T513D107K016BH61107505

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR MnO2 Overview The KEMET T513 Surface Mount Capacitors are suitable for the High Reliability Series (HRA) requirements of industrial, telecom, defense, and aerospace markets. This surface mount series offers very low ESR and surge robustness designed for applications that require high surge current and high ripple current capability. These benefits are achieved via a multiple anode construction similar to KEMET's T510 Series. The T513 HRA Series also offers various options including Weibull Grading, termination finish, and surge current. Benefits • Meets or exceeds EIA Standard 535BAAC • Taped & Reel standard packaging per EIA 481 • High surge current capability • Termination options B, C, H, K, and T • High ripple current capability • Surge testing options • 100% steady-state accelerated aging • ESR as low as 10 mΩ Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Applications The T513 Series is suitable for the industrial, telecom, defense, and aerospace markets. Typical applications include decoupling and filtering in radar, sonar, power supply, guidance systems, and other high reliability applications. Environmental Compliance RoHS compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder or gold-plated. • Halogen-free • Epoxy compliant with UL94 V–0 • Molded Epoxy complies for outgassing testing under ASTM E 595. Built Into Tomorrow © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 1 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 K-SIM For a detailed analysis of specific part numbers, please visit ksim.kemet.com to access KEMET’s K-SIM software. KEMET K-SIM is designed to simulate behavior of components with respect to frequency, ambient temperature, and DC bias levels. Ordering Information T 513 Capacitor Class Series T= Tantalum Multiple anode COTS X 108 K 004 Rated Case Capacitance Capacitance Voltage Size Code (pF) Tolerance (VDC) D E X First two digits represent significant figures. Third digit specifies number of zeros. K = ±10% M = ±20% 004 = 4 006 = 6.3 010 = 10 016 = 16 020 = 20 025 = 25 035 = 35 B H 61 10 Failure Rate/ Design Termination Finish Surge ESR A = N/A B = 0.1%/ 1,000 hours C = 0.01%/ 1,000 hours C = Hot solder dipped H = Standard solder-coated (SnPb 5% Pb minimum) B = Gold-Plated K = Solder fused T = 100% Tin 61 = None 62 = 10 cycles, 25°C after Weibull 63 = 10 cycles, −55°C and 85°C after Weibull 64 = 10 cycles, −55°C and 85°C before Weibull Packaging (C-Spec) 10 = Standard ESR Blank = 7" Reel 20 = Low ESR 7280 = 13" Reel 30 = Ultra-low ESR 7610 = Bulk bag 7640 = Bulk plastic box WAFL = Waffle pack Performance Characteristics Item Performance Characteristics Operating Temperature Rated Capacitance Range Capacitance Tolerance Rated Voltage Range −55°C to 125°C 15 – 1,000 μF at 120 Hz/25°C K Tolerance (10%), M Tolerance (20%) 4 – 35 VDC DF (120 Hz) Refer to Part Number Electrical Specification Table ESR (100 kHz) Refer to Part Number Electrical Specification Table Leakage Current ≤ 0.01 CV (μA) at rated voltage after 5 minutes © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 2 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Qualification Test Condition Characteristics Δ C/C Endurance 85°C at rated voltage, 2,000 hours 125°C at 2/3 rated voltage, 2,000 hours Within initial limits DCL Within 1.25 x initial limit ESR Within initial limits Δ C/C Storage Life 125°C at 0 volts, 2,000 hours Temperature Stability MIL–STD–202, Method 107, Condition B, mounted, −55°C to 125°C, 1,000 cycles Extreme temperature exposure at a succession of continuous steps at +25°C, −55°C, +25°C, +85°C, +125°C, +25°C Within initial limits DCL Within 1.25 x initial limit ESR Within initial limits Mechanical Shock/ Vibration Additional Qualification Tests per MIL–PRF– 55365/8 Within ±5% of initial value DF Within initial limits DCL Within 1.25 x initial limit ESR Within initial limits +25°C −55°C +85°C +125°C Δ C/C IL* ±10% ±10% ±20% DF IL IL 1.5 x IL 1.5 x IL DCL IL n/a 10 x IL 12 x IL Δ C/C Surge Voltage Within ±10% of initial value DF Δ C/C Thermal Shock Within ±10% of initial value DF 25°C and 85°C, 1.32 x rated voltage 1,000 cycles (125°C, 1.2 x rated voltage) MIL–STD–202, Method 213, Condition I, 100 G peak MIL–STD–202, Method 204, Condition D, 10 Hz to 2,000 Hz, 20 G peak Within ±5% of initial value DF Within initial limits DCL Within initial limits ESR Within initial limits Δ C/C Within ±10 of initial value DF Within initial limits DCL Within initial limits Please contact KEMET for more information. *IL = Initial limit © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 3 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Dimensions – Millimeters (Inches) Metric will govern CATHODE (-) END VIEW SIDE VIEW ANODE (+) END VIEW BOTTOM VIEW A B W B H X T S G S Case Size KEMET EIA F E P Termination cutout at KEMET's option, either end R L Typical Weight Component L W H F ±0.1 S ±0.3 ±(0.004) ±(0.012) B ±0.15 (Ref) ±0.006 X (Ref) P (Ref) R (Ref) T (Ref) A (Min) G (Ref) E (Ref) (mg) D 7.3±0.3 4.3±0.3 2.8±0.3 7343-31 (0.287±0.012) (0.169±0.012) (0.110±0.012) 2.4 (0.095) 1.3 (0.051) 0.5 (0.020) 0.10±0.10 0.9 1.0 0.13 3.8 (0.004±0.004) (0.035) (0.039) (0.005) (0.150) 3.5 3.5 (0.138) (0.138) 349.43 X 7.3±0.3 4.3±0.3 4.0±0.3 7343–43 (0.287±0.012) (0.169±0.012) (0.157±0.012) 2.4 (0.094) 1.3 (0.051) 0.5 (0.020) 0.10±0.10 1.7 1.0 0.13 3.8 (0.004±0.004) (0.067) (0.039) (0.005) (0.150) 3.5 3.5 (0.138) (0.138) 430.15 E 7.3±0.3 6.0±0.3 3.6±0.2 7360–38 (0.287±0.012) (0.236±0.012) (0.142±0.008) 4.1 (0.161) 1.3 (0.051) 0.5 (0.020) 0.10±0.10 0.9 1.0 0.13 3.8 (0.004±0.004) (0.035) (0.039) (0.005) (0.150) 3.5 3.5 (0.138) (0.138) 500.73 Notes: (Ref) – Dimensions provided for reference only. These weights are provided as reference. If exact weights are needed, please contact your KEMET Sales Representative. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 4 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Table 1 – Ratings & Part Number Reference Rated Voltage Rated Cap Case Code/ Case Size KEMET Part Number DC Leakage DF Standard ESR VDC at 85°C µF KEMET/EIA 4 4 4 6.3 6.3 6.3 10 16 16 16 20 25 25 35 35 35 680 1000 1000 470 680 680 330 100 150 220 100 68 100 15 33 47 X/7343-43 X/7343-43 E/7360-38 X/7343-43 X/7343-43 E/7360-38 X/7343-43 D/7343-31 X/7343-43 X/7343-43 X/7343-43 X/7343-43 E/7360-38 D/7343-31 X/7343-43 X/7343-43 VDC at 85°C µF KEMET/EIA (See below for part options) T513X687(1)004(2)(3)(4)(5) T513X108(1)004(2)(3)(4)(5) T513E108(1)004(6)(3)(4)(5) T513X477(1)006(2)(3)(4)(5) T513X687(1)006(2)(3)(4)(5) T513E687(1)006(6)(3)(4)(5) T513X337(1)010(6)(3)(4)(5) T513D107(1)016(2)(3)(4)(5) T513X157(1)016(2)(3)(4)(5) T513X227(1)016(2)(3)(4)(5) T513X107(1)020(6)(3)(4)(5) T513X686(1)025(2)(3)(4)(5) T513E107(1)025(2)(3)(4)(5) T513D156(1)035(2)(3)(4)(5) T513X336(1)035(2)(3)(4)(5) T513X476(1)035(2)(3)(4)(5) (See below for part options) μA at +25°C Max./5 Min. 27.2 40.0 40.0 29.6 42.8 42.8 33.0 16.0 24.0 35.2 20.0 17.0 25.0 5.3 11.6 16.5 μA at +25°C Max./5 Min. % at +25°C 120 Hz Max. 6.0 6.0 6.0 6.0 6.0 6.0 6.0 6.0 6.0 10.0 8.0 8.0 8.0 6.0 6.0 8.0 % at +25°C 120 Hz Max. mΩ at +25°C 100 kHz Max. 30 23 18 30 45 23 35 75 40 40 45 45 50 100 65 65 mΩ at +25°C 100 kHz Max. Rated Voltage Rated Cap Case Code/ Case Size KEMET Part Number DC Leakage DF Standard ESR Low ESR Ultralow ESR mΩ at +25°C mΩ at +25°C 100 kHz Max. 100 kHz Max. N/A N/A 18 N/A 10 N/A N/A N/A 23 N/A 12 N/A N/A N/A N/A N/A 30 N/A 25 N/A 40 35 N/A N/A N/A N/A N/A N/A 55 N/A 55 N/A mΩ at +25°C mΩ at +25°C 100 kHz Max. 100 kHz Max. Low ESR Ultra-low ESR Maximum Operating Temp. °C 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 °C Maximum Operating Temp. (1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates Capacitance tolerance. (2) To complete KEMET part number, insert B (0.1%/1,000 hours), or A = N/A. Designates Reliability Level. (3) To complete KEMET part number, insert B = Gold-plated, C = Hot solder dipped, H = Solder-plated, K = Solder Fused or T = 100% Tin (Sn). Designates Termination Finish. (4) To complete KEMET part number, insert 61 = None, 62 = 10 cycles +25°C, 63 = 10 cycles −55°C +85°C after Weibull or 64 = 10 cycles −55°C +85°C before Weibull. Designates Surge current option. (5) To complete KEMET part number, insert 10 = Standard ESR, 20 = Low ESR or 30 = Ultra Low ESR. Designates ESR option. (6) To complete KEMET part number, insert C (0.01%/1,000 hours), B (0.1%/1,000 hours), or A = N/A. Designates Reliability Level. Refer to Ordering Information for additional detail. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 5 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Recommended Voltage Derating Guidelines 85°C to 125°C 120% VR 67% of VR 100% 50% of VR 33% of VR % Working Voltage % Change in Working DC Voltage with Temperature Recommended Maximum Application Voltage −55°C to 85°C 80% % Change in Working DC Voltage with Temperature 67% 60% 40% 20% 0% −55 Recommended Maximum Application Voltage (As % of Rated Voltage) 25 33% 85 Temperature (ºC) 125 Ripple Current/Ripple Voltage Permissible AC ripple voltage and current are related to equivalent series resistance (ESR) and the power dissipation capabilities of the device. Permissible AC ripple voltage which may be applied is limited by two criteria: 1. The positive peak AC voltage plus the DC bias voltage, if any, must not exceed the DC voltage rating of the capacitor. 2. The negative peak AC voltage in combination with bias voltage, if any, must not exceed the allowable limits specified for reverse voltage. See the Reverse Voltage section for allowable limits. The maximum power dissipation by case size can be determined using the table at right. The maximum power dissipation rating stated in the table must be reduced with increasing environmental operating temperatures. Refer to the table below for temperature compensation requirements. Temperature Compensation Multipliers for Maximum Ripple Current T ≤ 25°C 1.00 T ≤ 85°C 0.90 T ≤ 125°C 0.40 T= Environmental Temperature The maximum power dissipation rating must be reduced with increasing environmental operating temperatures. Refer to the Temperature Compensation Multiplier table for details. KEMET Case Code EIA Case Code Maximum Power Dissipation (Pmax) mWatts at 25°C with +20°C Rise A B C D X E S T U V T510X T510E 3216–18 3528–21 6032–28 7343–31 7343–43 7360–38 3216–12 3528–12 6032–15 7343–20 7343–43 7360–38 75 85 110 150 165 200 60 70 90 125 270 285 Using the Pmax of the device, the maximum allowable rms ripple current or voltage may be determined. I(max) = √Pmax/R E(max) = Z √Pmax/R I = rms ripple current (amperes) E = rms ripple voltage (volts) Pmax = maximum power dissipation (watts) R = ESR at specified frequency (ohms) Z = Impedance at specified frequency (ohms) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 6 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Reverse Voltage Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The positive terminal is identified on the capacitor body by a stripe, plus in some cases a beveled edge. A small degree of transient reverse voltage is permissible for short periods per the below table. The capacitors should not be operated continuously in reverse mode, even within these limits. Temperature Permissible Transient Reverse Voltage 25°C 15% of Rated Voltage 85°C 5% of Rated Voltage 125°C 1% of Rated Voltage Table 2 – Land Dimensions/Courtyard KEMET Metric Size Code Case EIA W L S V1 V2 W L S V1 V2 W L S V1 V2 D 7343–31 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 E1 7360–38 4.25 2.77 3.67 10.22 7.30 4.13 2.37 3.87 9.12 6.80 4.03 1.99 4.03 8.26 6.54 X 7343–43 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 1 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351). 1 Height of these chips may create problems in wave soldering. 2 Land pattern geometry is too small for silkscreen outline. V1 L L W W V2 S Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 7 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Soldering Process Please note that although the X/7343–43 case size can withstand wave soldering, the tall profile (4.3 mm maximum) dictates care in wave process development. Hand soldering should be performed with care due to the difficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflow occurs. Once reflow occurs, the iron should be removed immediately. “Wiping” the edges of a chip and heating the top surface is not recommended. During typical reflow operations, a slight darkening of the gold-colored epoxy may be observed. This slight darkening is normal and not harmful to the product. Marking permanency is not affected by this change. Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak Temperature Minimum (TSmin) 100°C 150°C Temperature Maximum (TSmax) 150°C 200°C Time (t s) from Tsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds Ramp-up Rate (TL to TP) 3°C/seconds maximum 3°C/seconds maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (t L) 60 – 150 seconds 220°C* 235°C** 60 – 150 seconds 250°C* 260°C** Peak Temperature (TP) Time within 5°C of Maximum 20 seconds maximum 30 seconds maximum Peak Temperature (t P) Ramp-down Rate (TP to TL) 6°C/seconds maximum 6°C/seconds maximum Time 25°C to Peak 6 minutes maximum 8 minutes maximum Temperature Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. * For Case Size height > 2.5 mm ** For Case Size height ≤ 2.5 mm TP TL Temperature KEMET’s families of surface mount capacitors are compatible with wave (single or dual), convection, IR, or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J–STD–020D standard for moisture sensitivity testing. The devices can safely withstand a maximum of three reflow passes at these conditions. tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time Storage Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 60% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within three years of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 8 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Construction Polarity Stripe (+) Molded Epoxy Case Detailed Cross Section Silver Paint (Fourth Layer) Polarity Bevel (+) Leadframe (− Cathode) Washer Tantalum Wire Tantalum Wire Weld (to attach wire) Carbon (Third Layer) Washer Silver Adhesive Leadframe (+ Anode) Molded Epoxy Case MnO2 (Second Layer) Ta2O5 Dielectric (First Layer) Tantalum Capacitor Marking Date Code * KEMET Multi-Anode COTS Polarity Indicator (+) Picofarad Code KEMET ID Rated Voltage 1 digit = Last number of Year 6 = 2016 7 = 2017 8 = 2018 9 = 2019 0 = 2020 2nd and 3rd digit = Week of the Year 01 = 1st week of the Year to 52 = 52nd week of the Year st Date Code* * 036 = 36th week of 2020 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 9 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Tape & Reel Packaging Information KEMET’s molded chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in accordance with EIA Standard 481: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging system is compatible with all tape-fed automatic pick-and-place systems. Right hand orientation only (+) Embossed carrier (−) Embossment Top tape thickness 0.10 mm (0.004”) maximum thickness 180 mm (7.0”) or 330 mm (13.”) 8 mm (0.315”) or 12 mm (0.472”) Table 3 – Packaging Quantity Case Code KEMET S T M U L W Z V A B C D Q Y X E/T428P H O EIA 3216-12 3528-12 3528-15 6032-15 6032-19 7343-15 7343-17 7343-20 3216-18 3528-21 6032-28 7343-31 7343-12 7343-40 7343-43 7360-38 7360-20 7360-43 Tape Width (mm) 7" Reel* 13" Reel* 8 8 8 12 12 12 12 12 8 8 12 12 12 12 12 12 12 12 2,500 3,000 2,500 1,000 1,000 1,000 1,000 1,000 2,000 2,000 500 500 1,000 500 500 500 1,000 250 10,000 10,000 8,000 5,000 3,000 3,000 3,000 3,000 9,000 8,000 3,000 2,500 3,000 2,000 2,000 2,000 2,500 1,000 * No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 10 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 P0 (10 pitches cumulative tolerance on tape ±0.2 mm) A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1, Table 4 ØD1 Cover Tape User Direction of Unreeling Table 4 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm D1 Minimum Note 1 D0 1.5 +0.10/−0.0 (0.059 +0.004/−0.0) 1.0 (0.039) 1.5 (0.059) E1 P0 R Reference S1 Minimum T1 T Maximum Note 2 Note 3 Maximum P2 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 25.0 (0.984) 30 (1.181) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch B1 Maximum Note 4 8 mm Single (4 mm) 4.35 (0.171) 6.25 (0.246) 12 mm Single (4 mm) and Double (8 mm) 8.2 (0.323) 10.25 (0.404) E2 Minimum F P1 3.5 ±0.05 2.0 ±0.05 or 4.0 ±0.10 (0.138 ±0.002) (0.079 ±0.002 or 0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) or 5.5 ±0.05 4.0 ±0.10 (0.157 ±0.004) or (0.217 ±0.002) 8.0 ±0.10 (0.315 ±0.004) T2 Maximum W Maximum A0, B0 & K0 2.5 (0.098) 8.3 (0.327) 4.6 (0.181) 12.3 (0.484) Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape, with or without components, shall pass around R without damage (see Figure 4). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes (see Figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape (see Figure 3). (e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 11 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Packaging Information Performance Notes 1. Cover tape break force: 1.0 kg minimum. 2. Cover tape peel strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8, 12 Bo Maximum Rotation ( 20 ° T) ° s Tape Maximum Width (mm) Rotation ( 8, 12 20 Typical Component Centerline ° S) Ao Figure 3 – Maximum Lateral Movement Figure 4 – Bending Radius 8 and 12 mm Tape 0.5 mm maximum 0.5 mm maximum Embossed Carrier Punched Carrier R © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Bending Radius R T2049_T513 • 1/8/2021 12 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Figure 5 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 5 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/−0.2 (0.521 +0.02/−0.008) 20.2 (0.795) 12 mm Variable Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/−0.0 (0.331 +0.059/−0.0) 12.4 +2.0/−0.0 (0.488 +0.078/−0.0) 14.4 (0.567) 18.4 (0.724) Shall accommodate tape width without interference © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 13 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Figure 6 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 and 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum Leader 400 mm minimum Top Cover Tape Figure 7 – Maximum Camber Elongated Sprocket Holes (32 mm and wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 14 Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 KEMET Electronics Corporation Sales Offices For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2049_T513 • 1/8/2021 15