HAT2050T

HAT2050T Silicon N Channel Power MOS FET High Speed Power Switching ADE-208-660A (Z) 2nd. Edition February 1999 Features • • • • Low on-resistance Capable of 4 V gate drive Low drive current High density mounting Outline TSSOP–8 65 34 87 1 D 8 D 12 4 G 5 G SS 23 SS 67 MOS1 MOS2 1, 8 Drain 2, 3, 6, 7 Source 4, 5 Gate HAT2050T Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Channel dissipation Channel dissipation Channel temperature Storage temperature Note: Symbol VDSS VGSS ID I D(pulse) I DR Pch Pch Tch Tstg Note2 Note3 Note1 Ratings 100 ± 20 1 4 1 1.0 1.5 150 – 55 to + 150 Unit V V A A A W W °C °C 1. PW ≤ 10 µs, duty cycle ≤ 1 % 2. 1 Drive operation : When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW≤ 10s 3. 2 Drive operation : When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW≤ 10s Electrical Characteristics (Ta = 25°C) Item Symbol Min 100 ± 20 — — 1.3 — — 0.7 — — — — — — — — — Typ — — — — — 0.56 0.72 1.1 90 42 20 11 24 14 11 0.84 85 Max — — ± 10 1 2.3 0.75 1.0 — — — — — — — — 1.1 — Unit V V µA µA V Ω Ω S pF pF pF ns ns ns ns V ns I F = 1 A, VGS = 0 Note4 I F = 1 A, VGS = 0 diF/ dt = 20 A/µs Test Conditions I D = 10 mA, VGS = 0 I G = ± 100 µA, VDS = 0 VGS = ± 16 V, VDS = 0 VDS = 100 V, VGS = 0 VDS = 10 V, I D = 1 mA I D = 0.5 A, VGS = 10 V Note4 I D = 0.5 A, VGS = 4 V Note4 I D = 0.5 A, VDS = 10 V Note4 VDS = 10 V VGS = 0 f = 1MHz VGS = 4 V, ID = 0.5 A VDD ≅ 10 V Drain to source breakdown voltage V(BR)DSS Gate to source breakdown voltage V(BR)GSS Gate to source leak current Zero gate voltege drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body–drain diode forward voltage Body–drain diode reverse recovery time Note: 4. Pulse test I GSS I DSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss t d(on) tr t d(off) tf VDF t rr 2 HAT2050T Main Characteristics Power vs. Temperature Derating Test Condition : When using the glass epoxy board (FR4 40x40x1.6 mm), PW < 10 s Maximum Safe Operation Area 10 µs 10 0 2.0 Pch (W) 10 3 I D (A) 1 0.3 0.1 0.03 0.01 1.5 DC Op PW 1 µs m er Channel Dissipation Drain Current ati = s on 10 1.0 1 Dr (P m s 0.5 ive 2 ive Dr Op er at ion Operation in this area is limited by R DS(on) W < 10 te5 s) No Op er at ion 0 50 100 150 Ta (°C) 200 Ta = 25°C 0.003 1 shot Pulse 1 Drive Operation 0.001 3 1 10 0.2 Drain to Source Voltage 30 100 200 Ambient Temperature V DS (V) Note 5 : When using the glass epoxy board (FR4 40x40x1.6 mm) 5 Typical Output Characteristics Pulse Test 5 Typical Transfer Characteristics I D (A) 5V 3 6V 4.0 V (A) 4 10V 8V 4 –25°C 3 25°C Tc = 75°C Drain Current 2 3.0 V 1 VGS = 2.5 V 0 2 4 6 Drain to Source Voltage 8 10 V DS (V) Drain Current ID 2 1 V DS = 10 V Pulse Test 0 2 4 6 Gate to Source Voltage 10 8 V GS (V) 3 HAT2050T Drain to Source Saturation Voltage vs. Gate to Source Voltage Drain to Source Saturation Voltage V DS(on) (V) Pulse Test Drain to Source On State Resistance R DS(on) ( Ω ) 2.0 Static Drain to Source on State Resistance vs. Drain Current 20 Pulse Test 10 5 1.6 ID=2A 1.2 2 0.8 1A 0.4 0.5 A 0 2 4 6 Gate to Source Voltage 8 V GS (V) 10 4V 1 0.5 VGS = 10 V 0.2 0.2 0.5 1 2 5 10 20 Drain Current I D (A) Static Drain to Source on State Resistance R DS(on) (Ω ) 1.6 1, 0.5 A ID = 2 A Forward Transfer Admittance |y fs | (S) Static Drain to Source on State Resistance vs. Temperature 2.0 5 Forward Transfer Admittance vs. Drain Current 2 1 0.5 0.2 0.1 0.05 0.02 Tc = –25 °C 1.2 0.8 1, 0.5 A 0.4 0 –40 4V VGS = 2.5 V 0 40 80 2A 75 °C 25 °C Pulse Test 120 Tc (°C) 160 V DS = 10 V Pulse Test 0.05 0.1 0.2 0.5 1 2 Case Temperature Drain Current I D (A) 4 HAT2050T Body–Drain Diode Reverse Recovery Time Typical Capacitance vs. Drain to Source Voltage VGS = 0 f = 1 MHz Ciss Coss 500 Reverse Recovery Time trr (ns) 200 100 50 1000 300 100 30 10 3 1 0 20 10 5 0.1 di/dt = 20 A/µs V GS = 0, Ta = 25°C 0.2 0.5 1 2 5 10 Reverse Drain Current I DR (A) Capacitance C (pF) Crss 10 20 30 40 50 Drain to Source Voltage V DS (V) Dynamic Input Characteristics V DS (V) 50 I D= 1 A 40 V DD = 5 V 10 V 20 V 8 V GS 6 10 V GS (V) 100 50 Switching Time t (ns) 20 10 5 Switching Characteristics V GS = 4 V, V DD = 10 V PW = 5 µs, duty < 1 % t d(off) t d(on) tr Drain to Source Voltage Gate to Source Voltage 30 20 V DS tf 4 V DD = 20 V 10 V 5V 10 2 0 4.0 2 1 0.01 0.02 0 0.8 1.6 2.4 3.2 Gate Charge Qg (nc) 0.05 0.1 Drain Current 0.2 0.5 1 I D (A) 5 HAT2050T Reverse Drain Current vs. Souece to Drain Voltage 5 Pulse Test Reverse Drain Current I DR (A) 4 3 2 5V 1 V GS = 0 0 0.4 0.8 1.2 1.6 2.0 Source to Drain Voltage V SD (V) Normalized Transient Thermal Impedance vs. Pulse Width (1 Drive Operation) 10 Normalized Transient Thermal Impedance γ s (t) 1 D=1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 1s h p ot uls e θ ch – f(t) = γ s (t) • θ ch – f θ ch – f = 166 °C/W, Ta = 25 °C When using the glass epoxy board (FR4 40x40x1.6 mm) PDM PW T 0.001 D= PW T 0.0001 10 µ 100 µ 1m 10 m 100 m 1 10 100 1000 10000 Pulse Width PW (S) 6 HAT2050T Normalized Transient Thermal Impedance vs. Pulse Width (2 Drive Operation) 10 Normalized Transient Thermal Impedance γ s (t) 1 D=1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 t ho pu lse θ ch – f(t) = γ s (t) • θ ch – f θ ch – f = 210 °C/W, Ta = 25 °C When using the glass epoxy board (FR4 40x40x1.6 mm) PDM PW T 0.001 1s D= PW T 0.0001 10 µ 100 µ 1m 10 m 100 m 1 10 100 1000 10000 Pulse Width PW (S) Switching Time Test Circuit Vin Monitor D.U.T. RL Vin Vin 4V 50 Ω V DD = 10 V Vout Vout Monitor Switching Time Waveform 90% 10% 10% 90% td(on) tr 90% td(off) tf 10% 7 HAT2050T Package Dimensions Unit: mm 3.00 ± 0.1 4.40 ± 0.1 8 5 1 4 1.10 Max 6.40 ± 0.20 0.17 ± 0.05 0.07 +0.03 –0.04 0.65 0.10 0.22 +0.08 –0.07 0–8° 0.50 ± 0.10 0.13 M Hitachi Code EIAJ Code JEDEC Code TTP–8D — — 8 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: (408) 433-1990 Fax: (408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: (89) 9 9180-0 Fax: (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: (1628) 585000 Fax: (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: (2) 2718-3666 Fax: (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: (2) 735 9218 Fax: (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.