MPX2102GSX

Freescale Semiconductor Technical Data MPX2102 Rev 5, 10/2006 100 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors The MPX2102/MPXV2102G series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Features • Temperature Compensated Over 0°C to +85°C • Easy-to-Use Chip Carrier Package Options • Available in Absolute, Differential and Gauge Configurations • Ratiometric to Supply Voltage Application Examples • Pump/Motor Controllers • Robotics • Level Indicators • Medical Diagnostics • Pressure Switching • Barometers • Altimeters ORDERING INFORMATION Device Type Ported Elements MPX2102 MPXV2102G SERIES 0 TO 100 kPA (0 TO 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL) SMALL OUTLINE PACKAGES MPX2102GP CASE 1369-01 MPXV2102DP CASE 1351-01 Options Case No. MPX Series Order No. MPXV2102GP MPXV2102DP Packing Options Trays Trays Device Marking MPXV2102G MPXV2102G SMALL OUTLINE PACKAGE PIN NUMBERS 1 2 3 4 GND(1) +VOUT VS –VOUT 5 6 7 8 N/C N/C N/C N/C SMALL OUTLINE PACKAGE (MPXV2102G SERIES) Gauge, Side Port, SMT Differential, Dual Port, SMT Basic Element Ported Elements Absolute, Differential Differential, Dual Port Absolute, Gauge Absolute, Gauge Axial Gauge, Vacuum 1369 1351 UNIBODY PACKAGE (MPX2102 SERIES) 344 344C 344B 344F 344D MPX2102A MPX2102D MPX2102DP MPX2102AP MPX2102GP MPX2102ASX MPX2102GSX MPX2102GVP — — — — — MPX2102A MPX2102D MPX2102DP MPX2102AP MPX2102GP MPX2102A MPX2102D MPX2102GVP 1. Pin 1 in noted by the notch in the lead. UNIBODY PACKAGE PIN NUMBERS 1 2 GND(1) +VOUT 3 4 VS –VOUT 1. Pin 1 in noted by the notch in the lead. UNIBODY PACKAGES MPX2102A/D CASE 344-15 MPX2102AP/GP CASE 344B-01 MPX2102DP CASE 344C-01 MPX2102GVP CASE 344D-01 MPX2102ASX/GSX CASE 344F-01 © Freescale Semiconductor, Inc., 2006. All rights reserved. VS 3 Thin Film Temperature Compensation and Calibration Circuitry 1 GND Sensing Element 2 + VOUT 4 -V OUT Figure 1. Temperature Compensated Pressure Sensor Schematic VOLTAGE OUTPUT VS. APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure Table 1. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 400 -40 to +125 -40 to +125 Unit kPa °C °C (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip. 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX2102 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Differential Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) (0 to 100 kPa) Temperature Hysteresis(5)(- 40°C to +125°C) Temperature Coefficient of Full Scale Span(5) Temperature Coefficient of Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Time Offset Stability(7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: • • • • Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25°C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. MPX2102D Series MPX2102A Series MPX2102D Series MPX2102A Series Symbol POP VS IO VFSS VOFF ∆V/∆Ρ — — — — TCVFSS TCVOFF ZIN ZOUT tR — — Min 0 — — 38.5 -1.0 -2.0 — -0.6 -1.0 — — -2.0 -1.0 1000 1400 — — — Typ — 10 6.0 40 — — 0.4 — — ±0.1 ±0.5 — — — — 1.0 20 ±0.5 Max 100 16 — 41.5 1.0 2.0 — 0.4 1.0 — — 2.0 1.0 2500 3000 — — — Units kPa VDC mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV W W ms ms %VFSS 6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2102 Sensors Freescale Semiconductor 3 LINEARITY Linearity refers to how well a transducer's output follows the equation: VOUT = VOFF + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Squares Fit Exaggerated Performance Curve Relative Voltage Output Least Square Deviation Straight Line Deviation End Point Straight Line Fit Offset 0 50 Pressure (% Fullscale) 100 Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION Figure 3 shows the output characteristics of the MPX2102/ MPXV2102G series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. 40 35 30 25 Output (mVDC) 20 15 10 5 0 kPa PSI -5 0 25 3.62 50 7.25 75 10.88 14.5 Offset (TYP) MIN MAX VS = 10 VDC TA = 25°C MPX2102 P1 > P2 The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. TYP Span Range (TYP) 100 Figure 3. Output vs. Pressure Differential Silcone Gel Die Coat Differential/Gauge Die P1 Stainless Steel Metal Cover Epoxy Case Silicone Gel Die Coat Wire Bond Absolute Die P1 Stainless Steel Metal Cover Epoxy Case Wire Bond Lead Frame Differential/GaugeElement P2 Bond Die Lead Frame Absolute Element P2 Die Bond Figure 4. Cross Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2102/MPXV2102G series pressure sensor operating characteristics and internal reliability and MPX2102 4 Sensors Freescale Semiconductor qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The differential or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using Table 3. Table 3. Pressure (P1) Side Delineation Part Number MPX2102A MPX2102DP MPX2102AP MPX2102GVP MPX2102ASX MPX2102GSX MPX2102GP MPX2102DP MPX2102GP MPX2102D Case Type 344 344C 344B 344D 344F 1369 1351 Pressure (P1) Side Identifier Stainless Steep Cap Side with Part Marking Side with Port Attached Stainless Steep Cap Side with Port Marking Side with Port Attached Side with Part Marking MPX2102 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS C R M 1 B -AN PIN 1 1234 2 3 4 Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 L -TJ SEATING PLANE G F M F Y D 4 PL 0.136 (0.005) TA M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 2: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND STYLE 3: PIN 1. 2. 3. 4. GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE -TR H N PORT #1 POSITIVE PRESSURE (P1) -AU L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC -Q- B 12 34 PIN 1 K S -P0.25 (0.010) J C M TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2102 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 V R PORT #2 PORT #1 -AU W H N PORT #2 VACUUM (P2) L PORT #1 POSITIVE PRESSURE (P1) -QSEATING PLANE B SEATING PLANE PIN 1 1234 -P-TJ C -T0.25 (0.010) M K S TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE -AU -TR N -QSEATING PLANE PORT #2 VACUUM (P2) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.158 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC L H POSITIVE PRESSURE (P1) B 12 34 K S PIN 1 C J -P0.25 (0.010) M F TQ S G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344D-01 ISSUE B UNIBODY PACKAGE MPX2102 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS -TC E A U -Q- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92 V N R PORT #1 POSITIVE PRESSURE (P1) B -P0.25 (0.010) M PIN 1 TQ M 4 3 2 1 S K J F D 4 PL 0.13 (0.005) G STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT M TP S Q S CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2102 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2102 Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2102 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2102 Sensors Freescale Semiconductor 11 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2102 12 Sensors Freescale Semiconductor NOTES MPX2102 Sensors Freescale Semiconductor 13 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. All rights reserved. MPX2102 Rev. 5 10/2006