SP3002-04JTG

TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series SP3002 Series 0.85pF Diode Array RoHS Pb GREEN Description The SP3002 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features I/O 1 I/O 4 GND V CC I/O 2 I/O 3 I/O 1 1 NC 2 I/O 2 3 6 Gnd 5 4 μDFN-6 (1.6x1.6x0.5mm) SC70-6 Functional Block Diagram V CC I/O 3 • Small packaging options saves board space • E  SD protection of ±12kV contact discharge, ±15kV air discharge, (IEC 61000-4-2) • L  ightning Protection, IEC 61000-4-5, 2nd edition 4.5A (8/20µs) • E  FT protection, IEC 61000-4-4, 40A (5/50ns) • RoHS-Compliant and Lead-Free • AEC-Q101 qualified • L  ow leakage current of 0.5μA (MAX) at 5V Applications I/O4 V CC I/O2 I/O 4 • L  ow capacitance of 0.85 pF (TYP) per I/O • Computer Peripherals • Network Hardware/Ports • Mobile Phones • Test Equipment • PDA’s • Medical Equipment • Digital Cameras GND I/O1 I/O3 Application Example +5V Additional Information D2+ D2+ Gnd D2- D26 1 Datasheet Resources Samples 5 4 SP300x-04 2 3 D1+ D1+ Gnd D1HDMI or DVI Connector D1HDMI or DVI Interface IC D0+ D0+ Gnd D0- D06 1 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Clk+ 5 4 SP300x-04 2 3 Clk+ Gnd Clk- ClkGnd A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be floated or NC. © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/23/20 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Thermal Information Absolute Maximum Ratings Symbol Parameter IPP Peak Current (tp=8/20μs) 4.5 A Storage Temperature Range TOP Operating Temperature –40 to 125 °C Maximum Junction Temperature °C Maximum Lead Temperature (Soldering 20-40s) TSTOR Value Storage Temperature Units –55 to 150 Parameter Rating Units –55 to 150 °C 150 °C 260 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR ≤ 1µA 6.0 V Reverse Leakage Current ILEAK VR=5V 0.5 µA Clamp Voltage1 VC 9.5 11.0 V 10.6 13.0 ESD Withstand Voltage1 IPP=1A, tp=8/20µs, Fwd IPP=2A, tp=8/20µs, Fwd IEC61000-4-2 (Contact) VESD Diode Capacitance1 CI/O-GND Diode Capacitance1 CI/O-I/O V ±12 kV IEC61000-4-2 (Air) ±15 Reverse Bias=0V 0.95 1.1 1.25 pF kV Reverse Bias=1.65V 0.7 0.85 1.0 pF Reverse Bias=0V 0.5 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1.50 0 1.40 I/O Capacitance (pF) Insertion Loss [dB] 1.30 -5 -10 -15 1.20 VCC = Float 1.10 1.00 VCC = 3.3V 0.90 0.80 VCC = 5V 0.70 0.60 -20 1.E+06 0.50 1.E+07 1.E+08 Frequency [Hz] 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/23/20 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Capacitance vs. Frequency Product Characteristics Lead Plating SC70: Matte Tin μDFN: Pre-Plated Frame Lead Material Copper Alloy 1.4E-12 Lead Coplanarity 0.0004 inches (0.102mm) 1.2E-12 Substitute Material Silicon 1E-12 Body Material Molded Epoxy 8E-13 Flammability UL Recognized compound meeting flammability rating V-0 2E-12 1.8E-12 Capacitance [F] 1.6E-12 6E-13 4E-13 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate Reflow 3°C/second max - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C +0/-5 tP TP °C Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/23/20 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Package Dimensions — SC70-6 6 Package e e 4 5 6 JEDEC MO-203 HE E Symbol B D Millimeters Min Max Min Max 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 A2 A A1 0.65 BSC e C Inches A 3 2 1 SC70-6 Pins 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Solder Pad Layout L Package Dimensions — μDFN-6 (1.6x1.6x0.5mm) Bottom View Top View A D 6 5 Package 0.05 C L 4 4 6 5 0.05 C E 1 2 3 Symbol MO-229 Millimeters 2 3 B 1 ℮ Side View 0.05 C A3 A1 A Pin 1 chamfer 0.10 x 45’ Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.127 Ref 0.002 0.005 Ref b 0.20 0.30 0.008 0.012 D 1.50 1.70 0.060 0.067 D2 1.05 1.30 0.042 0.052 E 1.50 1.70 0.060 0.067 E2 0.40 0.65 0.016 0.50 Ref e Seating plane Inches Min A3 E2 Pin 1 Index Area μDFN-6 (1.6x1.6x0.5mm) JEDEC D2 L 0.25 0.026 0.020 Ref 0.40 0.010 0.016 C b 0.10 M C A B 0.05 M C Ordering Information Part Numbering System SP 3002 -04 * T G TVS Diode Arrays (SPA® Diodes) G= Green Series Number of Channels Package J = SC70-6 U = μDFN-6 -04 = 4 channel T= Tape & Reel Part Number Package Marking SP3002-04JTG SC70-6 μDFN-6 (1.6x1.6x0.5mm) E*4 Min. Order Qty. 3000 E*4 3000 SP3002-04UTG Part Marking System E * 4 E*4 Product Series Number of Channels E = SP3002 series Assembly Site (varies) © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/23/20 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Embossed Carrier Tape & Reel Specification — SC70-6 Symbol Millimetres Inches Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 40.0± 0.20 10P0 1.574±0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 0.27 Max t 0.318 0.010 Max D Embossed Carrier Tape & Reel Specification — μDFN-6 (1.6x1.6x0.5mm) t E P2 Symbol Millimetres Max Min Max E 1.65 1.85 0.06 0.07 F 3.45 3.55 0.14 0.14 D1 1.00 1.25 0.04 0.05 4.10 0.15 1.50 MIN W D P0 3.90 B0 F 0.16 1.57±0.01 W 7.90 8.30 0.31 0.33 P2 1.95 2.05 0.08 0.08 A0 1.78 1.88 0.07 0.07 B0 1.78 1.88 0.07 0.07 K0 0.84 0.94 0.03 t 0.25 TYP 0.04 0.01 TYP K0 A0 P0 0.06 MIN 40.0± 0.20 10P0 D1 Inches Min Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/23/20