X9111TV14-2.7

® X9111 Single Supply/Low Power/1024-Tap/SPI Bus Data Sheet September 15, 2006 FN8159.4 Single Digitally-Controlled (XDCP™) Potentiometer The X9111 integrates a single digitally controlled potentiometer (XDCP) on a monolithic CMOS integrated circuit. The digital controlled potentiometer is implemented using 1023 resistive elements in a series array. Between each element are tap points connected to the wiper terminal through switches. The position of the wiper on the array is controlled by the user through the SPI bus interface. The potentiometer has associated with it a volatile Wiper Counter Register (WCR) and four non-volatile Data Registers that can be directly written to and read by the user. The contents of the WCR controls the position of the wiper on the resistor array though the switches. Powerup recalls the contents of the default data register (DR0) to the WCR. The XDCP can be used as a three-terminal potentiometer or as a two terminal variable resistor in a wide variety of applications including control, parameter adjustments, and signal processing. Features • 1024 Resistor Taps – 10-Bit Resolution • SPI Serial Interface for Write, Read, And Transfer Operations Of The Potentiometer • Wiper Resistance, 40Ω Typical @ 5V • Four Non-Volatile Data Registers • Non-Volatile Storage of Multiple Wiper Positions • Power On Recall. Loads Saved Wiper Position on Power-Up. • Standby Current > R2 Function Generator C – + R2 R1 – + } RA } RB frequency ∝ R1, R2, C amplitude ∝ RA, RB 16 FN8159.4 September 15, 2006 X9111 Thin Shrink Small Outline Plastic Packages (TSSOP) N INDEX AREA E E1 -B1 2 3 0.05(0.002) -AD -CSEATING PLANE A 0.25 0.010 L 0.25(0.010) M GAUGE PLANE BM M14.173 14 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 b c D MIN 0.002 0.031 0.0075 0.0035 0.195 0.169 0.246 0.0177 14 0o 8o 0o MAX 0.047 0.006 0.041 0.0118 0.0079 0.199 0.177 0.256 0.0295 MILLIMETERS MIN 0.05 0.80 0.19 0.09 4.95 4.30 6.25 0.45 14 8o MAX 1.20 0.15 1.05 0.30 0.20 5.05 4.50 6.50 0.75 NOTES 9 3 4 6 7 Rev. 2 4/06 e b 0.10(0.004) M C AM BS α A1 0.10(0.004) A2 c E1 e E L N 0.026 BSC 0.65 BSC NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AC, Issue E. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) α All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 17 FN8159.4 September 15, 2006