T500X107K016AG61107505

Tantalum Surface Mount Capacitors – High Temperature T500 MnO2 200°C Overview The KEMET T500 is a high-temperature product that offers optimum performance characteristics in applications with operating temperatures up to 200°C. The T500 is classified as MSL (Moisture Sensitivity Level) 1 under J–STD–020: unlimited floor life time at ≤ 30°C/85% RH. Benefits • Meets or exceeds EIA standard 535BAAC • Weibull failure rate to B Level available • Standard gold-plated termination • RoHS Compliant • Operating temperature range of −55°C to +200°C • 100% steady-state accelerated aging at 200°C • Voltage derating is 40% at 200°C • Qualified at 1,000 hours of life test at 200°C • Taped and reeled per EIA 481 • Meets MSL 1 requirements for Pb-free assembly according to JEDEC J–STD–020 (*) • Surge current options available Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Applications Typical applications include decoupling and filtering in down-hole, defense, and aerospace industries. K-SIM For a detailed analysis of specific part numbers, please visit ksim.kemet.com to access KEMET’s K-SIM software. KEMET K-SIM is designed to simulate behavior of components with respect to frequency, ambient temperature, and DC bias levels. Built Into Tomorrow © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 1 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Ordering Information T 500 Capacitor Class Series T= Tantalum X 227 M Case Capacitance Capacitance Size Code (pF) Tolerance High Temperature 200°C B C D X First two digits represent significant figures. Third digit specifies number of zeros. K = ±10% M = ±20% 010 A G 61 10 Rated Voltage (VDC) Failure Rate/ Design Termination Finish Performance ESR A = N/A B = 0.1%/1,000 hours G = Gold-plated 006 = 6.3 010 = 10 016 = 16 035 = 35 050 = 50 61 = Surge None 62 = Surge at 25°C after Weibull 63 = Surge −55°C and +85°C after Weibull 10 = Standard ESR Packaging (C-Spec) Blank = 7" reel 7280 = 13" reel Performance Characteristics Item Performance Characteristics Operating Temperature Rated Capacitance Range Capacitance Tolerance Rated Voltage Range −55°C to 200°C 4.7 – 220 µF at 120 Hz/25°C K Tolerance (10%), M Tolerance (20%) 6.3 – 50 V DF (120 Hz) Refer to Part Number Electrical Specification Table ESR (100 kHz) Refer to Part Number Electrical Specification Table Leakage Current ≤ 0.01 CV (µA) at rated voltage after 5 minutes © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 2 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Qualification Test Condition Characteristics Δ C/C Endurance 200°C at 0.4 x VR , 1,000 hours (**) Within initial limits DCL 1 mAmp maximum ESR Within initial limits Δ C/C Storage Life 200°C at 0 volts, 1,000 hours Temperature Stability Mechanical Shock/ Vibration 85°C, 85% RH, 0 volts, 1,000 hours Extreme temperature exposure at a succession of continuous steps at +25°C, −55°C, +25°C, +85°C, +125°C, +25°C Within ±10% of initial value DF Within initial limits DCL 1 mAmp maximum ESR Within initial limits Δ C/C Humidity Within ±10% of initial value DF Within ±10% of initial value DF Within initial limits DCL Within initial limits ESR Within initial limits +25°C −55°C +85°C +150°C Δ C/C IL* ±10% ±10% ±20% DF IL IL 1.5 x IL 1.5 x IL DCL IL N/A 10 x IL 12 x IL MIL–STD–202, Method 213, Condition I, 100 G peak MIL–STD–202, Method 204, 10 Hz to 2,000 Hz, 5 G for 20 minutes, 12 cycles each of 3 orientations Δ C/C Within ±10 of initial value DF Within initial limits DCL Within initial limits *IL = Initial limit ** © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 3 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Electrical Characteristics Impedance & ESR vs. Frequency 100 Impedance & ESR (Ohms) T500X107K016 IMP T500X107K016 ESR 10 T500X227K010 IMP T500X227K010 ESR T500X336K035 IMP T500X336K035 ESR 1 0.1 0.01 100 1,000 10,000 100,000 1,000,000 10,000,000 Frequency (Hz) The measurements were taken at room temperature (25°C) Capacitance vs. Frequency 1,000 T500X107K016 T500X227K010 Capacitance (µF) T500X336K035 100 10 1 100 1,000 10,000 100,000 1,000,000 10,000,000 Frequency (Hz) The measurements were taken at room temperature (25°C) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 4 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Dimensions – Millimeters CATHODE (-) END VIEW SIDE VIEW ANODE (+) END VIEW BOTTOM VIEW A B W B H X F E T S G S P Termination cutout at KEMET's option, either end Case Size R L Component KEMET EIA L W H F ±0.1 ±(0.004) S ±0.3 (±0.012) B ±0.15 (Ref) ±0.006 X (Ref) P (Ref) R (Ref) T A (Ref) (Minimum) G (Ref) E (Ref) B 3528–21 3.5±0.2 (0.138±0.008) 2.8±0.2 (0.110±0.008) 1.9±0.2 (0.075±0.008) 2.2 (0.087) 0.80+0.1/−0.3 (0.032+0.004/−0.011) 0.4 (0.016) 0.10±0.10 (0.004±0.004) 0.5 (0.020) 1.0 (0.039) 0.13 (0.005) 1.9 (0.075) 1.8 (0.071) 2.2 (0.087) C 6032–28 6.0±0.3 (0.236±0.012) 3.2±0.3 (0.126±0.012) 2.5±0.3 (0.098±0.012) 2.2 (0.087) 1.3 (0.051) 0.5 (0.020) 0.10±0.10 (0.004±0.004) 0.9 (0.035) 1.0 (0.039) 0.13 (0.005) 2.9 (0.114) 2.8 (0.110) 2.4 (0.094) D 7343–31 7.3±0.3 (0.287±0.012) 4.3±0.3 (0.169±0.012) 2.8±0.3 (0.110±0.012) 2.4 (0.094) 1.3 (0.051) 0.5 (0.020) 0.10±0.10 (0.004±0.004) 0.9 (0.035) 1.0 (0.039) 0.13 (0.005) 3.8 (0.150) 3.5 (0.138) 3.5 (0.138) X 7343–43 7.3±0.3 (0.287±0.012) 4.3±0.3 (0.169±0.012) 4.0±0.3 (0.157±0.012) 2.4 (0.095) 1.3 (0.051) 0.5 (0.020) 0.10±0.10 (0.004±0.004) 1.7 (0.067) 1.0 (0.039) 0.13 (0.005) 3.8 (0.150) 3.5 (0.138) 3.5 (0.138) Notes: (Ref) – Dimensions provided for reference only. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 5 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Table 1 – Ratings & Part Number Reference Rated Voltage Working Voltage Rated Cap Case Code/ Case Size KEMET Part Number DC Leakage DF ESR Maximum Allowable Ripple Current (rms) VDC at 85°C VDC at +125°C VDC at +200°C µF KEMET/EIA (See below for part options) µA at 25°C Maximum /5 Minutes µA at 200°C, 0.33 VR Maximum /5 Minutes % at 25°C 120 Hz Maximum mΩ at 25°C 100 kHz Maximum mA at +25°C 100 kHz 6.3 6.3 6.3 6.3 6.3 6.3 6.3 10 10 10 10 10 16 16 16 16 16 16 20 20 25 25 25 25 25 35 35 35 35 35 50 50 4.2 4.2 4.2 4.2 4.2 4.2 4.2 6.6 6.6 6.6 6.6 6.6 10.6 10.6 10.6 10.6 10.6 10.6 13.4 13.4 16.8 16.8 16.8 16.8 16.8 23.1 23.1 23.1 23.1 23.1 33.5 33.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 4.0 4.0 4.0 4.0 4.0 6.4 6.4 6.4 6.4 6.4 6.4 8.0 8.0 10.0 10.0 10.0 10.0 10.0 14.0 14.0 14.0 14.0 14.0 20.0 20.0 6.8 10 15 22 33 47 68 6.8 10 15 47 220 4.7 6.8 10 33 47 100 22 33 6.8 10 15 22 33 6.8 10 10 15 33 6.8 10 B/3528-21 B/3528-21 B/3528-21 B/3528-21 C/6032-28 C/6032-28 C/6032-28 B/3528-21 B/3528-21 B/3528-21 D/7343-31 X/7343-43 B/3528-21 B/3528-21 B/3528-21 D/7343-31 D/7343-31 X/7343-43 D/7343-31 D/7343-31 D/7343-31 D/7343-31 D/7343-31 D/7343-31 D/7343-31 D/7343-31 D/7343-31 X/7343-43 D/7343-31 X/7343-43 D/7343-31 D/7343-31 T500B685(1)006AG(3)10 T500B106(1)006AG(3)10 T500B156(1)006AG(3)10 T500B226(1)006AG(3)10 T500C336(1)006AG(3)10 T500C476(1)006AG(3)10 T500C686(1)006AG(3)10 T500B685(1)010AG(3)10 T500B106(1)010AG(3)10 T500B156(1)010AG(3)10 T500D476(1)010AG(3)10* T500X227(1)010(2)G(3)10* T500B475(1)016AG(3)10 T500B685(1)016AG(3)10 T500B106(1)016AG(3)10 T500D336(1)016AG(3)10 T500D476(1)016AG(3)10 T500X107(1)016(2)G(3)10* T500D226(1)020AG(3)10 T500D336(1)020AG(3)10 T500D685(1)025AG(3)10 T500D106(1)025AG(3)10 T500D156(1)025AG(3)10 T500D226(1)025AG(3)10 T500D336(1)025AG(3)10 T500D685(1)035AG(3)10 T500D106(1)035AG(3)10 T500X106(1)035(2)G(3)10* T500D156(1)035AG(3)10 T500X336(1)035(2)G(3)10* T500D685(1)050AG(3)10 T500D106(1)050AG(3)10 0.5 0.6 0.9 1.4 2.1 3.0 4.3 0.7 1 1.5 4.7 22 0.8 1.1 1.6 5.3 7.5 16 4.4 6.6 1.7 2.5 3.8 5.5 8.3 2.4 3.5 3.5 5.3 11.6 3.4 5.0 5 6 9 14 21 30 43 7 10 15 47 220 8 11 16 53 75 160 44 66 17 25 38 55 83 24 35 35 53 116 34 50 6 6 6 6 6 6 6 6 6 6 6 10 6 6 6 6 6 8 6 6 6 6 6 6 6 6 6 6 6 8 6 6 3500 2800 3500 3500 1800 1800 1200 3500 2800 3500 800 250 6000 3500 2800 800 800 250 800 700 1300 1000 1000 800 700 1300 1000 700 1000 600 1000 1000 156 174 156 156 247 247 303 156 174 156 433 812 119 156 174 433 433 812 433 463 340 387 387 433 463 340 387 486 387 524 387 387 mA at mA at +125°C +200°C 100 100 kHz kHz 62 70 62 62 99 99 121 62 70 62 173 325 48 62 70 173 173 325 173 185 136 155 155 173 185 136 155 194 155 210 155 155 16 17 16 16 25 25 30 16 17 16 43 81 12 16 17 43 43 81 43 46 34 39 39 43 46 34 39 49 39 52 39 39 Maximum Operating Temperature MSL °C Reflow Temp. ≤ 260°C 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 (1) To complete KEMET part number, insert M for ±20% or K for ±10%. Designates capacitance tolerance. (2) To complete KEMET part number, insert B (0.1%/1,000 hours) or A = N/A. Designates reliability level. (3) To complete KEMET part number, insert 61 = None, 62 = 10 cycles +25°C after Weibull, 63 = 10 cycles −55°C +85°C after Weibull. Designates surge current option. * For the part numbers marked with an (*) please consider a 33% derating at +200°C Refer to Ordering Information for additional detail. Better than series product may be substituted within the same capacitance and voltage at KEMET's option. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 6 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Recommended Voltage Derating Guidelines Working Voltage +25°C +85°C +125°C +200°C 25°C 85°C 125°C 200°C 6.3 6.3 6.3 5.0 2.5 3.2 3.2 2.5 1.3 10 10 10 8.0 4.0 5.0 5.0 4.0 2.0 16 16 16 12.8 6.4 8.0 8.0 6.4 3.2 20 20 20 16.0 8.0 10 10 8.0 4.0 25 25 25 20.0 10.0 12.5 12.5 10.0 5.0 35 35 35 28.0 14.0 17.5 17.5 14.0 7.0 50 50 50 40.0 20.0 25.0 25.0 20.0 10.0 120% 100% % Working Voltage Rated Voltage Recommended Application Voltage (for maximum reliability) 80% 80% % Change in Working DC Voltage with Temperature 60% 50% 40% 20% 0% 40% Recommended Maximum Application Voltage −55 25 85 125 175 200 Temperature (°C) Note: Additional reliability can be obtained through the derating of voltage Ripple Current/Ripple Voltage Permissible AC ripple voltage and current are related to equivalent series resistance (ESR) and the power dissipation capabilities of the device. Permissible AC ripple voltage which may be applied is limited by two criteria: 1. The positive peak AC voltage plus the DC bias voltage, if any, must not exceed the DC voltage rating of the capacitor. 2. The negative peak AC voltage in combination with bias voltage, if any, must not exceed the allowable limits specified for reverse voltage. See the Reverse Voltage section for allowable limits. The maximum power dissipation by case size can be determined using the table at right. The maximum power dissipation rating stated in the table must be reduced with increasing environmental operating temperatures. Refer to the table below for temperature compensation requirements. Temperature Compensation Multipliers for Maximum Ripple Current T ≤ 25°C 1.00 T ≤ 85°C 0.90 T ≤ 125°C T ≤ 150°C T ≤ 175°C T ≤ 200°C 0.40 0.30 0.20 0.10 KEMET Case Code EIA Case Code Maximum Power Dissipation (P max) mWatts at 25°C with +20°C Rise B C D X 3528–21 6032–28 7343–31 7343–43 85 110 150 165 The maximum power dissipation rating must be reduced with increasing environmental operating temperatures. Refer to the Temperature Compensation Multiplier table for details. Using the P max of the device, the maximum allowable rms ripple current or voltage may be determined. I(max) = √P max/R E(max) = Z √P max/R I = rms ripple current (amperes) E = rms ripple voltage (volts) P max = maximum power dissipation (watts) R = ESR at specified frequency (ohms) Z = Impedance at specified frequency (ohms) T = Environmental Temperature © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 7 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Reverse Voltage Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The positive terminal is identified on the capacitor body by a stripe, plus in some cases a beveled edge. A small degree of transient reverse voltage is permissible for short periods per the below table. The capacitors should not be operated continuously in reverse mode, even within these limits. Temperature Permissible Transient Reverse Voltage 25°C 85°C 125°C 15% of Rated Voltage 5% of Rated Voltage 1% of Rated Voltage Table 2 – Land Dimensions/Courtyard KEMET Metric Size Code Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) Case EIA W L S V1 V2 W L S V1 V2 W L S V1 V2 B 3528–21 2.35 2.21 0.92 6.32 4.00 2.23 1.80 1.12 5.22 3.50 2.13 1.42 1.28 4.36 3.24 C 6032-28 2.35 2.77 2.37 8.92 4.50 2.23 2.37 2.57 7.82 4.00 2.13 1.99 2.73 6.96 3.74 D 7343–31 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 X1 7343–43 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351). 1 Height of these chips may create problems in wave soldering. 2 Land pattern geometry is too small for silkscreen outline. V1 L L W W V2 S Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 8 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Soldering Process Please note that although the X/7343–43 case size can withstand wave soldering, the tall profile (4.3 mm maximum) dictates care in wave process development. Hand soldering should be performed with care due to the difficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflow occurs. Once reflow occurs, the iron should be removed immediately. “Wiping” the edges of a chip and heating the top surface is not recommended. During typical reflow operations, a slight darkening of the gold-colored epoxy may be observed. This slight darkening is normal and not harmful to the product. Marking permanency is not affected by this change. Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak Temperature Minimum (TSmin) 100°C 150°C Temperature Maximum (TSmax) 150°C 200°C Time (t s) from Tsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds 3°C/second maximum Ramp-up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (t L) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 220°C* 235°C** 250°C* 260°C** Time within 5°C of Maximum Peak Temperature (t P) 20 seconds maximum 30 seconds maximum Ramp-down Rate (TP to TL) 6°C/second maximum 6°C/second maximum Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. * For Case Size height > 2.5 mm ** For Case Size height ≤ 2.5 mm TP TL Temperature The KEMET families of surface mount capacitors are compatible with wave (single or dual), convection, IR, or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J–STD–020D standard for moisture sensitivity testing. The devices can safely withstand a maximum of three reflow passes at these conditions. tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time Storage Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp, and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 60% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts, and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability, chip stock should be used promptly, preferably within three years of receipt. Due to the potential use of high melting point solders, KEMET has taken the initiative to package this product in moisture barrier bags with desiccant and a humidity indicator card. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 9 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Construction Polarity Stripe (+) Molded Epoxy Case Detailed Cross Section Nickel Plating (Fourth Layer) Polarity Bevel (+) Tantalum Wire Leadframe (− Cathode) Washer Tantalum Wire Weld (to attach wire) Carbon (Third Layer) Silver Adhesive Leadframe (+ Anode) Molded Epoxy Case MnO2 (Second Layer) Washer Ta2O5 Dielectric (First Layer) Tantalum Capacitor Marking Date Code * KEMET High Temperature MnO2 Polarity Indicator (+) 1 digit = Last number of Year 5 = 2015 6 = 2016 7 = 2017 8 = 2018 9 = 2019 0 = 2020 2nd and 3rd digit = Week of the Year 01 = 1st week of the Year to 52 = 52nd week of the Year st Picofarad Code KEMET ID Rated Voltage Date Code* * 904 = 4th week of 2019 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 10 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Tape & Reel Packaging Information KEMET’s molded chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in accordance with EIA Standard 481: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging system is compatible with all tape-fed automatic pick-and-place systems. Right hand orientation only (+) Embossed carrier (−) Embossment Top tape thickness 0.10 mm (0.004”) maximum thickness 180 mm (7.0”) or 330 mm (13.”) 8 mm (0.315”) or 12 mm (0.472”) Table 3 – Packaging Quantity Case Code KEMET S A T M B U C W V D X E/T428P EIA 3216-12 3216-18 3528-12 3528-15 3528-21 6032-15 6032-28 7343-15 7343-20 7343-31 7343-43 7360-38 Tape Width (mm) 7" Reel* 13" Reel* 8 8 8 8 8 12 12 12 12 12 12 12 2,500 2,000 3,000 2,500 2,000 1,000 500 1,000 1,000 500 500 500 10,000 9,000 10,000 8,000 8,000 5,000 3,000 3,000 3,000 2,500 2,000 2,000 * No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 11 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 P0 (10 pitches cumulative tolerance on tape ±0.2 mm) A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1, Table 4 ØD1 Cover Tape User Direction of Unreeling Table 4 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm D1 Minimum Note 1 D0 1.5 +0.10/−0.0 (0.059 +0.004/−0.0) 1.0 (0.039) 1.5 (0.059) E1 P0 R Reference S1 Minimum T1 T Maximum Note 2 Note 3 Maximum P2 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 25.0 (0.984) 30 (1.181) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch B1 Maximum Note 4 8 mm Single (4 mm) 4.35 (0.171) 6.25 (0.246) 12 mm Single (4 mm) and Double (8 mm) 8.2 (0.323) 10.25 (0.404) E2 Minimum F P1 3.5 ±0.05 2.0 ±0.05 or 4.0 ±0.10 (0.138 ±0.002) (0.079 ±0.002 or 0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) or 5.5 ±0.05 4.0 ±0.10 (0.157 ±0.004) or (0.217 ±0.002) 8.0 ±0.10 (0.315 ±0.004) T2 Maximum W Maximum A0, B0 & K0 2.5 (0.098) 8.3 (0.327) 4.6 (0.181) 12.3 (0.484) Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape, with or without components, shall pass around R without damage (see Figure 4). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes (see Figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape (see Figure 3). (e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 12 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Packaging Information Performance Notes 1. Cover tape break force: 1.0 kg minimum. 2. Cover tape peel strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8, 12 Bo Maximum Rotation ( 20 ° T) ° s Tape Maximum Width (mm) Rotation ( 8, 12 20 Typical Component Centerline ° S) Ao Figure 3 – Maximum Lateral Movement Figure 4 – Bending Radius 8 and 12 mm Tape 0.5 mm maximum 0.5 mm maximum Embossed Carrier Punched Carrier R © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Bending Radius R T2063_T500 • 1/8/2021 13 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Figure 5 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 5 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/−0.2 (0.521 +0.02/−0.008) 20.2 (0.795) 12 mm Variable Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/−0.0 (0.331 +0.059/−0.0) 12.4 +2.0/−0.0 (0.488 +0.078/−0.0) 14.4 (0.567) 18.4 (0.724) Shall accommodate tape width without interference © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 14 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C Figure 6 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 and 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum Leader 400 mm minimum Top Cover Tape Figure 7 – Maximum Camber Elongated Sprocket Holes (32 mm and wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 15 Tantalum Surface Mount Capacitors – High Temperature T500 MnO 2 200°C KEMET Electronics Corporation Sales Offices For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2063_T500 • 1/8/2021 16