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MRFG35002N6T1

MRFG35002N6T1

  • 厂商:

    FREESCALE(飞思卡尔)

  • 封装:

  • 描述:

    MRFG35002N6T1 - Gallium Arsenide PHEMT RF Power Field Effect Transistor - Freescale Semiconductor, I...

  • 数据手册
  • 价格&库存
MRFG35002N6T1 数据手册
Freescale Semiconductor Technical Data MRFG35002N6T1 replaced by MRFG35002N6AT1. Document Number: MRFG35002N6 Rev. 2, 1/2008 Gallium Arsenide PHEMT RF Power Field Effect Transistor Designed for WLL/MMDS/BWA or UMTS driver applications. Characterized from 500 to 5000 MHz. Device is unmatched and is suitable for use in Class AB Customer Premise Equipment (CPE) applications. • Typical Single - Carrier W - CDMA Performance: VDD = 6 Volts, IDQ = 65 mA, Pout = 158.5 mWatts Avg., 3550 MHz, Channel Bandwidth = 3.84 MHz, PAR = 8.5 dB @ 0.01% Probability on CCDF. Power Gain — 10 dB Drain Efficiency — 27% ACPR @ 5 MHz Offset — - 41 dBc in 3.84 MHz Channel Bandwidth • 1.5 Watts P1dB @ 3550 MHz, CW • Excellent Phase Linearity and Group Delay Characteristics • High Gain, High Efficiency and High Linearity • RoHS Compliant. • In Tape and Reel. T1 Suffix = 1000 Units per 12 mm, 7 inch Reel. MRFG35002N6T1 3.5 GHz, 1.5 W, 6 V POWER FET GaAs PHEMT CASE 466 - 03, STYLE 1 PLD - 1.5 PLASTIC Table 1. Maximum Ratings Rating Drain - Source Voltage Gate - Source Voltage RF Input Power Storage Temperature Range Channel Temperature (1) Symbol VDSS VGS Pin Tstg Tch TC Value 8 -5 22 - 65 to +150 175 - 20 to +85 Unit Vdc Vdc dBm °C °C °C Operating Case Temperature Range Table 2. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case Symbol RθJC Value (2) 15.2 Unit °C/W Table 3. Moisture Sensitivity Level Test Methodology Per JESD 22 - A113, IPC/JEDEC J - STD - 020 Rating 1 Package Peak Temperature 260 Unit °C 1. For reliable operation, the operating channel temperature should not exceed 150°C. 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf . Select Documentation/Application Notes - AN1955. © Freescale Semiconductor, Inc., 2006, 2008. All rights reserved. MRFG35002N6T1 1 RF Device Data Freescale Semiconductor LAST ORDER 8 DEC 07 LAST SHIP 8 JUN 08 LIFETIME BUY Table 4. Electrical Characteristics (TC = 25°C unless otherwise noted) Characteristic Saturated Drain Current (VDS = 3.5 Vdc, VGS = 0 Vdc) Off State Leakage Current (VGS = - 0.4 Vdc, VDS = 0 Vdc) Off State Drain Current (VDS = 6 Vdc, VGS = - 2.5 Vdc) Off State Current (VDS = 28.5 Vdc, VGS = - 2.5 Vdc) Gate - Source Cut - off Voltage (VDS = 3.5 Vdc, IDS = 8.7 mA) Quiescent Gate Voltage (VDS = 6 Vdc, ID = 65 mA) Symbol IDSS IGSS IDSO IDSX VGS(th) VGS(Q) Min — — — — - 1.2 - 1.1 Typ 1.7 < 1.0 — < 1.0 - 0.9 - 0.8 Max — 100 600 9 - 0.7 - 0.6 Unit Adc μAdc μAdc mAdc Vdc Vdc LIFETIME BUY Functional Tests (In Freescale Test Fixture, 50 ohm system) VDD = 6 Vdc, IDQ = 65 mA, Pout = 158.5 mW Avg., f = 3550 MHz, Single - Carrier W - CDMA, 3.84 MHz Channel Bandwidth Carrier. ACPR measured in 3.84 MHz Channel Bandwidth @ ±5 MHz Offset. PAR = 8.5 dB @ 0.01% Probability on CCDF. Power Gain Drain Efficiency Adjacent Channel Power Ratio Gps hD ACPR 8.5 23 — 10 27 - 41 — — - 38 dB % dBc Typical RF Performance (In Freescale Test Fixture, 50 οhm system) VDD = 6 Vdc, IDQ = 65 mA, f = 3550 MHz Output Power, 1 dB Compression Point, CW P1dB — 1.5 — W MRFG35002N6T1 2 RF Device Data Freescale Semiconductor LAST ORDER 8 DEC 07 LAST SHIP 8 JUN 08 VBIAS C8 C13 C12 C11 C10 C9 C7 R1 C19 C20 C6 RF INPUT Z1 C1 C3 C4 C23 Z2 Z3 Z4 Z5 C5 C22 Z6 Z7 Z8 Z9 Z10 C21 Z11 Z12 Z13 C24 Z14 C18 C17 C16 C15 C14 VSUPPLY RF OUTPUT Z1, Z14 Z2 Z3 Z4 Z5 Z6, Z11 Z7 0.044″ 0.044″ 0.044″ 0.468″ 0.468″ 0.015″ 0.031″ x 0.125″ Microstrip x 0.500″ Microstrip x 0.052″ Microstrip x 0.010″ Microstrip x 0.356″ Microstrip x 0.549″ Microstrip x 0.259″ Microstrip Z8 Z9 Z10 Z12 Z13 PCB 0.420″ x 0.150″ Microstrip 0.150″ x 0.068″ Microstrip 0.290″ x 0.183″ Microstrip 0.044″ x 0.115″ Microstrip 0.044″ x 0.894″ Microstrip Rogers 4350, 0.020″, εr = 3.5 Figure 1. MRFG35002N6 Test Circuit Schematic Table 5. MRFG35002N6 Test Circuit Component Designations and Values Part C1, C24 C2 C3 C4 C5, C6, C21, C22 C7, C20 C8, C19 C9, C18 C10, C17 C11, C16 C12, C15 C13, C14 C23 R1 Not Used 1.2 pF Chip Capacitor 0.7 pF Chip Capacitor 5.6 pF Chip Capacitors 10 pF Chip Capacitors 100 pF Chip Capacitors 100 pF Chip Capacitors 1000 pF Chip Capacitors 0.1 μF Chip Capacitors 39K pF Chip Capacitors 10 μF Chip Capacitors 0.2 pF Chip Capacitor 100 Ω, 1/4 W Chip Resistor 08051J1R2BBT 08051J0R7BBT 08051J6R8BBT 100A100JP150X 100A101JP150X 100B101JP500X 100B102JP50X CDR33BX104AKWS 200B393KP50X GRM55DR61H106KA88B 08051J0R2BBT AVX AVX AVX ATC ATC ATC ATC Kemet ATC Kemet AVX Description 13 pF Chip Capacitors Part Number 100A130JP150X Manufacturer ATC MRFG35002N6T1 RF Device Data Freescale Semiconductor 3 LAST ORDER 8 DEC 07 LAST SHIP 8 JUN 08 LIFETIME BUY C13 C12 C11 C10 C9 C8 C7 C18 C17 C16 C15 C14 R1 C5 C6 C19 C20 C22 C21 LIFETIME BUY C2 C1 C3 C4 C23 C24 MRFG35002M6, Rev. 2 3.5 GHz - 3.6 GHz Figure 2. MRFG35002N6 Test Circuit Component Layout MRFG35002N6T1 4 RF Device Data Freescale Semiconductor LAST ORDER 8 DEC 07 LAST SHIP 8 JUN 08 TYPICAL CHARACTERISTICS 14 GT, TRANSDUCER GAIN (dB) 12 VDS = 6 Vdc, IDQ = 75 mA, f = 3550 MHz Single−Carrier W−CDMA, 3.84 MHz Channel Bandwidth ΓS = 0.813é−115.4_, ΓL = 0.748é−147.8_ GT 50 10 30 8 20 6 ηD 4 0 5 10 15 20 25 Pout, OUTPUT POWER (dBm) 10 0 30 LIFETIME BUY Figure 3. Transducer Gain and Drain Efficiency versus Output Power ACPR, ADJACENT CHANNEL POWER RATIO (dBc) −20 VDS = 6 Vdc, IDQ = 75 mA, f = 3550 MHz Single−Carrier W−CDMA, 3.84 MHz Channel Bandwidth ΓS = 0.813é−115.4_, ΓL = 0.748é−147.8_ 0 IRL, INPUT RETURN LOSS (dB) −30 −5 −40 IRL −10 −50 ACPR −60 0 6 12 18 24 Pout, OUTPUT POWER (dBm) −15 −20 30 Figure 4. Single - Carrier W - CDMA ACPR and Input Return Loss versus Output Power NOTE: All data is referenced to package lead interface. ΓS and ΓL are the impedances presented to the DUT. All data is generated from load pull, not from the test circuit shown. ηD, DRAIN EFFICIENCY (%) 40 MRFG35002N6T1 RF Device Data Freescale Semiconductor 5 LAST ORDER 8 DEC 07 LAST SHIP 8 JUN 08 TYPICAL CHARACTERISTICS 14 VDS = 6 Vdc, IDQ = 65 mA, f = 3550 MHz Single−Carrier W−CDMA, 3.84 MHz Channel Bandwidth PAR = 8.5 dB @ 0.01% Probability (CCDF) 50 10 Gps 30 8 20 6 ηD 4 0 6 12 18 24 Pout, OUTPUT POWER (dBm) 10 0 30 LIFETIME BUY Figure 5. Single - Carrier W - CDMA Power Gain and Drain Efficiency versus Output Power ACPR, ADJACENT CHANNEL POWER RATIO (dBc) −20 VDS = 6 Vdc, IDQ = 65 mA, f = 3550 MHz Single−Carrier W−CDMA, 3.84 MHz Channel Bandwidth PAR = 8.5 dB @ 0.01% Probability (CCDF) −30 IRL −40 −15 −10 −5 IRL, INPUT RETURN LOSS (dB) −50 ACPR −60 0 6 12 18 24 Pout, OUTPUT POWER (dBm) −20 −25 30 Figure 6. Single - Carrier W - CDMA ACPR and Input Return Loss versus Output Power NOTE: Data is generated from the test circuit shown. MRFG35002N6T1 6 RF Device Data Freescale Semiconductor ηD, DRAIN EFFICIENCY (%) 12 Gps, POWER GAIN (dB) 40 LAST ORDER 8 DEC 07 LAST SHIP 8 JUN 08 Table 6. Class AB Common Source S - Parameters at VDS = 6 Vdc, IDQ = 65 mA f GHz 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 1.60 1.65 1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 2.15 2.20 2.25 2.30 2.35 2.40 2.45 2.50 2.55 2.60 2.65 2.70 2.75 S11 |S11| 0.906 0.906 0.906 0.906 0.908 0.907 0.907 0.907 0.908 0.908 0.907 0.908 0.909 0.909 0.907 0.907 0.907 0.911 0.904 0.906 0.905 0.907 0.908 0.908 0.908 0.907 0.907 0.907 0.907 0.907 0.906 0.905 0.904 0.905 0.903 0.902 0.901 0.901 0.900 0.899 0.899 0.897 0.896 0.895 0.894 0.893 ∠φ - 173.61 - 175.37 - 176.93 - 178.40 - 179.79 179.01 177.87 176.78 175.82 174.92 174.04 173.19 172.44 171.49 170.67 169.76 168.81 167.94 167.04 165.86 164.68 162.72 161.85 160.93 160.05 159.11 158.22 157.41 156.52 155.57 154.82 153.97 153.06 152.15 151.26 150.30 149.48 148.64 147.66 146.68 145.77 144.90 143.88 143.15 142.07 141.15 |S21| 6.43 5.86 5.38 4.98 4.65 4.34 4.08 3.85 3.65 3.46 3.30 3.15 3.02 2.90 2.79 2.68 2.59 2.50 2.43 2.36 2.30 2.18 2.11 2.06 2.00 1.95 1.90 1.86 1.82 1.78 1.74 1.71 1.67 1.65 1.62 1.59 1.57 1.55 1.53 1.52 1.50 1.49 1.47 1.46 1.45 1.43 S21 ∠φ 84.54 82.68 80.94 79.21 77.51 75.94 74.33 72.72 71.14 69.56 68.00 66.45 64.84 63.23 61.71 60.14 58.62 57.03 55.47 53.91 52.30 51.28 49.87 48.41 46.98 45.59 44.16 42.77 41.41 39.95 38.64 37.30 35.97 34.63 33.28 31.95 30.67 29.34 28.02 26.72 25.40 24.06 22.69 21.34 19.94 18.49 |S12| 0.0316 0.0319 0.0320 0.0317 0.0320 0.0320 0.0321 0.0323 0.0324 0.0322 0.0322 0.0324 0.0325 0.0327 0.0327 0.0328 0.0328 0.0330 0.0334 0.0334 0.0333 0.0325 0.0327 0.0328 0.0328 0.0330 0.0330 0.0330 0.0332 0.0332 0.0335 0.0336 0.0339 0.0339 0.0340 0.0341 0.0344 0.0345 0.0348 0.0351 0.0353 0.0356 0.0361 0.0365 0.0370 0.0375 S12 ∠φ 1.5 0.8 - 0.6 - 1.7 - 2.8 - 3.3 - 4.3 - 5.5 - 6.3 - 6.7 - 7.7 - 8.9 - 9.2 - 10.6 - 11.6 - 12.0 - 13.3 - 14.1 - 14.8 - 16.2 - 16.9 - 17.3 - 17.9 - 18.7 - 19.8 - 20.1 - 20.6 - 21.2 - 22.4 - 22.9 - 23.8 - 24.5 - 25.1 - 26.0 - 26.8 - 27.4 - 28.0 - 28.5 - 29.1 - 29.6 - 30.6 - 31.2 - 31.7 - 32.5 - 33.3 - 34.0 |S22| 0.713 0.714 0.714 0.713 0.713 0.712 0.713 0.713 0.713 0.712 0.711 0.712 0.711 0.711 0.711 0.709 0.709 0.713 0.706 0.707 0.707 0.712 0.712 0.713 0.713 0.712 0.713 0.714 0.713 0.713 0.713 0.712 0.712 0.712 0.711 0.709 0.709 0.707 0.705 0.703 0.703 0.699 0.697 0.695 0.692 0.689 S22 ∠φ - 175.9 - 177.3 - 178.6 - 179.9 178.9 177.6 176.4 175.1 173.7 172.4 171.1 169.7 168.2 167.0 165.7 164.5 163.5 162.3 161.1 160.1 161.0 160.0 159.1 158.1 157.3 156.4 155.6 154.8 154.0 153.4 152.7 152.1 151.5 150.9 150.3 149.7 149.2 148.6 148.0 147.3 146.8 146.2 145.6 144.9 144.2 - 174.6 MRFG35002N6T1 RF Device Data Freescale Semiconductor 7 LAST ORDER 8 DEC 07 LAST SHIP 8 JUN 08 LIFETIME BUY Table 6. Class AB Common Source S - Parameters at VDS = 6 Vdc, IDQ = 65 mA (continued) f GHz 2.80 2.85 2.90 2.95 3.00 3.05 3.10 3.15 3.20 3.25 3.30 3.35 3.40 3.45 3.50 3.55 3.60 3.65 3.70 3.75 3.80 3.85 3.90 3.95 4.00 4.05 4.10 4.15 4.20 4.25 4.30 4.35 4.40 4.45 4.50 4.55 4.60 4.65 4.70 4.75 4.80 4.85 4.90 4.95 5.00 5.05 S11 |S11| 0.890 0.889 0.888 0.887 0.885 0.884 0.883 0.881 0.880 0.879 0.878 0.876 0.876 0.874 0.872 0.871 0.871 0.867 0.867 0.865 0.864 0.863 0.861 0.859 0.859 0.858 0.855 0.854 0.852 0.850 0.851 0.848 0.847 0.846 0.845 0.843 0.840 0.839 0.837 0.835 0.834 0.832 0.831 0.831 0.829 0.826 ∠φ 140.26 139.29 138.19 137.20 136.18 135.00 133.98 132.89 131.67 130.56 129.47 128.25 127.01 125.80 124.44 123.10 121.58 120.32 118.80 117.37 115.86 114.26 112.73 111.11 109.30 107.69 106.01 104.09 102.36 100.53 98.59 96.65 94.71 92.56 90.47 88.43 86.15 83.96 81.79 79.39 77.08 74.81 72.32 69.82 67.43 64.82 |S21| 1.42 1.42 1.41 1.40 1.40 1.39 1.38 1.38 1.37 1.37 1.36 1.36 1.35 1.35 1.35 1.34 1.34 1.33 1.33 1.33 1.32 1.32 1.31 1.31 1.31 1.30 1.30 1.30 1.30 1.29 1.29 1.29 1.29 1.29 1.29 1.29 1.29 1.29 1.29 1.30 1.30 1.30 1.30 1.31 1.31 1.31 S21 ∠φ 17.14 15.69 14.28 12.80 11.33 9.81 8.29 6.77 5.14 3.56 1.92 0.22 - 1.44 - 3.12 - 4.89 - 6.62 - 8.32 - 10.12 - 11.94 - 13.68 - 15.54 - 17.42 - 19.27 - 21.16 - 23.12 - 25.03 - 26.95 - 28.98 - 30.89 - 32.85 - 34.85 - 36.86 - 38.87 - 40.97 - 43.11 - 45.16 - 47.39 - 49.59 - 51.81 - 54.06 - 56.36 - 58.58 - 60.91 - 63.36 - 65.78 - 68.28 |S12| 0.0381 0.0385 0.0386 0.0388 0.0392 0.0394 0.0398 0.0402 0.0407 0.0412 0.0415 0.0419 0.0422 0.0428 0.0431 0.0438 0.0442 0.0449 0.0455 0.0458 0.0458 0.0460 0.0464 0.0469 0.0472 0.0476 0.0482 0.0488 0.0491 0.0498 0.0500 0.0504 0.0509 0.0515 0.0519 0.0526 0.0531 0.0537 0.0541 0.0546 0.0550 0.0554 0.0560 0.0565 0.0571 0.0578 S12 ∠φ - 35.1 - 36.3 - 37.0 - 38.3 - 38.9 - 39.6 - 40.5 - 41.3 - 42.2 - 42.9 - 44.0 - 45.1 - 46.2 - 47.2 - 48.0 - 49.1 - 50.2 - 51.3 - 53.0 - 54.1 - 55.7 - 56.6 - 58.1 - 59.2 - 60.4 - 61.5 - 62.6 - 64.0 - 65.7 - 67.1 - 68.5 - 70.2 - 71.6 - 73.3 - 74.6 - 76.2 - 77.8 - 79.6 - 81.3 - 83.0 - 85.0 - 86.6 - 88.1 - 90.0 - 91.8 - 93.5 |S22| 0.687 0.684 0.682 0.678 0.676 0.671 0.668 0.665 0.662 0.658 0.656 0.651 0.648 0.646 0.642 0.638 0.637 0.633 0.629 0.626 0.624 0.620 0.617 0.615 0.611 0.608 0.605 0.602 0.599 0.596 0.593 0.589 0.586 0.583 0.580 0.576 0.572 0.568 0.564 0.559 0.556 0.550 0.546 0.542 0.537 0.532 S22 ∠φ 142.8 142.0 141.2 140.3 139.4 138.4 137.3 136.2 135.1 133.9 132.8 131.5 130.2 129.0 127.5 126.0 124.9 123.5 122.0 120.5 119.1 117.6 116.1 114.7 113.2 111.8 110.3 108.8 107.4 106.0 104.4 102.9 101.4 99.8 98.2 96.5 94.8 93.0 91.2 89.4 87.6 85.5 83.6 81.5 79.2 143.5 MRFG35002N6T1 8 RF Device Data Freescale Semiconductor LAST ORDER 8 DEC 07 LAST SHIP 8 JUN 08 LIFETIME BUY Table 6. Class AB Common Source S - Parameters at VDS = 6 Vdc, IDQ = 65 mA (continued) f GHz 5.10 5.15 5.20 5.25 5.30 5.35 5.40 5.45 S11 |S11| 0.826 0.824 0.821 0.819 0.818 0.815 0.814 0.812 ∠φ 62.21 59.75 57.08 54.50 51.91 49.24 46.40 43.69 |S21| 1.31 1.31 1.31 1.31 1.32 1.32 1.32 1.32 S21 ∠φ - 70.79 - 73.33 - 75.85 - 78.30 - 80.93 - 83.65 - 86.36 - 89.16 |S12| 0.0583 0.0592 0.0596 0.0605 0.0610 0.0617 0.0626 0.0629 S12 ∠φ - 95.6 - 97.5 - 99.5 - 101.5 - 103.7 - 105.8 - 108.2 - 110.5 |S22| 0.528 0.524 0.519 0.516 0.512 0.510 0.506 0.501 S22 ∠φ 74.7 72.3 70.0 67.4 64.6 61.9 59.0 77.0 MRFG35002N6T1 RF Device Data Freescale Semiconductor 9 LAST ORDER 8 DEC 07 LAST SHIP 8 JUN 08 LIFETIME BUY PACKAGE DIMENSIONS A F 3 0.146 3.71 0.095 2.41 0.115 2.92 B D 1 2 R L 0.115 2.92 0.020 0.51 4 N K Q ZONE V 0.35 (0.89) X 45_" 5 _ 10_DRAFT inches mm SOLDER FOOTPRINT DIM A B C D E F G H J K L N P Q R S U ZONE V ZONE W ZONE X INCHES MIN MAX 0.255 0.265 0.225 0.235 0.065 0.072 0.130 0.150 0.021 0.026 0.026 0.044 0.050 0.070 0.045 0.063 0.160 0.180 0.273 0.285 0.245 0.255 0.230 0.240 0.000 0.008 0.055 0.063 0.200 0.210 0.006 0.012 0.006 0.012 0.000 0.021 0.000 0.010 0.000 0.010 MILLIMETERS MIN MAX 6.48 6.73 5.72 5.97 1.65 1.83 3.30 3.81 0.53 0.66 0.66 1.12 1.27 1.78 1.14 1.60 4.06 4.57 6.93 7.24 6.22 6.48 5.84 6.10 0.00 0.20 1.40 1.60 5.08 5.33 0.15 0.31 0.15 0.31 0.00 0.53 0.00 0.25 0.00 0.25 U H 4 P C Y Y E ZONE W 1 G MRFG35002N6T1 10 RF Device Data Freescale Semiconductor ÉÉÉÉÉÉ ÉÉ ÉÉÉÉ É ÉÉÉÉÉÉ ÉÉ ÉÉÉÉÉÉ ÉÉÉÉ É ÉÉÉÉÉÉ ÉÉ 2 3 NOTES: 1. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1984. 2. CONTROLLING DIMENSION: INCH 3. RESIN BLEED/FLASH ALLOWABLE IN ZONE V, W, AND X. STYLE 1: PIN 1. 2. 3. 4. DRAIN GATE SOURCE SOURCE S ZONE X VIEW Y - Y CASE 466 - 03 ISSUE D PLD- 1.5 PLASTIC PRODUCT DOCUMENTATION Refer to the following documents to aid your design process. Application Notes • AN1955: Thermal Measurement Methodology of RF Power Amplifiers REVISION HISTORY The following table summarizes revisions to this document. Revision 2 Date Jan. 2008 • Listed replacement part, p. 1 • Added Product Documentation and Revision History, p. 11 Description MRFG35002N6T1 RF Device Data Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1 - 800 - 521 - 6274 or +1 - 480 - 768 - 2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1 - 8 - 1, Shimo - Meguro, Meguro - ku, Tokyo 153 - 0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1 - 800 - 441 - 2447 or 303 - 675 - 2140 Fax: 303 - 675 - 2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006, 2008. All rights reserved. MRFG35002N6T1 1Rev. 2, 1/2008 2 Document Number: MRFG35002N6 RF Device Data Freescale Semiconductor
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