C1812C944J5JLC7800

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Lead-free Overview KEMET's U2J with KONNEKT™ Technology surface mount capacitors are designed for high-efficiency and high-density power applications. KONNEKT utilizes an innovative Transient Liquid Phase Sintering (TLPS) material to create a leadless multi-chip solution. When combined with KEMET’s ultra-stable U2J dielectric, KONNEKT enables a low-loss, low-inductance package capable of handling extremely high ripple currents in the hundreds of kilohertz. U2J is an extremely stable Class I dielectric material that exhibits a negligible shift in capacitance with respect to voltage and a predictable and linear change in capacitance with reference to ambient temperature, with minimal aging effect. Capacitance change is limited to –750 ±120 ppm/°C from –55°C to +125°C. U2J with KONNEKT™ Technology can also be mounted in a low-loss orientation to further increasing its power handling capability. The low-loss orientation lowers ESR (Effective Series Resistance) and ESL (Effective Series Inductance) which increases ripple current handling capability. Benefits Applications • Extremely high-power density and ripple current capability • Extremely low equivalent series resistance (ESR) • Extremely low equivalent series inductance (ESL) • Operating temperature range of −55°C to +125°C • Retains over 99% of nominal capacitance at full rated voltage • Low noise • Surface mountable using standard MLCC reflow profiles • Low-loss orientation option for higher current handling capability • RoHS compliant and Pb-free • Wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems • Data centers • LLC resonant converters • Switched tank converters • Wireless charging systems • Photovoltaic systems • Power converters • Inverters • DC link • Snubber Standard Low Loss Built Into Tomorrow © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Typical Performance Typical Ripple Current (A rms)1 Part Type Mounting Configuration Typical ESR at 25°C, 100 kHz Typical ESL at 25°C 100 kHz 200 kHz 300 kHz Standard 1.15 mΩ 1.1 nH 12.0 12.0 11.5 Low Loss 0.77 mΩ 0.45 nH 18.0 18.0 16.0 Standard 1.3 mΩ 1.6 nH 11.0 10.0 10.0 Low Loss 0.35 mΩ 0.4 nH 20.0 34.0 31.0 1812 940 nF 1812 1.4 uF Ripple current measurements performed at 85°C with a peak capacitor temperature of 95°C. Samples mounted to heat sink with no forced air cooling. Maximum ambient and self heating cannot exceed 125°C. 1 ESR (mOhms) Impedance (Ohms) 1812 940 nF 50 V 1812 940 nF 50 V 1,000.00 Standard 100.00 Impedance (Ohms) 1,000.00 Low-Loss Standard Low-Loss 100.00 ESR (mOhms) 10.00 1.00 0.10 10.00 1.00 0.01 0.10 0.00 1 10 100 1,000 10,000 1 100,000 10 100 Impedance (Ohms) Low-Loss 1.00 0.10 1 10 Capacitance change (%) Capacitance change (%) 5 0 -5 -10 5 25 45 65 85 105 10 5 0 -5 -10 125 0 Temperature (°C) Ripple Current 1812 940 nF 50 V (A ) Standard rms ) Low-Loss ) 10 20 30 40 50 DC Voltage (V) © KEMET Electronics Corporation • KEMET Tower • One Eastrms Broward Boulevard 50 30 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com rms 1,000 Capacitance Change vs DC Voltage KONNEKT U2J 10 -15 100 Frequency (kHz) Capacitance Change vs Temperature KONNEKT U2J (Typical) -35 100,000 0.10 100,000 Frequency (kHz) -55 10,000 1.00 0.00 10,000 Low-Loss 10.00 0.01 1,000 Standard 100.00 10.00 ESR (mOhms) Impedance (Ohms) 1,000.00 Standard 100.00 100 100,000 1812 1.4 uF 50 V 1,000.00 10 10,000 ESR (mOhms) 1812 1.4 uF 50 V 1 1,000 Frequency (kHz) Frequency (kHz) 40 Ripple Current 1812 1.4 uF 50 V (Arms)• 8/25/2021 C1097_KONNEKT_U2J Standard Low-Loss 2 Capacitance chang Capacitance change ( 5 0 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) -5 5 0 -5 U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) -10 -55 -35 -15 5 25 45 Temperature (°C) Typical Performance cont. 65 85 105 -10 125 0 20 30 40 50 DC Voltage (V) Ripple Current 1812 1.4 uF 50 V (Arms) Ripple Current 1812 940 nF 50 V (Arms) 30 50 Standard Ripple Current (Arms) Low-Loss Ripple Current (Arms) 10 20 10 Standard Low-Loss 40 30 20 10 0 0 0 50 100 150 200 250 300 0 350 50 100 150 200 250 300 350 Frequency (kHz) Frequency (kHz) Ordering Information C 1812 C 145 Series Case Size (L"x W") Specification/ Series Capacitance Code (pF) 1812 C= Standard Two single digits and number of zeros. C= Ceramic J 5 J L C 7XXX Termination Finish1 Packaging (Suffix/C-Spec) C = 100% matte Sn See "Packaging C-Spec Ordering Options Table" Subclass Capacitance Rated Dielectric Designation Tolerance Voltage (V) J = ±5% K = ±10% 5= 50 V J= U2J L= KONNEKT Additional termination finish options may be available. Contact KEMET for details. See Table 1A for available capacitance and voltage ratings. 1 Table 1A - Product Ordering Codes, Ratings, and Package Quantities KEMET Part Number1 C1812C944(a)5JLC(b) C1812C145(a)5JLC(b) Capacitance 940 nF 1.4 µF Cap Code 944 145 Voltage 50 V 50 V Number of Chips Orientation Thickness mm (inch) Standard 3.5 (0.137) ±0.40 (0.016) Low Loss 3.20 (0.126) ±0.30 (0.012) Standard 5.3 (0.208) ±0.60 (0.024) Low Loss 3.20 (0.126) ±0.30 (0.012) 2 3 Typical Average Piece Weight (g) 0.22 0.33 Tape & Reel Quantity 7" Tape & Reel 13" Tape & Reel 500 2,000 500 2,200 200 900 500 2,200 Complete part number requires additional characters in the numbered positions provided in order to indicate capacitance tolerance and grade. For each numbered position, available options are as follows: (a) Capacitance tolerance character "J" or "K" (b) See Table 1B for C-Spec options 1 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Table 1B - Packaging C-Spec Ordering Options Table Mounting Orientation Standard Low Loss Packaging Type Packaging/Grade Ordering Code (C-Spec) 7" Reel/Unmarked TU 13" Reel/Unmarked 7210 7" Reel/Unmarked 7805 13" Reel/Unmarked 7810 Dimensions – Millimeters (Inches) Standard Mounting 2 Chips W Low Loss Mounting 2 Chips L L B Standard Mounting 3 Chips W W Low Loss Mounting 3 Chips L L B W B B T Number of Chips 2 3 Mounting EIA SIZE CODE METRIC SIZE CODE L LENGTH W WIDTH T THICKNESS B BANDWIDTH Mounting Technique 4.50 (0.177) ±0.30 (0.012) 3.2 (0.126) ±0.3 (0.012) 3.5 (0.137) ±0.4 (0.016) 3.2 (0.126) ±0.3 (0.012) 5.3 (0.208) ±0.6 (0.024) 3.5 (0.137) ±0.4 (0.016) 3.2 (0.126) ±0.3 (0.012) 5.3 (0.208) ±0.6 (0.024) 3.2 (0.126) ±0.3 (0.012) 0.6 (0.024) ±0.35 (0.014) Solder Reflow Only Standard Low Loss Standard Low Loss 1812 T T T 4532 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Table 2 - Performance and Reliability: Test Methods and Conditions Test Reference Test Condition Limits Visual and Mechanical KEMET Internal No defects that may affect performance (10X) Dimensions according KEMET Spec Sheet Capacitance (Cap) KEMET Internal Dissipation Factor (DF) KEMET Internal Insulation Resistance (IR) KEMET Internal 1 kHz ±50 Hz and 1.0 ±0.2 Vrms Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours 1 kHz ±50 Hz and 1.0 ±0.2 Vrms Apply rated voltage for 120 seconds at 25°C Within Tolerance Dissipation factor (DF) maximum limit at 25°C = 0.1% Within Specification To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. 1,000 MΩ-µF or 100 GΩ Frequency: 1 kHz ±50 Hz Capacitance Change with Reference to +25°C and 0 VDC Applied Temperature Coefficient of Capacitance (TCC) * See part number specification sheet for voltage KEMET Internal Step Temperature (°C) 1 +25°C 2 −55°C 3 +25°C (Reference Temperature) 4 +125°C Dielectric Withstanding Voltage (DWV) KEMET Internal 250% of rated voltage (5 ±1 seconds and charge/discharge not exceeding 50 mA) Aging Rate (Maximum % Capacitance Loss/Decade Hour) KEMET Internal Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. Please refer to a part number specific datasheet for referee time details. −750 ±120 ppm/°C Cap: Initial Limit DF: Initial Limit IR: Initial Limit Withstand test voltage without insulation breakdown or damage. 0.1% Loss/Decade Hour Shear stress test per specific case size, Time: 60±1 seconds Terminal Strength KEMET Internal Case Size Force 1812 18N © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com No evidence of mechanical damage C1097_KONNEKT_U2J • 8/25/2021 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Table 2 - Performance and Reliability: Test Methods and Conditions cont. Test Reference Test Condition Limits Standard Termination system 2.0 mm Test time: 60± 5 seconds Ramp time: 1 mm/second Board Flex AEC-Q200-005 Solderability KEMET Custom Test Temperature JESD22 Cycling Method JA-104 Biased Humidity MIL-STD-202 Method 103 No evidence of mechanical damage 1. Board shear – SAC305 solder. Shear force of 1.8 kg (minimum) 2. Wetting balance – IEC 60068–2–69 1,000 cycles (−55°C to +125°C) 2-3 cycles per hour Soak Time 1 or 5 minute Load Humidity: 1,000 hours 85°C / 85% RH and rated voltage, or 200 VDC maximum. Low Volt Humidity: 1,000 hours 85C°/85% RH and 1.5 V. Visual Inspection. 95% coverage on termination. No leaching. Measurement at 24 hours ±4 hours after test conclusion. Cap: Initial Limit DF: Initial Limit IR: Initial Limit Measurement at 24 hours ±4 hours after test conclusion. Within Post Environmental Limits: Cap: ±0.3% or ±0.25pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% Measurement at 24 hours ±4 hours after test conclusion. Moisture Resistance MIL-STD-202 Method 106 Number of cycles required 10, 24 hours per cycle. Steps 7a and 7b not required Thermal Shock MIL-STD-202 Method 107 Number of cycles required 5, (-55°C to 125°C) Dwell time 15 minutes. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Within Post Environmental Limits Cap: ±0.3% or ±0.25pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% Cap: Initial Limit DF: Initial Limit IR: Initial Limit C1097_KONNEKT_U2J • 8/25/2021 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Table 2 - Performance and Reliability: Test Methods and Conditions cont. Test High Temperature Life Reference Test Condition 1,000 hours at 125°C with 1.0 X rated voltage applied. MIL-STD-202 Method 108 Storage Life 1,000 hours at 125°C, Unpowered Limits Within Post Environmental Limits Cap: ±0.3% or ±0.25pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% Vibration MIL-STD-202 Method 204 5 G's for 20 minutes, 12 cycles each of 3 orientations. Test from 10 – 2,000 Hz Cap: Initial Limit DF: Initial Limit IR: Initial Limit Mechanical Shock MIL-STD-202 Method 213 1,500 G’s 0.5ms Half-sine, Velocity Change: 15.4 feet/second (Condition F) Cap: Initial Limit DF: Initial Limit IR: Initial Limit Resistance to Solvents MIL-STD-202 Method 215 Add Aqueous wash chemical OKEMCLEAN (A 6% concentrated Oakite cleaner) or equivalent. Do not use banned solvents. Visual Inspection 10X Readable marking, no decoloration or stains. No physical damage. Environmental Compliance Lead-free Lead (Pb)-free, RoHS, and REACH compliant without exemptions. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Table 3 – KONNEKT Land Pattern Design Recommendations per IPC-7351 (mm) Chip Number Orientation 2 Standard and Low Loss 3 Standard EIA SIZE CODE 1812 Low loss Median (Nominal) Land Protrusion METRIC SIZE CODE 4532 C Y X V1 V2 2.05 1.40 3.50 6.00 4.00 2.05 1.40 3.50 6.00 4.00 2.05 1.40 5.90 6.00 6.40 2 Chips Standard Low Loss (Land Pattern Design Recommendations per IPC-7351, top view) 3 Chips Standard Low Loss (Land Pattern Design Recommendations per IPC-7351, top view) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Soldering Process Recommended Reflow Soldering Profile KEMET's KONNEKT family of high density surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with convection and IR reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Termination Finish TP 100% matte Sn 150°C 200°C Time (tS) from TSmin to TSmax 60 – 120 seconds Ramp-Up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time Above Liquidous (tL) 60 – 150 seconds Peak Temperature (TP) 260°C Time Within 5°C of Maximum Peak Temperature (tP) 30 seconds maximum Ramp-Down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum TL Temperature Profile Feature tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years upon receipt. Construction Detailed Cross Section Dielectric Material (CaZrO3) Bonding Material (See Image Below) Dielectric Material (CaZrO3) Termination Finish (100% matte Sn) Barrier Layer (Ni) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) End Termination/ External Electrode (Cu) Inner Electrodes (Ni) Termination Finish (100% matte Sn) Bonding Material MLCC CuSn TLPS MLCC © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 1B for details on reeling quantities for commercial chips. KONNEKT Low loss orientation in pocket KONNEKT Standard orientation in pocket Bar code label Anti-static reel ® ET KEM Embossed plastic carrier Embossed plastic carrier Sprocket holes Embossment cavity 16 mm carrier tape Anti-static cover tape (0.10 mm (0.004") maximum thickness) 180 mm (7.00") or 330 mm (13.00") Table 4 – Carrier Tape Configuration, Embossed Plastic (mm) EIA Case Size KONNEKT 1812 Embossed Plastic Chip Number Tape Size (W)* 7" Reel 2 16 8 8 3 16 12 12 13" Reel Pitch (P1)2 1. Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. 2. Refer to Tables 4 and 5 for tolerance specifications. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 P0 (10 pitches cumulative tolerance on tape ±0.2 mm) A0 E1 F K0 B1 S1 W E2 B0 P1 T1 Center Lines of Cavity ØD1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 5 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 D1 Minimum Note 1 E1 P0 P2 R Reference Note 2 16 mm 1.5 +0.10/−0.0 (0.059 +0.004/−0.0) 1.5 (0.059) 1.75±0.10 (0.069±0.004) 4.0±0.10 (0.157±0.004) 2.0±0.05 (0.079±0.002) 30 (1.181) S1 Minimum T T1 Note 3 Maximum Maximum 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 16 mm Triple (12mm) B1 Maximum Note 4 12.1 (0.476) E2 Minimum 14.25 (0.561) F P1 7.5±0.05 (0.138±0.002) 12.0±0.10 (0.157±0.004) T2 Maximum 4.6 (0.181) W Maximum 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4) (e) For KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) ° s Tape Width (mm) 8,12 16 – 56 72 – 200 Typical Component Centerline Ao Figure 3 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum Maximum Rotation ( 20 10 5 ° S) Figure 4 – Bending Radius Embossed Carrier 16 mm Tape Punched Carrier 1.0 mm maximum 1.0 mm maximum R © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Bending Radius R C1097_KONNEKT_U2J • 8/25/2021 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Figure 5 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 6 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 16 mm 178±0.20 (7.008±0.008) or 330±0.20 (13.000±0.008) 1.5 (0.059) 13.0 +0.5/−0.2 (0.521 +0.02/−0.008) 20.2 (0.795) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum See Note 2, Tables 2-3 W1 W2 Maximum W3 16 mm 50 (1.969) 16.4 +2.0/−0.0 (0.646 +0.078/−0.0) 22.4 (0.882) Shall accommodate tape width without interference © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) Figure 6 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 7 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial Grade) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1097_KONNEKT_U2J • 8/25/2021 16