TLE4998S3

D ata Sheet, V 1.0, July 2008 TLE4998S3 TLE4998S4 Programmable Linear Hall Sensor Sensors Never stop thinking. Edition 2008-07 Published by Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany © Infineon Technologies AG 2008. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. TLE4998S Revision History: Previous Version: Page Subjects (major changes since last revision) 2008-07 V 1.0 We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: sensors@infineon.com Template: mc_a5_ds_tmplt.fm / 4 / 2004-09-15 TLE4998S 1 1.1 1.2 1.3 2 2.1 2.2 2.3 2.4 3 4 5 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Target Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 7 7 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Principle of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Transfer Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Electrical, Thermal, and Magnetic Parameters . . . . . . . . . . . . . . . . . . . 14 Calculation of the Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 16 Magnetic Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Signal Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Magnetic Field Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Temperature Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Magnetic Field Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gain Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Offset Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP Input Low-Pass Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 18 18 19 20 20 21 23 6 6.1 6.2 6.3 6.4 6.5 7 7.1 7.2 8 8.1 9 9.1 9.2 9.3 9.4 10 11 12 13 Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Voltages Outside the Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 EEPROM Error Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Temperature Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Parameter Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Calibration Data Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Programming Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Data Transfer Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Programming of Sensors with Common Supply Lines . . . . . . . . . . . . . . . 28 29 30 30 30 Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 TLE4998S3 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 TLE4998S4 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 SENT Output Definition (SAE J2716) . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 4 V 1.0, 2008-07 Data Sheet TLE4998S 13.1 13.2 13.3 Basic SENT Protocol Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Unit Time Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Checksum Nibble Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Data Sheet 5 V 1.0, 2008-07 Programmable Linear Hall Sensor TLE4998S3 TLE4998S4 1 1.1 Overview Features • Single Edge Nibble Transmission (SENT) open-drain output signal (SAE J2716) • 20-bit Digital Signal Processing (DSP) • Digital temperature compensation • 16-bit overall resolution • Operates within automotive temperature range • Low drift of output signal over temperature and lifetime • Programmable parameters stored in EEPROM with single-bit error correction: – SENT unit time – Magnetic range and sensitivity (gain), polarity of the output slope – Offset – Bandwidth – Clamping levels – Customer temperature compensation coefficients – Memory lock • Re-programmable until memory lock • Single supply voltage 4.5 - 5.5 V (4.1 - 16 V in extended range) • Operation between -200 mT and +200 mT within three ranges • Reverse-polarity and overvoltage protection for all pins • Output short-circuit protection • On-board diagnostics (overvoltage, EEPROM error, start up) • Output of internal magnetic field values and temperature • Programming and operation of multiple sensors with common power supply • Two-point calibration of magnetic transfer function without iteration steps • High immunity against mechanical stress, EMC, ESD Type TLE4998S3 TLE4998S4 Data Sheet Marking 4998S3 4998S4 6 Ordering Code SP412108 SP412110 Package PG-SSO-3-10 PG-SSO-4-1 V 1.0, 2008-07 TLE4998S Overview 1.2 Target Applications • Robust replacement of potentiometers – No mechanical abrasion – Resistant to humidity, temperature, pollution and vibration • Linear and angular position sensing in automotive applications such as pedal position, suspension control, throttle position, headlight levelling, and steering torque sensing • Sensing of high current for battery management, motor control, and electronic fuses 1.3 Pin Configuration Figure 1 and Figure 2 show the location of the Hall element in the chip and the distance between Hall probe and the surface of the package. 2.03 ±0.1 1.625 ±0.1 0.38 ±0.05 Center of Hall Probe Branded Side Hall-Probe 1 2 3 AEP03717 Figure 1 Table 1 Pin No. 1 2 3 TLE4998S3 Pin Configuration and Hall Cell Location TLE4998S3 Pin Definitions and Functions Symbol Function Supply voltage / programming interface Ground Output / programming interface VDD GND OUT Data Sheet 7 V 1.0, 2008-07 TLE4998S Overview B A 1.53 2.67 0.2 B Center of sensitive area d Branded Side Hall-Probe 1 2 3 4 0.2 A d : Distance chip to branded side of IC PG-SSO-4-1: 0.3 ±0.08 mm AEP03654 Figure 2 Table 2 Pin No. 1 2 3 4 TLE4998S4 Pin Configuration and Hall Cell Location TLE4998S4 Pin Definitions and Functions Symbol Function Test pin (connection to GND is recommended) Supply voltage / programming interface Ground Output / programming interface TST VDD GND OUT Data Sheet 8 V 1.0, 2008-07 TLE4998S General 2 2.1 General Block Diagram Figure 3 is a simplified block diagram. VDD Bias Supply EEPROM A D Interface TST *) spinning HALL DSP Temp. Sense A D OUT SENT GND ROM Figure 3 Block Diagram (TLE4998S4) *) TLE4998S4 only 2.2 Functional Description The linear Hall IC TLE4998S has been designed specifically to meet the requirements of highly accurate rotation and position detection, as well as for current measurement applications. The sensor provides a digital SENT signal based on the SAE J2716 standard, which consists of a sequence of pulses. Each transmission has a constant number of nibbles containing the Hall value, the temperature, and status information of the sensor. The output stage is an open-drain driver pulling the output pin to low only. Therefore, the high level needs to be obtained by an external pull-up resistor. This output type has the advantage that the receiver may use an even lower supply voltage (e.g. 3.3 V). In this case the pull-up resistor must be connected to the given receiver supply. The IC is produced in BiCMOS technology with high voltage capability, and it also has reverse-polarity protection. Data Sheet 9 V 1.0, 2008-07 TLE4998S General Digital signal processing using a 16-bit DSP architecture together with digital temperature compensation guarantee excellent long-time stability compared to analog compensation methods. While the overall resolution is 16 bits, some internal stages work with resolutions up to 20 bits. 2.3 Principle of Operation • A magnetic flux is measured by a Hall-effect cell • The output signal from the Hall-effect cell is converted from analog to digital • The chopped Hall-effect cell and continuous-time A/D conversion ensure a very low and stable magnetic offset • A programmable low-pass filter to reduce noise • The temperature is measured and A/D converted, too • Temperature compensation is done digitally using a second-order function • Digital processing of output value is based on zero field and sensitivity value • The output value range can be clamped by digital limiters • The final output value is represented by the data nibbles of the SENT protocol Data Sheet 10 V 1.0, 2008-07 TLE4998S General 2.4 Transfer Functions The examples in Figure 4 show how different magnetic field ranges can be mapped to the desired output value ranges. • Polarity Mode: – Bipolar: Magnetic fields can be measured in both orientations. The limit points do not necessarily have to be symmetrical around the zero field point – Unipolar: Only north- or south-oriented magnetic fields are measured • Inversion: The gain can be set to both positive and negative values OUT12 / OUT16 OUT12 / OUT16 4095 / 65535 B (mT) 50 B (mT) B (mT) 200 OUT12 / OUT16 4095 / 65535 4095 / 100 65535 0 0 0 0 0 0 -50 -100 -200 Example 1: - Bipolar Example 2: - Unipolar - Big offset Example 3: - Bipolar - Inverted (neg. gain) Figure 4 Examples of Operation Data Sheet 11 V 1.0, 2008-07 TLE4998S Maximum Ratings 3 Table 3 Parameter Maximum Ratings Absolute Maximum Ratings Symbol TST TJ VDD IDDov IDDrev - 40 - 40 -18 -1 -13) Limit Values min. max. 150 170 18 15 0 184) unlimited 4.0 1) Unit °C °C V mA mA V T kV Notes Storage temperature Junction temperature Voltage on VDD pin with respect to ground Supply current @ overvoltage VDD max. Reverse supply current @ VDD min. 2) Voltage on output pin with VOUT respect to ground Magnetic field ESD protection 1) 2) BMAX VESD According HBM JESD22-A114-B 5) For limited time of 96 h. Depends on customer temperature lifetime cycles. Please ask for support by Infineon Higher voltage stress than absolute maximum rating, e.g. 150% in latch-up tests is not applicable. In such cases, Rseries ≥100 Ω for current limitation is required IDD can exceed 10 mA when the voltage on OUT is pulled below -1 V (-5 V at room temperature) 3) 4) 5) VDD = 5 V, open drain permanent low, for max. 10 minutes 100 pF and 1.5 kΩ Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Data Sheet 12 V 1.0, 2008-07 TLE4998S Operating Range 4 Operating Range The following operating conditions must not be exceeded in order to ensure correct operation of the TLE4998S. All parameters specified in the following sections refer to these operating conditions, unless otherwise indicated. Table 4 Parameter Operating Range Symbol Limit Values min. max. 5.5 16 5 8 125 1504) 2) Unit V V V kΩ mA nF °C Notes Supply voltage Output pull-up voltage3) Load resistance3) Output current3) Load capacitance3) Junction temperature VDD Vpull-up RL IOUT CL TJ 4.5 4.1 1 0 1 - 40 1) Extended range 18 For 5000 h For 1000 h not additive 1) 2) 3) For reduced output accuracy For supply voltages > 12 V, a series resistance Rseries ≥ 100 Ω is recommended Required output protocol characteristics depend on these parameters, RL must be according to max. output current For reduced magnetic accuracy; extended limits are taken for characteristics 4) Note: Keeping signal levels within the limits specified in this table ensures operation without overload conditions. Data Sheet 13 V 1.0, 2008-07 TLE4998S Electrical, Thermal, and Magnetic Parameters 5 Table 5 Parameter Electrical, Thermal, and Magnetic Parameters Electrical Characteristics Symbol tSENT IDD IOUTsh RthJA RthJC RthJA RthJC tPon VDDpon ZOUT tfall trise tlow tHIGH min VOUTsat Limit Values min. typ. max. 3 19 2 6 95 1 8 Unit Notes ms mA mA VOUT = 5 V, max. 10 minutes 1) SENT transmission time Supply current Output current @ OUT shorted to supply lines Thermal resistance TLE4998S3 Thermal resistance TLE4998S4 Power-on time2) Power-on reset level Output impedance Output fall time Output rise time Output low time Output min. high time Output max. high time Output low saturation voltage Output noise (rms) 1) 2) 219 47 41 0.7 15 3.6 30 20 9 36 0.3 0.2 1 2 20 4 44 4 0.6 0.4 2.5 240 - K/W Junction to air K/W Junction to case K/W Junction to air K/W Junction to case ms V kΩ µs µs µs µs µs V 3) ≤ ± 5% target out value ≤ ± 1% target out value VOUT 4.5 V to 0.5 V 4) VOUT 0.5 V to 4.5 V 4)5) SENT edge generation SENT “0” nibble SENT synchron. frame IOUTsink = 5 mA IOUTsink = 2.2 mA tHIGH max - 168 - OUTnoise - LSB12 6) Transmission time depends on the data values being sent and on int. RC oscillator freq. variation of +/- 20% Response time to set up output data at power on when a constant field is applied. The first value given has a ± 5% error, the second value has a ± 1% error. Measured with 640-Hz low-pass filter VDD = 5V, open drain high state, voltage on OUT pin typ. 84% of VDD For VDD = 5 V, RL = 2.2 kΩ, CL = 4.7 nF 3) 4) Data Sheet 14 V 1.0, 2008-07 TLE4998S Electrical, Thermal, and Magnetic Parameters 5) Depends on external RL and CL VOUT *) t HIGH tlow VDD 90% VDD 10% VDD VOUTsat *) RL to VDD assumed trise tfall 6) t Range 100 mT, Gain 2.23, internal LP filter 244 Hz, B = 0 mT, T = 25 °C Data Sheet 15 V 1.0, 2008-07 TLE4998S Electrical, Thermal, and Magnetic Parameters Calculation of the Junction Temperature The internal power dissipation PTOT of the sensor increases the chip junction temperature above the ambient temperature. The power multiplied by the total thermal resistance RthJA (Junction to Ambient) added to TA leads to the final junction temperature. RthJA is the sum of the addition of the two components, Junction to Case and Case to Ambient. RthJA = RthJC + RthCA TJ = TA + Δ T ΔT = RthJA x PTOT = RthJA x ( VDD x IDD + VOUT x IOUT ) Example (assuming no load on Vout and TLE4998S4 type): – VDD = 5 V – IDD = 8 mA – ΔT = 240 [K/W] x (5 [V] x 0.008 [A] + 0 [VA] ) = 9.6 K IDD , IOUT > 0, if direction is into IC For moulded sensors, the calculation with RthJC is more adequate. Magnetic Parameters Table 6 Parameter Sensitivity Magnetic Characteristics Symbol Limit Values min. S1) ± 8.2 -150 ± 50 - 0.1 - 400 -5 0 typ. 0 max. ± 245 LSB12/ Programmable2)3) mT 150 ppm/ °C %MFR μT μT 4) Unit Notes Temperature TC coefficient of sensitivity Magnetic field range Integral nonlinearity Magnetic offset Magnetic offset drift Magnetic hysteresis 1) 2) 3) See Figure 5 Programmable 6) 7)9) 8)9) MFR INL BOS ΔBOS BHYS ± 1005) ± 200 mT 0 0.1 400 5 10 μT / °C Error band9) 10) Defined as ΔOUT / ΔB Programmable in steps of 0.024% @ VDD = 5 V and TJ = 25 °C Data Sheet 16 V 1.0, 2008-07 TLE4998S Electrical, Thermal, and Magnetic Parameters 4) 5) 6) 7) 8) 9) 10) For any 1st and 2nd order polynomial, coefficient within definition in Chapter 8. This range is also used for temperature and offset pre-calibration of the IC Depending on offset and gain settings, the output may already be saturated at lower fields Gain setup is 1.0 In operating temperature range and over lifetime Measured at ± 100 mT range Measured in 100 mT range, Gain = 1, room temperature ΔS ~ S(T)/S0-1 max. pos. TC-error TCmax = ΔS/ΔT ΔS0 0 Tmin T0 Tmax Tj max. neg. TC-error TCmin = ΔS/ΔT Figure 5 Drift of Temperature Coefficient Data Sheet 17 V 1.0, 2008-07 TLE4998S Signal Processing 6 Signal Processing The signal flow diagram in Figure 6 shows the signal path and data-processing algorithm. Range Hall Sensor Temperature Sensor A D LP Gain + Limiter ( Clamp) X X Protocol Generation out Offset TC 2 X X A D + TC 1 1 X + Stored in EEPROM Memory -T0 Temperature Compensation Figure 6 Signal Processing Flow Magnetic Field Path • The analog output signal of the chopped Hall-effect cell is converted to a digital signal in the continuous-time A/D converter. The range of the chopped A/D converter can be set in several steps (see Table 7). This gives a suitable level for the A/D converter • After the A/D conversion, a digital low-pass filter reduces the bandwidth (Table 11) • A multiplier amplifies the value depending on the gain (see Table 9) and temperature compensation settings • The offset value is added (see Table 10) • A limiter reduces the resulting signal to 16 bits (see Chapter 13) and feeds the Protocol Generation stage Temperature Compensation (Details are listed in Chapter 8) • The output signal of the temperature cell is also A/D converted Data Sheet 18 V 1.0, 2008-07 TLE4998S Signal Processing • The temperature is normalized by subtraction of the reference temperature T0 value (zero point of the quadratic function) • The linear path is multiplied with the TC1 value • In the quadratic path, the temperature difference to T0 is squared and multiplied with the TC2 value • Both path outputs are added together and multiplied with the Gain value from the EEPROM 6.1 Magnetic Field Ranges The working range of the magnetic field defines the input range of the A/D converter. It is always symmetrical around the zero field point. Any two points in the magnetic field range can be selected to be the end points of the output value. The output value is represented within the range between the two points. In the case of fields higher than the range values, the output signal may be distorted. The range must be set before the calibration of offset and gain. Table 7 Range Low Mid High 1) Range Setting Range in mT1) ± 50 ± 100 ± 200 Parameter R 3 12) 0 Ranges do not have a guaranteed absolute accuracy. The temperature pre-calibration is performed in the mid range (100 mT) Setting R = 2 is not used, internally changed to R = 1 2) Table 8 Parameter Register size Range Symbol Limit Values min. max. 2 bit Unit Notes R Data Sheet 19 V 1.0, 2008-07 TLE4998S Signal Processing 6.2 Gain Setting The overall sensitivity is defined by the range and the gain setting. The output of the ADC is multiplied with the Gain value. Table 9 Parameter Register size Gain range 1) Gain Symbol Limit Values min. max. 15 - 4.0 3.9998 244.14 bit ppm Unsigned integer value 1)2) Unit Notes G Gain Gain quantization steps ΔGain Corresponds to 1/4096 For Gain values between - 0.5 and + 0.5, the numerical accuracy decreases To obtain a flatter output curve, it is advisable to select a higher range setting A gain value of +1.0 corresponds to typical 32 LSB12/mT sensitivity (100 mT range, not guaranteed). It is crucial to do a final calibration of each IC within the application using the Gain/OUTOS value 2) The Gain value can be calculated by : ( G – 16384 ) Gain = ----------------------------4096 6.3 Table 10 Parameter Offset Setting Offset Symbol Limit Values min. max. bit LSB12 LSB12 Unsigned integer value 1) The offset value corresponds to an output value with zero field at the sensor. Unit Notes Register size Offset range Offset quantization steps 1) 15 OS OUTOS -16384 16383 ΔOUTOS 1 Infineon pre-calibrates the samples at zero field to 50% output value (100 mT range), but does not guarantee the value. Therefore it is crucial to do a final calibration of each IC within the application The offset value can be calculated by: OUT OS = OS – 16384 Data Sheet 20 V 1.0, 2008-07 TLE4998S Signal Processing 6.4 DSP Input Low-Pass Filter A digital low-pass filter is placed between the Hall A/D converter and the DSP, and can be used to reduce the noise level. The low-pass filter has a constant DC amplification of 0 dB (Gain of 1), which means that its setting has no influence on the internal Hall ADC value. The bandwidth can be set to any of 8 values. Table 11 0 1 2 3 4 5 6 7 1) Low Pass Filter Setting Cutoff frequency in Hz (-3dB point)1) 80 240 440 640 860 1100 1390 off Note: Parameter LP As this is a digital filter running with an RC-based oscillator, the cutoff frequency may vary within ±20% Table 12 Parameter Register size Low-Pass Filter Symbol Limit Values min. max. 3 - 20 + 20 bit % Unit Notes Corner frequency variation LP Δf Note: In range 7 (filter off), the output noise increases. Data Sheet 21 V 1.0, 2008-07 TLE4998S Signal Processing Figure 7 shows the filter characteristics as a magnitude plot (the highest setting is marked). The “off” position would be a flat 0 dB line. The update rate after the low-pass filter is 16 kHz. 0 -1 Magnitude (dB) -2 -3 -4 -5 -6 101 10 2 10 3 Frequency (Hz) Figure 7 DSP Input Filter (Magnitude Plot) Data Sheet 22 V 1.0, 2008-07 TLE4998S Signal Processing 6.5 Clamping The clamping function is useful for separating the output range into an operating range and error ranges. If the magnetic field is exceeding the selected measurement range, the output value OUT is limited to the clamping values. Table 13 Parameter Register size Clamping value low Clamping value high Clamping quantization steps 1) 2) 3) Clamping Symbol Limit Values min. max. 2x7 0 0 65535 65535 512 bit LSB16 LSB16 LSB16 (0...127) 1) 1) 2) 3) Unit Notes CL,CH OUTCL OUTCH ΔOUTCx For CL = 0 and CH = 127, the clamping function is disabled OUTCL < OUTCH mandatory Quantization starts for CL at 0 LSB16 and for CH at 65535 LSB16 The clamping values are calculated by: Clamping value low (deactivated if CL=0): O UT CL = CL ⋅ 32 ⋅ 16 Clamping value high (deactivated if CH=127): OUT CH = ( CH + 1 ) ⋅ 32 ⋅ 16 – 1 Data Sheet 23 V 1.0, 2008-07 TLE4998S Signal Processing Figure 8 shows an example in which the magnetic field range between Bmin and Bmax is mapped to output values between 10240 LSB16 and 55295 LSB16. OUT ( LSB16) 65535 Error range 55295 OUTCH Operating range 10240 OUTCL Error range Bmin Bmax 0 B (mT) Figure 8 Clamping Example Note: The clamping high value must be above the low value. If OUTCL is set to a higher value than OUTCH, the OUTCH value is dominating. This would lead to a constant output value independent of the magnetic field strength. Data Sheet 24 V 1.0, 2008-07 TLE4998S Error Detection 7 Error Detection Different error cases can be detected by the On-Board Diagnostics (OBD) and reported to the microcontroller in the status nibble (see Chapter 13). 7.1 Table 14 Parameter Voltages Outside the Operating Range Overvoltage Symbol Limit Values min. typ. max. 18.35 V 1) The output signals an error condition if VDD crosses the overvoltage threshold level. Unit Notes Overvoltage threshold 1) VDDov 16.65 17.5 Overvoltage bit activated in status nibble, output stays in “off” state (high ohmic) 7.2 EEPROM Error Correction The parity method is able to correct a single bit in the EEPROM line. One other single bit error in another EEPROM line can also be detected, but not corrected. In an uncorrectable EEPROM failure, the open drain stage is disabled and kept in the off state permanently (high ohmic/sensor defect). Data Sheet 25 V 1.0, 2008-07 TLE4998S Temperature Compensation 8 Temperature Compensation The magnetic field strength of a magnet depends on the temperature. This material constant is specific for the different magnet types. Therefore, the TLE4998S offers a second-order temperature compensation polynomial, by which the Hall signal output is multiplied in the DSP. There are three parameters for the compensation: • Reference temperature T0 • A linear part (1st order) TC1 • A quadratic part (2nd order) TC2 The following formula describes the sensitivity dependent on the temperature in relation to the sensitivity at the reference temperature T0: S TC ( T ) = 1 + TC1 × ( T – T 0 ) + TC2 × ( T – T 0 ) 2 For more information, please refer to the signal processing flow in Figure 6. The full temperature compensation of the complete system is done in two steps: 1. Pre-calibration in the Infineon final test The parameters TC1, TC2, T0 are set to maximally flat temperature characteristics with respect to the Hall probe and internal analog processing parts. 2. Overall system calibration The typical coefficients TC1, TC2, T0 of the magnetic circuitry are programmed. This can be done deterministically, as the algorithm of the DSP is fully reproducible. The final setting of the TC1, TC2, T0 values depend on the pre-calibrated values. Table 15 Parameter Register size TC1 1st order coefficient TC1 Quantization steps of TC1 Register size TC2 2nd order coefficient TC2 Quantization steps of TC2 Reference temp. Quantization steps of T0 1) 2) 3) Temperature Compensation Symbol Limit Values Unit min. max. 9 15.26 -4 - 48 1 8 4 0.119 64 bit ppm/ °C ppm/ °C bit ppm/ °C² ppm/ °C² °C °C 3) Notes Unsigned integer values 1) TL TC1 qTC1 TQ TC2 qTC2 T0 qT0 - -1000 2500 Unsigned integer values 2) Full adjustable range: -2441 to +5355 ppm/°C, can be only used after confirmation by Infineon Full adjustable range: -15 to +15 ppm/°C², can be only used after confirmation by Infineon Handled by algorithm only (see Application Note) Data Sheet 26 V 1.0, 2008-07 TLE4998S Temperature Compensation 8.1 Parameter Calculation The parameters TC1 and TC2 may be calculated by: TL – 160 TC 1 = ---------------------- × 1000000 65536 TQ – 128 TC2 = ----------------------- × 1000000 8388608 Now the digital output for a given field BIN at a specific temperature can be calculated by: ⎛ B IN ⎞ OUT = 2 ⋅ ⎜ ------------ × S TC × S TCHall × S 0 × 4096⎟ + OUT OS ⎝ B FSR ⎠ BFSR is the full-range magnetic field. It is dependent on the range setting (e.g 100 mT). S0 is the nominal sensitivity of the Hall probe times the Gain factor set in the EEPROM. STC is the temperature-dependent sensitivity factor calculated by the DSP. STCHall is the temperature behavior of the Hall probe. The pre-calibration at Infineon is performed such that the following condition is met: S TC ( T J – T 0 ) × S TCHall ( T J ) ≈ 1 Within the application, an additional factor BIN(T) / BIN(T0) is given due to the magnetic system. STC then needs to be modified to STCnew so that the following condition is satisfied: B IN ( T ) -------------------- × S TCnew ( T ) × S TCHall ( T ) ≈ S TC ( T ) × S TCHall ( T ) ≈ 1 B IN ( T 0 ) Therefore, the new sensitivity parameters STCnew can be calculated from the precalibrated setup STC using the relationship: B IN ( T ) -------------------- × S TCnew ( T ) ≈ S TC ( T ) B IN ( T 0 ) Data Sheet 27 V 1.0, 2008-07 TLE4998S Calibration 9 Calibration For the calibration of the sensor, a special hardware interface to a PC is required. All calibration and setting bits can be temporarily written into a Random Access Memory (RAM). This allows the EEPROM to remain untouched during the entire calibration process, since the number of the EEPROM programming cycles is limited. Therefore, this temporary setup (using the RAM only) does not stress the EEPROM. The digital signal processing is completely deterministic. This allows a two-point calibration to be performed in one step without iterations. After measuring the Hall output signal for the two end points, the signal processing parameters Gain and Offset can be calculated. Table 16 Parameter Calibration Characteristics Symbol Limit Values min. Ambient temperature at TCAL calibration 2 point Calibration accuracy1) 1) Unit °C LSB12 LSB12 Notes max. 30 8 8 10 ΔOUTCAL1 -8 ΔOUTCAL2 -8 Position 1 Position 2 Corresponds to ± 0.2% accuracy in each position Data Sheet 28 V 1.0, 2008-07 TLE4998S Calibration 9.1 Calibration Data Memory When the MEMLOCK bits are programmed (two redundant bits), the memory content is frozen and may no longer be changed. Furthermore, the programming interface is locked out and the chip remains in application mode only, preventing accidental programming due to environmental influences. Column Parity Bits R ow Parity Bits User-Calibration Bits Pre-Calibration Bits Figure 9 EEPROM Map A matrix parity architecture allows automatic correction of any single-bit error. Each row is protected by a row parity bit. The sum of bits set (including this bit) must be an odd number (ODD PARITY). Each column is additionally protected by a column parity bit. Each bit in the even positions (0, 2, etc.) of all lines must sum up to an even number (EVEN PARITY), and each bit in the odd positions (1, 3, etc.) must have an odd sum (ODD PARITY). The parity column must have an even sum (EVEN PARITY). This system of different parity calculations also protects against many block errors (such as erasing a full line or even the whole EEPROM). When modifying the application bits (such as Gain, Offset, TC, etc.), the parity bits must be updated. As for the column bits, the pre-calibration area must be read out and considered for correct parity generation as well. Note: A specific programming algorithm must be followed to ensure data retention. A detailed separate programming specification is available on request. Data Sheet 29 V 1.0, 2008-07 TLE4998S Calibration Table 17 Parameter Number of EEPROM programming cycles Programming Characteristics Symbol Limit Values min. max. 10 30 150 26 Cycles1) Programming allowed only at start of lifetime °C ms Bit Bit For complete memory 2) All active EEPROM bits All parity EEPROM bits Unit Notes NPRG 10 100 Ambient temperature at TPRG programming Programming time Calibration memory Error Correction 1) 2) tPRG - 1 cycle is the simultaneous change of ≥ 1 bit Depending on clock frequency at VDD, write pulse 10 ms ±1%, erase pulse 80 ms ±1% 9.2 Programming Interface The VDD pin and the OUT pin are used as a two-wire interface to transmit the EEPROM data to and from the sensor. This allows: • Communication with high data reliability • The bus-type connection of several sensors and separate programming via the OUT pin 9.3 Data Transfer Protocol The data transfer protocol is described in a separate document (User Programming Description), available on request. 9.4 Programming of Sensors with Common Supply Lines In many automotive applications, two sensors are used to measure the same parameter. This redundancy makes it possible to continue operation in an emergency mode. If both sensors use the same power supply lines, they can be programmed together in parallel. Data Sheet 30 V 1.0, 2008-07 TLE4998S Application Circuit 10 Application Circuit Figure 10 shows the connection of multiple sensors to a microcontroller. Sensor Module Voltage Supply Sensor Voltage Supply µC ECU Module VDD V DD µC V dd 2k2 50 47nF TLE 4998 GND OUT1 out CCin1 1 nF GND 4.7nF VGND CCin2 2k2 V DD 47nF TLE out 4998 GND OUT2 50 optional 4.7nF 1 nF Figure 10 Application Circuit Note: For calibration and programming, the interface has to be connected directly to the OUT pin. The application circuit shown should be regarded as an example only. It will need to be adapted to meet the requirements of other specific applications. Data Sheet 31 V 1.0, 2008-07 TLE4998S TLE4998S3 Package Outlines 11 TLE4998S3 Package Outlines 45˚ 5˚ 0.1 MAX. 4.06 ±0.05 1.5 B 2A 1.5 ±0.05 1 ±0.2 (0.25) 1) 0.5 ±0.1 0.42 ±0.05 3x 0.5 B 4.05 ±0.05 0.82 ±0.05 0.36 ±0.05 1 2 3 2 x 1.27 = 2.54 12.7 ±1 2C (10) (Useable Length) 19 ±0.5 33 MAX. +0.75 C 9 -0.50 18 ±0.5 A 6 ±0.5 Tape 6.35 ±0.4 12.7 ±0.3 Total tolerance at 19 pitches ±1 1) No solder function area Molded body dimensions do not unclude plastic or metal protrusion of 0.15 max per side P-PG-SSO-3-10-PO V02 4 ±0.3 0.25 -0.15 0.39 ±0.1 Figure 11 Data Sheet PG-SSO-3-10 (Plastic Green Single Small Outline Package) 32 V 1.0, 2008-07 1-1 Adhesive Tape TLE4998S TLE4998S4 Package Outlines 12 TLE4998S4 Package Outlines 5.34 ±0.05 5.16 ±0.08 0.2 2A 0.1 MAX. 3.38 ±0.06 1.9 MAX. 3.71±0.08 1 x 45˚ ±1˚ 1-0.1 0.25 ±0.05 7˚ (0.25) 1 MAX.1) 0.2 +0.1 4x 0.5 0.4 ±0.05 0.6 MAX. 1 2 3 4 1.27 3 x 1.27 = 3.81 12.7 ±1 (14.8) (Useable Length) 23.8 ±0.5 38 MAX. 7˚ 9 +0.75 -0.5 18 ±0.5 6 ±0.5 A Adhesive Tape Tape 0.25 -0.15 0.39 ±0.1 GPO05357 6.35 ±0.4 12.7 ±0.3 Total tolerance at 10 pitches ±1 1) No solder function area 4 ±0.3 Figure 12 Data Sheet PG-SSO-4-1 (Plastic Green Single Small Outline Package) 33 V 1.0, 2008-07 1-1 TLE4998S SENT Output Definition (SAE J2716) 13 SENT Output Definition (SAE J2716) The sensor supports a basic version of the Single Edge Nibble Transmission (SENT) protocol defined by SAE. The main difference between the standard version and its implementation in the TLE4998 is the usage of an open drain instead of a push-pull output. 13.1 • Basic SENT Protocol Definition • • • • The single edge is defined by a 9-µs low pulse on the output, followed by the high time defined in the protocol (nominal values, may vary by tolerance of internal RC oscillator and the programming, see Section 13.2). All values are multiples of a 3-µs unit time frame concept. A transfer consists of the following parts:A synchronization period of 168 µs (in parallel, a new sample is calculated) A status nibble of 36-81 µs Three data nibbles of 36-81 µs (data packet 1 with a length of 108-243 µs) Three data nibbles of 36-81 µs (data packet 2 with a length of 108-243 µs) A CRC nibble of 36-81 µs Sensor processing compensate the sample transfer compensated sample Output pin (physical) register decim ation filter values taken from Sam pling point: N sam ext pe Transferred data (logical) sync. period Status nibble Data nibble 1 high Data nibble 1 mid Data nibble 2 low CRC nibble Figure 13 SENT Frame The CRC checksum calculation includes the status nibble and the data nibbles. This leads to a minimum transfer time of 456 µs, and a maximum transfer time of 816 µs per sample. It is important to know that the sampling time (when values are taken for temperature compensation) here is always defined as the beginning of the synchronization period; during this period, the resulting data is always calculated from scratch. Data Sheet 34 V 1.0, 2008-07 TLE4998S SENT Output Definition (SAE J2716) As only one Hall value needs to be transferred within one sequence, the second data package is divided into two parts (see Table 20): • First, the remaining 4 LSBs of the Hall signals are transferred in the first data nibble. This means the receiver may use the whole 16-bit data available in the sensor when reading and using all 4 nibbles transferred. • Second, the temperature is transferred as an 8-bit value. The value is transferred in unsigned integer format and corresponds to -55°C to 200°C. For example, transferring the value 55 corresponds to 0°C. The temperature is additional information and although it is not calibrated, may be used for a plausibility check, for example. Table 18 - 55°C 0°C 25°C 200°C 1) Mapping of Temperature Value 0 55 80 255 Theoretical upper limit1) Theoretical lower limit1) Junction Temperature Typ. Decimal Value from Sensor Note Theoretical range of temperature values, not operating temperature range The status nibble as defined in the SAE standard has two free bits (the LSBs or first and second bit). These bits contain the selected magnetic range of the sensor and therefore allow the received data to be interpreted easily. As no serial data is transferred with the IC, the remaining bits of the status nibble are not required. The MSB (fourth bit) notifying a start of a serial transmission and the data bit (or third bit) would be kept zero. Thus, these bits are used in a more suitable way for this sensor, as shown in Table 20. In case of startup- or supply overvoltage condition, the open-drain stage is disabled (high ohmic) and the corresponding status bits are set. After VDD has returned to the normal operating range, this status information will be transmitted within the first SENT transmission. In case of uncorrectable EEPROM failure, the open-drain stage is disabled and is kept in “switched off” state permanently (high ohmic/ sensor defect). The fourth bit is switched to “1” for the first data package transferred after a reset. This allows the receiver to detect low-voltage situations or EMC problems of the sensor. The third bit is set to “1” in case of an over-voltage condition of the IC. This signals that a sensor is still functioning, but its performance may be out of specification. It enables an early warning for high supply voltage, before the sensor completely stops functioning (e.g. VDD > 17.5 V, see Chapter 7.1). Data Sheet 35 V 1.0, 2008-07 TLE4998S SENT Output Definition (SAE J2716) 13.2 Unit Time Setup The basic SENT protocol unit time granularity is defined as 3 µs. Every timing is a multiple of this basic time unit. To achieve more flexibility, trimming of the unit time can be used to: • Allow a calibration trim within a timing error of less than 20% clock error (as given in SAE standard) • Allow a modification of the unit time for small speed adjustments This enables a setup of different unit times, even if the internal RC oscillator varies by ±20%. Of course, timing values that are too low could clash with timing requirements of the application and should therefore be avoided, but in principle it is possible to adjust the timer unit for a more precise protocol timing. Table 19 Parameter Register size Unit time 1) Predivider Setting Symbol Limit Values min. max. 4 2.0 4.0 bit µs Predivider1) ClkUNIT=8MHz2) Unit Notes Prediv tUNIT Useable predivider range is decimal 7 to 15. Prediv < 7 is internally kept at 7. Prediv default is decimal = 11 for 3 µs nominal unit time RC oscillator frequency variation +/- 20% 2) The nominal unit time is calculated by: tUNIT = ( Prediv × 2 + 2) / ClkUNIT ClkUNIT = 8MHz ±20% Data Sheet 36 V 1.0, 2008-07 TLE4998S SENT Output Definition (SAE J2716) Table 20 Content of a SENT Data Frame (8 Nibbles) DATA WORD 1 SYNC STATUS D1 MSN D1 MidN D1 LSN DATA WORD 2 D2 MSN D2 MidN D2 LSN CRC bits state range description status and current range startup condition in range RR overvoltage in range RR normal state using range RR description CRC calculation for all nibbles on the basis of SAE J2716 seed value: 0101 polynomial: X +X +X +1 4 3 2 10 01 00 RR RR RR bits 11 01 00 bits D1 MSN D1 MidN description +/- 50mT +/- 100mT +/- 200mT description1 D2MSN description 2 decimal: OUT16 ( = OUT12*16+D2MSN ) bits D2MidN D2LSN description decimal: TEMP8 ( = D2MidN* 16+D2LSN ) D1 LSN decimal: OUT12 ( = D1MSN*256 +D1MidN*16+D1LSN ) 1111 1111 1111 1111 1111 1111 1111 1111 1111 : 0000 0000 0000 0000 0000 0000 0000 0000 0000 1111 1111 1111 1111 1111 1111 1111 1111 1111 : 0000 0000 0000 0000 0000 0000 0000 0000 0000 1111 1111 1111 1111 1110 1110 1110 1110 1101 : 0010 0001 0001 0001 0000 0000 0000 0000 0000 1111 1110 : 0000 1111 1110 : 0000 1111 : 0000 1111 : 0000 1111 1110 : 0001 0000 4095 (FSR) 4095 4095 4095 4094 4094 4094 4094 4093 : 2 1 1 1 0 0 0 0 0 65535 (FSR) 65534 : 65520 65519 65518 : 65504 65503 : 32 31 : 16 15 14 : 1 0 1111 1111 1111 1111 1110 : 0101 0100 : 0011 0011 : 0000 0000 1111 1110 : 0000 1111 : 0000 1111 : 0111 0110 : 0001 0000 200 °C 199 °C : 185 °C 184 °C : 25 °C 24 °C : 0°C -1°C : -54 °C -55 °C Abbreviations: SYNC – synchronization nibble STATUS – status nibble CRC – cyclic redundancy code nibble FSR – full scale range MSN – most significant nibble MidN – middle nibble LSN – least significant nibble OUT12 – 12 bit output value OUT16 – 16 bit output value TEMP8 – 8 bit temperature value Data Sheet 37 V 1.0, 2008-07 TLE4998S SENT Output Definition (SAE J2716) 13.3 Checksum Nibble Details The Checksum nibble is a 4-bit CRC of the data nibbles including the status nibble. The CRC is calculated using a polynomial x4 +x3 + x2 + 1 with a seed value of 0101. In the TLE4998S it is implemented as a series of XOR and shift operations as shown in the following flowchart: CRC calculation Pre-initialization : GENERATOR = 1101 next Nibble Nibble VALUE SEED = 0101 , use this constant as old CRC value at first call xor SEED