W2635A

W2635A and W2636A DDR3 BGA Probe Adapter for Infiniium Oscilloscopes Data Sheet Superior probing for DDR3 compliance test and debug The Agilent Technologies' W2635A and W2636A DDR3 BGA probe adapters provide signal access to the clock, strobe, data, address and command signals of the DDR3 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. The DDR3 JEDEC1 specification (JESD79-3C) is defined at the DRAM ballout, and the ballout is difficult to access. The BGA probe adapter provides direct signal access to the BGA package for true compliance testing. The W2635A and W2636A DDR3 BGA probe adapters are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM footprint on the bottom side and the DRAM footprint on the top side. The BGA adapter passes the signals from the memory controller chip and DRAM directly to the top side of the BGA probe adapter where they can be accessed with oscilloscope probes. Buried resistors placed at the signals inside the BGA probe adapter connect the probed signals to solder pads designed to work with Agilent InfiniiMax E2677A, N5381A, N5425A, and N5426A differential solder-in probe heads. These resistors isolate the DDR3 signal and the probe loading effect. This design minimizes capacitive loading of the probe heads and allows high-speed operation without impact on signal integrity. Probing at the right location is also an important consideration for DDR3 measurement. Many designs have vias or designed-in probe points, but they do not always produce good signal integrity. Probing at the wrong location could cause signal reflection, resulting in non-monotonic edges. This will cause error in your tests such as slew rate, setup and hold time measurements. When used with Agilent's U7231A DDR3 compliance test application, the BGA adapter provides a fast and easy way to test, debug and characterize your DDR3 designs. The tests covered by the U7231A software are based on the JEDEC (JESD79-3C) DDR3 SDRAM Specification. The test application offers a user-friendly setup wizard and a comprehensive report that includes margin analysis. 1 The JEDEC (Joint Electronic Device Engineering Council) Solid State Technology Association is a semiconductor engineering standardization body of the Electronic Industries Alliance (EIA), a trade association that represents all areas of the electronic industry. Superior probing for DDR3 compliance test and debug Features • Provides signal access points for DDR3 DRAM x4, x8 and x16 packages using JEDEC-standard common BGA footprints to the oscilloscope • 10-mm and 11-mm BGA probe adapter widths for different spacing requirement between the DRAM placements on the PCB or DIMM • Buried resistors provide signal isolation and minimize capacitive loading • Probing compatibility with InfiniiMax probe, which includes E2677A, N5381A, and N5425A/ N5426A differential solder-in probe heads Installing the DDR3 BGA probe adapter The W2635A and W2636A DDR3 BGA probe adapter is installed by soldering it to the BGA footprint on the PC board or DIMM card where the DRAM normally would be soldered. Then you can solder the DDR3 DRAM to the top side of the BGA probe adapter. These attachment steps may occur in any order. The probe is designed to tolerate lead-free soldering temperature profiles. However, we recommend you apply the minimum temperature required for soldering and you use the minimum number of heating and cooling cycles to reduce risk of any damage to the probe. The probe is supplied without solder balls attached. Depending on the exact attachment order, you may prefer to use either leaded or lead-free solder to attach the BGA probe adapter. We recommend you attach the BGA probe during the manufacturing process. For designs that are manufactured, it will require expertise to attach the BGA probe adapter. If you lack the in-house expertise to attach the BGA probe adapter, you may wish to work with a contract manufacturer with this expertise that may be willing to perform the attachment for a fee. You can find more information on BGA soldering and rework techniques that may be useful in attaching the probe at: http://www.circuitrework.com/ guides/9-0.shtm http://www.agilent.com/find/ ddr3bga-scope Figure 1. The diagram above shows the top (left) and bottom (right) view of the W2636A DDR3 BGA probe adapter. The top side shows the footprint for DDR3 DRAM and the bottom side shows the footprint for a PC board or DIMM card. 2 Superior probing for DDR3 compliance test and debug Installing the InfiniiMax probe You can use the DDR3 BGA probe adapter with various InfiniiMax solder-in probes. Instructions that come with the InfiniiMax probe provide details on the proper soldering procedures for the InfiniiMax probe heads. Figure 2. The picture above shows the InfiniiMax N5425A and N5426A ZIF probe head connected to the W2636A DDR3 BGA probe adapter. 3 DDR3 BGA probe adapters dimensions, pad numbering and location W2635A-010 dimensions, pad numbering and location Size Height = 13.97 mm (0.550 in) Width = 11.176 mm (0.440 in) Thickness = 1.575 mm (0.062 in) Brings 20 signals to SMT pads for probing Provides 12 GND pads (6 on either side of DDR3 BGA probe adapter) 75-ohm buried tip resistor Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Signal GND LDQS LDQS# GND RAS CAS GND ODT CS0 Table 1. W2635A-010 pad numbering GND CS1 WE GND BA0 BA2 GND Signal GND DQ1 DQ3 GND DQ7 DQ5 GND CK CK# GND CKE A10 GND BA1 A12 GND Pin # 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 4 DDR3 BGA probe adapters dimensions, pad numbering and location W2635A-011 dimensions, pad numbering and location Size Height = 13.97 mm (0.550 in) Width = 12.192 mm (0.480 in) Thickness = 1.575 mm (0.062 in) Brings 20 signals to SMT pads for probing Provides 12 GND pads (6 on either side of DDR3 BGA probe adapter) 75-ohm buried tip resistor Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Signal GND LDQS LDQS# GND RAS CAS GND ODT CS0 GND CS1 WE GND BA0 BA2 GND Table 2. W2635A-011 pad numbering Signal GND DQ1 DQ3 GND DQ7 DQ5 GND CK CK# GND CKE A10 GND BA1 A12 GND Pin # 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 5 DDR3 BGA probe adapters dimensions, pad numbering and location W2636A-010 dimensions, pad numbering and location Size Height = 19.05 mm (0.750 in) Width = 11.176 mm (0.440 in) Thickness = 1.575 mm (0.062 in) Brings 26 signals to SMT pads for probing Provides 14 GND pads (7 on either side of DDR3 BGA probe adapter) 75-ohm buried tip resistor Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Signal GND DQ13 DQ19 GND DQ0 LDQS GND LDQS# RAS GND CAS ODT GND CS0 CS1 GND WE BA0 GND BA2 Table 3. W2636A-010 pad numbering Signal GND DQ12 DQ14 GND UDQS# UDQS GND DQ3 DQ5 GND CK CK# GND CKE A10 GND BA1 A12 GND A11 Pin # 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 6 DDR3 BGA probe adapters dimensions, pad numbering and location W2636A-011 dimensions, pad numbering and location Size Height = 19.05 mm (0.750 in) Width = 12.192 mm (0.480 in) Thickness = 1.575 mm (0.062 in) Brings 26 signals to SMT pads for probing Provides 14 GND pads (7 on either side of DDR3 BGA probe adapter) 75-ohm buried tip resistor Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Signal GND DQ13 DQ9 GND DQ0 LDQS GND LDQS# RAS GND CAS ODT GND CS0 CS1 GND WE BA0 GND BA2 Table 4. W2636A-011 pad numbering Signal GND DQ12 DQ14 GND UDQS# UDQS GND DQ3 DQ5 GND CK CK# GND CKE A10 GND BA1 A12 GND A11 Pin # 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 7 Ordering information DDR3 BGA probe adapter model numbers and options. Each model comes with a kit of 10 BGA probe adapters. Model number W2635A-010 W2635A-011 W2636A-010 W2636A-011 Description x8, 10 mm width DDR3 BGA probe adapter for x4 and x8 DRAM package x8, 11 mm width DDR3 BGA probe adapter for x4 and x8 DRAM package x16, 10 mm width DDR3 BGA probe adapter for x16 DRAM package x16, 11 mm width DDR3 BGA probe adapter for x16 DRAM package Infiniium oscilloscope and InfiniiMax oscilloscope probe amplifiers and probe heads that are recommended for use with the DDR3 BGA probe adapters Product Description 9000 Series 9404A 4-GHz 4-channels 10 GSa/s Infiniium scope 90000 Series 90404A 90604A 90804A 91204A 91304A 4-GHz, 4 channels Infiniium scope 6-GHz, 4 channels Infiniium scope 8-GHz, 4 channels Infiniium scope 12-GHz, 4 channels Infiniium scope 13-GHz, 4 channels Infiniium scope 8 Ordering information Probe accessories InfiniiMax probe amplifiers Model number 1169A 1168A 1134A 1132A 1131A Description 12-GHz differential probe amplifier 10-GHz differential probe amplifier 7-GHz differential probe amplifier 5-GHz differential probe amplifier 3.5-GHz differential probe amplifier InfiniiMax probe heads Model number N5381A N5382A E2677A N5425A N5426A N5451A Description InfiniiMax II 12-GHz differential solder-in probe head and accessories InfiniiMax II 12-GHz differential browser InfiniiMax 12-GHz differential solder-in probe head and accessories InfiniiMax 12-GHz ZIF probe head InfiniiMax ZIF tips (x10) (requires both N5425A and N5426A) InfiniiMax differential long wire ZIF tip (x10) (requires both N5425A and N5451A) Related literature Publication title Infiniium 90000 Series Oscilloscopes and InfiniiMax Series Probes Agilent InfiniiScan Event Identification Software for Infiniium 80000 and 8000 Series Oscilloscopes (N5414A and 5415A) Agilent Technologies E2688A, N5384A High-Speed Serial Data Analysis and Clock Recovery Software for Infiniium Series Oscilloscopes Agilent Technologies EZJIT and EZJIT Plus Jitter Analysis Software for Infiniium Series Oscilloscopes A Time-Saving Method for Analyzing Signal Integrity in DDR Memory Buses Publication type Data sheet Data sheet Data sheet Data sheet Application note Publication number 5989-7819EN 5989-4605EN 5989-0108EN 5989-0109EN 5989-6664EN To download copies of these publications go to www.agilent.com/find/ddr3bga-scope 9 Agilent Technologies Oscilloscopes Multiple form factors from 20 MHz to >90 GHz | Industry leading specs | Powerful applications 10 www.agilent.com www.agilent.com/find/ddr3bga-scope For more information on Agilent Technologies’ products, applications or services, please contact your local Agilent office. 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