LUY3133H-HV12-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only HIGH VOLTAGE LED LAMPS Pb Lead-Free Parts LUY3133H/HV12-PF DATA SHEET DOC. NO : REV. DATE : : QW0905-LUY3133H/HV12-PF A 22 - May. - 2006 PART NO. LUY3133H/HV12-PF Package Dimension Directivity Radiation Page 1/3 4.75 IF +Vcc Vcc=12Volts 0° 7.65 1.5MAX VF IF= Vcc-VF RL RL RL=1200ohms ±20% -30° 30 ° -60 ° 25.0MIN 60° □0.5 TYP 100% 75% 50% 25% 0 25% 50% 75% 100% 2.54TYP + - 1.0MIN Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted 2.Specifications are subject to change without notice •Part Selection And Application Information (Ratings At 25℃ Ambient) Dominant Spectral wave halfwidth length △λnm λDnm PART NO MATERIAL COLOR Emitted Forward current (mA) @12V Luminous lntensity (mcd) @12V Reverse current (μA) VR=15V Max. 100 Viewing angle 2θ1/2 (deg) Lens Water Clear Min. Max. Min. Typ. 590 20 6.0 12 900 1500 LUY3133H/HV12-PF A lGaInP/GaP Yellow 30 •Absolute Maximum Rating (Ta=25℃) RED GREEN YELLOW UYH 12 15 -40℃ TO +85℃ -40℃ TO +100 ℃ V V ORANGE UNIT REMARK PARAMETER Forward voltage Reverse voltage Operating Temperature Storage Temperature LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3133H/HV12-PF Page 2/3 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120 ° 2° /sec max Preheat 60 Seconds Max 25° 0° 0 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3133H/HV12-PF Page 3/3 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2