CPC1150N
350V, 120mArms/mADC Single-Pole
Normally Closed Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
350
120
50
Units
VP
mArms / mADC
Description
The CPC1150N is a miniature single-pole,
normally-closed (1-Form-B) solid state relay that
uses optically coupled MOSFET technology to
provide 1500Vrms of input to output isolation.
Its optically coupled output, which uses the patented
OptoMOS architecture, is controlled by a highly
efficient infrared LED.
Features
• 1500Vrms Input/Output Isolation
• Low Drive Power Requirements
• High Reliability
• No EMI/RFI Generation
• Small 4-Pin SOP Package
• Tape & Reel Version Available
• Flammability Rating UL 94 V-0
State of the art double-molded vertical construction
packaging enables the CPC1150N to be one of the
world’s smallest 4-pin solid state relays. It offers
board space savings over the competitor’s larger
4-pin SOP relay.
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Industrial Controls
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• TUV EN 62368-1: Certificate # B 082667 0008
Ordering Information
Part #
CPC1150N
CPC1150NTR
Description
4-Pin SOP (100/tube)
4-Pin SOP (2000/reel)
Pin Configuration
+ Control
– Control
1
4
3
2
Load
Load
Switching Characteristics
of Normally-Closed Devices
Form-B
IF
ILOAD
10%
toff
DS-CPC1150N-R11
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90%
ton
1
INTEGRATED CIRCUITS DIVISION
CPC1150N
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature, Ambient
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate output power linearly 3.33 mW / ºC
Ratings
350
5
50
1
70
400
1500
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Blocking Voltage
Load Current
Continuous 1
Peak
On-Resistance
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 2
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
2
Conditions
Symbol
Min
Typ
Max
Units
IL=1A
VDRM
350
-
-
V
t =10ms
IL=120mA
IF=2mA , VL=350VP
IL
ILPK
RON
ILEAK
-
-
120
±350
50
5
mArms / mADC
mAP
µA
IF=2mA, VL=50V, f=1MHz
ton
toff
COUT
-
25
1
2
-
IL=120mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.3
0.9
-
0.6
0.55
1.36
-
2
1.5
10
mA
mA
V
µA
1
-
pF
IF=5mA, VL=10V
VIO=0V, f=1MHz
CIO
Load current derates linearly from 120mA @ 25oC to 85mA @ 85oC.
For applications requiring high temperature operation (greater than 60°C) a minimum LED drive current of 4mA is recommended.
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ms
pF
R11
INTEGRATED CIRCUITS DIVISION
CPC1150N
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
25
Device Count (N)
20
15
10
5
1.364
35
15
10
5
1.366
1.368
1.370
1.372
LED Forward Voltage Drop (V)
Device Count (N)
20
15
10
5
0.50
0.55 0.60 0.65 0.70
LED Current (mA)
39
39.5
40
40.5
41
10
5
0.75
0.45
25
25
20
20
15
10
5
0.55 0.60 0.65 0.70
LED Current (mA)
0.75
15
10
5
0
0.21
41.5
0.50
Typical Turn-Off Time
(N=50, IF=5mA, IL=90mA)
0
0
38.5
15
Typical Turn-On Time
(N=50, IF=5mA, IL=90mA)
Typical On-Resistance Distribution
(N=50, IL=90mA)
25
20
0
0.45
30
Device Count (N)
20
0
0
Typical IF for Switch Dropout
(N=50, IL=90mA)
25
Device Count (N)
Device Count (N)
25
Device Count (N)
30
Typical IF for Switch Operation
(N=50, IL=90mA)
0.22
On-Resistance (:)
0.23 0.24 0.25 0.26
Turn-On Time (ms)
0.27
0.50
0.60
0.70
0.80
0.90
1.00
1.10
Turn-Off Time (ms)
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
377.5 388.5 399.5 410.5 421.5 432.5 443.5
Blocking Voltage (VP)
Typical IF for Switch Operation
vs. Temperature
(IL=50mA)
3.0
1.8
1.7
150
1.6
IF=10mA
IF=5mA
IF=2mA
1.5
1.4
1.3
1.2
Load Current (mA)
2.5
LED Current (mA)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
2.0
1.5
1.0
-50
-25
0
25
50
Temperature (ºC)
75
100
50
0
-50
-150
0
1.0
100
-100
0.5
1.1
Typical Load Current vs. Load Voltage
(IF=0mA)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-6
-4
-2
0
2
4
6
Load Voltage (V)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R11
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3
INTEGRATED CIRCUITS DIVISION
CPC1150N
PERFORMANCE DATA*
0.5
0.4
0.3
0.2
0.1
0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
Typical Turn-On Time
vs. Temperature
(IL=50mA)
Typical Turn-Off Time
vs. Temperature
(IL=50mA)
IF=5mA
-20
0
20
40
60
Temperature (ºC)
80
100
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
0.016
425
0.014
420
Leakage (µA)
Blocking Voltage (VP)
Typical Blocking Voltage
vs. Temperature
430
415
410
405
60
5
-40
-20
0
20
40
60
Temperature (ºC)
80
100
20
10
-20
0
20
40
60
80
100
100
120
Maximum Load Current
vs. Temperature
(IF=0mA)
180
160
IF=5mA
140
120
100
80
60
40
20
IF=10mA
0
-20
0
20
40
60
Temperature (ºC)
80
100
-40
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=350V)
0.010
0.008
0.006
-20
0
20
40
60
Temperature (ºC)
80
-20
0
20
40
60
80
Temperature (ºC)
Energy Rating Curve
0.012
0
-40
-40
Temperature (ºC)
0.002
395
30
50
45
0.004
400
40
0
10 15 20 25 30 35 40
LED Forward Current (mA)
IF=10mA
Typical On-Resistance
vs. Temperature
(IF=0mA, IL=Max Rated)
50
0
Turn-Off Time (ms)
Turn-On Time (ms)
0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
On-Resistance (:)
Turn-Off Time (ms)
Turn-On Time (ms)
0.6
Load Current (A)
0.7
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
Load Current (mA)
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms
1s
10s 100s
Time
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
4
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R11
INTEGRATED CIRCUITS DIVISION
CPC1150N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
CPC1150N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum
dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification
Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes.
Device
Classification Temperature (Tc)
Dwell Time (tP)
Max Reflow Cycles
CPC1150N
260ºC
30 seconds
3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to halide flux or solvents.
R11
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5
INTEGRATED CIRCUITS DIVISION
CPC1150N
Mechanical Dimensions
CPC1150N
4.089 ± 0.025
(0.161 ± 0.001)
Recommended PCB Land Pattern
0.203 ± 0.025
(0.008 ± 0.001)
0.60
(0.024)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.025
(0.150 ± 0.001)
0.559 ± 0.127
(0.022 ± 0.005)
0.910 ± 0.025
(0.036 ± 0.001)
Pin 1
2.54 Typ
(0.100 Typ)
2.030± 0.025
(0.080± 0.001)
0.481
(0.019)
0-0.1
(0-0.004)
Package standoff:
0.051 ± 0.051
(0.0020 ± 0.0020)
0.381 ± 0.025
(0.015 ± 0.001)
3.85
(0.152)
1.54
(0.061)
2.54
(0.10)
Dimensions
mm
(inches)
Note:
1. Lead dimensions do not include plating: 1000 microinches max.
2. Controlling dimension: mm
CPC1150NTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=12.00
(0.472)
B0=4.70
(0.185)
K0=2.70
(0.106)
K1=2.30
(0.091)
P1=8.00
(0.315)
A0=6.50
(0.256)
User Direction of Feed
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
For additional information please visit our website at: https://www.ixysic.com
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
6
Specification: DS-CPC1150N-R11
©Copyright 2021, Littelfuse, Inc.
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
8/5/2021
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