD_REF_CLK and SD_REF_CLK are internally AC-coupled differential inputs as shown in Figure 16. Each differential clock input (SD_REF_CLK or SD_REF_CLK) has a 50- termination to XCOREVSS followed by on-chip AC-coupling. — The external reference clock driver must be able to drive this termination. — The SerDes reference clock input can be either differential or single-ended. Refer to the Differential Mode and Single-ended Mode description below for further detailed requirements. • The maximum average current requirement that also determines the common mode voltage range — When the SerDes reference clock differential inputs are DC coupled externally with the clock driver chip, the maximum average current allowed for each input pin is 8mA. In this case, the exact common mode input voltage is not critical as long as it is within the range allowed by the maximum average current of 8 mA (refer to the following bullet for more detail), since the input is AC-coupled on-chip. — This current limitation sets the maximum common mode input voltage to be less than 0.4 V (0.4 V/50 = 8 mA) while the minimum common mode input level is 0.1 V above XCOREVSS. For example, a clock with a 50/50 duty cycle can be produced by a clock driver with output driven by its current source from 0mA to 16mA (0–0.8 V), such that each phase of the differential input has a single-ended swing from 0 V to 800 mV with the common mode voltage at 400mV. — If the device driving the SD_REF_CLK and SD_REF_CLK inputs cannot drive 50  to XCOREVSS DC, or it exceeds the maximum input current limitations, then it must be AC-coupled off-chip. • The input amplitude requirement — This requirement is described in detail in the following sections. 50  SD_REF_CLK Input Amp SD_REF_CLK 50  Figure 16. Receiver of SerDes Reference Clocks MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 27 High-Speed Serial Interfaces (HSSI) 10.2.2 DC Level Requirement for SerDes Reference Clocks The DC level requirement for the MPC8308 SerDes reference clock inputs is different depending on the signaling mode used to connect the clock driver chip and SerDes reference clock inputs as described below. • Differential Mode — The input amplitude of the differential clock must be between 400 mV and 1600 mV differential peak-peak (or between 200 mV and 800 mV differential peak). In other words, each signal wire of the differential pair must have a single-ended swing less than 800 mV and greater than 200 mV. This requirement is the same for both external DC-coupled or AC-coupled connection. — For external DC-coupled connection, as described in Section 10.2.1, “SerDes Reference Clock Receiver Characteristics,” the maximum average current requirements sets the requirement for average voltage (common mode voltage) to be between 100 mV and 400 mV. Figure 17 shows the SerDes reference clock input requirement for DC-coupled connection scheme. — For external AC-coupled connection, there is no common mode voltage requirement for the clock driver. Since the external AC-coupling capacitor blocks the DC level, the clock driver and the SerDes reference clock receiver operate in different command mode voltages. The SerDes reference clock receiver in this connection scheme has its common mode voltage set to XCOREVSS. Each signal wire of the differential inputs is allowed to swing below and above the common mode voltage (XCOREVSS). Figure 18 shows the SerDes reference clock input requirement for AC-coupled connection scheme. • Single-ended Mode — The reference clock can also be single-ended. The SD_REF_CLK input amplitude (single-ended swing) must be between 400 mV and 800 mV peak-peak (from Vmin to Vmax) with SD_REF_CLK either left unconnected or tied to ground. — The SD_REF_CLK input average voltage must be between 200 and 400 mV. Figure 19 shows the SerDes reference clock input requirement for single-ended signaling mode. — To meet the input amplitude requirement, the reference clock inputs might need to be DC or AC-coupled externally. For the best noise performance, the reference of the clock could be DC or AC-coupled into the unused phase (SD_REF_CLK) through the same source impedance as the clock input (SD_REF_CLK) in use. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 28 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) 200 mV < Input Amplitude or Differential Peak < 800mV SD_REF_CLK Vmax < 80 0mV 100 mV < Vcm < 400 mV Vmin > 0 V SD_REF_CLK Figure 17. Differential Reference Clock Input DC Requirements (External DC-Coupled) 200mV < Input Amplitude or Differential Peak < 800mV SD_REF_CLK Vmax < Vcm + 400 mV Vcm Vmin > Vcm – 400 mV SD_REF_CLK Figure 18. Differential Reference Clock Input DC Requirements (External AC-Coupled) 400 mV < SD_REF_CLK Input Amplitude < 800 mV SD_REF_CLK 0V SD_REF_CLK Figure 19. Single-Ended Reference Clock Input DC Requirements 10.2.3 Interfacing with Other Differential Signaling Levels With on-chip termination to XCOREVSS, the differential reference clocks inputs are high-speed current steering logic (HCSL) compatible and DC coupled. Many other low voltage differential type outputs like low-voltage differential signaling (LVDS) can be used but may need to be AC-coupled due to the limited common mode input range allowed (100–400 mV) for DC-coupled connection. LVPECL outputs can produce signal with too large amplitude and may need to be DC-biased at clock driver output first, then followed with series attenuation resistor to reduce the amplitude, in addition to AC-coupling. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 29 High-Speed Serial Interfaces (HSSI) NOTE Figure 20–Figure 23 are for conceptual reference only. Due to the fact that clock driver chip's internal structure, output impedance, and termination requirements are different between various clock driver chip manufacturers, it is very much possible that the clock circuit reference designs provided by clock driver chip vendor are different from what is shown below. They might also vary from one vendor to the other. Therefore, Freescale Semiconductor can neither provide the optimal clock driver reference circuits, nor guarantee the correctness of the following clock driver connection reference circuits. The system designer is recommended to contact the selected clock driver chip vendor for the optimal reference circuits with the MPC8308 SerDes reference clock receiver requirement provided in this document. This figure shows the SerDes reference clock connection reference circuits for HCSL type clock driver. It assumes that the DC levels of the clock driver chip is compatible with MPC8308 SerDes reference clock input’s DC requirement. MPC8308 HCSL CLK Driver Chip CLK_Out 33  SD_REF_CLK 50  SerDes Refer. CLK Receiver 100 differential PWB trace Clock Driver 33  CLK_Out Total 50 Assume clock driver’s output impedance is about 16  SD_REF_CLK 50  Clock driver vendor dependent source termination resistor Figure 20. DC-Coupled Differential Connection with HCSL Clock Driver (Reference Only) This figure shows the SerDes reference clock connection reference circuits for LVDS type clock driver. Since LVDS clock driver’s common mode voltage is higher than the MPC8308’s SerDes reference clock input’s allowed range (100–400 mV), AC-coupled connection scheme must be used. It assumes the LVDS output driver features 50-termination resistor. It also assumes that the LVDS transmitter establishes its own common mode level without relying on the receiver or other external component. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 30 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) MPC8308 LVDS CLK Driver Chip CLK_Out SD_REF_CLK 10 nF 50  SerDes Refer. CLK Receiver 100 differential PWB trace Clock Driver CLK_Out SD_REF_CLK 10 nF 50  Figure 21. AC-Coupled Differential Connection with LVDS Clock Driver (Reference Only) Figure 22 shows the SerDes reference clock connection reference circuits for LVPECL type clock driver. Since LVPECL driver’s DC levels (both common mode voltages and output swing) are incompatible with MPC8308 SerDes reference clock input’s DC requirement, AC-coupling has to be used. This figure assumes that the LVPECL clock driver’s output impedance is 50 R1 is used to DC-bias the LVPECL outputs prior to AC-coupling. Its value could be ranged from 140 to 240 depending on clock driver vendor’s requirement. R2 is used together with the SerDes reference clock receiver’s 50- termination resistor to attenuate the LVPECL output’s differential peak level such that it meets the MPC8308’s SerDes reference clock’s differential input amplitude requirement (between 200 mV and 800 mV differential peak). For example, if the LVPECL output’s differential peak is 900 mV and the desired SerDes reference clock input amplitude is selected as 600 mV, the attenuation factor is 0.67, which requires R2 = 25 Please consult clock driver chip manufacturer to verify whether this connection scheme is compatible with a particular clock driver chip. LVPECL CLK Driver Chip MPC8308 CLK_Out R2 10nF SD_REF_CLK 50  SerDes Refer. CLK Receiver R1 100 differential PWB trace Clock Driver R2 10 nF SD_REF_CLK CLK_Out R1 50  Figure 22. AC-Coupled Differential Connection with LVPECL Clock Driver (Reference Only) MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 31 High-Speed Serial Interfaces (HSSI) This figure shows the SerDes reference clock connection reference circuits for a single-ended clock driver. It assumes the DC levels of the clock driver are compatible with the device’s SerDes reference clock input’s DC requirement. Single-Ended CLK Driver Chip MPC8308 Total 50 Assume clock driver’s output impedance is about 16  Clock Driver CLK_Out 50  SD_REF_CLK 33  SerDes Refer. CLK Receiver 100 differential PWB trace 50  SD_REF_CLK 50  Figure 23. Single-Ended Connection (Reference Only) 10.2.4 AC Requirements for SerDes Reference Clocks The clock driver selected should provide a high quality reference clock with low phase noise and cycle-to-cycle jitter. Phase noise less than 100 kHz can be tracked by the PLL and data recovery loops and is less of a problem. Phase noise above 15 MHz is filtered by the PLL. The most problematic phase noise occurs in the 1–15 MHz range. The source impedance of the clock driver should be 50  to match the transmission line and reduce reflections which are a source of noise to the system. This table describes some AC parameters for PCI Express protocol. Table 32. SerDes Reference Clock AC Parameters At recommended operating conditions with XCOREVDD= 1.0V ± 5% Parameter Symbol Min Max Unit Notes Rising Edge Rate Rise Edge Rate 1.0 4.0 V/ns 2, 3 Falling Edge Rate Fall Edge Rate 1.0 4.0 V/ns 2, 3 Differential Input High Voltage VIH +200 — mV 2 Differential Input Low Voltage VIL — –200 mV 2 MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 32 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) Table 32. SerDes Reference Clock AC Parameters (continued) At recommended operating conditions with XCOREVDD= 1.0V ± 5% Parameter Rising edge rate (SD_REF_CLK) to falling edge rate (SD_REF_CLK) matching Symbol Min Max Unit Notes Rise-Fall Matching — 20 % 1, 4 Notes: 1. Measurement taken from single ended waveform. 2. Measurement taken from differential waveform. 3. Measured from –200 mV to +200 mV on the differential waveform (derived from SD_REF_CLK minus SD_REF_CLK). The signal must be monotonic through the measurement region for rise and fall time. The 400 mV measurement window is centered on the differential zero crossing (Figure 24). 4. Matching applies to rising edge rate for SD_REF_CLK and falling edge rate for SD_REF_CLK. It is measured using a 200 mV window centered on the median cross point where SD_REF_CLK rising meets SD_REF_CLK falling. The median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. The Rise Edge Rate of SD_REF_CLK should be compared to the Fall Edge Rate of SD_REF_CLK, the maximum allowed difference should not exceed 20% of the slowest edge rate (See Figure 25). VIH = +200 0.0 V VIL = -200 mV SD_REF_CLK minus SD_REF_CLK Figure 24. Differential Measurement Points for Rise and Fall Time SD_REF_CLK SD_REF_CLK SD_REF_CLK SD_REF_CLK Figure 25. Single-Ended Measurement Points for Rise and Fall Time Matching The other detailed AC requirements of the SerDes reference clocks is defined by each interface protocol based on application usage. For detailed information, see the following sections: • Section 11.2, “AC Requirements for PCI Express SerDes Clocks” MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 33 PCI Express 10.2.4.1 Spread Spectrum Clock SD_REF_CLK/SD_REF_CLK are not intended to be used with, and should not be clocked by, a spread spectrum clock source. 10.3 SerDes Transmitter and Receiver Reference Circuits This figure shows the reference circuits for SerDes data lane’s transmitter and receiver. TXn RXn 50  50  Transmitter Receiver 50  TXn 50  RXn Figure 26. SerDes Transmitter and Receiver Reference Circuits The DC and AC specification of SerDes data lanes are defined in Section 11, “PCI Express.” Note that external AC coupling capacitor is required for the PCI Express serial transmission protocol with the capacitor value defined in specification of PCI Express protocol section. 11 PCI Express This section describes the DC and AC electrical specifications for the PCI Express bus. 11.1 DC Requirements for PCI Express SD_REF_CLK and SD_REF_CLK For more information, see Section 10.2, “SerDes Reference Clocks.” 11.2 AC Requirements for PCI Express SerDes Clocks This table lists the PCI Express SerDes clock AC requirements. Table 33. SD_REF_CLK and SD_REF_CLK AC Requirements Symbol Min Typ Max Units Notes REFCLK cycle time (for 125 MHz and 100 MHz) 8 10 — ns — tREFCJ REFCLK cycle-to-cycle jitter. Difference in the period of any two adjacent REFCLK cycles. — — 100 ps — tREFPJ Phase jitter. Deviation in edge location with respect to mean edge location. –50 — 50 ps — tREF Parameter Description MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 34 Freescale Semiconductor PCI Express 11.3 Clocking Dependencies The ports on the two ends of a link must transmit data at a rate that is within 600 parts per million (ppm) of each other at all times. This is specified to allow bit rate clock sources with a ±300 ppm tolerance. 11.4 Physical Layer Specifications Following is a summary of the specifications for the physical layer of PCI Express on this device. For further details as well as the specifications of the transport and data link layer please use the PCI Express Base Specification, Rev. 1.0a. 11.4.1 Differential Transmitter (TX) Output This table defines the specifications for the differential output at all transmitters (TXs). The parameters are specified at the component pins. Table 34. Differential Transmitter (TX) Output Specifications Parameter Symbol Unit interval UI Differential peak-to-peak output voltage VTX-DIFFp-p De-Emphasized differential output voltage (ratio) Minimum TX eye width Comments Min Each UPETX is 400 ps ± 300 ppm. UPETX 399.88 does not account for Spread Spectrum Clock dictated variations. Typical Max Units Note 400 400.12 ps 1 VPEDPPTX = 2*|VTX-D+ - VTX-D-| 0.8 — 1.2 V 2 VTX-DE-RATIO Ratio of the VPEDPPTX of the second and following bits after a transition divided by the VPEDPPTX of the first bit after a transition. –3.0 –3.5 –4.0 dB 2 TTX-EYE The maximum Transmitter jitter can be derived as TTX-MAX-JITTER = 1 UPEEWTX= 0.3 UI. 0.70 — — UI 2, 3 — — 0.15 UI 2, 3 Maximum time between the TTX-EYE-MEDIAN-to- Jitter is defined as the measurement jitter median and maximum variation of the crossing points MAX-JITTER deviation from the median (VPEDPPTX = 0 V) in relation to a recovered TX UI. A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. Jitter is measured using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX UI. D+/D- TX output rise/fall time TTX-RISE, TTX-FALL — 0.125 — — UI 2, 5 RMS AC peak common mode output voltage VTX-CM-ACp VPEACPCMTX = RMS(|VTXD+ + VTXD-|/2 VTX-CM-DC) VTX-CM-DC = DC(avg) of |VTX-D+ + VTX-D-|/2 — — 20 mV 2 MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 35 PCI Express Table 34. Differential Transmitter (TX) Output Specifications (continued) Parameter Symbol Min Typical Max Absolute delta of DC VTX-CM-DC- ACTIVE- |VTX-CM-DC (during L0) - VTX-CM-Idle-DC common mode voltage IDLE-DELTA (During Electrical Idle)| 175 mV 0.4 UI = TRX-EYE-MIN Figure 28. Minimum Receiver Eye Timing and Voltage Compliance Specification 11.5.1 Compliance Test and Measurement Load The AC timing and voltage parameters must be verified at the measurement point, as specified within 0.2 inches of the package pins, into a test/measurement load shown in Figure 29. NOTE The allowance of the measurement point to be within 0.2 inches of the package pins is meant to acknowledge that package/board routing may benefit from D+ and D– not being exactly matched in length at the package pin boundary. Figure 29. Compliance Test/Measurement Load 12 Enhanced Local Bus This section describes the DC and AC electrical specifications for the enhanced local bus interface. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 41 Enhanced Local Bus 12.1 Enhanced Local Bus DC Electrical Characteristics This table provides the DC electrical characteristics for the local bus interface. Table 36. Local Bus DC Electrical Characteristics at 3.3 V Parameter Symbol Min Max Unit High-level input voltage VIH 2.0 NVDD + 0.3 V Low-level input voltage VIL –0.3 0.8 V Input current, (VIN1 = 0 V or VIN = LVDD) IIN — ±5 A High-level output voltage, (LVDD = min, IOH = –2 mA) VOH NVDD – 0.2 — V Low-level output voltage, (LVDD = min, IOH = 2 mA) VOL — 0.2 V Note: The parameters stated in above table are valid for all revisions unless explicitly mentioned. 12.2 Enhanced Local Bus AC Electrical Specifications This table describes the general timing parameters of the local bus interface. Table 37. Local Bus General Timing Parameters Symbol 1 Min Max Unit Notes tLBK 15 — ns 2 Input setup to local bus clock tLBIVKH 7 — ns 3, 4 Input hold from local bus clock tLBIXKH 1 — ns 3, 4 Local bus clock to output valid tLBKHOV — 3 ns 3 Local bus clock to output high impedance for LD tLBKHOZ — 4 ns 5 Parameter Local bus cycle time Notes: 1. The symbols used for timing specifications follow the pattern of t(First two letters of functional block)(signal)(state) (reference)(state) for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for clock one(1). 2. All timings are in reference to falling edge of LCLK0 (for all outputs and for LGTA and LUPWAIT inputs) or rising edge of LCLK0 (for all other inputs). 3. All signals are measured from NVDD/2 of the rising/falling edge of LCLK0 to 0.4  NVDD of the signal in question for 3.3-V signaling levels. 4. Input timings are measured at the pin. 5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. This figure provides the AC test load for the local bus. Output Z0 = 50  RL = 50  NVDD/2 Figure 30. Local Bus AC Test Load MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 42 Freescale Semiconductor Enhanced Local Bus Figure 31 through Figure 33 show the local bus signals. In what follows, T1, T2, T3, and T4 are internal clock reference phase signals corresponding to LCCR[CLKDIV]. LCLK0 tLBIXKH tLBIVKH Input Signals: LD[0:15] tLBIXKH tLBIVKH Input Signal: LGTA tLBIXKH Output Signals: tLBKHOV LBCTL//LOE/ tLBKHOV tLBKHOZ Output Signals: LA[0:25] Figure 31. Local Bus Signals, Non-Special Signals Only LCLK0 T1 T3 tLBKHOV tLBKHOZ GPCM Mode Output Signals: LCS[0:3]/LWE tLBIVKH tLBIXKH UPM Mode Input Signal: LUPWAIT tLBIVKH Input Signals: LD[0:15] tLBKHOV tLBIXKH tLBKHOZ UPM Mode Output Signals: LCS[0:3]/LBS[0:1]/LGPL[0:5] Figure 32. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 2 MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 43 Enhanced Secure Digital Host Controller (eSDHC) LCLK T1 T2 T3 T4 tLBKHOV tLBKHOZ GPCM Mode Output Signals: LCS[0:3]/LWE tLBIXKH tLBIVKH UPM Mode Input Signal: LUPWAIT tLBIXKH tLBIVKH Input Signals: LD[0:15] tLBKHOV tLBKHOZ UPM Mode Output Signals: LCS[0:3]/LBS[0:1]/LGPL[0:5] Figure 33. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 13 Enhanced Secure Digital Host Controller (eSDHC) This section describes the DC and AC electrical specifications for the eSDHC (SD/MMC/SDIO) interface of the MPC8308. The eSDHC controller always uses the falling edge of the SD_CLK in order to drive the SD_DAT[0:3]/CMD as outputs and rising edge to sample the SD_DAT[0:3], CMD, CD and WP as inputs. This behavior is true for both full and high speed modes. 13.1 eSDHC DC Electrical Characteristics This table provides the DC electrical characteristics for the eSDHC (SD/MMC) interface of the device, compatible with SDHC specifications. The eSDHC NVDD range is between 3.0 V and 3.6 V. Table 38. eSDHC interface DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –8.0 mA 2.4 — V Output low voltage VOL IOL = 8.0 mA — 0.5 V MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 44 Freescale Semiconductor Enhanced Secure Digital Host Controller (eSDHC) Table 38. eSDHC interface DC Electrical Characteristics (continued) Characteristic 13.2 Symbol Condition Min Max Unit Output low voltage VOL IOL = 3.2 mA — 0.4 V Input high voltage VIH — 2.1 NVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V eSDHC AC Timing Specifications (Full Speed Mode) This section describes the AC electrical specifications for the eSDHC (SD/MMC) interface of the device. This table provides the eSDHC AC timing specifications for full speed mode as defined in Figure 35 and Figure 36. Table 39. eSDHC AC Timing Specifications for Full Speed Mode At recommended operating conditions NVDD = 3.3 V ± 300 mV. Symbol 1 Min Max Unit Notes SD_CLK clock frequency—full speed mode fSFSCK 0 25 MHz — SD_CLK clock cycle tSFSCK 40 — ns — SD_CLK clock frequency—identification mode fSIDCK 0 400 kHz — SD_CLK clock low time tSFSCKL 15 — ns 2 SD_CLK clock high time tSFSCKH 15 — ns 2 SD_CLK clock rise and fall times tSFSCKR/ tSFSCKF — 5 ns 2 Input setup times: SD_CMD, SD_DATx to SD_CLK tSFSIVKH 3 — ns 2 Input hold times: SD_CMD, SD_DATx to SD_CLK tSFSIXKH 2 — ns 2 Output valid: SD_CLK to SD_CMD, SD_DATx valid tSFSKHOV — 3 ns 2 Output hold: SD_CLK to SD_CMD, SD_DATx valid tSFSKHOX –3 — — — SD card input setup tISU 5 — ns 3 SD card input hold tIH 5 — ns 3 SD card output valid tODLY — 14 ns 3 SD card output hold tOH 0 — ns 3 Parameter Notes: The symbols used for timing specifications herein follow the pattern of t(first three letters of functional block)(signal)(state) (reference)(state) for inputs and t(first three letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tSFSIXKH symbolizes eSDHC full mode speed device timing (SFS) input (I) to go invalid (X) with respect to the clock reference (K) going to high (H). Also tSFSKHOV symbolizes eSDHC full speed timing (SFS) for the clock reference (K) to go high (H), with respect to the output (O) going valid (V) or data output valid time. Note that, in general, the clock reference symbol representation is based on five letters representing the clock of a particular functional. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2 Measured at capacitive load of 40 pF. 3 For reference only, according to the SD card specifications. 4 Average, for reference only. 1 MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 45 Enhanced Secure Digital Host Controller (eSDHC) This figure provides the eSDHC clock input timing diagram. eSDHC External Clock operational mode VM VM VM tSFSCKL tSFSCKH tSFSCK VM = Midpoint Voltage (NVDD/2) tSFSCKR tSFSCKF Figure 34. eSDHC Clock Input Timing Diagram 13.2.1 Full Speed Output Path (Write) This figure provides the data and command output timing diagram. tSFSCK (Clock Cycle) SD CLK at the MPC8308 Pin Driving Edge tCLK_DELAY SD CLK at the Card Pin Sampling Edge Output Valid Time: tSFSKHOV Output Hold Time: tSFSKHOX Output from the MPC8308 Pins tSFSCKL Input at the MPC8308 Pins tDATA_DELAY tIH (5 ns) tISU (5 ns) Figure 35. Full Speed Output Path MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 46 Freescale Semiconductor Enhanced Secure Digital Host Controller (eSDHC) 13.2.2 Full Speed Input Path (Read) This figure provides the data and command input timing diagram. tSFSCK (Clock Cycle) SD CLK at the MPC8308 Pin Sampling Edge tCLK_DELAY SD CLK at the Card Pin Driving Edge tODLY tOH tDATA_DELAY Output from the SD Card Pins Input at the MPC8308 Pins tSFSIXKH tSFSIVKH (MPC8308 Input Hold) Figure 36. Full Speed Input Path 13.3 eSDHC AC Timing Specifications This table provides the eSDHC AC timing specifications. Table 40. eSDHC AC Timing Specifications for High Speed Mode At recommended operating conditions NVDD = 3.3 V ± 300 mV. Symbol 1 Min Max Unit Notes SD_CLK clock frequency—high speed mode fSHSCK 0 50 MHz 3 SD_CLK clock cycle tSHSCK 20 — ns — SD_CLK clock frequency—identification mode fSIDCK 0 400 kHz — SD_CLK clock low time tSHSCKL 7 — ns 2 SD_CLK clock high time tSHSCKH 7 — ns 2 SD_CLK clock rise and fall times tSHSCKR/ tSHSCKF — 3 ns 2 Input setup times: SD_CMD, SD_DATx tSHSIVKH 3 — ns 2 Input hold times: SD_CMD, SD_DATx tSHSIXKH 2 — ns 2 Output delay time: SD_CLK to SD_CMD, SD_DATx valid tSHSKHOV 3 — ns 2 Output Hold time: SD_CLK to SD_CMD, SD_DATx invalid tSHSKHOX –3 — ns 2 SD Card Input Setup tISU 6 — ns 3 SD Card Input Hold tIH 2 — ns 3 Parameter MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 47 Enhanced Secure Digital Host Controller (eSDHC) Table 40. eSDHC AC Timing Specifications for High Speed Mode (continued) At recommended operating conditions NVDD = 3.3 V ± 300 mV. Symbol 1 Min Max Unit Notes SD Card Output Valid tODLY — 14 ns 3 SD Card Output Hold tOH 2.5 — ns 3 Parameter Notes: 1 The symbols used for timing specifications herein follow the pattern of t(first three letters of functional block)(signal)(state) (reference)(state) for inputs and t(first three letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tSFSIXKH symbolizes eSDHC full mode speed device timing (SFS) input (I) to go invalid (X) with respect to the clock reference (K) going to high (H). Also tSFSKHOV symbolizes eSDHC full speed timing (SFS) for the clock reference (K) to go high (H), with respect to the output (O) going valid (V) or data output valid time. Note that, in general, the clock reference symbol representation is based on five letters representing the clock of a particular functional. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2 Measured at capacitive load of 40 pF. 3 For reference only, according to the SD card specifications. This figure provides the eSDHC clock input timing diagram. eSDHC External Clock operational mode VM VM VM tSHSCKL tSHSCKH tSHSCK VM = Midpoint Voltage (NVDD/2) tSHSCKR tSHSCKF Figure 37. eSDHC Clock Input Timing Diagram MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 48 Freescale Semiconductor Enhanced Secure Digital Host Controller (eSDHC) 13.3.1 High Speed Output Path (Write) This figure provides the data and command output timing diagram. tSHSCK (Clock Cycle) SD CLK at the MPC8308 Pin Driving Edge tCLK_DELAY SD CLK at the Card Pin Sampling Edge Output Valid Time: tSHSKHOV tSHSCKL Output Hold Time: tSHSKHOX Output from the MPC8308 Pins Input at the SD Card Pins tDATA_DELAY tIH (2 ns) tISU (6 ns) Figure 38. High Speed Output Path 13.3.2 High Speed Input Path (Read) This figure provides the data and command input timing diagram. tSHSCK (Clock Cycle) 1/2 Cycle SD CLK at the MPC8308 Pin Sampling Edge tCLK_DELAY SD CLK at the Card Pin Driving Edge tODLY tOH tDATA_DELAY Output from the SD Card Pins Input at the MPC8308 Pins tSHSIVKH (MPC8308 Input (MPC8308 Input tSHSIXKH Figure 39. High Speed Input Path MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 49 JTAG 14 JTAG This section describes the DC and AC electrical specifications for the IEEE Std 1149.1™ (JTAG) interface. 14.1 JTAG DC Electrical Characteristics This table provides the DC electrical characteristics for the IEEE 1149.1 (JTAG) interface. Table 41. JTAG Interface DC Electrical Characteristics Characteristic 14.2 Symbol Condition Min Max Unit Input high voltage VIH — 2.1 NVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN — ±5 A Output high voltage VOH IOH = –8.0 mA 2.4 — V Output low voltage VOL IOL = 8.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V JTAG AC Timing Specifications This section describes the AC electrical specifications for the IEEE 1149.1 (JTAG) interface. This table provides the JTAG AC timing specifications as defined in Figure 41 through Figure 44. Table 42. JTAG AC Timing Specifications (Independent of SYS_CLK_IN) 1 At recommended operating conditions (see Table 2). Symbol2 Min Max Unit Note JTAG external clock frequency of operation fJTG 0 33.3 MHz — JTAG external clock cycle time t JTG 30 — ns — tJTKHKL 15 — ns — tJTGR & tJTGF 0 2 ns — tTRST 25 — ns 3 Boundary-scan data TMS, TDI tJTDVKH tJTIVKH 4 4 — — Boundary-scan data TMS, TDI tJTDXKH tJTIXKH 10 10 — — Boundary-scan data TDO tJTKLDV tJTKLOV 2 2 11 11 Parameter JTAG external clock pulse width measured at 1.4 V JTAG external clock rise and fall times TRST assert time Input setup times: ns 4 ns Input hold times: 4 ns Valid times: 5 MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 50 Freescale Semiconductor JTAG Table 42. JTAG AC Timing Specifications (Independent of SYS_CLK_IN) 1 (continued) At recommended operating conditions (see Table 2). Symbol2 Min Max Unit Note Boundary-scan data TDO tJTKLDX tJTKLOX 2 2 — — ns 5 JTAG external clock to output high impedance: Boundary-scan data TDO tJTKLDZ tJTKLOZ 2 2 19 9 ns 5, 6 Parameter Output hold times: Notes: 1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-load (see Figure 40). Time-of-flight delays must be added for trace lengths, vias, and connectors in the system. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals (D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only. 4. Non-JTAG signal input timing with respect to tTCLK. 5. Non-JTAG signal output timing with respect to tTCLK. 6. Guaranteed by design and characterization. This figure provides the AC test load for TDO and the boundary-scan outputs. Z0 = 50  Output RL = 50  NVDD/2 Figure 40. AC Test Load for the JTAG Interface This figure provides the JTAG clock input timing diagram. JTAG External Clock VM VM VM tJTGR tJTKHKL tJTG tJTGF VM = Midpoint Voltage (NVDD/2) Figure 41. JTAG Clock Input Timing Diagram MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 51 JTAG This figure provides the TRST timing diagram. TRST VM VM tTRST VM = Midpoint Voltage (NVDD/2) Figure 42. TRST Timing Diagram This figure provides the boundary-scan timing diagram. JTAG External Clock VM VM tJTDVKH tJTDXKH Boundary Data Inputs Input Data Valid tJTKLDV tJTKLDX Boundary Data Outputs Output Data Valid tJTKLDZ Boundary Data Outputs Output Data Valid VM = Midpoint Voltage (NVDD/2) Figure 43. Boundary-Scan Timing Diagram This figure provides the test access port timing diagram. JTAG External Clock VM VM tJTIVKH tJTIXKH Input Data Valid TDI, TMS tJTKLOV tJTKLOX Output Data Valid TDO tJTKLOZ TDO Output Data Valid VM = Midpoint Voltage (NVDD/2) Figure 44. Test Access Port Timing Diagram MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 52 Freescale Semiconductor I2 C 15 I2C This section describes the DC and AC electrical characteristics for the I2C interface. 15.1 I2C DC Electrical Characteristics This table provides the DC electrical characteristics for the I2C interface. Table 43. I2C DC Electrical Characteristics At recommended operating conditions with NVDD of 3.3 V ± 0.3 V. Parameter Symbol Min Max Unit Notes Input high voltage level VIH 0.7  NVDD NVDD + 0.3 V — Input low voltage level VIL –0.3 0.3  NVDD V — Low level output voltage VOL 0 0.2  NVDD V 1 High level output voltage VOH 0.8 x NVDD NVDD + 0.3 V — Output fall time from VIH(min) to VIL(max) with a bus capacitance from 10 to 400 pF tI2KLKV 20 + 0.1  CB 250 ns 2 Pulse width of spikes which must be suppressed by the input filter tI2KHKL 0 50 ns 3 Capacitance for each I/O pin CI — 10 pF — Input current, (0 V VIN NVDD) IIN — ±5 A — Notes: 1. Output voltage (open drain or open collector) condition = 3 mA sink current. 2. CB = capacitance of one bus line in pF. 3. For information on the digital filter used, see the MPC8308 PowerQUICC II Pro Processor Reference Manual. 15.2 I2C AC Electrical Specifications This table provides the AC timing parameters for the I2C interface. Table 44. I2C AC Electrical Specifications All values refer to VIH (min) and VIL (max) levels (see Table 43). Symbol1 Min Max Unit SCL clock frequency fI2C 0 400 kHz Low period of the SCL clock tI2CL 1.3 — s High period of the SCL clock tI2CH 0.6 — s Setup time for a repeated START condition tI2SVKH 0.6 — s Hold time (repeated) START condition (after this period, the first clock pulse is generated) tI2SXKL 0.6 — s Data setup time tI2DVKH 100 — ns Data hold time: tI2DXKL — 02 — 0.9 3 — 300 Parameter I2C bus devices Fall time of both SDA and SCL signals5 tI2CF s ns MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 53 I2 C Table 44. I2C AC Electrical Specifications (continued) All values refer to VIH (min) and VIL (max) levels (see Table 43). Symbol1 Min Max Unit Setup time for STOP condition tI2PVKH 0.6 — s Bus free time between a STOP and START condition tI2KHDX 1.3 — s Noise margin at the LOW level for each connected device (including hysteresis) VNL 0.1  NVDD — V Noise margin at the HIGH level for each connected device (including hysteresis) VNH 0.2  NVDD — V Parameter Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2) with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start condition (S) went invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C timing (I2) for the time that the data with respect to the stop condition (P) reaching the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. The device provides a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the falling edge of SCL. 3. The maximum tI2DXKL has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal. 4. CB = capacitance of one bus line in pF. 5. The device does not follow the I2C-BUS Specifications, Version 2.1, regarding the tI2CF AC parameter. This figure provides the AC test load for the I2C. Output Z0 = 50  RL = 50  NVDD/2 Figure 45. I2C AC Test Load This figure shows the AC timing diagram for the I2C bus. SDA tI2CF tI2DVKH tI2CL tI2KHKL tI2SXKL tI2CF tI2CR SCL tI2SXKL S tI2CH tI2DXKL tI2SVKH tI2PVKH Sr P S Figure 46. I2C Bus AC Timing Diagram MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 54 Freescale Semiconductor Timers 16 Timers This section describes the DC and AC electrical specifications for the timers. 16.1 Timers DC Electrical Characteristics This table provides the DC electrical characteristics for the MPC8308 timers pins, including TIN, TOUT, and TGATE. Table 45. Timers DC Electrical Characteristics 16.2 Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –8.0 mA 2.4 — V Output low voltage VOL IOL = 8.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V Input high voltage VIH — 2.1 NVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V VIN NVDD — ±5 A Timers AC Timing Specifications This table provides the timers input and output AC timing specifications. Table 46. Timers Input AC Timing Specifications Characteristic Timers inputs—minimum pulse width Symbol1 Min Unit tTIWID 20 ns Notes: 1. Timers inputs and outputs are asynchronous to any visible clock. Timers outputs should be synchronized before use by any external synchronous logic. Timers inputs are required to be valid for at least tTIWID ns to ensure proper operation This figure provides the AC test load for the Timers. Output Z0 = 50  RL = 50  NVDD/2 Figure 47. Timers AC Test Load MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 55 GPIO 17 GPIO This section describes the DC and AC electrical specifications for the GPIO of MPC8308 17.1 GPIO DC Electrical Characteristics This table provides the DC electrical characteristics for the GPIO. Table 47. GPIO DC Electrical Characteristic Characteristic 17.2 Symbol Condition Min Max Unit Output high voltage VOH IOH = –8.0 mA 2.4 — V Output low voltage VOL IOL = 8.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V Input high voltage VIH — 2.1 NVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V  VIN  NVDD — ±5 A GPIO AC Timing Specifications This table provides the GPIO input and output AC timing specifications. Table 48. GPIO Input AC Timing Specifications Characteristic GPIO inputs—minimum pulse width Symbol1 Min Unit tPIWID 20 ns Note: 1. GPIO inputs and outputs are asynchronous to any visible clock. GPIO outputs should be synchronized before use by any external synchronous logic. GPIO inputs are required to be valid for at least tPIWID ns to ensure proper operation. This figure provides the AC test load for the GPIO. Output Z0 = 50  RL = 50  NVDD/2 Figure 48. GPIO AC Test Load MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 56 Freescale Semiconductor IPIC 18 IPIC This section describes the DC and AC electrical specifications for the external interrupt pins. 18.1 IPIC DC Electrical Characteristics This table provides the DC electrical characteristics for the external interrupt pins. Table 49. IPIC DC Electrical Characteristics Characteristic 18.2 Symbol Condition Min Max Unit Input high voltage VIH — 2.1 NVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN — — ±5 A Output high voltage VOH IOH = –8.0 mA 2.4 — V Output low voltage VOL IOL = 8.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V IPIC AC Timing Specifications This table provides the IPIC input and output AC timing specifications. Table 50. IPIC Input AC Timing Specifications Characteristic IPIC inputs—minimum pulse width Symbol1 Min Unit tPIWID 20 ns Note: 1. IPIC inputs and outputs are asynchronous to any visible clock. IPIC outputs should be synchronized before use by any external synchronous logic. IPIC inputs are required to be valid for at least tPIWID ns to ensure proper operation when working in edge triggered mode. 19 SPI This section describes the DC and AC electrical specifications for the SPI of the device. 19.1 SPI DC Electrical Characteristics This table provides the DC electrical characteristics for the MPC8308 SPI. Table 51. SPI DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Input high voltage VIH — 2.1 NVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V  VIN  NVDD — ±5 A MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 57 SPI Table 51. SPI DC Electrical Characteristics (continued) 19.2 Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –8.0 mA 2.4 — V Output low voltage VOL IOL = 8.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V SPI AC Timing Specifications This table and provide the SPI input and output AC timing specifications. Table 52. SPI AC Timing Specifications 1 Symbol 2 Min Max Unit SPI outputs valid—master mode (internal clock) delay tNIKHOV — 6 ns SPI outputs hold—master mode (internal clock) delay tNIKHOX 0.5 — ns SPI outputs valid—slave mode (external clock) delay tNEKHOV 8.5 ns SPI outputs hold—slave mode (external clock) delay tNEKHOX 2 — ns SPI inputs—master mode (internal clock) input setup time tNIIVKH 6 — ns SPI inputs—master mode (internal clock) input hold time tNIIXKH 0 — ns SPI inputs—slave mode (external clock) input setup time tNEIVKH 4 — ns SPI inputs—slave mode (external clock) input hold time tNEIXKH 2 — ns Characteristic Notes: 1. Output specifications are measured from the 50% level of the rising edge of SPICLK to the 50% level of the signal. Timings are measured at the pin. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tNIKHOX symbolizes the internal timing (NI) for the time SPICLK clock reference (K) goes to the high state (H) until outputs (O) are invalid (X). This figure provides the AC test load for the SPI. Output Z0 = 50  RL = 50  NVDD/2 Figure 49. SPI AC Test Load Figure 50 through Figure 51 represent the AC timing from Table 52. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 58 Freescale Semiconductor Package and Pin Listings This figure shows the SPI timing in slave mode (external clock). SPICLK (input) Input Signals: SPIMOSI (See Note) tNEIVKH tNEIXKH tNEKHOV Output Signals: SPIMISO (See Note) Note: The clock edge is selectable on SPI. Figure 50. SPI AC Timing in Slave Mode (External Clock) Diagram This figure shows the SPI timing in master mode (internal clock). SPICLK (output) Input Signals: SPIMISO (See Note) tNIIVKH Output Signals: SPIMOSI (See Note) tNIIXKH tNIKHOV Note: The clock edge is selectable on SPI. Figure 51. SPI AC Timing in Master Mode (Internal Clock) Diagram 20 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. The MPC8308 is available in a moulded array process ball grid array (MAPBGA). For information on the MAPBGA, see Section 20.1, “Package Parameters for the MPC8308 MAPBGA,” and Section 20.2, “Mechanical Dimensions of the MPC8308 MAPBGA.” 20.1 Package Parameters for the MPC8308 MAPBGA The package parameters are as provided in the following list. The package type is 19 mm  19 mm, 473 MAPBGA. Package outline 19 mm 19 mm Interconnects 473 Pitch 0.80 mm Module height (typical) 1.39 mm Solder Balls 96.5 Sn/ 3.5Ag Ball diameter (typical) 0.40 mm MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 59 Package and Pin Listings 20.2 Mechanical Dimensions of the MPC8308 MAPBGA This figure shows the mechanical dimensions and bottom surface nomenclature of the MAPBGA package. Figure 52. Mechanical Dimension and Bottom Surface Nomenclature of the MPC8308 MAPBG Notes: 1. All dimensions are in millimeters. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 60 Freescale Semiconductor Package and Pin Listings 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 20.3 Pinout Listings This table provides the pin-out listing for the MPC8308, MAPBGA package. Table 53. MPC8308 Pinout Listing Signal Package Pin Number Pin Type Power Supply Note DDR Memory Controller Interface MEMC_MDQ[0] V6 I/O GVDDA — MEMC_MDQ[1] Y4 I/O GVDDA — MEMC_MDQ[2] AB3 I/O GVDDA — MEMC_MDQ[3] AA3 I/O GVDDA — MEMC_MDQ[4] AA2 I/O GVDDA — MEMC_MDQ[5] AA1 I/O GVDDA — MEMC_MDQ[6] W4 I/O GVDDA — MEMC_MDQ[7] Y2 I/O GVDDA — MEMC_MDQ[8] W3 I/O GVDDA — MEMC_MDQ[9] W1 I/O GVDDA — MEMC_MDQ[10] Y1 I/O GVDDA — MEMC_MDQ[11] W2 I/O GVDDA — MEMC_MDQ[12] U4 I/O GVDDA — MEMC_MDQ[13] U3 I/O GVDDA — MEMC_MDQ[14] V4 I/O GVDDA — MEMC_MDQ[15] U6 I/O GVDDA — MEMC_MDQ[16] T3 I/O GVDDB — MEMC_MDQ[17] T2 I/O GVDDB — MEMC_MDQ[18] R4 I/O GVDDB — MEMC_MDQ[19] R3 I/O GVDDB — MEMC_MDQ[20] P4 I/O GVDDB — MEMC_MDQ[21] N6 I/O GVDDB — MEMC_MDQ[22] P2 I/O GVDDB — MEMC_MDQ[23] P1 I/O GVDDB — MEMC_MDQ[24] N4 I/O GVDDB — MEMC_MDQ[25] N3 I/O GVDDB — MEMC_MDQ[26] N2 I/O GVDDB — MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 61 Package and Pin Listings Table 53. MPC8308 Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Note MEMC_MDQ[27] M6 I/O GVDDB — MEMC_MDQ[28] M2 I/O GVDDB — MEMC_MDQ[29] M3 I/O GVDDB — MEMC_MDQ[30] L2 I/O GVDDB — MEMC_MDQ[31] L3 I/O GVDDB — MEMC_MDM[0] AB2 O GVDDA — MEMC_MDM[1] V3 O GVDDA — MEMC_MDM[2] P3 O GVDDB — MEMC_MDM[3] M7 O GVDDB — MEMC_MDM[8] K2 O GVDDB — MEMC_MDQS[0] AC3 I/O GVDDA — MEMC_MDQS[1] V1 I/O GVDDA — MEMC_MDQS[2] R1 I/O GVDDB — MEMC_MDQS[3] M1 I/O GVDDB — MEMC_MDQS[8] K1 I/O GVDDB — MEMC_MBA[0] C3 O GVDDB — MEMC_MBA[1] B2 O GVDDB — MEMC_MBA[2] H4 O GVDDB — MEMC_MA0 C2 O GVDDB — MEMC_MA1 D2 O GVDDB — MEMC_MA2 D3 O GVDDB — MEMC_MA3 D4 O GVDDB — MEMC_MA4 E4 O GVDDB — MEMC_MA5 F4 O GVDDB — MEMC_MA6 E2 O GVDDB — MEMC_MA7 E1 O GVDDB — MEMC_MA8 F2 O GVDDB — MEMC_MA9 F3 O GVDDB — MEMC_MA10 C1 O GVDDB — MEMC_MA11 F7 O GVDDB — MEMC_MA12 G2 O GVDDB — MEMC_MA13 G3 O GVDDB — MEMC_MWE D5 O GVDDB — MEMC_MRAS B4 O GVDDB — MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 62 Freescale Semiconductor Package and Pin Listings Table 53. MPC8308 Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Note MEMC_MCAS C5 O GVDDB — MEMC_MCS[0] B6 O GVDDB — MEMC_MCS[1] C6 O GVDDB — MEMC_MCKE H3 O GVDDB 3 MEMC_MCK [0] A3 O GVDDB — MEMC_MCK [1] U2 O GVDDB — MEMC_MCK [2] G1 O GVDDB — MEMC_MCK [0] A4 O GVDDB — MEMC_MCK [1] U1 O GVDDB — MEMC_MCK [2] H1 O GVDDB — MEMC_MODT[0] A5 O GVDDB — MEMC_MODT[1] B5 O GVDDB — MEMC_MECC[0] L4 I/O GVDDB — MEMC_MECC[1] L6 I/O GVDDB — MEMC_MECC[2] K4 I/O GVDDB — MEMC_MECC[3] K3 I/O GVDDB — MEMC_MECC[4] J2 I/O GVDDB — MEMC_MECC[5] K6 I/O GVDDB — MEMC_MECC[6] J3 I/O GVDDB — MEMC_MECC[7] J6 I/O GVDDB — MVREF G6 I GVDDB — Local Bus Controller Interface LD0 U18 I/O NVDDP_K 8 LD1 V18 I/O NVDDP_K 8 LD2 U16 I/O NVDDP_K 8 LD3 Y20 I/O NVDDP_K 8 LD4 AA21 I/O NVDDP_K 8 LD5 AC22 I/O NVDDP_K 8 LD6 V17 I/O NVDDP_K 8 LD7 AB21 I/O NVDDP_K 8 LD8 Y19 I/O NVDDP_K 8 LD9 AA20 I/O NVDDP_K 8 LD10 Y17 I/O NVDDP_K 8 MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 63 Package and Pin Listings Table 53. MPC8308 Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Note LD11 AC21 I/O NVDDP_K 8 LD12 AB20 I/O NVDDP_K 8 LD13 V16 I/O NVDDP_K 8 LD14 AA19 I/O NVDDP_K 8 LD15 AC17 I/O NVDDP_K 8 LA0 AC20 O NVDDP_K — LA1 Y16 O NVDDP_K — LA2 U15 O NVDDP_K — LA3 V15 O NVDDP_K — LA4 AA18 O NVDDP_K — LA5 AA17 O NVDDP_K — LA6 AC19 O NVDDP_K — LA7 AA16 O NVDDP_K — LA8 AB18 O NVDDP_K — LA9 AC18 O NVDDP_K — LA10 V14 O NVDDP_K — LA11 AB17 O NVDDP_K — LA12 AA15 O NVDDP_K — LA13 AC16 O NVDDP_K — LA14 Y14 O NVDDP_K — LA15 AC15 O NVDDP_K — LA16 U13 O NVDDP_K — LA17 V13 O NVDDP_K — LA18 Y13 O NVDDP_K — LA19 AB15 O NVDDP_K — LA20 AA14 O NVDDP_K — LA21 AB14 O NVDDP_K — LA22 U12 O NVDDP_K — LA23 V12 O NVDDP_K — LA24 Y12 O NVDDP_K — LA25 AC14 O NVDDP_K — LCS[0] AA13 O NVDDP_K 4 LCS[1] AB13 O NVDDP_K 4 LCS[2] AA12 O NVDDP_K 4 MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 64 Freescale Semiconductor Package and Pin Listings Table 53. MPC8308 Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Note LCS[3] Y11 O NVDDP_K 4 LWE[0] /LFWE0/LBS0 AB11 O NVDDP_K — LWE[1]/LBS1 AC11 O NVDDP_K — LBCTL U11 O NVDDP_K — LGPL0/LFCLE Y10 O NVDDP_K — LGPL1/LFALE AA10 O NVDDP_K — LGPL2/LOE/LFRE AB10 O NVDDP_K 4 LGPL3/LFWP AC10 O NVDDP_K — LGPL4/LGTA/LUPWAIT/ LFRB AB9 I/O NVDDP_K 4 LGPL5 Y9 O NVDDP_K — LCLK0 AC12 O NVDDP_K — DUART UART_SOUT1/MSRCID0/ LSRCID0 C17 O NVDDB — UART_SIN1/MSRCID1/ LSRCID1 B18 I/O NVDDB — UART_SOUT2/MSRCID2/ LSRCID2 D17 O NVDDB — UART_SIN2/MSRCID3/ LSRCID3 D18 I/O NVDDB — PEX PHY TXA C14 O XPADVDD — TXA C15 O XPADVDD — RXA A13 I XCOREVDD — RXA B13 I XCOREVDD — SD_IMP_CAL_RX A15 I XCOREVDD — SD_REF_CLK C12 I XCOREVDD — SD_REF_CLK D12 I XCOREVDD — SD_PLL_TPD F13 O — — SD_IMP_CAL_TX A11 I XPADVDD — SD_PLL_TPA_ANA F11 O — — SDAVDD_0 G12 I — — SDAVSS_0 F12 I — — I/O NVDDA 2 I2C interface IIC_SDA1 C9 MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 65 Package and Pin Listings Table 53. MPC8308 Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Note IIC_SCL1 A9 I/O NVDDA 2 IIC_SDA2/CKSTOP_OUT D10 I/O NVDDA 2 IIC_SCL2/CKSTOP_IN C10 I/O NVDDA 2 Interrupts IRQ[0]/MCP_IN A17 I NVDDB — IRQ[1]/MCP_OUT F16 I/O NVDDB — IRQ[2] /CKSTOP_OUT B17 I/O NVDDB — IRQ[3] /CKSTOP_IN A18 I NVDDB — JTAG TCK Y7 I NVDDP_K — TDI U9 I NVDDP_K 4 TDO AC5 O NVDDP_K 3 TMS AA6 I NVDDP_K 4 TRST V8 I NVDDP_K 4 I NVDDP_K 5 TEST TEST_MODE AC6 System Control HRESET AA9 I/O NVDDP_K 1 PORESET AA8 I NVDDP_K — SRESET AB7 I/O NVDDP_K — Clocks SYS_CLK_IN AC8 I NVDDP_K — RTC_PIT_CLOCK AA23 I NVDDJ — MISC QUIESCE AA7 O NVDDP_K — THERM0 AC7 I NVDDP_K 6 ETSEC1 TSEC1_COL B20 I NVDDC — TSEC1_CRS B21 I NVDDC — TSEC1_GTX_CLK F18 O NVDDC 3 TSEC1_RX_CLK A22 I NVDDC — TSEC1_RX_DV D21 I NVDDC — TSEC1_RXD[3] C22 I NVDDC — TSEC1_RXD[2] C21 I NVDDC — MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 66 Freescale Semiconductor Package and Pin Listings Table 53. MPC8308 Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Note TSEC1_RXD[1] C20 I NVDDC — TSEC1_RXD[0] D20 I NVDDC — TSEC1_RX_ER C23 I NVDDC — TSEC1_TX_CLK/ TSEC1_GTX_CLK125 E23 I NVDDC — TSEC1_TXD[3]/ CFG_RESET_SOURCE[0] F22 I/O NVDDC — TSEC1_TXD[2]/ CFG_RESET_SOURCE[1] F21 I/O NVDDC — TSEC1_TXD[1]/ CFG_RESET_SOURCE[2] E21 I/O NVDDC — TSEC1_TXD[0]/ CFG_RESET_SOURCE[3] D22 I/O NVDDC — TSEC1_TX_EN/ LBC_PM_REF_10 F20 O NVDDC — TSEC1_TX_ER/ LB_POR_CFG_BOOT_ECC E22 I/O NVDDC 7 Ethernet Mgmt TSEC1_MDC A20 O NVDDB — TSEC1_MDIO C19 I/O NVDDB 2 eSDHC/GTM SD_CLK/GPIO[16] D7 O NVDDA — SD_CMD/GPIO[17] G9 I/O NVDDA — SD_CD/GTM1_TIN1/ GPIO[18] A7 I NVDDA — SD_WP/GTM1_TGATE1/ GPIO[19] D8 I NVDDA — SD_DAT[0]/GTM1_TOUT1/ GPIO[20] C8 I/O NVDDA — SD_DAT[1]/GTM1_TOUT2/ GPIO[21] B8 I/O NVDDA — SD_DAT[2]/GTM1_TIN2/ GPIO[22] A8 I/O NVDDA — SD_DAT[3]/GTM1_TGATE2/ GPIO[23] B9 I/O NVDDA — SPI SPIMOSI/MSRCID4/ LSRCID4 AB5 I/O NVDDP_K — SPIMISO/MDVAL/LDVAL Y6 I/O NVDDP_K — MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 67 Package and Pin Listings Table 53. MPC8308 Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Note SPICLK AA5 I/O NVDDP_K — SPISEL AB4 I NVDDP_K — GPIO/ETSEC2 GPIO[0]/TSEC2_COL G21 I/O NVDDF — GPIO[1]/TSEC2_TX_ER K23 I/O NVDDF — GPIO[2]/TSEC2_GTX_CLK H18 I/O NVDDF — GPIO[3]/TSEC2_RX_CLK G23 I/O NVDDF — GPIO[4]/TSEC2_RX_DV J18 I/O NVDDF — GPIO[5]/TSEC2_RXD3 J20 I/O NVDDF — GPIO[6]/TSEC2_RXD2 H22 I/O NVDDF — GPIO[7]/TSEC2_RXD1 H21 I/O NVDDF — GPIO[8]/TSEC2_RXD0 H20 I/O NVDDF — GPIO[9]/TSEC2_RX_ER J21 I/O NVDDF — GPIO[10]/TSEC2_TX_CLK/ TSEC2_GTX_CLK125 J23 I/O NVDDF — GPIO[11]/TSEC2_TXD3 K22 I/O NVDDF — GPIO[12]/TSEC2_TXD2 K20 I/O NVDDF — GPIO[13]/TSEC2_TXD1 K18 I/O NVDDF — GPIO[14]/TSEC2_TXD0 J17 I/O NVDDF — GPIO[15]/TSEC2_TX_EN K21 I/O NVDDF — USB/IEEE1588/GTM USBDR_PWR_FAULT P20 I NVDDH — USBDR_CLK R23 I NVDDH — USBDR_DIR R21 I NVDDH — USBDR_NXT P18 I NVDDH — USBDR_TXDRXD0 T22 I/O NVDDH — USBDR_TXDRXD1 T21 I/O NVDDH — USBDR_TXDRXD2 U23 I/O NVDDH — USBDR_TXDRXD3 U22 I/O NVDDH — USBDR_TXDRXD4 T20 I/O NVDDH — USBDR_TXDRXD5 R18 I/O NVDDH — USBDR_TXDRXD6 V23 I/O NVDDH — USBDR_TXDRXD7 V22 I/O NVDDH — USBDR_PCTL0 R17 O NVDDH — MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 68 Freescale Semiconductor Package and Pin Listings Table 53. MPC8308 Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Note USBDR_PCTL1 U20 O NVDDH — USBDR_STP V21 O NVDDH — TSEC_TMR_CLK/ GPIO[8] W23 I NVDDH — GTM1_TOUT3/ GPIO[9] T18 O NVDDH — GTM1_TOUT4/ GPIO[10] V20 O NVDDH — TSEC_TMR_TRIG1/ GPIO[11] W21 I NVDDH — TSEC_TMR_TRIG2/ GPIO[12] Y21 I NVDDH — TSEC_TMR_GCLK L17 O NVDDG — TSEC_TMR_PP1 L18 O NVDDG — TSEC_TMR_PP2 L21 O NVDDG — TSEC_TMR_PP3/ GPIO[13] L22 O NVDDG — TSEC_TMR_ALARM1 L23 O NVDDG — TSEC_TMR_ALARM2/ GPIO[14] M23 O NVDDG — GPIO[7] M22 IO — — TSEC2_CRS/ GPIO[0] M21 IO NVDDG — TSEC2_TMR_RX_ESFD/ GPIO[1] M18 O NVDDG — TSEC2_TMR_TX_ESFD/ GPIO[2] M20 O NVDDG — TSEC1_TMR_RX_ESFD/ GPIO[3] N23 O NVDDG — TSEC1_TMR_TX_ESFD/ GPIO[4] N21 O NVDDG — GTM1_TGATE3 N20 I NVDDG — GTM1_TIN4 N18 I NVDDG — GTM1_TGATE4/ GPIO[15] P23 I NVDDG — GTM1_TIN3 P22 I NVDDG — GPIO[5] N17 IO NVDDH — GPIO[6] P21 IO NVDDH — Power and Ground Supplies AVDD1 R6 I — — AVDD2 V10 I — — NC, No Connection B11, B16, D16 — — — MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 69 Package and Pin Listings Table 53. MPC8308 Pinout Listing (continued) Pin Type Power Supply Note Y23, H8, H9, H10, H14, H15, H16, J8, J16, K8, K16, L8, L16, M8, M16, N8, N16, P8, P16, R8, R16, T8, T9, T10, T11, T12, T13, T14, T15, T16 I — — VSS A2, A21, B1, B19, B23, C4, C16, D6, D19, E3, F8, F15, F17, F23, G7, G8, G10, G15, G16, G17, G20, H2, H6, H7, H17, H23, J7, J9, J10, J11, J12, J13, J14, J15, K9, K10, K11, K12, K13, K14, K15, L1, L7, L9, L10, L11, L12, L13, L14, L15, L20, M4, M9, M10, M11, M12, M13, M14, M15, N9, N10, N11, N12, N13, N14, N15, P6, P7, P9, P10, P11, P12, P13, P14, P15, R2, R7, R9, R10, R11, R12, R13, R14, R15, R22, T6, T7, U8, U17, U21, V2, V7, V9, V11, W20, Y8, Y15, AA4, AB1, AB6, AB12, AB19, AC2, AC9, AC23 I — — NVDDA B7, B10, C7, D9, F9 I — — NVDDB A16, A19, C18 I — — NVDDC A23, B22, D23, E20, G18 I — — NVDDF G22, J22, K17 I — — NVDDG M17, N22 I — — NVDDH P17, R20, T17, T23, W22, Y22 I — — NVDDJ AB23, AA22 I — — NVDDP_K U10, U14, Y5, Y18, AA11, AB8, AB16, AB22, AC4, AC13 I — — GVDD A1, A6, B3, D1, F1, F6, G4, J1, J4, K7, N1, N7, T1, T4, U7, Y3, AC1 I — — XPADVDD D15, F10, F14 I — — XPADVSS A10, B15, D14, G13, G14, H12 I — — XCOREVDD A14, B12, C13 I — — XCOREVSS A12, B14, C11, D11, D13, G11, H11, H13 I — — Signal Package Pin Number VDD Notes: 1. This pin is an open drain signal. A weak pull-up resistor (1 k) should be placed on this pin to NVDD 2. This pin is an open drain signal. A weak pull-up resistor (2–10 k) should be placed on this pin to NVDD. 3. This output is actively driven during reset rather than being three-stated during reset. 4. This pin has weak internal pull-up that is always enabled. 5. This pin must always be tied to VSS. 6. Internal thermally sensitive resistor, resistor value varies linearly with temperature. Useful for determining the junction temperature. 7. The LB_POR_CFG_BOOT_ECC is sampled only during the PORESET negation. This pin with an internal pull down resistor enables the ECC by default. To disable the ECC an external strong pull up resistor or a buffer released to high impedance is needed. 8. This pin has weak internal pull-down that is always enabled MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 70 Freescale Semiconductor Clocking 21 Clocking This figure shows the internal distribution of clocks within the device. MPC8308 e300 Core x M1 e300 PLL csb_clk clk tree x L2 System PLL ref Clk Gen ddr_clk lbc_clk fb SYS_CLK_IN eSHDC DDR Memory Device Local Bus Memory Device Protocol Converter SD_REF_CLK SD_REF_CLK_B eTSEC1 TSEC1_RX_CLK + - 125/100 MHz 2 MCK[0:2] PCI Express PCVTR Mux 1 MCK[0:2] /n LBC Clock Divider 24–66 MHz SD_CLK DDR Clock Divider /2 PLL SerDes PHY TSEC1_TX_CLK/ TSEC1_GTX_CLK125 Multiplication factor M = 1, 1.5, 2, 2.5, and 3. Value is decided by RCWLR[COREPLL]. Multiplication factor L = 2, 3, 4, 5 and 6. Value is decided by RCWLR[SPMF]. Figure 53. MPC8308 Clock Subsystem The following external clock sources are utilized on the MPC8308: • System clock (SYS_CLK_IN) • Ethernet Clock (TSEC1_RX_CLK/TSEC1_TX_CLK/TSEC1_GTX_CLK125 for eTSEC) • SerDes PHY clock • eSHDC clock (SD_CLK) For more information, see the SerDes chapter in the MPC8308 PowerQUICC II Pro Processor Reference Manual. All clock inputs can be supplied using an external canned oscillator, a clock generation chip, or some other source that provides a standard CMOS square wave input. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 71 Clocking 21.1 System Clock Domains The primary clock input (SYS_CLK_IN) frequency is multiplied up by the system phase-locked loop (PLL) and the clock unit to create three major clock domains: • The coherent system bus clock (csb_clk) • The internal clock for the DDR controller (ddr_clk) • The internal clock for the local bus interface unit (lbc_clk) The csb_clk frequency is derived as follows: csb_clk = [SYS_CLK_IN] × SPMF The csb_clk serves as the clock input to the e300 core. A second PLL inside the core multiplies up the csb_clk frequency to create the internal clock for the core (core_clk). The system and core PLL multipliers are selected by the SPMF and COREPLL fields in the reset configuration word low (RCWL), which is loaded at power-on reset or by one of the hard-coded reset options. For more information, see the Reset Clock Configuration chapter in the MPC8308 PowerQUICC II Pro Processor Reference Manual. The DDR SDRAM memory controller will operate with a frequency equal to twice the frequency of csb_clk. Note that ddr_clk is not the external memory bus frequency; ddr_clk passes through the DDR clock divider (2) to create the differential DDR memory bus clock outputs (MCK and MCK). However, the data rate is the same frequency as ddr_clk. The local bus memory controller will operate with a frequency equal to the frequency of csb_clk. Note that lbc_clk is not the external local bus frequency; lbc_clk passes through the LBC clock divider to create the external local bus clock outputs (LSYNC_OUT and LCLK0:2). The LBC clock divider ratio is controlled by LCCR[CLKDIV]. For more information, see the Reset Clock Configuration chapter in the MPC8308 PowerQUICC II Pro Processor Reference Manual. In addition, some of the internal units may be required to be shut off or operate at lower frequency than the csb_clk frequency. These units have a default clock ratio that can be configured by a memory mapped register after the device comes out of reset. Table 54 specifies which units have a configurable clock frequency. For more information, see Reset Clock Configuration chapter in the MPC8308 PowerQUICC II Pro Processor Reference Manual. Table 54. Configurable Clock Units Unit eTSEC1,eTSEC2 Default Frequency Options csb_clk/3 Off, csb_clk, csb_clk/2, csb_clk/3 I2C csb_clk Off, csb_clk,csb_clk/2, csb_clk/3 DMA complex csb_clk Off, csb_clk,csb_clk/2,csb_clk/3 PCIEXP csb_clk Off, csb_clk eSDHC csb_clk Off, csb_clk, csb_clk/2, csb_clk/3 USB csb_clk Off, csb_clk, csb_clk/2, csb_clk/3 NOTE The clock ratios of these units must be set before they are accessed. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 72 Freescale Semiconductor Clocking This table provides the operating frequencies for the device under recommended operating conditions (Table 2). Table 55. Operating Frequencies for MPC8308 Characteristic1 Maximum Operating Frequency Unit e300 core frequency (core_clk) 400 MHz Coherent system bus frequency (csb_clk) 133 MHz DDR2 memory bus frequency (MCK)2 133 MHz 66 MHz Local bus frequency (LCLK0) 3 Notes: 1. The SYS_CLK_IN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen such that the resulting csb_clk, MCK, LCLK0, and core_clk frequencies do not exceed their respective maximum or minimum operating frequencies. 2. The DDR data rate is 2x the DDR memory bus frequency. 3. The local bus frequency is 1/2, 1/4, or 1/8 of the lbc_clk frequency (depending on LCCR[CLKDIV]) which is in turn, 1x or 2x the csb_clk frequency (depending on RCWL[LBCM]). 21.2 System PLL Configuration The system PLL is controlled by the RCWL[SPMF] parameter. This table shows the multiplication factor encodings for the system PLL. Table 56. System PLL Ratio RCWL[SPMF] csb_clk: SYS_CLK_IN 0000 Reserved 0001 Reserved 0010 2:1 0011 3:1 0100 4:1 0101 5:1 0110–1111 Reserved As described in Section 21, “Clocking,” the LBCM, DDRCM, and SPMF parameters in the reset configuration word low select the ratio between the primary clock input (SYS_CLK_IN) and the internal coherent system bus clock (csb_clk). This table shows the expected frequency values for the CSB frequency for select csb_clk to SYS_CLK_IN ratios. Table 57. CSB Frequency Options SPMF csb_clk :Input Clock Ratio 0010 2:1 0100 4:1 0101 5:1 Input Clock Frequency (MHz) 25 33.33 66.67 133 133 125 167 MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 73 Thermal 21.3 Core PLL Configuration RCWL[COREPLL] selects the ratio between the internal coherent system bus clock (csb_clk) and the e300 core clock (core_clk). This table shows the encodings for RCWL[COREPLL]. COREPLL values that are not listed in this table should be considered as reserved. NOTE Core VCO frequency = core frequency VCO divider. The VCO divider, which is determined by RCWLR[COREPLL], must be set properly so that the core VCO frequency is in the range of 400–800 MHz. Table 58. e300 Core PLL Configuration RCWL[COREPLL] core_clk: csb_clk Ratio1 VCO Divider (VCOD)2 0–1 2–5 6 nn 0000 0 PLL bypassed (PLL off, csb_clk clocks core directly) PLL bypassed (PLL off, csb_clk clocks core directly) 11 nnnn n n/a n/a 00 0001 0 1:1 2 01 0001 0 1:1 4 10 0001 0 1:1 8 00 0001 1 1.5:1 2 01 0001 1 1.5:1 4 10 0001 1 1.5:1 8 00 0010 0 2:1 2 01 0010 0 2:1 4 10 0010 0 2:1 8 00 0010 1 2.5:1 2 01 0010 1 2.5:1 4 10 0010 1 2.5:1 8 00 0011 0 3:1 2 01 0011 0 3:1 4 10 0011 0 3:1 8 Note: 1 2 For any core_clk:csb_clk ratios, the core_clk must not exceed its maximum operating frequency of 400 MHz. Core VCO frequency = core frequency  VCO divider. Note that VCO divider has to be set properly so that the core VCO frequency is in the range of 400–800 MHz. 22 Thermal This section describes the thermal specifications of the device. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 74 Freescale Semiconductor Thermal 22.1 Thermal Characteristics This table provides the package thermal characteristics for the 473, 19  19 mm MAPBGA. Table 59. Package Thermal Characteristics for MAPBGA Characteristic Board Type Symbol Value Unit Note Junction to Ambient Natural Convection Single layer board (1s) RJA 42 °C/W 1, 2 Junction to Ambient Natural Convection Four layer board (2s2p) RJA 27 °C/W 1, 2, 3 Junction to Ambient (@200 ft/min) Single layer board (1s) RJMA 35 °C/W 1, 3 Junction to Ambient (@200 ft/min) Four layer board (2s2p) RJMA 24 °C/W 1, 3 Junction to Board — RJB 17 °C/W 4 Junction to Case — RJC 9 °C/W 5 Natural Convection JT 2 °C/W 6 Junction to Package Top Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification. 3. Per JEDEC JESD51-6 with the board horizontal. 4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. 22.2 Thermal Management Information For the following sections, PD = (VDD  IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers. 22.2.1 Estimation of Junction Temperature with Junction-to-Ambient Thermal Resistance An estimation of the chip junction temperature, TJ, can be obtained from the equation: TJ = TA + (RJA  PD) where: TJ = junction temperature (C) TA = ambient temperature for the package (C) RJA = junction-to-ambient thermal resistance (C/W) PD = power dissipation in the package (W) The junction-t-ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal performance. As a general statement, the value obtained on a single layer board is MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 75 Thermal appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually appropriate if the board has low power dissipation and the components are well separated. Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible. 22.2.2 Estimation of Junction Temperature with Junction-to-Board Thermal Resistance The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal resistance. The thermal performance of any component is strongly dependent on the power dissipation of surrounding components. In addition, the ambient temperature varies widely within the application. For many natural convection and especially closed box applications, the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature near the device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the local ambient conditions that determine the temperature of the device. At a known board temperature, the junction temperature is estimated using the following equation: TJ = TB + (RJB  PD) where: TJ = junction temperature (C) TB = board temperature at the package perimeter (C) RJB = junction-to-board thermal resistance (C/W) per JESD51–8 PD = power dissipation in the package (W) When the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made. The application board should be similar to the thermal test condition: the component is soldered to a board with internal planes. 22.2.3 Experimental Determination of Junction Temperature To determine the junction temperature of the device in the application after prototypes are available, the thermal characterization parameter (JT) can be used to determine the junction temperature with a measurement of the temperature at the top center of the package case using the following equation: TJ = TT + (JT  PD) where: TJ = junction temperature (C) TT = thermocouple temperature on top of package (C) JT = thermal characterization parameter (C/W) PD = power dissipation in the package (W) The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 76 Freescale Semiconductor System Design Information 23 System Design Information This section provides electrical and thermal design recommendations for successful application of the device 23.1 System Clocking The device includes two PLLs. 1. The platform PLL generates the platform clock from the externally supplied SYS_CLK_IN input. The frequency ratio between the platform and SYS_CLK_IN is selected using the platform PLL ratio configuration bits as described in Section 21.2, “System PLL Configuration.” 2. The e300 core PLL generates the core clock as a slave to the platform clock. The frequency ratio between the e300 core clock and the platform clock is selected using the e300 PLL ratio configuration bits as described in Section 21.3, “Core PLL Configuration.” 23.2 PLL Power Supply Filtering Each of the PLLs listed above is provided with power through independent power supply pins (AVDD1 for core PLL and AVDD2 for the platform PLL). The AVDD level should always be equivalent to VDD, and preferably these voltages are derived directly from VDD through a low pass filter scheme such as the following. There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to provide independent filter circuits as illustrated in Figure 54, one to each of the two AVDD pins. By providing independent filters to each PLL the opportunity to cause noise injection from one PLL to the other is reduced. This circuit is intended to filter noise in the PLLs’ resonant frequency range from a 500 kHz to 10 MHz range. It should be built with surface mount capacitors with minimum effective series inductance (ESL). Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a single large value capacitor. Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AVDD pin, which is on the periphery of package, without the inductance of vias. This figure shows the PLL power supply filter circuits. 10 VDD AVDD1 and AVDD2 2.2 µF 2.2 µF Low ESL Surface Mount Capacitors Figure 54. PLL Power Supply Filter Circuit MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 77 System Design Information 23.3 Decoupling Recommendations Due to large address and data buses, and high operating frequencies, the device can generate transient power surges and high frequency noise in its power supply, especially while driving large capacitive loads. This noise must be prevented from reaching other components in the MPC8308 system, and the MPC8308 itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system designer place at least one decoupling capacitor at each VDD, NVDD, GVDD and LVDD pin of the device. These decoupling capacitors should receive their power from separate VDD, NVDD, GVDD, LVDD, and VSS power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may be placed directly under the device using a standard escape pattern. Others may surround the part. These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology) capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes. In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB, feeding the VDD, NVDD, GVDD, LVDD planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the quick response time necessary. They should also be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk capacitors—100 to 330 µF (AVX TPS tantalum or Sanyo OSCON). However, customers should work directly with their power regulator vendor for best values and types of bulk capacitors. 23.4 Connection Recommendations To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal level. Unused active low inputs should be tied to NVDD, GVDD, LVDD as required. Unused active high inputs should be connected to VSS. All NC (no-connect) signals must remain unconnected. Power and ground connections must be made to all external VDD, NVDD, AVDD1, AVDD2, GVDD, LVDD and VSS pins of the device. 23.5 Output Buffer DC Impedance The device drivers are characterized over process, voltage, and temperature. For all buses, the driver is a push-pull single-ended driver type (open drain for I2C, MDIO and HRESET) To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to NVDD or VSS. Then, the value of each resistor is varied until the pad voltage is NVDD/2 (Figure 55). The output impedance is the average of two components, the resistances of the pull-up and pull-down devices. When data is held high, SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals NVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each other in value. Then, Z0 = (RP + RN)/2. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 78 Freescale Semiconductor System Design Information NVDD RN SW2 Pad Data SW1 RP VSS Figure 55. Driver Impedance Measurement The value of this resistance and the strength of the driver’s current source can be found by making two measurements. First, the output voltage is measured while driving logic 1 without an external differential termination resistor. The measured voltage is V1 = Rsource  Isource. Second, the output voltage is measured while driving logic 1 with an external precision differential termination resistor of value Rterm. The measured voltage is V2 = (1/(1/R1 + 1/R2))  Isource. Solving for the output impedance gives Rsource = Rterm  (V1/V2 – 1). The drive current is then Isource = V1/Rsource. This table summarizes the signal impedance targets. The driver impedance are targeted at minimum VDD, nominal NVDD, 105C. Table 60. Impedance Characteristics Impedance Local Bus, Ethernet, DUART, Control, Configuration, Power Management DDR DRAM Symbol Unit RN 42 Target 20 Target Z0  RP 42 Target 20 Target Z0  Note: Nominal supply voltages. See Table 2, Tj = 105C. 23.6 Configuration Pin Muxing The device provides the user with power-on configuration options which can be set through the use of external pull-up or pull-down resistors of 4.7 K on certain output pins (see customer visible configuration pins). These pins are generally used as output only pins in normal operation. While PORESET is asserted however, these pins are treated as inputs. The value presented on these pins while PORESET is asserted, is latched when PORESET deasserts, at which time the input receiver is disabled and the I/O circuit takes on its normal function. Careful board layout with stubless connections to these pull-up/pull-down resistors coupled with the large value of the pull-up/pull-down resistor should minimize the disruption of signal quality or speed for output pins thus configured. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 79 Ordering Information 23.7 Pull-Up Resistor Requirements The device requires high resistance pull-up resistors (10 k is recommended) on open drain type pins including I2C, Ethernet management MDIO, HRESET and IPIC (integrated programmable interrupt controller). Correct operation of the JTAG interface requires configuration of a group of system control pins as demonstrated in Figure 56. Care must be taken to ensure that these pins are maintained at a valid deasserted state under normal operating conditions because most have asynchronous behavior and spurious assertion, which give unpredictable results. 24 Ordering Information This section presents ordering information for the devices discussed in this document, and it shows an example of how the parts are marked. Ordering information for the devices fully covered by this document is provided in Section 24.1, “Part Numbers Fully Addressed by This Document.” 24.1 Part Numbers Fully Addressed by This Document This table provides the Freescale part numbering nomenclature for the MPC8308 family. Note that the individual part numbers correspond to a maximum processor core frequency. For available frequencies, contact your local Freescale sales office. In addition to the maximum processor core frequency, the part numbering scheme also includes the maximum effective DDR memory speed. Each part number also contains a revision code which refers to the die mask revision number. Table 61. Part Numbering Nomenclature MPC nnnn C VM AD D A Product Code Part Identifier Temperature Range1,4 Package2 e300 Core Frequency3 DDR Frequency Revision Level MPC 8308 Blank = 0 to 105C C = –40 to 105C VM = Pb-free 473 MAPBGA AD = 266 MHz AF = 333 MHz AG = 400 MHz D = 266 MHz Contact local Freescale sales office Notes: 1. Contact local Freescale office on availability of parts with C temperature range. 2. See Section 20, “Package and Pin Listings,” for more information on available package types. 3. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification support all core frequencies. Additionally, parts addressed by Part Number Specifications may support other maximum core frequencies 4. Minimum temperature is specified with TA; Maximum temperature is specified with TJ MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 80 Freescale Semiconductor Ordering Information 24.2 Part Marking Parts are marked as in the example shown in this figure. MPCnnnnCVMADDA core/platform MHZ ATWLYYWW CCCCC *MMMMM YWWLAZ PBGA Notes: ATWLYYWW is the traceability code. CCCCC is the country code. MMMMM is the mask number. YWWLAZ is the assembly traceability code. Figure 56. Freescale Part Marking for PBGA Devices This table lists the SVR settings. Table 62. SVR Settings Device Package SVR MPC8308 MAPBGA 0x8101 _0110 Note: PVR = 8085_0020 for the device. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 Freescale Semiconductor 81 Document Revision History 25 Document Revision History This table summarizes a revision history for this document. Table 63. Document Revision History Rev. Number Date 3 10/2011 • • • • 2 02/2011 • Added NVDDJ to Note-7 in Table 1. • In Table 2, Added Note-2 Added NVDDJ to Note-3 Added “Extended Temperature range from -40 to 105 C, in the last row of the table Changed “characteristic name Junction temperature” to “Operating temperature range” • In Table 4, Note-3, changed ambient temperature to junction temperature, TJ = 105 C • In Table 18, tDDKHCS changed from 3.15ns to 2.5ns tDDKHMP and tDDKHME values updated • In Figure 6, corrected tDDKHMP & tDDKHME waveform • In Table 53, Y23 Package Pin Number changed from NC to VDD signal group TSEC2_CRS is muxed with GPIO[0], shown as TSEC2_CRS/ GPIO[0] • In Table 58, note-1, core_clk maximum operating frequency 333 MHz replaced with 400 MHz 1 06/2010 • In Table 4, TA = 105 replaced with TJ = 105 • In Table 8, fSYS_CLK_IN (Max) = 66 replaced with 66.67 and tSYS_CLK_IN (Min) = 15.15 replaced with 15 • In Table 53, TSEC1_TMR_RX_ESFD replaced with TSEC2_TMR_RX_ESFD TSEC1_TMR_TX_ESFD replaced with TSEC2_TMR_TX_ESFD TSEC0_TMR_RX_ESFD replaced with TSEC1_TMR_RX_ESFD TSEC0_TMR_TX_ESFD replaced with TSEC1_TMR_TX_ESFD • In Table 56, rows from 1000 to 1111 removed • In Table 57, SPMF 5:1 Option 167 MHz added. 0 05/2010 Initial release Substantive Change(s) In Section 2.1.4, “Power Sequencing,” changed description. In Table 53, updated GPIOs pins as I/O. In Table 54, removed PCI Express = csb_clk/2 and csb_clk/3 options. In Table 61, added note 4. MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3 82 Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. 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