C2220C663KDGLCAUTO

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Lead-free Overview KEMET's C0G with KONNEKTTM technology surface mount capacitors are designed for high-efficiency and high-density power applications. KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multichip solution for high density packaging. By utilizing KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern. With an operating temperature range up to 125°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. C0G with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames. Benefits Applications • Extremely high-power density and ripple current capability • Extremely low equivalent series resistance (ESR) • Extremely low equivalent series inductance (ESL) • Capacitance offerings ranging from 0.78 nF – 1.4 uF • DC voltage ratings from 50 – 3,000 V • EIA sizes 1812 and 2220 • Operating temperature range of −55°C to +125°C • No capacitance shift with voltage • No piezoelectric noise • High thermal stability • Surface mountable using standard MLCC reflow profiles • Wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems • Data centers • EV/HEV (drive systems, charging) • LLC resonant converters • Switched tank converters • Wireless charging systems • Photovoltaic systems • Power converters • Inverters • DC link • Snubber Standard Orientation C0G with KONNEKT series compliments the KC-LINK with KONNEKT series by offering a wider voltage range and operating temperature range up to 125°C Standard Orientation Built Into Tomorrow © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Ordering Information C Ceramic C 1812 C 943 Case Size Specification/ Capacitance (L"x W") Series Code (pF) 1812 2220 C = Standard Two single digits + number of zeros. K C G L Capacitance Tolerance Subclass Rated Voltage Dielectric Designation (V) K = ±10% 5 = 50 V 1 = 100 V 2 = 200 V A = 250 V C = 500 V B = 630 V D = 1,000 V F = 1,500 V G = 2,000 V Z = 2,500 V H = 3,000 V G= C0G L= KONNEKT C XXXX Termination Finish Orientation and Packaging (Suffix/C-Spec) C= 100% matte Sn See "Packaging and Orientation C-Spec Ordering Options Table" Additional termination finish options may be available. Contact KEMET for details. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Orientation and Packaging (Suffix/C-Spec) Options Table Mounting Orientation1 Tape and Reel Illustration Packaging Type Packaging/Grade Ordering Code (C-Spec) Commercial Grade Standard 7" Reel/Unmarked TU 13" Reel/Unmarked 7210 7" Reel/Unmarked 7805 13" Reel/Unmarked 7810 Low Loss Automotive Grade Standard 7" Reel/Unmarked AUTO 13" Reel/Unmarked AUTO7210 7" Reel/Unmarked AUTO7805 13" Reel/Unmarked AUTO7810 Low Loss 1 - Orientation refers to the positioning of the KONNEKT capacitors in the Tape and Reel pockets. This allows pick and place machines to place capacitors on the PCB in the correct orientation. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notification (PCN) The KEMET product change notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit, function, and/or reliability • Changes in manufacturing site • Product obsolescence Process/Product change Obsolescence* Days Prior To Implementation KEMET assigned Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 1 Customer Notification Due To: KEMET Automotive C-Spec KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. PPAP (Product Part Approval Process) Level KEMET Automotive C-Spec 1 2 3 4 5 KEMET assigned ● ● ● ● ● 1 AUTO 1 ○ KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. ● Part number specific PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) Standard Mounting 2 Chips Standard Mounting 3 Chips Low Loss Mounting 3 Chips L B Standard Mounting 4 Chips L W 1812 METRIC SIZE CODE Number of Chips Mounting 2 Standard 4532 Standard 3 L LENGTH 2220 5750 3 4.50 (0.177) ± 0.30 (0.012) 4 Low Loss W WIDTH T THICKNESS B BANDWIDTH Mounting Technique See Ordering Code Table 0.60 (0.024) ± 0.35 (0.014) Solder Reflow Only 3.20 (0.126) ± 0.30 (0.012) 7.70 (0.303) ±0.60 (0.24) Standard Standard W 3.20 (0.126) ± 0.30 (0.012) Low Loss 2 B T T EIA SIZE CODE Low Loss Mounting 4 Chips 5.70 (0.224) ± 0.40 (0.016) Low Loss © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 5.00 (0.197) ± 0.40 (0.016) 5.00 (0.197) ± 0.40 (0.016) 7.70 (0.303) ±0.60 (0.24) 10.30 (0.405) ±0.80 (0.031) C1113_KONNEKT_C0G • 12/1/2023 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Table 1A - 1812, 2-Chip Product Ordering Codes, Ratings, and Package Quantities Thickness mm (inch) Typical Average Piece Weight (g) 50 V 3.3 (0.130) ± 0.4 (0.016) 0.19 500 2000 304 100 V 3.5 (0.138) ± 0.4 (0.016) 0.19 500 2000 200 nF 204 200 V 4.1 (0.161) ± 0.4 (0.016) 0.24 275 1050 C1812C204KAGLC(a) 200 nF 204 250 V 4.1 (0.161) ± 0.4 (0.016) 0.24 275 1050 C1812C943KCGLC(a) 94 nF 943 500 V 0.3 200 850 C1812C943KBGLC(a) 94 nF 943 630 V 0.3 200 850 C1812C303KDGLC(a) 30 nF 303 1000 V 0.3 200 850 C1812C542KFGLC(a) 5.4 nF 542 1500 V 0.3 200 850 C1812C302KGGLC(a) 3 nF 302 2000 V 0.3 200 850 C1812C142KZGLC(a) 1.4 nF 142 2500 V 0.3 200 850 C1812C781KHGLC(a) 0.78 nF 781 3000 V 0.3 200 850 KEMET Part Number Capacitance Cap Code Voltage C1812C444K5GLC(a) 440 nF 444 C1812C304K1GLC(a) 300 nF C1812C204K2GLC(a) Number of Chips 2 Orientation Available Standard 5.1 (0.200) ± 0.4 (0.016) Tape & Reel Quantity 7""Tape & 13" Tape & Reel Reel (a) C-Spec for Product Grade, Reeling and Mounting Orientation. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Table 1B - 1812, 3-Chip Product Ordering Codes, Ratings, and Package Quantities Thickness mm (inch) Typical Average Piece Weight (g) 50 V 5.0 (0.197) ± 0.6 (0.024) 0.28 200 950 454 100 V 5.3 (0.209) ± 0.6 (0.024) 0.28 200 900 300 nF 304 200 V 6.2 (0.244) ± 0.6 (0.024) 0.36 175 725 C1812C304KAGLC(a) 300 nF 304 250 V 6.2 (0.244) ± 0.6 (0.024) 0.36 175 725 C1812C144KCGLC(a) 140 nF 144 500 V 0.45 100 600 C1812C144KBGLC(a) 140 nF 144 630 V 0.45 100 600 C1812C453KDGLC(a) 45 nF 453 1000 V 0.45 100 600 C1812C802KFGLC(a) 8 nF 802 1500 V 0.45 100 600 C1812C452KGGLC(a) 4.5 nF 452 2000 V 0.45 100 600 C1812C202KZGLC(a) 2.0 nF 202 2500 V 0.45 100 600 C1812C122KHGLC(a) 1.2 nF 122 3000 V 0.45 100 600 KEMET Part Number Capacitance Cap Code Voltage C1812C664K5GLC(a) 660 nF 664 C1812C454K1GLC(a) 450 nF C1812C304K2GLC(a) Number of Chips Orientation Available Standard 7.7 (0.303) ± 0.6 (0.024) 3 Tape & Reel Quantity 7" Tape & 13" Tape & Reel Reel C1812C664K5GLC(a) 660 nF 664 50 V 5.0 (0.197) ± 0.6 (0.024) 0.28 500 2200 C1812C454K1GLC(a) 450 nF 454 100 V 5.3 (0.209) ± 0.6 (0.024) 0.28 500 2200 C1812C304K2GLC(a) 300 nF 304 200 V 6.2 (0.244) ± 0.6 (0.024) 0.36 350 1350 C1812C304KAGLC(a) 300 nF 304 250 V 6.2 (0.244) ± 0.6 (0.024) 0.36 350 1350 C1812C144KCGLC(a) 140 nF 144 500 V 0.45 350 1350 C1812C144KBGLC(a) 140 nF 144 630 V 0.45 350 1350 C1812C453KDGLC(a) 45 nF 453 1000 V 0.45 350 1350 C1812C802KFGLC(a) 8 nF 802 1500 V 0.45 350 1350 C1812C452KGGLC(a) 4.5 nF 452 2000 V 0.45 350 1350 C1812C202KZGLC(a) 2.0 nF 202 2500 V 0.45 350 1350 C1812C122KHGLC(a) 1.2 nF 122 3000 V 0.45 350 1350 Low Loss 7.7 (0.303) ± 0.6 (0.024) (a) C-Spec for Product Grade, Reeling and Mounting Orientation. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Table 1C - 2220, 2-Chip Product Ordering Codes, Ratings, and Package Quantities Thickness mm (inch) Typical Average Piece Weight (g) 50 V 3.5 (0.138) ± 0.4 (0.016) 0.45 475 1825 664 100 V 3.5 (0.138) ± 0.4 (0.016) 0.445 475 1825 440 nF 444 200 V 4.1 (0.161) ± 0.4 (0.016) 0.45 225 950 C2220C204KCGLC(a) 200 nF 204 500 V 0.65 300 1250 C2220C204KBGLC(a) 200 nF 204 630 V 0.65 300 1250 0.65 300 1250 0.65 300 1250 KEMET Part Number Capacitance Cap Code Voltage C2220C944K5GLC(a) 940 nF 944 C2220C664K1GLC(a) 660 nF C2220C444K2GLC(a) Number of Chips 2 Orientation Available Tape & Reel Quantity 7" Tape & 13" Tape & Reel Reel Standard C2220C663KDGLC(a) 66 nF 663 1000 V C2220C143KFGLC(a) 14 nF 143 1500 V C2220C782KGGLC(a) 7.8 nF 782 2000 V 0.645 300 1250 C2220C362KZGLC(a) 3.6 nF 362 2500 V 0.65 300 1250 C2220C202KHGLC(a) 2.0 nF 202 3000 V 0.65 300 1250 5.1 (0.200) ± 0.4 (0.016) (a) C-Spec for Product Grade, Reeling and Mounting Orientation. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Table 1D - 2220, 3-Chip Product Ordering Codes, Ratings, and Package Quantities Thickness mm (inch) Typical Average Piece Weight (g) 50 V 5.3 (0.209) ± 0.45 (0.018) 0.67 300 1250 105 100 V 5.3 (0.209) ± 0.45 (0.018) 0.67 300 1250 660 nF 664 200 V 6.2 (0.244) ± 0.6 (0.024) 0.67 175 700 C2220C304KCGLC(a) 300 nF 304 500 V 0.97 125 575 C2220C304KBGLC(a) 300 nF 304 630 V 0.97 125 575 0.97 125 575 0.97 125 575 KEMET Part Number Capacitance Cap Code Voltage C2220C145K5GLC(a) 1.4 uF 145 C2220C105K1GLC(a) 1.0 uF C2220C664K2GLC(a) Number of Chips Orientation Available Tape & Reel Quantity 7" Tape & 13" Tape & Reel Reel Standard C2220C104KDGLC(a) 100 nF 104 1000 V C2220C203KFGLC(a) 20 nF 203 1500 V C2220C123KGGLC(a) 12 nF 123 2000 V 0.97 125 575 C2220C542KZGLC(a) 5.4 nF 542 2500 V 0.97 125 575 C2220C302KHGLC(a) 3 nF 302 3000 V 0.97 125 575 7.7 (0.303) ± 0.6 (0.024) 3 C2220C145K5GLC(a) 1.4 uF 145 50 V 5.3 (0.209) ± 0.45 (0.018) 0.67 225 900 C2220C105K1GLC(a) 1.0 uF 105 100 V 5.3 (0.209) ± 0.45 (0.018) 0.67 225 900 C2220C664K2GLC(a) 660 nF 664 200 V 6.2 (0.244) ± 0.6 (0.024) 0.67 225 900 C2220C304KCGLC(a) 300 nF 304 500 V 0.97 160 675 C2220C304KBGLC(a) 300 nF 304 630 V 0.97 160 675 0.97 160 675 0.97 160 675 Low Loss C2220C104KDGLC(a) 100 nF 104 1000 V C2220C203KFGLC(a) 20 nF 203 1500 V C2220C123KGGLC(a) 12 nF 123 2000 V 0.97 160 675 C2220C542KZGLC(a) 5.4 nF 542 2500 V 0.97 160 675 C2220C302KHGLC(a) 3 nF 302 3000 V 0.97 160 675 7.7 (0.303) ± 0.6 (0.024) (a) C-Spec for Product Grade, Reeling and Mounting Orientation. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Table 1E - 2220, 4-Chip Product Ordering Codes, Ratings, and Package Quantities Thickness mm (inch) Typical Average Piece Weight (g) 50 V 7.1 (0.280) ± 0.6 (0.024) 0.9 125 525 135 100 V 7.1 (0.280) ± 0.6 (0.024) 0.9 125 525 880 nF 884 200 V 8.3 (0.327) ± 0.6 (0.024) 0.9 125 525 C2220C404KCGLC(a) 400 nF 404 500 V 1.3 125 525 C2220C404KBGLC(a) 400 nF 404 630 V 1.3 125 525 1.3 125 525 1.3 125 525 KEMET Part Number Capacitance Cap Code Voltage C2220C205K5GLC(a) 2uF 205 C2220C135K1GLC(a) 1.3 uF C2220C884K2GLC(a) Number of Chips 4 Orientation Available Tape & Reel Quantity 7" Tape & 13" Tape & Reel Reel Low Loss C2220C134KDGLC(a) 130 nF 134 1000 V C2220C273KFGLC(a) 27 nF 273 1500 V C2220C163KGGLC(a) 16 nF 163 2000 V 1.3 125 525 C2220C722KZGLC(a) 7.2 nF 722 2500 V 1.3 125 525 C2220C402KHGLC(a) 4 nF 402 3000 V 1.3 125 525 10.3 (0.406) ± 0.8 (0.031) (a) C-Spec for Product Grade, Reeling and Mounting Orientation. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Table 2 - Performance and Reliability: Test Methods and Conditions (Commercial Only) Test Reference Test Condition Limits Visual and Mechanical KEMET Internal No defects that may affect performance (10X) Dimensions according KEMET Spec Sheet Capacitance (Cap) KEMET Internal Dissipation Factor (DF) KEMET Internal Insulation Resistance (IR) KEMET Internal 1 kHz ±50 Hz and 1.0 ±0.2 Vrms of capacitance Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours Within Tolerance 1 kHz ±50 Hz and 1.0 ±0.2 Vrms Dissipation factor (DF) maximum limit at 25°C = 0.1% For < 500 VDC: Rated voltage applied for 120 ±5 seconds at 25°C Within Specification For ≥ 500 VDC: 500 V applied for 120 ±5 seconds at 25°C To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. 1,000 MΩ-µF or 100 GΩ Frequency: 1 kHz ±50 Hz Capacitance change with reference to +25°C and 0 VDC applied * See part number specification sheet for voltage Temperature Coefficient of Capacitance (TCC) Dielectric Withstanding Voltage (DWV) KEMET Internal KEMET Internal Step Temperature (°C) 1 +25°C 2 −55°C 3 +25°C (Reference Temperature) 4 +125°C Rated DC Voltage DWV Voltage (% of Rated) < 500 250% 500 150% 630 130% ≥ 1,000 120% ±30 PPM/°C Cap: Initial Limit DF: Initial Limit IR: Initial Limit Withstand test voltage without insulation breakdown or damage. (5 ±1 seconds and charge/discharge not exceeding 50 mA) Aging Rate (Maximum % Capacitance Loss/Decade Hour) KEMET Internal Maximum % capacitance loss/decade hour © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 0% Loss/Decade Hour C1113_KONNEKT_C0G • 12/1/2023 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Table 2 - Performance and Reliability: Test Methods and Conditions (Commercial Only) cont. Test Reference Test Condition Limits Shear stress test per specific case size, Time: 60±1 seconds Terminal Strength KEMET Internal Case Size 1812 2220 Board Flex Solderability Temperature Cycling Biased Humidity Moisture Resistance AEC-Q200-005 J-STD-002 JESD22 Method JA-104 MIL-STD-202 Method 103 MIL-STD-202 Method 106 Force No evidence of mechanical damage 18N Standard Termination System 3.0 mm Test time: 60± 5 seconds Ramp time: 1 mm/second Magnification 10X. Conditions: Category 2 (Dry Bake 155°C/4 hours ±15 minutes) a) Method B, 245°C, SnPb b) Method B1 at 245°C, Pb-Free c) Method D, at 260°C, SnPb or Pb-Free 1,000 cycles (−55°C to +125°C) 2 – 3 cycles per hour Soak Time 1 or 5 minutes Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC. Add 100 KΩ resistor. Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 KΩ resistor. Number of cycles required 10, 24 hours per cycle. Steps 7a and 7b not required. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com No evidence of mechanical damage Visual Inspection. 95% coverage on termination. No leaching Measurement at 24 hours ±4 hours after test conclusion. Cap: Initial Limit DF: Initial Limit IR: Initial Limit Measurement at 24 hours ±4 hours after test conclusion. Within Post Environmental Limits Cap: ±0.3% or ±0.25 pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% Measurement at 24 hours ±4 hours after test conclusion. Within Post Environmental Limits Cap: ±0.3% or ±0.25 pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% C1113_KONNEKT_C0G • 12/1/2023 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Table 2 - Performance and Reliability: Test Methods and Conditions (Commercial Only) cont. Test Reference Test Condition Limits Thermal Shock MIL-STD-202 Method 107 Number of cycles required 5, (−55°C to 125°C) Dwell time 15 minutes. Cap: Initial Limit DF: Initial Limit IR: Initial Limit High Temperature Life 1,000 hours at 125°C with 1.0 X rated voltage applied MIL-STD-202 Method 108 Storage Life 1,000 hours at 125°C, Unpowered Measurement at 24 hours ±4 hours after test conclusion. Within Post Environmental Limits Cap: ±0.3% or ±0.25 pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% Vibration MIL-STD-202 Method 204 5 g's for 20 minutes, 12 cycles each of 3 orientations. Test from 10 – 2,000 Hz Cap: Initial Limit DF: Initial Limit IR: Initial Limit Mechanical Shock MIL-STD-202 Method 213 1,500 g’s 0.5 ms Half-sine, Velocity Change 15.4 feet/second (Condition F) Cap: Initial Limit DF: Initial Limit IR: Initial Limit Resistance to Solvents MIL-STD-202 Method 215 Add Aqueous wash chemical OKEMCLEAN (A 6% concentrated Oakite cleaner) or equivalent. Do not use banned solvents. Visual Inspection 10X Readable marking, no decoloration or stains. No physical damage. Environmental Compliance Lead-free Lead (Pb)-free, RoHS, and REACH compliant without exemptions. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Table 3 – KONNEKT Land Pattern Design Recommendations per IPC-7351 (mm) Median (Nominal) Land Protrusion STANDARD ORIENTATION EIA Size Code Metric Size Code LOW LOSS Thickness Code 2,3,4-Chip Stack Pad Sizes 3-Chip Stack Pad Size 4-Chip Stack Pad Size C Y X V1 V2 C Y X V1 V2 1812 4532 GO 2.05 1.40 3.50 6.00 4.00 2.05 1.40 8.40 6.00 8.90 2220 5750 JN 2.65 1.50 5.40 7.30 5.90 2.65 1.50 8.40 7.30 8.90 C Y X V1 V2 2.65 1.50 11.20 7.30 11.70 Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years upon receipt. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Soldering Process Recommended Reflow Soldering Profile KEMET's KONNEKT family of high density surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with convection and IR reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Termination Finish TP 100% matte Sn 150°C 200°C Time (tS) from TSmin to TSmax 60 – 120 seconds Ramp-Up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time Above Liquidous (tL) 60 – 150 seconds Peak Temperature (TP) 260°C Time Within 5°C of Maximum Peak Temperature (tP) 30 seconds maximum Ramp-Down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum TL Temperature Profile Feature tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Hand Soldering and Removal of KONNEKT Capacitors The preferred method of attachment for KEMET’s KONNEKT Capacitors is IR or convection reflow where temperature, time and air flow are well controlled. However, it is understood that the manual attachment of KONNEKT capacitors is necessary for prototype and lab testing. In these instances, care must be taken not to introduce excessive temperature gradients in the KONNEKT part type that may lead to cracking in the ceramic or separation of the TLPS material. Please see KEMET's KONNEKT Soldering Guidelines here. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Construction – Standard Termination Detailed Cross Section Dielectric Material (CaZrO3) Bonding Material (See Image Below) Termination Finish (100% matte Sn) Dielectric Material (CaZrO3) Barrier Layer (Ni) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) End Termination/ External Electrode (Cu) Termination Finish (100% matte Sn) Inner Electrodes (Ni) Bonding Material MLCC CuSn TLPS MLCC © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers X7R with KONNEKT technology capacitors packaged in 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. Bar code label Anti-static reel KONNEKT Standard orientation in pocket ® ET KEM Embossed plastic carrier Sprocket holes 16 mm carrier tape Embossment cavity Anti-static cover tape (0.10 mm (0.004") maximum thickness) 180 mm (7.00") or 330 mm (13.00") Table 4 – Carrier Tape Configuration, Embossed Plastic (mm) EIA Case Size 1812 2220 Number of Chips Part Orienation 2 Standard 3 Standard 3 Tape Size (W)1 Embossed Plastic 7" Reel 13" Reel Pitch (P1)2 12 12 16 16 Low Loss 8 8 2 Standard 8 8 3 Standard 12 12 3 Low Loss 16 16 4 Low Loss 20 20 16 16 1. Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. 2. Refer to Tables 4 and 5 for tolerance specifications. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 P0 (10 pitches cumulative tolerance on tape ±0.2 mm) A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1 Table 4 ØD1 Cover Tape User Direction of Unreeling Table 5 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 D1 Minimum Note 1 E1 P0 P2 R Reference Note 2 16 mm 1.5 +0.10/−0.0 (0.059 +0.004/−0.0) 1.5 (0.059) 1.75±0.10 (0.069±0.004) 4.0±0.10 (0.157±0.004) 2.0±0.05 (0.079±0.002) 30 (1.181) S1 Minimum T T1 Note 3 Maximum Maximum 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Case Size Number of Chips Tape Size 1812 2 16 mm 2220 2 16 mm Pitch B1 Maximum Note 4 Triple (12mm) Double (8mm) Triple (12mm) Double (8mm) 7.9 (0.311) 7.5 (0.295) 8.5 (0.335) 9.2 (0.363) E2 Minimum 14.25 (0.561) 14.25 (0.561) F P1 12.0±0.10 (0.472±0.004) 7.5±0.05 (0.138±0.002) 8.0±0.10 (0.315±0.004) 12.0±0.10 (0.472±0.004) 7.5±0.05 (0.138±0.002) 8.0±0.10 (0.315±0.004) T2 Maximum W Maximum A0,B0 & K0 6.5 (0.256) 16.3 (0.642) Note 5 6.5 (0.256) 16.3 (0.642) Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied. See EIA Document 481, Paragraph 4.3 (b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) For KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 16 mm 0.1 to 1.3 newton (10 to 130 gf) Table 6 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 16 mm 178±0.20 (7.008±0.008) or 330±0.20 (13.000±0.008) 1.5 (0.059) 13.0 +0.5/−0.2 (0.521 +0.02/−0.008) 20.2 (0.795) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum See Note 2, Tables 2-3 W1 W2 Maximum W3 16 mm 50 (1.969) 16.4 +2.0/−0.0 (0.646 +0.078/−0.0) 22.4 (0.882) Shall accommodate tape width without interference © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 19 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer YAGEO Corporation and its affi liates do not recommend the use of commercial or automotive grade products for high reliability applications or manned space fl ight. All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1113_KONNEKT_C0G • 12/1/2023 20