CPC1009N

CPC1009N 100V, 150mArms/mADC Single-Pole, Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Load Voltage Load Current On-Resistance (max) Output Leakage, Off-State Ratings 100 150 8 20 Units VP mArms / mADC  nA Description CPC1009N is a miniature low voltage, low on-resistance, low off-state leakage, normally-open (1-Form-A) solid state relay in a 4-pin SOP package. The MOSFET switches and photovoltaic die use IXYS Integrated Circuits' patented OptoMOS® architecture to provide 1500 Vrms of input to output isolation. The optically coupled output is controlled by a highly efficient infrared LED. Features • Extremely Low Output Leakage: 20nA • 1500Vrms Input/Output Isolation • Small 4-Pin SOP Package • Low Drive Power Requirements • High Reliability • No EMI/RFI Generation • Tape & Reel Version Available • Flammability Rating UL 94 V-0 The CPC1009N uses IXYS Integrated Circuits' state of the art double-molded vertical construction to produce one of the world’s smallest 4-pin relays, which offers board space savings of 20% over the competitor’s larger 4-pin SOP relay. Applications • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security Systems • Industrial Controls Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC1009N CPC1009NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control – Control 1 4 3 2 Load Load Switching Characteristics of Normally-Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1009N-R08 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1009N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total PowerDissipation 2 Isolation voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 3.33 mW / ºC Ratings 100 5 50 1 70 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC (Unless Otherwise Noted) Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input to Output 1 2 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 100 - - V t=10ms IL=150mA VL=100VP , T=115ºC IL ILPK RON ILEAK - 5 - 150 ±350 8 20 mArms / mADC mAP  nA IF=0mA, VL=50V, f=1MHz ton toff COUT - 6 2 0.5 - IL=150mA IF=5mA VR=5V IF IF VF IR 0.3 0.9 - 0.87 0.86 1.36 - 2 1.5 10 mA mA V A CIO - 1 - pF IF=5mA, VL=10V VIO=0V, f=1MHz Load current derates linearly from 150mA @ 25oC to120mA @85oC. Measurement taken within 1 second of on-time. www.ixysic.com ms pF R08 INTEGRATED CIRCUITS DIVISION CPC1009N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 15 10 5 1.364 35 15 10 5 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical On-Resistance Distribution (N=50, IL=150mA) 20 15 10 5 0.80 0.85 0.90 0.95 LED Current (mA) 1.00 4.40 4.60 4.80 5.00 5.20 5.40 5 0.75 0.80 0.85 0.90 0.95 1.00 LED Current (mA) Typical Turn-Off Time (N=50, IF=5mA, IL=150mA) 25 20 15 10 5 20 15 10 5 0 0.25 5.60 10 0.70 0 0 15 1.05 Typical Turn-On Time (N=50, IF=5mA, IL=150mA) 25 Device Count (N) 25 20 0 0.75 30 Device Count (N) 20 0 0 Typical IF for Switch Dropout (N=50, IL=100mA) 25 Device Count (N) Device Count (N) 25 20 Typical IF for Switch Operation (N=50, IL=100mA) Device Count (N) 30 0.30 On-Resistance (:) 0.35 0.40 0.45 0.50 Turn-On Time (ms) 0.55 0.21 0.22 0.23 0.24 0.25 0.26 Turn-Off Time (ms) 0.27 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 106 124 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 2.5 LED Current (mA) 1.6 2.0 1.5 1.0 0.5 1.1 -50 -25 0 25 50 Temperature (ºC) 75 100 2.0 1.5 1.0 0.5 0 1.0 Typical IF for Switch Dropout vs. Temperature (IL=100mA) 3.0 2.5 LED Current (mA) LED Forward Voltage Drop (V) 3.0 1.7 112 115 118 121 Blocking Voltage (VP) Typical IF for Switch Operation vs. Temperature (IL=100mA) Typical LED Forward Voltage Drop vs. Temperature 1.8 109 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 80 100 Temperature (ºC) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1009N PERFORMANCE DATA* 0 -50 -100 -150 -1.5 -1.0 -0.5 0 0.5 Load Voltage (V) 1.0 10 8 Steady State Instantaneous IF=5mA 6 4 Turn-On Time (ms) On-Resistance (:) IF=5mA IF=10mA 2 -40 -20 0 20 40 60 80 0.5 0.4 0.3 0.2 0.1 0 5 10 15 20 25 30 35 40 45 50 0 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) Typical Turn-On Time vs. Temperature (IL=100mA) Typical Turn-Off Time vs. Temperature (IL=100mA) IF=5mA IF=10mA -20 0 20 40 60 80 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 IF=10mA IF=5mA -20 -40 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) Typical Maximum Load Current vs. Temperature Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=100VP) 190 122 1.6 180 121 1.4 160 150 140 IF=10mA 130 IF=5mA 120 120 119 118 117 110 116 100 115 -20 0 20 40 60 80 100 120 Leakage (nA) 170 -40 5 LED Forward Current (mA) -40 100 0.7 Temperature (ºC) Blocking Voltage (VP) Load Current (mA) 0 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 Typical Turn-Off Time vs. LED Forward Current (IL=120mA) 0.6 0 1.5 Typical On-Resistance vs. Temperature (IL=150mA) 12 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Turn-Off Time (ms) 50 Typical Turn-On Time vs. LED Forward Current (IL=120mA) Turn-Off Time (ms) 100 Turn-On Time (ms) Load Current (mA) 150 Typical Load Current vs. Load Voltage (IF=5mA) -20 0 20 40 60 Temperature (ºC) 30 20 10 0 50 Load Voltage (V) 75 100 80 100 0 -20 20 40 60 80 100 120 Temperature (ºC) Energy Rating Curve Load Current (A) Output Capacitnace (pF) 0.6 0 -40 40 25 0.8 0.2 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 0 1.0 0.4 Temperature (ºC) 50 1.2 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION CPC1009N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1009N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1009N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R08 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1009N MECHANICAL DIMENSIONS CPC1009N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 ± 0.025 (0.008 ± 0.001) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.559 ± 0.127 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 3.85 (0.152) 1.54 (0.061) 2.030± 0.025 (0.080± 0.001) 2.54 (0.10) Dimensions mm (inches) Package standoff: 0.051 ± 0.051 (0.0020 ± 0.0020) 0.481 (0.019) 0-0.1 (0-0.004) 0.60 (0.024) Note: 1. Lead dimensions do not include plating: 1000 microinches max. 2. Controlling dimension: mm 0.381 ± 0.025 (0.015 ± 0.001) CPC1009NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) A0=6.50 (0.256) P1=8.00 (0.315) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC1009N-R08 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 8/5/2021