X9111TV14Z

DATASHEET X9111 FN8159 Rev 5.00 October 13, 2016 Single Supply/Low Power/1024-Tap/SPI Bus/Single Digitally-Controlled (XDCP™) Potentiometer The X9111 integrates a single, digitally controlled potentiometer (XDCP) on a monolithic CMOS integrated circuit. The digital controlled potentiometer is implemented using 1023 resistive elements in a series array. Between each element are tap points connected to the wiper terminal through switches. The position of the wiper on the array is controlled by the user through the SPI bus interface. The potentiometer has associated with it a volatile Wiper Counter Register (WCR) and four nonvolatile Data Registers that can be directly written to and read by the user. The contents of the WCR control the position of the wiper on the resistor array through the switches. Power-up recalls the contents of the default data register (DR0) to the WCR. The XDCP can be used as a 3-terminal potentiometer or as a 2-terminal variable resistor in a wide variety of applications including control, parameter adjustments, and signal processing. Features • 1024 resistor taps – 10-bit resolution • SPI serial interface for write, read, and transfer operations of the potentiometer • Wiper resistance, 40Ω typical at 5V • Four nonvolatile Data Registers • Nonvolatile storage of multiple wiper positions • Power-on recall, loads saved wiper position on power-up • Standby current > R2 FIGURE 20. INVERTING AMPLIFIER FIGURE 21. EQUIVALENT L-R CIRCUIT R2 – R1 – + } RA + } RB FREQUENCY  R1, R2, C AMPLITUDERA, RB FIGURE 22. FUNCTION GENERATOR FN8159 Rev 5.00 October 13, 2016 Page 17 of 19 X9111 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure you have the latest revision. DATE REVISION October 13, 2016 FN8159.5 CHANGE Updated entire datasheet applying Intersil’s new standards. Updated the Ordering Information table on page 2. Updated Notes 1 and 2. Added Note 3. In “AC Timing” on page 12, changed fSCK maximum specification from “2.0” to “2.5”. Added Revision History and About Intersil sections. Updated Package Outline Drawing M14.173 to the latest revision changes are as follows: -Updated drawing to remove table and added land pattern About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing, and high-end consumer markets. For the most updated datasheet, application notes, related documentation, and related parts, see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. © Copyright Intersil Americas LLC 2005-2016. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN8159 Rev 5.00 October 13, 2016 Page 18 of 19 X9111 Package Outline Drawing For the most recent package outline drawing, see M14.173. M14.173 14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Rev 3, 10/09 A 1 3 5.00 ±0.10 14 SEE DETAIL "X" 8 6.40 PIN #1 I.D. MARK 4.40 ±0.10 2 3 1 0.20 C B A 7 B 0.65 0.09-0.20 TOP VIEW END VIEW 1.00 REF 0.05 H C 0.90 +0.15/-0.10 1.20 MAX SEATING PLANE 0.25 +0.05/-0.06 0.10 C 0.10 GAUGE PLANE 0.25 5 0°-8° 0.05 MIN 0.15 MAX CBA SIDE VIEW 0.60 ±0.15 DETAIL "X" (1.45) NOTES: 1. Dimension does not include mold flash, protrusions or gate burrs. (5.65) Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. 2. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25 per side. 3. Dimensions are measured at datum plane H. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. 5. Dimension does not include dambar protrusion. Allowable protrusion shall be 0.80mm total in excess of dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm. (0.65 TYP) (0.35 TYP) TYPICAL RECOMMENDED LAND PATTERN FN8159 Rev 5.00 October 13, 2016 6. Dimension in ( ) are for reference only. 7. Conforms to JEDEC MO-153, variation AB-1. Page 19 of 19