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ISL41387

ISL41387

  • 厂商:

    INTERSIL(Intersil)

  • 封装:

  • 描述:

    ISL41387 - ±15kV ESD Protected, Dual Protocol (RS-232/RS-485) Transceivers - Intersil Corporation

  • 数据手册
  • 价格&库存
ISL41387 数据手册
® ISL81387, ISL41387 Data Sheet December 20, 2005 FN6201.1 ±15kV ESD Protected, Dual Protocol (RS-232/RS-485) Transceivers These devices are BiCMOS interface ICs that are user configured as either a single RS-422/485 differential transceiver, or as a dual (2 Tx, 2 Rx) RS-232 transceiver. In RS-232 mode, the on-board charge pump generates RS-232 compliant ±5V Tx output levels, from a supply as low as 4.5V. Four small 0.1µF capacitors are required for the charge pump. The transceivers are RS-232 compliant, with the Rx inputs handling up to ±25V, and the Tx outputs handling ±12V. In RS-485 mode, the transceivers support both the RS-485 and RS-422 differential communication standards. The RS-485 receiver features "full failsafe" operation, so the Rx output remains in a high state if the inputs are open or shorted together. The RS-485 transmitter supports up to three data rates, two of which are slew rate limited for problem free communications. The charge pump disables in RS-485 mode, thereby saving power, minimizing noise, and eliminating the charge pump capacitors. Both RS-232/485 modes feature loopback and shutdown functions. The loopback mode internally connects the Tx outputs to the corresponding Rx input, which facilitates the implementation of board level self test functions. The outputs remain connected to the loads during loopback, so connection problems (e.g., shorted connectors or cables) can be detected. The shutdown mode disables the Tx and Rx outputs, disables the charge pump if in RS-232 mode, and places the IC in a low current (20µA) mode. The ISL41387 is a QFN packaged device that offers additional functionality, including a lower speed and edge rate option (115kbps) for EMI sensitive designs, or to allow longer bus lengths. It also features a logic supply voltage pin (VL) that sets the VOH level of logic outputs, and the switching points of logic inputs, to be compatible with another supply voltage in mixed voltage systems. The QFN's choice of active high or low Rx enable pins increases design flexibility, allowing Tx/Rx direction control via a single signal by connecting DEN and RXEN together. For a dual port version of these devices, please see the ISL81334/ISL41334 data sheet. Features • User Selectable RS-232 or RS-485/422 Interface Port (Two RS-232 Transceivers or One RS-485/422 Transceiver) • ±15kV (HBM) ESD Protected Bus Pins (RS-232 or RS-485) • Flow-Through Pinouts Simplify Board Layouts • Pb-Free Plus Anneal Available (RoHS Compliant) • Large (2.7V) Differential VOUT for Improved Noise Immunity in RS-485/422 Networks • Full Failsafe (Open/Short) Rx in RS-485/422 Mode • Loopback Mode Facilitates Board Self Test Functions • User Selectable RS-485 Data Rates . . . . . . . . . . 20Mbps - Slew Rate Limited. . . . . . . . . . . . . . . . . . . . . . . 460kbps - Slew Rate Limited (ISL41387 Only) . . . . . . . . . 115kbps • Fast RS-232 Data Rate . . . . . . . . . . . . . . . Up to 650kbps • Low Current Shutdown Mode. . . . . . . . . . . . . . . . . . .35µA • QFN Package Saves Board Space (ISL41387 Only) • Logic Supply Pin (VL) Eases Operation in Mixed Supply Systems (ISL41387 Only) Applications • Gaming Applications (e.g., Slot machines) • Single Board Computers • Factory Automation • Security Networks • Industrial/Process Control Networks • Level Translators (e.g., RS-232 to RS-422) • Point of Sale Equipment TABLE 1. SUMMARY OF FEATURES PART NUMBER ISL81387 ISL41387 NO. OF PORTS 1 1 PACKAGE OPTIONS 20 Ld SOIC, 20 Ld SSOP 40 Ld QFN (6 x 6mm) RS-485 DATA RATE (bps) 20M, 460k 20M, 460k, 115k RS-232 DATA RATE (kbps) 650 650 VL PIN? NO YES ACTIVE H or L Rx ENABLE? H BOTH LOW POWER SHUTDOWN? YES YES 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2005. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. ISL81387, ISL41387 Ordering Information PART NUMBER (NOTE) ISL81387IAZ ISL81387IAZ-T ISL81387IBZ ISL81387IBZ-T ISL41387IRZ ISL41387IRZ-T PART MARKING 81387IAZ 81387IAZ ISL81387IBZ ISL81387IBZ 41387IRZ 41387IRZ TEMP. RANGE (°C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 PACKAGE (Pb-Free) 20 Ld SSOP 20 Ld SSOP Tape and Reel 20 Ld SOIC 20 Ld SOIC Tape and Reel 40 Ld QFN 40 Ld QFN Tape and Reel PKG. DWG. # M20.209 M20.209 M20.3 M20.3 L40.6x6 L40.6x6 NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Pinouts ISL81387 (SOIC, SSOP) TOP VIEW C1+ 1 C1- 2 V+ 3 20 C2+ 19 C218 VCC 17 RA 16 RB 15 DY 14 DZ/SLEW 13 ON 12 RXEN 11 V- A4 B5 Y6 Z7 485/232 8 DEN 9 GND 10 ISL41387 (QFN) TOP VIEW VCC C1+ C2+ C1C2NC NC NC NC 32 VL 31 30 RA 29 RB 28 DY 27 DZ/SLEW 26 NC 25 NC 24 NC 23 NC 22 NC 21 ON 11 485/232 12 DEN 13 NC 14 SPB 15 GND 16 GND 17 RXEN 18 NC 19 V20 RXEN 40 V+ A B Y Z NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 39 38 37 36 35 34 33 2 FN6201.1 December 20, 2005 ISL81387, ISL41387 TABLE 2. ISL81387 FUNCTION TABLE INPUTS 485/232 0 0 0 0 0 0 0 X 1 1 1 1 1 NOTES: 1. Charge pumps are on if in RS-232 mode and ON or DEN or RXEN are high. 2. Loopback is enabled when ON = 0, and DEN = RXEN = 1. ON 1 1 1 1 0 0 0 0 1 X X 1 0 RXEN 0 0 1 1 0 1 1 0 0 0 1 1 1 DEN SLEW 0 1 0 1 1 0 1 0 0 1 0 1 1 N.A. N.A. N.A. N.A. N.A. N.A. N.A. X X 1/0 X 1/0 1/0 RECEIVER OUTPUTS RA High-Z High-Z ON ON High-Z High-Z ON High-Z High-Z High-Z ON ON ON RB High-Z High-Z ON ON High-Z ON ON High-Z High-Z High-Z High-Z High-Z High-Z DRIVER OUTPUTS Y High-Z ON High-Z ON ON ON ON High-Z High-Z ON High-Z ON ON Z High-Z ON High-Z ON High-Z High-Z ON High-Z High-Z ON High-Z ON ON DRIVER SPEED (Mbps) 0.46 0.46 0.46 0.46 0.46 20/0.46 20/0.46 20/0.46 CHARGE PUMPS (NOTE 1) ON ON ON ON ON ON ON OFF OFF OFF OFF OFF OFF LOOPBACK (NOTE 2) OFF OFF OFF OFF OFF OFF ON OFF OFF OFF OFF OFF ON MODE RS-232 RS-232 RS-232 RS-232 RS-232 RS-232 RS-232 Shutdown RS-485 RS-485 RS-485 RS-485 RS-485 ISL81387 Truth Tables RS-232 TRANSMITTING MODE INPUTS (ON = 1) 485/232 0 0 0 0 0 DEN 1 1 1 1 0 DY 0 0 1 1 X DZ 0 1 0 1 X OUTPUTS Y 1 1 0 0 High-Z Z 1 0 1 0 High-Z 485/232 1 1 1 1 1 DEN 1 1 1 1 0 RS-485 TRANSMITTING MODE INPUTS (ON = 1) DY 0 1 0 1 X SLEW 1 1 0 0 X Y 1 0 1 0 OUTPUTS Z 0 1 0 1 DATA RATE (Mbps) 20 20 0.46 0.46 - High-Z High-Z RS-232 RECEIVING MODE INPUTS (ON = 1) 485/232 0 0 0 0 0 0 RXEN 1 1 1 1 1 0 A 0 0 1 1 Open X B 0 1 0 1 Open X OUTPUT RA 1 1 0 0 1 High-Z RB 1 0 1 0 1 High-Z 485/232 1 1 1 1 RXEN 1 1 1 0 RS-485 RECEIVING MODE INPUTS (ON = 1) B-A ≥ -40mV ≤ -200mV Open or Shorted together X OUTPUT RA 1 0 1 High-Z RB High-Z High-Z High-Z High-Z 3 FN6201.1 December 20, 2005 ISL81387, ISL41387 TABLE 3. ISL41387 FUNCTION TABLE INPUTS RXEN and/or RXEN 1 and 0 1 and 0 0 or 1 0 or 1 1 and 0 0 or 1 0 or 1 1 and 0 1 and 0 1 and 0 1 and 0 0 or 1 0 or 1 0 or 1 0 or 1 0 or 1 RECEIVER OUTPUTS DRIVER OUTPUTS DRIVER DATA RATE (Mbps) 0.46 0.46 0.46 0.46 0.46 0.46/0.115 20 0.46/0.115 20 0.46/0.115 20 485/232 0 0 0 0 0 0 0 X 1 1 1 1 1 1 1 1 NOTES: ON 1 1 1 1 0 0 0 0 1 X X X 1 1 0 0 DEN 0 1 0 1 1 0 1 0 0 1 1 0 1 1 1 1 SLEW N.A. N.A. N.A. N.A. N.A. N.A. N.A. X X 0 1 X 0 1 0 1 SPB N.A. N.A. N.A. N.A. N.A. N.A. N.A. X X 1/0 X X 1/0 X 1/0 X RA High-Z High-Z ON ON High-Z High-Z ON High-Z High-Z High-Z High-Z ON ON ON ON ON RB High-Z High-Z ON ON High-Z ON ON High-Z High-Z High-Z High-Z High-Z High-Z High-Z High-Z High-Z Y High-Z ON High-Z ON ON ON ON High-Z High-Z ON ON High-Z ON ON ON ON Z High-Z ON High-Z ON High-Z High-Z ON High-Z High-Z ON ON High-Z ON ON ON ON CHARGE PUMPS (NOTE 3) ON ON ON ON ON ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF MODE RS-232 RS-232 RS-232 RS-232 RS-232 RS-232 RS-232 (Note 4) Shutdown RS-485 RS-485 RS-485 RS-485 RS-485 RS-485 RS-485 (Note 4) RS-485 (Note 4) 3. Charge pumps are on if in RS-232 mode and ON or DEN or RXEN is high, or RXEN is low. 4. Loopback is enabled when ON = 0, and DEN = 1, and (RXEN = 1 or RXEN = 0). ISL41387 Truth Tables RS-232 TRANSMITTING MODE INPUTS (ON=1) 485/232 0 0 0 0 0 DEN 1 1 1 1 0 DY 0 0 1 1 X DZ 0 1 0 1 X OUTPUTS Y 1 1 0 0 High-Z Z 1 0 1 0 High-Z 485/232 OUTPUT A 0 0 1 1 Open X B 0 1 0 1 Open X RA 1 1 0 0 1 RB 1 0 1 0 1 1 1 1 1 485/232 1 1 1 1 DEN 1 1 1 0 RS-485 TRANSMITTING MODE INPUTS (ON=1) SLEW 0 0 1 X SPB 0 1 X X DY 0/1 0/1 0/1 X OUTPUTS Y 1/0 1/0 1/0 Z 0/1 0/1 0/1 DATA Mbps 0.115 0.460 20 - High-Z High-Z RS-485 RECEIVING MODE INPUTS (ON=1) OUTPUT B-A ≥ -40mV ≤ -200mV Open or Shorted together X RA 1 0 1 RB High-Z High-Z High-Z RS-232 RECEIVING MODE INPUTS (ON=1) 485/232 0 0 0 0 0 0 RXEN and/or 0 or 1 0 or 1 0 or 1 0 or 1 0 or 1 1 and 0 RXEN and/or 0 or 1 0 or 1 0 or 1 1 and 0 High-Z High-Z High-Z High-Z 4 FN6201.1 December 20, 2005 ISL81387, ISL41387 Pin Descriptions PIN 485/232 DEN GND NC ON MODE BOTH BOTH BOTH BOTH BOTH FUNCTION Interface Mode Select input. High for RS-485 Mode and low for RS-232 Mode. Driver output enable. The driver outputs, Y and Z, are enabled by bringing DEN high. They are high impedance when DEN is low. Ground connection. No Connection. In RS-232 mode only, ON high enables the charge pumps. ON low, with DEN and RXEN low (and RXEN high if QFN), turns off the charge pumps (in RS-232 mode), and in either mode places the device in low power shutdown. In both modes, when ON is low, and DEN is high, and RXEN is high or RXEN is low, loopback is enabled. Receiver output enable. Rx is enabled when RXEN is high; Rx is high impedance when RXEN is low and, if using the QFN package, RXEN is high. When using the QFN and the active high Rx enable function, RXEN should be high or floating. Active low receiver output enable. Rx is enabled when RXEN is low; Rx is high impedance when RXEN is high and RXEN is low. (i.e., to use active low Rx enable function, tie RXEN to GND). For single signal Tx/Rx direction control, connect RXEN to DEN. Internally pulled high. (QFN only) System power supply input (5V). Logic-Level Supply. All TTL/CMOS inputs and outputs are powered by this supply. (QFN only) RXEN RXEN BOTH BOTH VCC VL A BOTH BOTH RS-232 Receiver input with ±15kV ESD protection. A low on A forces RA high; A high on A forces RA low. RS-485 Inverting receiver input with ±15kV ESD protection. B RS-232 Receiver input with ±15kV ESD protection. A low on B forces RB high; A high on B forces RB low. RS-485 Noninverting receiver input with ±15kV ESD protection. DY RS-232 Driver input. A low on DY forces output Y high. Similarly, a high on DY forces output Y low. RS-485 Driver input. A low on DY forces output Y high and output Z low. Similarly, a high on DY forces output Y low and output Z high. DZ SLEW RS-232 Driver input. A low on DZ forces output Z high. Similarly, a high on DZ forces output Z low. RS-485 Slew rate control. With the SLEW pin high, the drivers run at the maximum slew rate (20Mbps). With the SLEW pin low, the drivers run at a reduced slew rate (460kbps). On the QFN version, works in conjunction with SPB to select one of three RS-485 data rates. Internally pulled high in RS-485 mode. RS-485 Speed control. Works in conjunction with the SLEW pin to select the 20Mbps, 460kbps or 115kbps RS-485 data rate. Internally pulled high. (QFN only) RS-232 Receiver output. RS-485 Receiver output: If B > A by at least -40mV, RA is high; If B < A by -200mV or more, RA is low; RA = High if A and B are unconnected (floating) or shorted together (i.e., full fail-safe). SPB RA RB RS-232 Receiver output. RS-485 Not used. Output is high impedance, and unaffected by RXEN and RXEN. Y RS-232 Driver output with ±15kV ESD protection. RS-485 Inverting driver output with ±15kV ESD protection. Z RS-232 Driver output with ±15kV ESD protection. RS-485 Noninverting driver output with ±15kV ESD protection. C1+ C1C2+ C2V+ V- RS-232 External capacitor (voltage doubler) is connected to this lead. Not needed in RS-485 Mode. RS-232 External capacitor (voltage doubler) is connected to this lead. Not needed in RS-485 Mode. RS-232 External capacitor (voltage inverter) is connected to this lead. Not needed in RS-485 Mode. RS-232 External capacitor (voltage inverter) is connected to this lead. Not needed in RS-485 Mode. RS-232 Internally generated positive RS-232 transmitter supply (+5.5V). C3 not needed in RS-485 Mode. RS-232 Internally generated negative RS-232 transmitter supply (-5.5V). C4 not needed in RS-485 Mode. 5 FN6201.1 December 20, 2005 ISL81387, ISL41387 Typical Operating Circuit / RS-232 MODE WITHOUT LOOPBACK +5V +5V 18 VCC V+ 3 + C3 0.1µF C4 0.1µF + RA C1 0.1µF C2 0.1µF + + RS-232 MODE WITH LOOPBACK + 0.1µF 1 C1+ C1C2+ C2- + 0.1µF 1 2 20 19 4 5kΩ C1+ C1C2+ C2R 18 VCC V+ 3 + C3 0.1µF C4 0.1µF + RA C1 0.1µF C2 0.1µF + + 2 20 19 4 V- 11 V- 11 17 A 5kΩ 5 5kΩ 6 7 9 DEN 8 485/232 R 17 A1 B R 16 RB B1 5 5kΩ R LB Rx 16 RB Y Z VCC D D 15 14 12 RXEN ON 13 DY DZ VCC VCC Y Z VCC 6 7 9 8 DEN 485/232 D D 15 14 12 RXEN 13 DY DZ VCC GND 10 NOTE: PINOUT FOR SOIC AND SSOP GND 10 ON NOTE: PINOUT FOR SOIC AND SSOP RS-485 MODE WITHOUT LOOPBACK +5V +5V 0.1µF 1 + + 2 20 19 4 5 R 17 C1+ C1C2+ C218 VCC V+ 3 + C3 0.1µF C4 0.1µF + RA C1 0.1µF C2 0.1µF RS-485 MODE WITH LOOPBACK + + 0.1µF 1 C1+ C1C2+ C2R 18 VCC V+ 3 + C3 0.1µF C4 0.1µF + RA C1 0.1µF C2 0.1µF A B + + 2 20 19 4 5 V- 11 V- 11 A B 17 16 Y Z 6 7 D 15 RB DY 6 7 LB Rx 16 Y Z D 15 RB DY 14 9 DEN 8 485/232 GND 10 RXEN ON 13 12 SLEW VCC VCC 9 8 DEN 485/232 GND 10 RXEN ON 14 12 13 SLEW VCC VCC VCC VCC VCC NOTE: PINOUT FOR SOIC AND SSOP NOTE: PINOUT FOR SOIC AND SSOP 6 FN6201.1 December 20, 2005 ISL81387, ISL41387 Absolute Maximum Ratings (TA = 25°C) VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V VL (QFN Only) . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Input Voltages All Except A,B (non-QFN Package) . . . . . . -0.5V to (VCC + 0.5V) All Except A,B (QFN Package). . . . . . . . . . . -0.5V to (VL + 0.5V) Input/Output Voltages A, B (Any Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V to +25V Y, Z (Any Mode, Note 5) . . . . . . . . . . . . . . . . . . . -12.5V to +12.5V RA, RB (non-QFN Package). . . . . . . . . . . . -0.5V to (VCC + 0.5V) RA, RB (QFN Package) . . . . . . . . . . . . . . . . -0.5V to (VL + 0.5V) Output Short Circuit Duration Y, Z, RA, RB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Information Thermal Resistance (Typical, Note 6) θJA (°C/W) 20 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 65 20 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 60 40 Ld QFN Package. . . . . . . . . . . . . . . . . . . . . . . . . 32 Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C Maximum Storage Temperature Range . . . . . . . . . . -65°C to 150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C (SOIC and SSOP - Lead Tips Only) Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 5. One output at a time, IOUT ≤ 100mA for ≤ 10 mins. 6. QFN θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. θJA for other packages is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 and Tech Brief TB389 for details. Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V, C1 - C4 = 0.1µF, VL = VCC (for QFN only), Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C (Note 7) SYMBOL TEST CONDITIONS TEMP (°C) MIN TYP MAX UNITS PARAMETER DC CHARACTERISTICS - RS-485 DRIVER (485/232 = VCC) Driver Differential VOUT (no load) Driver Differential VOUT (with load) VOD1 VOD2 R = 50Ω (RS-422) (Figure 1) R = 27Ω (RS-485) (Figure 1) VOD3 Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Driver Short-Circuit Current, VOUT = High or Low Driver Three-State Output Leakage Current (Y, Z) ∆VOD RD = 60Ω, R = 375Ω, VCM = -7V to 12V (Figure 1) R = 27Ω or 50Ω (Figure 1) Full Full Full Full Full 2.5 2.2 2 3.1 2.7 2.7 0.01 VCC 5 5 0.2 V V V V V VOC ∆VOC R = 27Ω or 50Ω (Figure 1) (Note 11) R = 27Ω or 50Ω (Figure 1) (Note 11) Full Full - 0.01 3.1 0.2 V V IOS IOZ -7V ≤ (VY or VZ) ≤ 12V (Note 9) Outputs Disabled, VCC = 0V or 5.5V VOUT = 12V VOUT = -7V Full Full Full 35 -150 - 250 150 - mA µA µA DC CHARACTERISTICS - RS-232 DRIVER (485/232 = 0V) Driver Output Voltage Swing Driver Output Short-Circuit Current VO IOS All TOUTS Loaded with 3kΩ to Ground VOUT = 0V Full Full ±5.0 -60 +6/-7 25/-35 60 V mA DC CHARACTERISTICS - LOGIC PINS (i.e., DRIVER AND CONTROL INPUT PINS) Input High Voltage VIH1 VIH2 VIH3 VL = VCC if QFN VL = 3.3V (QFN Only) VL = 2.5V (QFN Only) Full Full Full 2 2 1.5 1.6 1.2 1 V V V 7 FN6201.1 December 20, 2005 ISL81387, ISL41387 Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V, C1 - C4 = 0.1µF, VL = VCC (for QFN only), Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C (Note 7) (Continued) SYMBOL VIL1 VIL2 VIL3 Input Current IIN1 IIN2 TEST CONDITIONS VL = VCC if QFN VL = 3.3V (QFN Only) VL = 2.5V (QFN Only) Except SLEW, RXEN (QFN), and SPB (QFN) SLEW (Note 12), RXEN (QFN), and SPB (QFN) TEMP (°C) Full Full Full Full Full MIN -2 -25 TYP 1.4 1 0.8 MAX 0.8 0.7 0.5 2 25 UNITS V V V µA µA PARAMETER Input Low Voltage DC CHARACTERISTICS - RS-485 RECEIVER INPUTS (485/232 = VCC) Receiver Differential Threshold Voltage Receiver Input Hysteresis Receiver Input Current (A, B) VTH ∆VTH IIN -7V ≤ VCM ≤ 12V, Full Failsafe VCM = 0V VCC = 0V or 4.5 to 5.5V VIN = 12V VIN = -7V Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V, VCC = 0 (Note 10), or 4.5V ≤ VCC ≤ 5.5V Full 25 Full Full Full -0.2 -0.64 15 35 -0.04 0.8 V mV mA mA kΩ DC CHARACTERISTICS - RS-232 RECEIVER INPUTS (485/232 = GND) Receiver Input Voltage Range Receiver Input Threshold VIN VIL VIH Receiver Input Hysteresis Receiver Input Resistance ∆VTH RIN VIN = ±15V, VCC Powered Up (Note 10) Full Full Full 25 Full -25 2.4 3 1.4 1.9 0.5 5 25 0.8 7 V V V V kΩ DC CHARACTERISTICS - RECEIVER OUTPUTS (485 OR 232 MODE) Receiver Output High Voltage VOH1 VOH2 VOH3 Receiver Output Low Voltage Receiver Short-Circuit Current Receiver Three-State Output Current VOL IOSR IOZR IO = -2mA (VL = VCC if QFN) IO = -650µA, VL = 3V, QFN Only IO = -500µA, VL = 2.5V, QFN Only IO = 3mA 0V ≤ VO ≤ VCC Output Disabled, 0V ≤ VO ≤ VCC (or VL for QFN) Full Full Full Full Full Full 3.5 2.6 2 7 4.6 2.9 2.4 0.1 0.4 85 ±10 V V V V mA µA POWER SUPPLY CHARACTERISTICS No-Load Supply Current, Note 8 ICC232 ICC485 Shutdown Supply Current ISHDN232 ISHDN485 ESD CHARACTERISTICS Bus Pins (A, B, Y, Z) Any Mode All Other Pins Human Body Model Human Body Model 25 25 15 4 kV kV 485/232 = 0V, ON = VCC 485/232 = VCC, ON = VCC ON = DEN = RXEN = 0V (RXEN = SPB = VCC if QFN) ON = DEN = RXEN = SLEW = 0V (RXEN = VCC, SPB = 0V if QFN) Full Full Full Full 3.7 1.6 5 35 7 5 30 60 mA mA µA µA RS-232 DRIVER and RECEIVER SWITCHING CHARACTERISTICS (485/232 = 0V, ALL VERSIONS AND SPEEDS) Driver Output Transition Region Slew Rate SR RL = 3kΩ, Measured From 3V to CL ≥ 15pF -3V or -3V to 3V CL ≤ 2500pF Full Full 4 18 12 30 V/µs V/µs 8 FN6201.1 December 20, 2005 ISL81387, ISL41387 Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V, C1 - C4 = 0.1µF, VL = VCC (for QFN only), Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C (Note 7) (Continued) SYMBOL tr, tf tDPHL tDPLH Driver Propagation Delay Skew Driver Enable Time Driver Disable Time Driver Enable Time from Shutdown Driver Maximum Data Rate Receiver Propagation Delay tDSKEW tDEN tDDIS tDENSD DRD tRPHL tRPLH Receiver Propagation Delay Skew Receiver Maximum Data Rate tRSKEW DRR tRPHL - tRPLH (Figure 7) CL = 15pF RL = 5kΩ, Measured at VOUT = ±3V VOUT = ±3.0V (Note 13) RL = 3kΩ, CL = 1000pF, One Transmitter Switching CL = 15pF (Figure 7) tDPHL - tDPLH (Figure 6) TEST CONDITIONS RL = 3kΩ, CL = 2500pF, 10% - 90% RL = 3kΩ, CL = 1000pF (Figure 6) TEMP (°C) Full Full Full Full 25 25 25 Full Full Full Full Full MIN 0.22 460 0.46 TYP 1.2 1 1.2 240 800 500 20 650 50 40 10 2 MAX 3.1 2 2 400 120 120 40 UNITS µs µs µs ns ns ns µs kbps ns ns ns Mbps PARAMETER Driver Output Transition Time Driver Propagation Delay RS-485 DRIVER SWITCHING CHARACTERISTICS (FAST DATA RATE (20Mbps), 485/232 = VCC, SLEW = VCC, ALL VERSIONS) Driver Differential Input to Output Delay Driver Output Skew Driver Differential Rise or Fall Time Driver Enable to Output Low Driver Enable to Output High Driver Disable from Output Low Driver Disable from Output High Driver Enable from Shutdown to Output Low Driver Enable from Shutdown to Output High Driver Maximum Data Rate tDLH, tDHL RDIFF = 54Ω, CL = 100pF (Figure 2) tSKEW tR, tF tZL tZH tLZ tHZ tZL(SHDN) tZH(SHDN) fMAX RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) CL = 100pF, SW = VCC (Figure 3) CL = 100pF, SW = GND (Figure 3) CL = 15pF, SW = VCC (Figure 3) CL = 15pF, SW = GND (Figure 3) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3) (Note 13) RL = 500Ω, CL = 100pF, SW = GND (Figure 3) (Note 13) RDIFF = 54Ω, CL = 100pF (Figure 2) Full Full Full Full Full Full Full Full Full Full 15 3 30 0.5 11 27 24 31 24 65 152 30 50 10 20 60 60 60 60 250 250 ns ns ns ns ns ns ns ns ns Mbps RS-485 DRIVER SWITCHING CHARACTERISTICS (MEDIUM DATA RATE (460kbps), 485/232 = VCC, SLEW = SPB (QFN Only) = GND, ALL VERSIONS) Driver Differential Input to Output Delay Driver Output Skew Driver Differential Rise or Fall Time Driver Enable to Output Low Driver Enable to Output High Driver Disable from Output Low Driver Disable from Output High Driver Enable from Shutdown to Output Low Driver Enable from Shutdown to Output High Driver Maximum Data Rate tDLH, tDHL RDIFF = 54Ω, CL = 100pF (Figure 2) tSKEW tR, tF tZL tZH tLZ tHZ tZL(SHDN) tZH(SHDN) fMAX RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) CL = 100pF, SW = VCC (Figure 3) CL = 100pF, SW = GND (Figure 3) CL = 15pF, SW = VCC (Figure 3) CL = 15pF, SW = GND (Figure 3) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3) (Note 13) RL = 500Ω, CL = 100pF, SW = GND (Figure 3) (Note 13) RDIFF = 54Ω, CL = 100pF (Figure 2) Full Full Full Full Full Full Full Full Full Full 200 300 490 110 600 30 128 31 24 65 255 2000 1000 400 1100 300 300 60 60 500 500 ns ns ns ns ns ns ns ns ns kbps 9 FN6201.1 December 20, 2005 ISL81387, ISL41387 Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V, C1 - C4 = 0.1µF, VL = VCC (for QFN only), Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C (Note 7) (Continued) SYMBOL TEST CONDITIONS TEMP (°C) MIN TYP MAX UNITS PARAMETER RS-485 DRIVER SWITCHING CHARACTERISTICS (SLOW DATA RATE (115kbps, QFN ONLY), 485/232 = VCC, SLEW = 0V, SPB = VCC) Driver Differential Input to Output Delay Driver Output Skew Driver Differential Rise or Fall Time Driver Enable to Output Low Driver Enable to Output High Driver Disable from Output Low Driver Disable from Output High Driver Enable from Shutdown to Output Low Driver Enable from Shutdown to Output High Driver Maximum Data Rate tDLH, tDHL RDIFF = 54Ω, CL = 100pF (Figure 2) tSKEW tR, tF tZL tZH tLZ tHZ tZL(SHDN) tZH(SHDN) fMAX RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) CL = 100pF, SW = VCC (Figure 3) CL = 100pF, SW = GND (Figure 3) CL = 15pF, SW = VCC (Figure 3) CL = 15pF, SW = GND (Figure 3) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3) (Note 13) RL = 500Ω, CL = 100pF, SW = GND (Figure 3) (Note 13) RDIFF = 54Ω, CL = 100pF (Figure 2) Full Full Full Full Full Full Full Full Full Full 800 1000 1500 350 2000 32 300 31 24 65 420 800 2500 1250 3100 600 600 60 60 800 800 ns ns ns ns ns ns ns ns ns kbps RS-485 RECEIVER SWITCHING CHARACTERISTICS (485/232 = VCC, ALL VERSIONS AND SPEEDS) Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | Receiver Maximum Data Rate tPLH, tPHL tSKEW fMAX (Figure 4) (Figure 4) Full Full Full 20 50 0.1 40 90 10 ns ns Mbps RECEIVER ENABLE/DISABLE CHARACTERISTICS (ALL MODES AND VERSIONS AND SPEEDS) Receiver Enable to Output Low Receiver Enable to Output High Receiver Disable from Output Low Receiver Disable from Output High Receiver Enable from Shutdown to Output Low Receiver Enable from Shutdown to Output High NOTES: 7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 8. Supply current specification is valid for loaded drivers when DEN = 0V. 9. Applies to peak current. See “Typical Performance Curves” for more information. 10. RIN defaults to RS-485 mode (>15kΩ) when the device is unpowered (VCC = 0V), regardless of the state of the 485/232 pin. 11. VCC ≤ 5.25V. 12. The Slew pin has a pull-up resistor that enables only when in RS-485 mode (485/232 = VCC). 13. ON, RXEN, and DEN all simultaneously switched Low-to-High. tZL tZH tLZ tHZ tZLSHDN CL = 15pF, SW = VCC (Figure 5) CL = 15pF, SW = GND (Figure 5) CL = 15pF, SW = VCC (Figure 5) CL = 15pF, SW = GND (Figure 5) CL = 15pF, SW = VCC (Figure 5) (Note 13) RS-485 Mode RS-232 Mode Full Full Full Full Full 25 Full 25 22 23 24 25 260 35 260 25 60 60 60 60 700 700 ns ns ns ns ns ns ns ns tZHSHDN CL = 15pF, SW = GND (Figure 5) RS-485 Mode (Note 13) RS-232 Mode 10 FN6201.1 December 20, 2005 ISL81387, ISL41387 Test Circuits and Waveforms R VCC DEN Y DY D Z R VOC RD VOD + - VCM FIGURE 1. RS-485 DRIVER VOD AND VOC TEST CIRCUIT 3V DY CL = 100pF Y D Z SIGNAL GENERATOR OUT (Y) tDLH DIFF OUT (Z - Y) tR SKEW = |tPLH (Y or Z) - tPHL (Z or Y)| 90% 10% 0V 0V RDIFF CL = 100pF tPHL 50% tDHL 90% 10% tF +VOD -VOD tPLH VOH 50% VOL 1.5V 1.5V 0V DEN DY tPLH OUT (Z) 50% tPHL VOH 50% VOL VCC FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. RS-485 DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DEN DY D SIGNAL GENERATOR Z CL SW Y 500Ω ENABLED VCC GND tZH DEN 1.5V 1.5V 0V tZH(SHDN) FOR SHDN TESTS, SWITCH ON AND DEN L- H SIMULTANEOUSLY OUT (Y, Z) tHZ VOH - 0.5V VOH 0V tZL tZL(SHDN) OUT (Y, Z) 2.3V OUTPUT LOW tLZ VCC VOL + 0.5V V OL 3V OUTPUT HIGH 2.3V PARAMETER OUTPUT tHZ tLZ tZH tZL tZH(SHDN) tZL(SHDN) Y/Z Y/Z Y/Z Y/Z Y/Z Y/Z RXEN X X X X 0 0 DY 0/1 1/0 0/1 1/0 0/1 1/0 SW GND VCC GND VCC GND VCC CL (pF) 15 15 100 100 100 100 FIGURE 3B. MEASUREMENT POINTS FIGURE 3A. TEST CIRCUIT FIGURE 3. RS-485 DRIVER ENABLE AND DISABLE TIMES 11 FN6201.1 December 20, 2005 ISL81387, ISL41387 Test Circuits and Waveforms (Continued) VCC 0V RXEN A B R 15pF RA B 0V tPLH tPHL 0V +1.5V -1.5V SIGNAL GENERATOR VCC RA 1.5V 1.5V 0V FIGURE 4A. TEST CIRCUIT RXEN A R SIGNAL GENERATOR B 15pF RA 1kΩ SW FIGURE 4B. MEASUREMENT POINTS FIGURE 4. RS-485 RECEIVER PROPAGATION DELAY ENABLED VCC GND RXEN 1.5V 1.5V 0V tZH tZH(SHDN) FOR SHDN TESTS, SWITCH ON AND RXEN L- H SIMULTANEOUSLY RA tHZ VOH - 0.5V VOH 0V tZL tZL(SHDN) RA 1.5V OUTPUT LOW tLZ VCC VOL + 0.5V V OL 3V OUTPUT HIGH 1.5V PARAMETER tHZ tLZ tZH tZL tZH(SHDN) tZL(SHDN) DEN X X X X 0 0 B +1.5V -1.5V +1.5V -1.5V +1.5V -1.5V SW GND VCC GND VCC GND VCC FIGURE 5B. MEASUREMENT POINTS FIGURE 5A. TEST CIRCUIT FIGURE 5. RS-485 RECEIVER ENABLE AND DISABLE TIMES DEN DY,Z D RL Y, Z CL tDPHL OUT (Y,Z) SKEW = |tDPHL - tDPLH| 0V 0V VO3V DY,Z 1.5V 1.5V 0V tDPLH VO+ VCC SIGNAL GENERATOR FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RS-232 DRIVER PROPAGATION DELAY RXEN A, B R RA, RB CL = 15pF tRPHL RA, RB 0.8V SKEW = |tRPHL - tRPLH| tRPLH 2.4V VOH VOL 3V A, B 1.3V 1.7V 0V VCC SIGNAL GENERATOR FIGURE 7A. TEST CIRCUIT FIGURE 7B. MEASUREMENT POINTS FIGURE 7. RS-232 RECEIVER PROPAGATION DELAY 12 FN6201.1 December 20, 2005 ISL81387, ISL41387 Detailed Description The ISLX1387 port supports dual protocols: RS-485/422, and RS-232. RS-485 and RS-422 are differential (balanced) data transmission standards for use in high speed (up to 20Mbps) networks, or long haul and noisy environments. The differential signalling, coupled with RS-485’s requirement for extended common mode range (CMR) of +12V to -7V make these transceivers extremely tolerant of ground potential differences, as well as voltages induced in the cable by external fields. Both of these effects are real concerns when communicating over the RS-485/422 maximum distance of 4000’ (1220m). It is important to note that the ISLX1387 don’t follow the RS-485 convention whereby the inverting I/O is labelled “B/Z”, and the noninverting I/O is “A/Y”. Thus, in the application diagrams below the 1387 A/Y (B/Z) pins connect to the B/Z (A/Y) pins of the generic RS-485/422 ICs. RS-422 is typically a point-to-point (one driver talking to one receiver on a bus), or a point-to-multipoint (multidrop) standard that allows only one driver and up to 10 receivers on each bus. Because of the one driver per bus limitation, RS-422 networks use a two bus, full duplex structure for bidirectional communication, and the Rx inputs and Tx outputs (no tri-state required) connect to different busses, as shown in Figure 9. Tx and Rx enables aren’t required, so connect RXEN and DEN to VCC through a 1kΩ resistor. Conversely, RS-485 is a true multipoint standard, which allows up to 32 devices (any combination of drivers- must be tri-statable - and receivers) on each bus. Now bidirectional communication takes place on a single bus, so the Rx inputs and Tx outputs of a port connect to the same bus lines, as shown in Figure 8. A port set to RS-485 /422 mode includes one Rx and one Tx. RS-232 is a point-to-point, singled ended (signal voltages referenced to GND) communication protocol targeting fairly short ( VCC 400 RS-485, SLEW, SPB, RXEN = GND ICC and IL (mA) 300 IL (A) 200 0 2 2.5 FIGURE 19. RS-232, VL SUPPLY CURRENT vs VL VOLTAGE (QFN ONLY) 1700 FIGURE 20. VCC and VL SHDN SUPPLY CURRENTS vs VL VOLTAGE (QFN ONLY) 400 RDIFF = 54Ω, CL = 100pF 350 |tPHLZ - tPLHY| 300 |tPLHZ - tPHLY| RDIFF = 54Ω, CL = 100pF 1650 PROPAGATION DELAY (ns) 1600 tDHL tDLH 1500 tDHL 250 SKEW (ns) 200 150 100 50 1550 1450 |tDLH - tDHL| 1400 -40 -25 0 25 50 75 85 -40 -25 0 25 50 75 85 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 21. RS-485, DRIVER PROPAGATION DELAY vs TEMPERATURE (SLOW DATA RATE, QFN ONLY) 560 550 PROPAGATION DELAY (ns) 540 530 520 510 500 490 480 470 -40 -25 0 25 50 75 85 RDIFF = 54Ω, CL = 100pF FIGURE 22. RS-485, DRIVER SKEW vs TEMPERATURE (SLOW DATA RATE, QFN ONLY) 120 RDIFF = 54Ω, CL = 100pF |tPHLZ - tPLHY| 100 80 SKEW (ns) tDHL tDLH tDHL 60 |tPLHZ - tPHLY| 40 20 |tDLH - tDHL| 0 -40 -25 0 25 TEMPERATURE (°C) 50 75 85 TEMPERATURE (°C) FIGURE 23. RS-485, DRIVER PROPAGATION DELAY vs TEMPERATURE (MEDIUM DATA RATE, QFN ONLY) FIGURE 24. RS-485, DRIVER SKEW vs TEMPERATURE (MEDIUM DATA RATE, QFN ONLY) 20 FN6201.1 December 20, 2005 ISL81387, ISL41387 Typical Performance Curves 40 RDIFF = 54Ω, CL = 100pF VCC = VL = 5V, TA = 25°C; Unless Otherwise Specified (Continued) 2.5 RDIFF = 54Ω, CL = 100pF PROPAGATION DELAY (ns) 35 2 |tDLH - tDHL| tDHL tDLH SKEW (ns) 1.5 30 1 |tPLHZ - tPHLY| 0.5 |tPHLZ - tPLHY| 0 -40 -25 25 20 -40 -25 0 25 50 75 85 0 25 50 75 85 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 25. RS-485, DRIVER PROPAGATION DELAY vs TEMPERATURE (FAST DATA RATE) DRIVER INPUT (V) RECEIVER OUTPUT (V) RDIFF = 60Ω, CL = 100pF DY 5 0 5 0 RA FIGURE 26. RS-485, DRIVER SKEW vs TEMPERATURE (FAST DATA RATE) RECEIVER OUTPUT (V) RDIFF = 60Ω, CL = 100pF 5 DY 5 0 0 RA DRIVER INPUT (V) DRIVER INPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) 5 4 3 2 1 0 TIME (400ns/DIV) Y Z 5 4 3 2 1 0 TIME (400ns/DIV) Z Y FIGURE 27. RS-485, DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (SLOW DATA RATE, QFN ONLY) DRIVER INPUT (V) RECEIVER OUTPUT (V) RDIFF = 60Ω, CL = 100pF DY 5 0 5 0 RA FIGURE 28. RS-485, DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (SLOW DATA RATE, QFN ONLY) RECEIVER OUTPUT (V) RDIFF = 60Ω, CL = 100pF 5 DY 5 0 0 RA DRIVER OUTPUT (V) DRIVER OUTPUT (V) 5 4 3 2 1 0 TIME (200ns/DIV) Y Z 5 4 3 2 1 0 TIME (200ns/DIV) Y Z FIGURE 29. RS-485, DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (MEDIUM DATA RATE, QFN ONLY) FIGURE 30. RS-485, DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (MEDIUM DATA RATE, QFN ONLY) 21 FN6201.1 December 20, 2005 ISL81387, ISL41387 Typical Performance Curves RECEIVER OUTPUT (V) VCC = VL = 5V, TA = 25°C; Unless Otherwise Specified (Continued) DRIVER INPUT (V) RECEIVER OUTPUT (V) RDIFF = 60Ω, CL = 100pF 5 DY 5 0 0 RA DRIVER INPUT (V) 85 RDIFF = 60Ω, CL = 100pF DY 5 0 5 0 RA DRIVER OUTPUT (V) DRIVER OUTPUT (V) 5 4 3 2 1 0 TIME (10ns/DIV) Y Z 5 4 3 2 1 0 TIME (10ns/DIV) Y Z FIGURE 31. RS-485, DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (FAST DATA RATE) 7.5 TRANSMITTER OUTPUT VOLTAGE (V) RS-232 REGION OF NONCOMPLIANCE 250kbps 5 2.5 ALL TOUTS LOADED WITH 3kΩ TO GND 0 1 TRANSMITTER AT 250kbps or 500kbps, OTHER TRANSMITTER AT 30kbps -2.5 -5 VOUT -7.5 250kbps 0 1000 2000 3000 4000 5000 500kbps 500kbps VOUT+ FIGURE 32. RS-485, DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (FAST DATA RATE) 7.5 TRANSMITTER OUTPUT VOLTAGE (V) 5 2.5 0 -2.5 -5 -7.5 -40 OUTPUTS STATIC ALL TOUTS LOADED WITH 3kΩ TO GND VOUT+ VOUT - -25 LOAD CAPACITANCE (pF) 0 25 TEMPERATURE (°C) 50 75 FIGURE 33. RS-232, TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE 40 30 TRANSMITTER OUTPUT CURRENT (mA) Y or Z = LOW 20 10 VOUT SHORTED TO GND 0 -10 -20 -30 -40 -40 Y or Z = HIGH FIGURE 34. RS-232, TRANSMITTER OUTPUT VOLTAGE vs TEMPERATURE 5 0 5 0 CL = 3500pF, 2 CHANNELS SWITCHING DY Y/A -5 5 0 RA -25 0 25 50 75 85 2µs/DIV. TEMPERATURE (°C) FIGURE 35. RS-232, TRANSMITTER SHORT CIRCUIT CURRENT vs TEMPERATURE FIGURE 36. RS-232, TRANSMITTER AND RECEIVER WAVEFORMS AT 250kbps 22 FN6201.1 December 20, 2005 ISL81387, ISL41387 Typical Performance Curves 5 0 5 0 Y/A -5 5 RA 0 48 50 1µs/DIV. 500 1000 DATA RATE (kbps) 1500 2000 VCC = VL = 5V, TA = 25°C; Unless Otherwise Specified (Continued) 60 VIN = ±5V FULL TEMP RANGE CL = 1000pF, 2 CHANNELS SWITCHING DY RECEIVER + DUTY CYCLE (%) 58 56 54 SR IN = 15V/µs 52 SR IN = 100V/µs 50 FIGURE 37. RS-232, TRANSMITTER AND RECEIVER WAVEFORMS AT 500kbps 1100 1000 900 DATA RATE (kbps) 800 700 600 500 400 300 200 100 100 1000 1 TRANSMITTER AT 85°C 2 TRANSMITTERS AT 85°C 2000 3000 LOAD CAPACITANCE (pF) 4000 5000 2 TRANSMITTERS AT 25°C 1 TRANSMITTER AT 25°C FIGURE 38. RS-232, RECEIVER OUTPUT +DUTY CYCLE vs DATA RATE 7.5 TRANSMITTER OUTPUT VOLTAGE (V) 5 2.5 2 TRANSMITTERS SWITCHING ALL TOUTS LOADED WITH 5kΩ TO GND, CL = 1000pF VOUT+ 85°C RS-232 REGION OF NONCOMPLIANCE VOUT ≥ ±4V ALL TOUTS LOADED WITH 5kΩ TO GND 25°C 0 -2.5 -5 85°C VOUT 25°C 200 300 400 500 600 700 800 -7.5 0 100 DATA RATE (kbps) FIGURE 39. RS-232, TRANSMITTER MAXIMUM DATA RATE vs LOAD CAPACITANCE 450 2 TRANSMITTERS SWITCHING 400 350 85°C 300 250 25°C 200 150 50 ALL TOUTS LOADED WITH 3kΩ TO GND, CL = 1000pF FIGURE 40. RS-232, TRANSMITTER OUTPUT VOLTAGE vs DATA RATE 100 SLOW 10 JITTER (%) MED FAST SKEW (ns) 1 0.1 150 250 350 450 550 650 750 32 100 200 300 400 DATA RATE (kbps) DOUBLE TERM’ED WITH 121Ω 500 600 700 800 900 1000 DATA RATE (kbps) FIGURE 41. RS-232, TRANSMITTER SKEW vs DATA RATE FIGURE 42. RS-485, TRANSMITTER JITTER vs DATA RATE WITH 2000’ CAT 5 CABLE 23 FN6201.1 December 20, 2005 ISL81387, ISL41387 Typical Performance Curves 100 VCC = VL = 5V, TA = 25°C; Unless Otherwise Specified (Continued) 100 SLOW MED 10 FAST JITTER (%) SLOW 10 JITTER (%) MED FAST 1 1 0.1 32 100 200 300 400 DOUBLE TERM’ED WITH 121Ω 500 600 700 800 900 1000 0.1 32 100 200 300 400 DOUBLE TERM’ED WITH 121Ω 500 600 700 800 900 1000 DATA RATE (kbps) DATA RATE (kbps) FIGURE 43. RS-485, TRANSMITTER JITTER vs DATA RATE WITH 1000’ CAT 5 CABLE FIGURE 44. RS-485, TRANSMITTER JITTER vs DATA RATE WITH 350’ CAT 5 CABLE Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 2490 PROCESS: BiCMOS 24 FN6201.1 December 20, 2005 ISL81387, ISL41387 Small Outline Plastic Packages (SOIC) N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45° 0.25(0.010) M BM M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A L MILLIMETERS MIN 2.35 0.10 0.35 0.23 12.60 7.40 10.00 0.25 0.40 20 8° 0° 8° MAX 2.65 0.30 0.49 0.32 13.00 7.60 10.65 0.75 1.27 NOTES 9 3 4 5 6 7 Rev. 2 6/05 MIN 0.0926 0.0040 0.014 0.0091 0.4961 0.2914 0.394 0.010 0.016 20 0° MAX 0.1043 0.0118 0.019 0.0125 0.5118 0.2992 0.419 0.029 0.050 A1 B C D E e H C e B 0.25(0.010) M C AM BS α A1 0.10(0.004) 0.050 BSC 1.27 BSC h L N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α 25 FN6201.1 December 20, 2005 ISL81387, ISL41387 Shrink Small Outline Plastic Packages (SSOP) N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA 0.25 0.010 L 0.25(0.010) M GAUGE PLANE BM M20.209 (JEDEC MO-150-AE ISSUE B) 20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B C D MIN 0.068 0.002 0.066 0.010’ 0.004 0.278 0.205 MAX 0.078 0.008’ 0.070’ 0.015 0.008 0.289 0.212 MILLIMETERS MIN 1.73 0.05 1.68 0.25 0.09 7.07 5.20’ MAX 1.99 0.21 1.78 0.38 0.20’ 7.33 5.38 3 4 9 NOTES e B 0.25(0.010) M C AM BS α A1 0.10(0.004) A2 C E e H L N 0.026 BSC 0.301 0.025 20 0 deg. 8 deg. 0.311 0.037 0.65 BSC 7.65 0.63 20 0 deg. 8 deg. Rev. 3 11/02 7.90’ 0.95 6 7 NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α 26 FN6201.1 December 20, 2005 ISL81387, ISL41387 Quad Flat No-Lead Plastic Package (QFN) Micro Lead Frame Plastic Package (MLFP) L40.6x6 40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJD-2 ISSUE C) MILLIMETERS SYMBOL A A1 A2 A3 b D D1 D2 E E1 E2 e k L L1 N Nd Ne P θ 0.25 0.30 3.95 3.95 0.18 MIN 0.80 NOMINAL 0.90 0.20 REF 0.23 6.00 BSC 5.75 BSC 4.10 6.00 BSC 5.75 BSC 4.10 0.50 BSC 0.40 40 10 10 0.60 12 0.50 0.15 4.25 4.25 0.30 MAX 1.00 0.05 1.00 NOTES 9 9 5, 8 9 7, 8 9 7, 8 8 10 2 3 3 9 9 Rev. 1 10/02 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd and Ne refer to the number of terminals on each D and E. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. Features and dimensions A2, A3, D1, E1, P & θ are present when Anvil singulation method is used and not present for saw singulation. 10. Depending on the method of lead termination at the edge of the package, a maximum 0.15mm pull back (L1) maybe present. L minus L1 to be equal to or greater than 0.3mm. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 27 FN6201.1 December 20, 2005
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