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SACB12

SACB12

  • 厂商:

    HAMLIN(力特)

  • 封装:

    SMB(DO-214AA)

  • 描述:

    TVS DIODE 12VWM 19VC SMD

  • 数据手册
  • 价格&库存
SACB12 数据手册
Transient Voltage Suppression Diodes Surface Mount – 500W > SACB series SACB Series RoHS Pb e3 Description Uni-directional SACB series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features Agency Approvals AGENCY AGENCY FILE NUMBER E230531 Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Peak Pulse Power Dissipation at TL=25OC by 10/1000μs Waveform (fig.1)( Note 1) Symbol Value Unit PPPM 500 W Power Dissipation on Infinite Heat Sink at TL=50ºC PD 3.0 W Operating Temperature Range TJ -65 to 150 °C TSTG -65 to 175 °C Storage Temperature Range Note: 1. Non-repetitive current pulse , per Fig. 3 and derated above TJ (initial) = 25OC per Fig. 2. Resources © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/27/16 • Glass passivated chip junction • Fast response time: typically less than 1.0ps from 0V to BV min • Excellent clamping capability • Low incremental surge resistance • High temperature to reflow soldering guaranteed: 260°C/40sec • Plastic package is flammability rated V-0 per Underwriters Laboratories • Meet MSL level1, per J-STD-020, LF maximun peak of 260°C • Matte tin lead–free plated • Halogen free and RoHS compliant • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01) Applications Additional Infomarion Datasheet • 500W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01% • For surface mounted applications in order to optimize board space • Low profile package • Built-in strain relief • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact) • ESD protection of data lines in accordance with IEC 61000-4-2 • EFT protection of data lines in accordance with IEC 61000-4-4 • VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%) Samples TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. Transient Voltage Suppression Diodes Surface Mount – 500W > SACB series Electrical Characteristics (T =25°C unless otherwise noted) A Part Number Marking Code SACB5.0 SACB6.0 SACB7.0 SACB8.0 SACB8.5 SACB10 SACB12 SACB15 SACB18 SACB22 SACB26 SACB30 SACB36 SACB45 SACB50 SKE SKG SKM SKR SKT SKX SLE SLM SLT SLX SME SMK SMP SMV SMZ Stand-Off Voltage VR (V) Maximum Minimum Maximum Maximum Maximum Peak Clamping Breakdown Reverse Junction Pulse Voltage at IT Leakage at Voltage at Current per Capacitance IPP=5.0A =1.0MA at IR@ VR (Fig.3) 0 Volts (pF) (uA) VBR(V) VC(V) IPP(A) 5.0 6.0 7.0 8.0 8.5 10.0 12.0 15.0 18.0 22.0 26.0 30.0 36.0 45.0 50.0 7.60 7.90 8.33 8.89 9.44 11.10 13.30 16.70 20.00 24.40 28.90 33.30 40.00 50.00 55.50 300 300 300 100 50 5 5 5 5 5 5 5 5 5 5 10.0 11.2 12.6 13.4 14.0 16.3 19.0 23.6 28.8 35.4 42.3 48.6 60.0 77.0 88.0 44.0 41.0 38.0 36.0 34.0 29.0 25.0 20.0 15.0 14.0 11.1 10.0 8.6 6.8 5.8 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 Working Inverse Blocking Voltage VWIB(V) Inverse Blocking Peak Inverse Leakage Blocking Current at Voltage V PIB VWIB@ IIB (V) (mA) 75 75 75 75 75 75 75 75 75 75 75 75 75 150 150 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Agency Approval 100 100 100 100 100 100 100 100 100 100 100 100 100 200 200 X X X X X X X X X X X X X X X Ratings =25°C unless otherwise noted Ratings and and Characteristic Characteristic Curves Curves (T (T = 25°C unless otherwise noted) A A Figure 1 - Peak Pulse Power Rating Curve Figure 2 - Peak Pulse Power Derating Curve 100 Peak Pulse Power (PPP) or Current (IPP) Derating in Percentage % IPPM - Peak Pulse Power (kW) 100 30 10 1 Impulse Exponential Decay µ PPK ".5" td td PPK Half Sine td=7tp PPK 0.1 0.001 td Square Current Waveforms 0.01 0.1 1 10 t d - Pulse Width (ms) Figure 3 - Pulse Waveform 80 60 40 20 0 0 25 50 75 100 125 150 TJ - Initial Junction Temperature (ºC) 175 Figure 4 - AC Line Protection Application IPPM- Peak Pulse Current, % IRSM 150 tr=10µsec TJ=25°C Pulse Width(td) is defined as the point where the peak current decays to 50% of IPPM Peak Value IPPM 100 Half Value IPPM IPPM ( ) 2 50 0 10/1000µsec. Waveform as defined by R.E.A Low Capacitance Application Note: Device must be used with two units in parallel, opposite in polarity as shown in circuit for AC signal line protection. td 0 1.0 2.0 3.0 4.0 t-Time (ms) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/27/16 Transient Voltage Suppression Diodes Surface Mount – 500W > SACB series Soldering Parameters Lead–free assembly Reflow Condition Pre Heat 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TA) to peak 3°C/second max TS(max) to TA - Ramp-up Rate 3°C/second max Reflow - Temperature (TA) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Ramp-up TL Temperature (T) - Temperature Min (Ts(min)) tp TP tL Critical Zone TL to TP Ts(max) Ramp-down Ts(min) ts Preheat 25˚C t 25˚C to Peak Time (t) Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Flow/Wave Soldering (Solder Dipping) Ramp-down Rate 6°C/second max Peak Temperature : 265OC Time 25°C to peak Temperature (TP) 8 minutes Max. Dipping Time : 10 seconds Do not exceed 260°C Soldering : 1 time Environmental Specifications Physical Specifications Weight 0.003oz., 0.093g High Temp. Storage JESD22-A103 Case JEDEC DO-214AA molded plastic body over glass passivated junction. HTRB JESD22-A108 Polarity Color band denotes cathode except Bidirectional Temperature Cycling JESD22-A104 Terminal Matte Tin-plated leads. Solderable per JESD22-B102. MSL JEDEC-J-STD-020, Level 1 H3TRB JESD22-A101 RSH JESD22-A111 Dimensions DO-214AA (SMB J-Bend) Dimensions C B H D E F G Dimension in inches and (millimeters) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/27/16 33 Millimeters Max A 0.077 B 0.160 Cathode Band A Inches Min Min Max 0.086 1.950 2.200 0.180 4.060 4.570 C 0.130 0.155 3.300 3.940 D 0.084 0.096 2.130 2.440 E 0.030 0.060 0.760 1.520 F - 0.008 - 0.203 G 0.205 0.220 5.210 5.590 H 0.006 0.012 0.152 0.305 Transient Voltage Suppression Diodes Surface Mount – 500W > SACB series Part Numbering System XX Cathode Band F SACB Part Marking System Series Type Stand Off Voltage XX YMXXX Littelfuse Logo Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Packaging Part number SACBXX Component Package DO-214AA Quantity 3000 Packaging Option Tape & Reel - 12mm tape/13” reel Packaging Specification EIA STD RS-481 Schematic Transient Voltage Suppressor Diode Tape and Reel Specification 0.157 (4.0) 0.47 (12.0) Cathode 0.315 (8.0) 0.059 DIA (1.5) Cover tape 13.0 (330) 0.80 (20.2) Arbor Hole Dia. 0.49 (12.5) Dimensions are in inches (and millimeters). Direction of Feed © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/27/16
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