LTC2246HLU#PBF

LTC2246H 14-Bit, 25Msps 125°C ADC In TQFP FEATURES ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ DESCRIPTION Sample Rate: 25Msps –40°C to 125°C Operation Single 3V Supply (2.8V to 3.5V) Low Power: 75mW 74.5dB SNR 90dB SFDR No Missing Codes Flexible Input: 1VP-P to 2VP-P Range 575MHz Full Power Bandwidth S/H Clock Duty Cycle Stabilizer Shutdown and Nap Modes Pin Compatible Family LTC2246H (14-Bit), LTC2226H (12-Bit) 32-Pin (5mm × 5mm) TQFP Package The LTC®2246H is a 14-bit 25Msps, low power 3V A/D converter designed for digitizing high frequency, wide dynamic range signals. The LTC2246H is perfect for demanding imaging and communications applications with AC performance that includes 74.5dB SNR and 90dB SFDR. DC specs include ±1LSB INL (typ), ±0.5LSB DNL (typ) and no missing codes over temperature. The transition noise is a low 1LSBRMS. A single 3V supply allows low power operation. A separate output supply allows the outputs to drive 0.5V to 3.6V logic. A single-ended CLK input controls converter operation. An optional clock duty cycle stabilizer allows high performance at full speed for a wide range of clock duty cycles. APPLICATIONS ■ ■ ■ Automotive Industrial Wireless and Wired Broadband Communication , LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. TYPICAL APPLICATION Typical INL, 2V Range 2.0 REFH REFL FLEXIBLE REFERENCE 1.5 + ANALOG INPUT INPUT S/H – 14-BIT PIPELINED ADC CORE CORRECTION LOGIC D13 • • • D0 OUTPUT DRIVERS OGND INL ERROR (LSB) 1.0 OVDD 0.5 0 –0.5 –1.0 –1.5 CLOCK/DUTY CYCLE CONTROL –2.0 0 2246 TA01 4096 8192 CODE 12288 16384 2246 TA01b CLK 2246hf 1 LTC2246H ABSOLUTE MAXIMUM RATINGS PACKAGE/ORDER INFORMATION OVDD = VDD (Notes 1, 2) TOP VIEW VDD VCM SENSE MODE OF D13 D12 D11 Supply Voltage (VDD) ..................................................4V Digital Output Ground Voltage (OGND) ........ –0.3V to 1V Analog Input Voltage (Note 3) .......–0.3V to (VDD + 0.3V) Digital Input Voltage......................–0.3V to (VDD + 0.3V) Digital Output Voltage ................ –0.3V to (OVDD + 0.3V) Power Dissipation ............................................ 1500mW Operating Temperature Range ............... –40°C to 125°C Storage Temperature Range................... –65°C to 150°C 32 31 30 29 28 27 26 25 AIN+ AIN– GND REFH REFL GND VDD GND 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 D10 D9 D8 OVDD OGND D7 D6 D5 CLK SHDN OE D0 D1 D2 D3 D4 9 10 11 12 13 14 15 16 LU PACKAGE 32-LEAD (5mm × 5mm) PLASTIC TQFP TJMAX = 150°C, θJA = 88°C/W ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE LTC2246HLU#PBF LTC2246HLU#TRPBF 2246H 32-Lead (5mm × 5mm) Plastic TQPF –40°C to 125°C LEAD BASED FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE LTC2246HLU LTC2246HLU#TR 2246H 32-Lead (5mm × 5mm) Plastic TQPF –40°C to 125°C Consult LTC Marketing for parts specified with wider operating temperature ranges. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ CONVERTER CHARACTERISTICS The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) PARAMETER CONDITIONS Resolution (No Missing Codes) MIN ● 14 TYP MAX UNITS Bits Integral Linearity Error Differential Analog Input (Note 5) ● –6 ±1 6 LSB Differential Linearity Error Differential Analog Input ● –1 ±0.5 1 LSB Offset Error (Note 6) ● –15 ±2 15 mV Gain Error External Reference ● –3 ±0.5 3 %FS Offset Drift Full-Scale Drift Transition Noise ±10 μV/°C Internal Reference ±30 ppm/°C External Reference ±5 ppm/°C SENSE = 1V 1 LSBRMS 2246hf 2 LTC2246H ANALOG INPUT The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS VIN Analog Input Range (AIN+ – AIN–) MIN TYP MAX UNITS 2.8V < VDD < 3.5V (Note 7) ● VIN, CM Analog Input Common Mode (AIN+ + AIN–)/2 Differential Input (Note 7) Single Ended Input (Note 7) ● ● 1 0.5 IIN Analog Input Leakage Current 0V < AIN+, AIN– < VDD ● ISENSE SENSE Input Leakage 0V < SENSE < 1V IMODE MODE Pin Leakage tAP Sample-and-Hold Acquisition Delay Time tJITTER Sample-and-Hold Acquisition Delay Time Jitter 0.2 psRMS CMRR Analog Input Common Mode Rejection Ratio 80 dB ±0.5V to ±1V 1.5 1.5 V 1.9 2 V V –10 10 μA ● –10 10 μA ● –10 10 μA 0 ns DYNAMIC ACCURACY The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Note 4) SYMBOL PARAMETER CONDITIONS SNR Signal-to-Noise Ratio 5MHz Input 12.5MHz Input 70MHz Input Spurious Free Dynamic Range 2nd or 3rd Harmonic SFDR SFDR S/(N+D) IMD MIN TYP ● 72 74.5 74.2 73.4 dB dB dB 5MHz Input 12.5MHz Input 70MHz Input ● 74 90 90 85 dB dB dB Spurious Free Dynamic Range 4th Harmonic or Higher 5MHz Input 12.5MHz Input 70MHz Input ● 78 90 90 90 dB dB dB Signal-to-Noise Plus Distortion Ratio 5MHz Input 12.5MHz Input 70MHz Input ● 71.5 74.5 74.2 73.4 dB dB dB 90 dB Intermodulation Distortion fIN1 = 4.3MHz, fIN2 = 4.6MHz MAX UNITS INTERNAL REFERENCE CHARACTERISTICS TA = 25°C. (Note 4) PARAMETER CONDITIONS MIN TYP MAX UNITS VCM Output Voltage IOUT = 0 1.475 1.500 1.525 V VCM Output Tempco ±25 ppm/°C VCM Line Regulation 2.8V < VDD < 3.5V 3 mV/V VCM Output Regulation –1mA < IOUT < 1mA 4 Ω DIGITAL INPUTS AND DIGITAL OUTPUTS The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS LOGIC INPUTS (CLK, ⎯O⎯E, SHDN) VIH High Level Input Voltage VDD = 3V ● VIL Low Level Input Voltage VDD = 3V ● IIN Input Current VIN = 0V to VDD ● CIN Input Capacitance (Note 7) 2 V –10 3 0.8 V 10 μA pF 2246hf 3 LTC2246H DIGITAL INPUTS AND DIGITAL OUTPUTS The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS LOGIC OUTPUTS OVDD = 3V COZ Hi-Z Output Capacitance ⎯O⎯E = High (Note 7) 3 pF ISOURCE Output Source Current VOUT = 0V 50 mA ISINK Output Sink Current VOUT = 3V 50 mA VOH High Level Output Voltage IO = –10μA IO = –200μA ● IO = 10μA IO = 1.6mA ● VOL Low Level Output Voltage 2.7 2.995 2.99 0.005 0.09 V V V V 0.4 OVDD = 2.5V VOH High Level Output Voltage IO = –200μA 2.49 V VOL Low Level Output Voltage IO = 1.6mA 0.09 V VOH High Level Output Voltage IO = –200μA 1.79 V VOL Low Level Output Voltage IO = 1.6mA 0.09 V OVDD = 1.8V POWER REQUIREMENTS The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 8) SYMBOL PARAMETER CONDITIONS VDD Analog Supply Voltage (Note 9) OVDD Output Supply Voltage (Note 9) MIN TYP MAX UNITS ● 2.8 3 3.5 V ● 0.5 V 3 3.6 25 30 mA 75 90 mW IVDD Supply Current ● PDISS Power Dissipation ● PSHDN Shutdown Power SHDN = H, ⎯O⎯E = H, No CLK 2 mW PNAP Nap Mode Power SHDN = H, ⎯O⎯E = L, No CLK 15 mW TIMING CHARACTERISTICS The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS fS Sampling Frequency (Note 9) ● 1 tL CLK Low Time Duty Cycle Stabilizer Off Duty Cycle Stabilizer On (Note 7) ● ● 18.9 5 tH CLK High Time Duty Cycle Stabilizer Off Duty Cycle Stabilizer On (Note 7) ● ● 18.9 5 tAP Sample-and-Hold Aperture Delay tD CLK to DATA Delay CL = 5pF (Note 7) ● Data Access Time After ⎯O⎯E↓ CL = 5pF (Note 7) BUS Relinquish Time (Note 7) Pipeline Latency MIN TYP MAX 25 MHz 20 20 500 500 ns ns 20 20 500 500 ns ns 0 1.4 UNITS ns 2.7 6 ns ● 4.3 12 ns ● 3.3 10 ns 5 Cycles 2246hf 4 LTC2246H Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All voltage values are with respect to ground with GND and OGND wired together (unless otherwise noted). Note 3: When these pin voltages are taken below GND or above VDD, they will be clamped by internal diodes. This product can handle input currents of greater than 100mA below GND or above VDD without latchup. Note 4: VDD = 3V, fSAMPLE = 25MHz, input range = 2VP-P with differential drive, unless otherwise noted. Note 5: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual endpoints of the transfer curve. The deviation is measured from the center of the quantization band. Note 6: Offset error is the offset voltage measured from –0.5 LSB when the output code flickers between 00 0000 0000 0000 and 11 1111 1111 1111. Note 7: Guaranteed by design, not subject to test. Note 8: VDD = 3V, fSAMPLE = 25MHz, input range = 1VP-P with differential drive. Note 9: Recommended operating conditions. TYPICAL PERFORMANCE CHARACTERISTICS Typical INL, 2V Range, 25Msps 1.00 0.75 1.0 0.50 0.5 0 –0.5 0 –10 –20 –30 AMPLITUDE (dB) 1.5 DNL ERROR (LSB) INL ERROR (LSB) 2.0 0.25 0 –0.25 –0.50 –1.0 –1.5 –0.75 –2.0 –1.00 –40 –50 –60 –70 –80 –90 –100 –110 0 4096 8192 CODE 12288 0 16384 4096 8192 CODE 12288 –120 16384 8192 Point FFT, fIN = 30MHz, –1dB, 2V Range, 25Msps 0 –10 –20 –20 –20 –30 –30 –30 –70 –80 AMPLITUDE (dB) 0 –10 AMPLITUDE (dB) 0 –60 –40 –50 –60 –70 –80 –50 –60 –70 –80 –90 –90 –100 –100 –100 –110 –110 –110 –120 –120 2 4 6 8 10 FREQUENCY (MHz) 12 2246 G04 0 2 4 6 8 10 FREQUENCY (MHz) 12 –40 –90 0 4 6 8 10 FREQUENCY (MHz) 8192 Point FFT, fIN = 140MHz, –1dB, 2V Range, 25Msps –10 –50 2 2246 G03 8192 Point FFT, fIN = 70MHz, –1dB, 2V Range, 25Msps –40 0 2246 G02 2246 G01 AMPLITUDE (dB) 8192 Point FFT, fIN = 5MHz, –1dB, 2V Range, 25Msps Typical DNL, 2V Range, 25Msps 12 2246 G05 –120 0 2 4 6 8 10 FREQUENCY (MHz) 12 2246 G06 2246hf 5 LTC2246H TYPICAL PERFORMANCE CHARACTERISTICS 8192 Point 2-Tone FFT, fIN = 10.9MHz and 13.8MHz, –1dB, 2V Range, 25Msps Grounded Input Histogram, 25Msps 25000 0 75 22016 –10 –20 20000 74 18803 –30 –50 –60 –70 15000 13373 10000 –80 –90 5000 72 0 0 2 4 6 8 10 FREQUENCY (MHz) 12 2246 G07 SFDR vs Input Frequency, –1dB, 2V Range, 25Msps 71 3227 –110 853 43 278 70 8179 8180 8181 8182 8183 8184 8185 8186 CODE 2246 G08 100 50 150 INPUT FREQUENCY (MHz) 0 110 80 dBFS 70 95 200 2246 G09 SNR vs Input Level, fIN = 5MHz, 2V Range, –1dB SNR and SFDR vs Sample Rate, 2V Range, fIN = 5MHz, –1dB 100 85 80 75 SFDR SNR (dBc AND dBFS) SNR AND SFDR (dBFS) 100 90 SFDR (dBFS) 73 6919 –100 –120 SNR (dBFS) –40 COUNT AMPLITUDE (dB) SNR vs Input Frequency, –1dB, 2V Range, 25Msps 90 80 SNR 60 50 dBc 40 30 20 70 70 10 60 65 50 100 150 INPUT FREQUENCY (MHz) 0 10 0 200 2246 G10 SFDR vs Input Level, fIN = 5MHz, 2V Range, 25Msps 20 30 40 SAMPLE RATE (Msps) 0 –60 50 IVDD vs Sample Rate, 5MHz Sine Wave Input, –1dB 120 –50 2246 G11 –30 –40 –20 INPUT LEVEL (dBFS) –10 0 2246 G12 IOVDD vs Sample Rate, 5MHz Sine Wave Input, –1dB, OVDD = 1.8V 35 3 110 dBFS 30 90 dBc 70 90dBc SFDR REFERENCE LINE 60 IOVDD (mA) 2 80 IVDD (mA) SFDR (dBc AND dBFS) 100 2V RANGE 25 1V RANGE 1 50 20 40 30 20 –60 – 50 – 40 –30 –20 INPUT LEVEL (dBFS) –10 0 2246 G13 15 0 5 25 20 15 10 SAMPLE RATE (Msps) 30 35 2246 G14 0 0 5 25 20 15 10 SAMPLE RATE (Msps) 30 35 2246 G15 2246hf 6 LTC2246H PIN FUNCTIONS AIN+ (Pin 1): Positive Differential Analog Input. AIN- (Pin 2): Negative Differential Analog Input. GND (Pins 3, 6, 8): ADC Power Ground. REFH (Pin 4): ADC High Reference. Bypass to pin 5 with a 0.1μF ceramic chip capacitor as close to the pin as possible. Also bypass to pin 5 with an additional 2.2μF ceramic chip capacitor and to ground with a 1μF ceramic chip capacitor. REFL (Pin 5): ADC Low Reference. Bypass to pin 4 with a 0.1μF ceramic chip capacitor as close to the pin as possible. Also bypass to pin 4 with an additional 2.2μF ceramic chip capacitor and to ground with a 1μF ceramic chip capacitor. VDD (Pins 7, 32): 3V Supply. Bypass to GND with 0.1μF ceramic chip capacitors. CLK (Pin 9): Clock Input. The input sample starts on the positive edge. SHDN (Pin 10): Shutdown Mode Selection Pin. Connecting SHDN to GND and ⎯O⎯E to GND results in normal operation with the outputs enabled. Connecting SHDN to GND and ⎯O⎯E to VDD results in normal operation with the outputs at high impedance. Connecting SHDN to VDD and ⎯O⎯E to GND results in nap mode with the outputs at high impedance. Connecting SHDN to VDD and ⎯O⎯E to VDD results in sleep mode with the outputs at high impedance. ⎯O⎯E (Pin 11): Output Enable Pin. Refer to SHDN pin function. D0 – D13 (Pins 12, 13, 14, 15, 16, 17, 18, 19, 22, 23, 24, 25, 26, 27): Digital Outputs. D13 is the MSB. OGND (Pin 20): Output Driver Ground. OVDD (Pin 21): Positive Supply for the Output Drivers. Bypass to ground with 0.1μF ceramic chip capacitor. OF (Pin 28): Over/Under Flow Output. High when an over or under flow has occurred. MODE (Pin 29): Output Format and Clock Duty Cycle Stabilizer Selection Pin. Connecting MODE to GND selects offset binary output format and turns the clock duty cycle stabilizer off. 1/3 VDD selects offset binary output format and turns the clock duty cycle stabilizer on. 2/3 VDD selects 2’s complement output format and turns the clock duty cycle stabilizer on. VDD selects 2’s complement output format and turns the clock duty cycle stabilizer off. SENSE (Pin 30): Reference Programming Pin. Connecting SENSE to VCM selects the internal reference and a ±0.5V input range. VDD selects the internal reference and a ±1V input range. An external reference greater than 0.5V and less than 1V applied to SENSE selects an input range of ±VSENSE. ±1V is the largest valid input range. VCM (Pin 31): 1.5V Output and Input Common Mode Bias. Bypass to ground with 2.2μF ceramic chip capacitor. If the clock duty cycle stabilizer is used, a >1μs high pulse should be applied to the SHDN pin once the power supplies are stable at power up. 2246hf 7 LTC2246H FUNCTIONAL BLOCK DIAGRAM AIN+ AIN– VCM INPUT S/H FIRST PIPELINED ADC STAGE SECOND PIPELINED ADC STAGE THIRD PIPELINED ADC STAGE FOURTH PIPELINED ADC STAGE FIFTH PIPELINED ADC STAGE 1.5V REFERENCE SIXTH PIPELINED ADC STAGE SHIFT REGISTER AND CORRECTION 2.2μF RANGE SELECT REFH SENSE REFL INTERNAL CLOCK SIGNALS OVDD REF BUF OF D13 CLOCK/DUTY CYCLE CONTROL DIFF REF AMP REFH 0.1μF CONTROL LOGIC OUTPUT DRIVERS • • • D0 2246 F01 REFL OGND CLK MODE SHDN OE 2.2μF 1μF 1μF Figure 1. Functional Block Diagram TIMING DIAGRAM tAP ANALOG INPUT N+4 N+2 N N+3 tH N+5 N+1 tL CLK tD D0-D13, OF N–5 N–4 N–3 N–2 N–1 N 2246 TD01 2246hf 8 LTC2246H APPLICATIONS INFORMATION DYNAMIC PERFORMANCE either input tone to the RMS value of the largest 3rd order intermodulation product. Signal-to-Noise Plus Distortion Ratio The signal-to-noise plus distortion ratio [S/(N + D)] is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components at the ADC output. The output is band limited to frequencies above DC to below half the sampling frequency. Spurious Free Dynamic Range (SFDR) Spurious free dynamic range is the peak harmonic or spurious noise that is the largest spectral component excluding the input signal and DC. This value is expressed in decibels relative to the RMS value of a full scale input signal. Input Bandwidth Signal-to-Noise Ratio The signal-to-noise ratio (SNR) is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components except the first five harmonics and DC. Total Harmonic Distortion Total harmonic distortion is the ratio of the RMS sum of all harmonics of the input signal to the fundamental itself. The out-of-band harmonics alias into the frequency band between DC and half the sampling frequency. THD is expressed as: THD = 20Log (√(V22 + V32 + V42 + . . . Vn2)/V1) where V1 is the RMS amplitude of the fundamental frequency and V2 through Vn are the amplitudes of the second through nth harmonics. The THD calculated in this data sheet uses all the harmonics up to the fifth. Intermodulation Distortion If the ADC input signal consists of more than one spectral component, the ADC transfer function nonlinearity can produce intermodulation distortion (IMD) in addition to THD. IMD is the change in one sinusoidal input caused by the presence of another sinusoidal input at a different frequency. If two pure sine waves of frequencies fa and fb are applied to the ADC input, nonlinearities in the ADC transfer function can create distortion products at the sum and difference frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3, etc. The 3rd order intermodulation products are 2fa + fb, 2fb + fa, 2fa – fb and 2fb – fa. The intermodulation distortion is defined as the ratio of the RMS value of The input bandwidth is that input frequency at which the amplitude of the reconstructed fundamental is reduced by 3dB for a full scale input signal. Aperture Delay Time The time from when CLK reaches mid-supply to the instant that the input signal is held by the sample and hold circuit. Aperture Delay Jitter The variation in the aperture delay time from conversion to conversion. This random variation will result in noise when sampling an AC input. The signal to noise ratio due to the jitter alone will be: SNRJITTER = –20log (2π • fIN • tJITTER) CONVERTER OPERATION As shown in Figure 1, the LTC2246H is a CMOS pipelined multistep converter. The converter has six pipelined ADC stages; a sampled analog input will result in a digitized value five cycles later (see the Timing Diagram section). For optimal AC performance the analog inputs should be driven differentially. For cost sensitive applications, the analog inputs can be driven single-ended with slightly worse harmonic distortion. The CLK input is single-ended. The LTC2246H has two phases of operation, determined by the state of the CLK input pin. Each pipelined stage shown in Figure 1 contains an ADC, a reconstruction DAC and an interstage residue amplifier. In operation, the ADC quantizes the input to the stage and the quantized value is subtracted from the input by the DAC to produce a residue. The residue is amplified and 2246hf 9 LTC2246H APPLICATIONS INFORMATION output by the residue amplifier. Successive stages operate out of phase so that when the odd stages are outputting their residue, the even stages are acquiring that residue and vice versa. When CLK is low, the analog input is sampled differentially directly onto the input sample-and-hold capacitors, inside the “Input S/H” shown in the block diagram. At the instant that CLK transitions from low to high, the sampled input is held. While CLK is high, the held input voltage is buffered by the S/H amplifier which drives the first pipelined ADC stage. The first stage acquires the output of the S/H during this high phase of CLK. When CLK goes back low, the first stage produces its residue which is acquired by the second stage. At the same time, the input S/H goes back to acquiring the analog input. When CLK goes back high, the second stage produces its residue which is acquired by the third stage. An identical process is repeated for the third, fourth and fifth stages, resulting in a fifth stage residue that is sent to the sixth stage ADC for final evaluation. Each ADC stage following the first has additional range to accommodate flash and amplifier offset errors. Results from all of the ADC stages are digitally synchronized such that the results can be properly combined in the correction logic before being sent to the output buffer. SAMPLE/HOLD OPERATION AND INPUT DRIVE Sample/Hold Operation Figure 2 shows an equivalent circuit for the LTC2246H CMOS differential sample-and-hold. The analog inputs are connected to the sampling capacitors (CSAMPLE) through NMOS transistors. The capacitors shown attached to each input (CPARASITIC) are the summation of all other capacitance associated with each input. During the sample phase when CLK is low, the transistors connect the analog inputs to the sampling capacitors and they charge to and track the differential input voltage. When CLK transitions from low to high, the sampled input voltage is held on the sampling capacitors. During the hold phase when CLK is high, the sampling capacitors are disconnected from the input and the held voltage is passed to the ADC core for processing. As CLK transitions from high to low, LTC2246H VDD CSAMPLE 4pF 15Ω AIN+ VDD AIN– CPARASITIC 1pF CSAMPLE 4pF 15Ω CPARASITIC 1pF CLK 2246 F02 Figure 2. Equivalent Input Circuit the inputs are reconnected to the sampling capacitors to acquire a new sample. Since the sampling capacitors still hold the previous sample, a charging glitch proportional to the change in voltage between samples will be seen at this time. If the change between the last sample and the new sample is small, the charging glitch seen at the input will be small. If the input change is large, such as the change seen with input frequencies near Nyquist, then a larger charging glitch will be seen. Single-Ended Input For cost sensitive applications, the analog inputs can be driven single-ended. With a single-ended input the harmonic distortion and INL will degrade, but the SNR and DNL will remain unchanged. For a single-ended input, AIN+ should be driven with the input signal and AIN– should be connected to VCM or a low noise reference voltage between 1V and 1.5V. Common Mode Bias For optimal performance the analog inputs should be driven differentially. Each input should swing ±0.5V for the 2V range or ±0.25V for the 1V range, around a common mode voltage of 1.5V. The VCM output pin (Pin 31) may be used to provide the common mode bias level. VCM can be tied directly to the center tap of a transformer to set the DC input level or as a reference level to an op amp differential driver circuit. The VCM pin must be bypassed to ground close to the ADC with a 2.2μF or greater capacitor. 2246hf 10 LTC2246H APPLICATIONS INFORMATION Input Drive Impedance As with all high performance, high speed ADCs, the dynamic performance of the LTC2246H can be influenced by the input drive circuitry, particularly the second and third harmonics. Source impedance and reactance can influence SFDR. At the falling edge of CLK, the sample-and-hold circuit will connect the 4pF sampling capacitor to the input pin and start the sampling period. The sampling period ends when CLK rises, holding the sampled input on the sampling capacitor. Ideally the input circuitry should be fast enough to fully charge the sampling capacitor during the sampling period 1/(2FENCODE); however, this is not always possible and the incomplete settling may degrade the SFDR. The sampling glitch has been designed to be as linear as possible to minimize the effects of incomplete settling. For the best performance, it is recommended to have a source impedance of 100Ω or less for each input. The source impedance should be matched for the differential inputs. Poor matching will result in higher even order harmonics, especially the second. mode path for charging glitches caused by the sample and hold. Figure 3 shows a 1:1 turns ratio transformer. Other turns ratios can be used if the source impedance seen by the ADC does not exceed 100Ω for each ADC input. A disadvantage of using a transformer is the loss of low frequency response. Most small RF transformers have poor performance at frequencies below 1MHz. Figure 4 demonstrates the use of a differential amplifier to convert a single ended input signal into a differential input signal. The advantage of this method is that it provides low frequency input response; however, the limited gain bandwidth of most op amps will limit the SFDR at high input frequencies. Figure 5 shows a single-ended input circuit. The impedance seen by the analog inputs should be matched. This circuit is not recommended if low distortion is required. The 25Ω resistors and 12pF capacitor on the analog inputs serve two purposes: isolating the drive circuitry from the sample-and-hold charging glitches and limiting the wideband noise at the converter input. VCM Input Drive Circuits Figure 3 shows the LTC2246H being driven by an RF transformer with a center tapped secondary. The secondary center tap is DC biased with VCM, setting the ADC input signal at its optimum DC level. Terminating on the transformer secondary is desirable, as this provides a common 2.2μF HIGH SPEED DIFFERENTIAL 25Ω AMPLIFIER ANALOG INPUT + AIN+ + CM – LTC2246H 12pF – AIN– 25Ω 2246 F04 Figure 4. Differential Drive with an Amplifier VCM VCM 2.2μF 0.1μF ANALOG INPUT 1k 0.1μF T1 1:1 25Ω 25Ω AIN+ LTC2246H ANALOG INPUT 1k 2.2μF AIN+ 25Ω LTC2246H 0.1μF 12pF 12pF 25Ω AIN– T1 = MA/COM ETC1-1T 25Ω RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE Figure 3. Single-Ended to Differential Conversion Using a Transformer 25Ω 2246 F03 AIN– 0.1μF 2246 F05 Figure 5. Single-Ended Drive 2246hf 11 LTC2246H APPLICATIONS INFORMATION Reference Operation Figure 6 shows the LTC2246H reference circuitry consisting of a 1.5V bandgap reference, a difference amplifier and switching and control circuit. The internal voltage reference can be configured for two pin selectable input ranges of 2V (±1V differential) or 1V (±0.5V differential). Tying the SENSE pin to VDD selects the 2V range; tying the SENSE pin to VCM selects the 1V range. The 1.5V bandgap reference serves two functions: its output provides a DC bias point for setting the common mode voltage of any external input circuitry; additionally, the reference is used with a difference amplifier to generate the differential reference levels needed by the internal ADC circuitry. An external bypass capacitor is required for the 1.5V reference output, VCM. This provides a high frequency low impedance path to ground for internal and external circuitry. The difference amplifier generates the high and low reference for the ADC. High speed switching circuits are connected to these outputs and they must be externally bypassed. Other voltage ranges in-between the pin selectable ranges can be programmed with two external resistors as shown in Figure 7. An external reference can be used by applying its output directly or through a resistor divider to SENSE. It is not recommended to drive the SENSE pin with a logic device. The SENSE pin should be tied to the appropriate level as close to the converter as possible. If the SENSE pin is driven externally, it should be bypassed to ground as close to the device as possible with a 1μF ceramic capacitor. Input Range The input range can be set based on the application. The 2V input range will provide the best signal-to-noise performance while maintaining excellent SFDR. The 1V input range will have better SFDR performance, but the SNR will degrade by 5.8dB. LTC2246H 1.5V VCM 4Ω 1.5V 1.5V BANDGAP REFERENCE VCM 2.2μF 12k 2.2μF 1V TIE TO VDD FOR 2V RANGE; TIE TO VCM FOR 1V RANGE; RANGE = 2 • VSENSE FOR 0.5V < VSENSE < 1V 0.75V 0.5V 12k RANGE DETECT AND CONTROL LTC2246H 1μF 2246 F07 SENSE Figure 7. 1.5V Range ADC BUFFER INTERNAL ADC HIGH REFERENCE 1μF REFH 2.2μF SENSE 0.1μF CLEAN SUPPLY 4.7μF FERRITE BEAD DIFF AMP 0.1μF 1μF REFL CLK 100Ω INTERNAL ADC LOW REFERENCE LTC2246H 2246 F06 2246 F08 Figure 6. Equivalent Reference Circuit IF LVDS USE FIN1002 OR FIN1018. FOR PECL, USE AZ1000ELT21 OR SIMILAR Figure 8. CLK Drive Using an LVDS or PECL to CMOS Converter 2246hf 12 LTC2246H APPLICATIONS INFORMATION Driving the Clock Input The CLK input can be driven directly with a CMOS or TTL level signal. A differential clock can also be used along with a low-jitter CMOS converter before the CLK pin (see Figure 8). The noise performance of the LTC2246H can depend on the clock signal quality as much as on the analog input. Any noise present on the clock signal will result in additional aperture jitter that will be RMS summed with the inherent ADC aperture jitter. Table 1. Output Codes vs Input Voltage AIN+ – AIN– (2V Range) OF >+1.000000V +0.999878V +0.999756V 1 0 0 11 1111 1111 1111 01 1111 1111 1111 11 1111 1111 1111 01 1111 1111 1111 11 1111 1111 1110 01 1111 1111 1110 +0.000122V 0.000000V –0.000122V –0.000244V 0 0 0 0 10 0000 0000 0001 10 0000 0000 0000 01 1111 1111 1111 01 1111 1111 1110 –0.999878V –1.000000V 1μs high pulse should be applied to the SHDN pin once the power supplies are stable at power up. N-channel transistor in the output driver allows operation down to low voltages. The internal resistor in series with the output makes the output appear as 50Ω to external circuitry and may eliminate the need for external damping resistors. As with all high speed/high resolution converters, the digital output loading can affect the performance. The digital outputs of the LTC2246H should drive a minimal capacitive load to avoid possible interaction between the digital outputs and sensitive input circuitry. The output should be buffered with a device such as an ALVCH16373 CMOS latch. For full speed operation the capacitive load should be kept under 10pF. Lower OVDD voltages will also help reduce interference from the digital outputs. LTC2246H OVDD The lower limit of the LTC2246H sample rate is determined by droop of the sample-and-hold circuits. The pipelined architecture of this ADC relies on storing analog signals on small valued capacitors. Junction leakage will discharge the capacitors. The specified minimum operating frequency for the LTC2246H is 1Msps. 0.5V TO 3.6V VDD VDD 0.1μF OVDD DATA FROM LATCH PREDRIVER LOGIC 43Ω TYPICAL DATA OUTPUT OE OGND DIGITAL OUTPUTS 2246 F09 Table 1 shows the relationship between the analog input voltage, the digital data bits, and the overflow bit. Figure 9. Digital Output Buffer 2246hf 13 LTC2246H APPLICATIONS INFORMATION Data Format Sleep and Nap Modes Using the MODE pin, the LTC2246H parallel digital output can be selected for offset binary or 2’s complement format. Connecting MODE to GND or 1/3VDD selects offset binary output format. Connecting MODE to 2/3VDD or VDD selects 2’s complement output format. The converter may be placed in shutdown or nap modes to conserve power. Connecting SHDN to GND results in normal operation. Connecting SHDN to VDD and ⎯O⎯E to VDD results in sleep mode, which powers down all circuitry including the reference and typically dissipates 1mW. When exiting sleep mode it will take milliseconds for the output data to become valid because the reference capacitors have to recharge and stabilize. Connecting SHDN to VDD and ⎯O⎯E to GND results in nap mode, which typically dissipates 15mW. In nap mode, the on-chip reference circuit is kept on, so that recovery from nap mode is faster than that from sleep mode, typically taking 100 clock cycles. In both sleep and nap modes, all digital outputs are disabled and enter the Hi-Z state. An external resistor divider can be used to set the 1/3VDD or 2/3VDD logic values. Table 2 shows the logic states for the MODE pin. Table 2. MODE Pin Function MODE Pin Output Format Clock Duty Cycle Stablizer 0 Offset Binary Off 1/3VDD Offset Binary On 2/3VDD 2’s Complement On VDD 2’s Complement Off Overflow Bit When OF outputs a logic high the converter is either overranged or underranged. Output Driver Power Separate output power and ground pins allow the output drivers to be isolated from the analog circuitry. The power supply for the digital output buffers, OVDD, should be tied to the same power supply as for the logic being driven. For example if the converter is driving a DSP powered by a 1.8V supply, then OVDD should be tied to that same 1.8V supply. OVDD can be powered with any voltage from 500mV up to 3.6V. OGND can be powered with any voltage from GND up to 1V and must be less than OVDD. The logic outputs will swing between OGND and OVDD. Output Enable The outputs may be disabled with the output enable pin, ⎯O⎯E. ⎯O⎯E high disables all data outputs including OF. Grounding and Bypassing The LTC2246H requires a printed circuit board with a clean, unbroken ground plane. A multilayer board with an internal ground plane is recommended. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. High quality ceramic bypass capacitors should be used at the VDD, OVDD, VCM, REFH, and REFL pins. Bypass capacitors must be located as close to the pins as possible. Of particular importance is the 0.1μF capacitor between REFH and REFL. This capacitor should be placed as close to the device as possible (1.5mm or less). A size 0402 ceramic capacitor is recommended. The large 2.2μF capacitor between REFH and REFL can be somewhat further away. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. The LTC2246H differential inputs should run parallel and close to each other. The input traces should be as short as possible to minimize capacitance and to minimize noise pickup. 2246hf 14 LTC2246H PACKAGE DESCRIPTION LU Package 32-Lead Plastic TQFP (5mm × 5mm) (Reference LTC DWG # 05-08-1735 Rev Ø) 5.15 – 5.25 7.00 BSC 3.50 REF 5.00 BSC 32 0.50 BSC 1 2 3 32 SEE NOTE: 4 1 2 3 3.50 REF 7.00 BSC 5.00 BSC 5.15 – 5.25 A A 0.22 – 0.30 PACKAGE OUTLINE SEE NOTE: 5 1.30 MIN RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 1.20 0.95 – 1.05 MAX 11° – 13° R0.08 – 0.20 GAUGE PLANE 0.25 0° – 7° 11° – 13° 0.09 – 0.22 1.00 REF 0.50 BSC 0.05 – 0.15 0.17 – 0.27 LU32 TQFP 0906 REVØ 0.45 – 0.75 SECTION A – A NOTE: 1. DRAWING CONFORMS TO JEDEC #MS-026 PACKAGE OUTLINE 2. DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT 4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION 5. EXACT SHAPE OF EACH CORNER IS OPTIONAL 6. DRAWING IS NOT TO SCALE 2246hf Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15 LTC2246H RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LTC1748 14-Bit, 80Msps, 5V ADC 76.3dB SNR, 90dB SFDR, 48-Pin TSSOP Package LTC1750 14-Bit, 80Msps, 5V Wideband ADC Up to 500MHz IF Undersampling, 90dB SFDR LT1993-2 High Speed Differential Op Amp 800MHz BW, –70dBc Distortion at 70MHz, 6dB Gain LT1994 Low Noise, Low Distortion Fully Differential Input/Output Amplifier/Driver Low Distortion: –94dBc at 1MHz LTC2202 16-Bit, 10Msps, 3.3V ADC, Lowest Noise 150mW, 81.6dB SNR, 100dB SFDR, 48-Pin QFN LTC2208 16-Bit, 130Msps, 3.3V ADC, LVDS Outputs 1250mW, 78dB SNR, 100dB SFDR, 64-Pin QFN LTC2220-1 12-Bit, 185Msps, 3.3V ADC, LVDS Outputs 910mW, 67.7dB SNR, 80dB SFDR, 64-Pin QFN LTC2224 12-Bit, 135Msps, 3.3V ADC, High IF Sampling 630mW, 67.6dB SNR, 84dB SFDR, 48-Pin QFN LTC2225 12-Bit, 10Msps, 3V ADC, Lowest Power 60mW, 71.3dB SNR, 90dB SFDR, 32-Pin QFN LTC2226 12-Bit, 25Msps, 3V ADC, Lowest Power 75mW, 71.4dB SNR, 90dB SFDR, 32-Pin QFN LTC2227 12-Bit, 40Msps, 3V ADC, Lowest Power 120mW, 71.4dB SNR, 90dB SFDR, 32-Pin QFN LTC2228 12-Bit, 65Msps, 3V ADC, Lowest Power 205mW, 71.3dB SNR, 90dB SFDR, 32-Pin QFN LTC2229 12-Bit, 80Msps, 3V ADC, Lowest Power 211mW, 70.6dB SNR, 90dB SFDR, 32-Pin QFN LTC2236 10-Bit, 25Msps, 3V ADC, Lowest Power 75mW, 61.8dB SNR, 85dB SFDR, 32-Pin QFN LTC2237 10-Bit, 40Msps, 3V ADC, Lowest Power 120mW, 61.8dB SNR, 85dB SFDR, 32-Pin QFN LTC2238 10-Bit, 65Msps, 3V ADC, Lowest Power 205mW, 61.8dB SNR, 85dB SFDR, 32-Pin QFN LTC2239 10-Bit, 80Msps, 3V ADC, Lowest Power 211mW, 61.6dB SNR, 85dB SFDR, 32-Pin QFN LTC2245 14-Bit, 10Msps, 3V ADC, Lowest Power 60mW, 74.4dB SNR, 90dB SFDR, 32-Pin QFN LTC2246 14-Bit, 25Msps, 3V ADC, Lowest Power 75mW, 74.5dB SNR, 90dB SFDR, 32-Pin QFN LTC2247 14-Bit, 40Msps, 3V ADC, Lowest Power 120mW, 74.4dB SNR, 90dB SFDR, 32-Pin QFN LTC2248 14-Bit, 65Msps, 3V ADC, Lowest Power 205mW, 74.3dB SNR, 90dB SFDR, 32-Pin QFN LTC2249 14-Bit, 80Msps, 3V ADC, Lowest Power 222mW, 73dB SNR, 90dB SFDR, 32-Pin QFN LTC2250 10-Bit, 105Msps, 3V ADC, Lowest Power 320mW, 61.6dB SNR, 85dB SFDR, 32-Pin QFN LTC2251 10-Bit, 125Msps, 3V ADC, Lowest Power 395mW, 61.6dB SNR, 85dB SFDR, 32-Pin QFN LTC2252 12-Bit, 105Msps, 3V ADC, Lowest Power 320mW, 70.2dB SNR, 88dB SFDR, 32-Pin QFN LTC2253 12-Bit, 125Msps, 3V ADC, Lowest Power 395mW, 70.2dB SNR, 88dB SFDR, 32-Pin QFN LTC2254 14-Bit, 105Msps, 3V ADC, Lowest Power 320mW, 72.4dB SNR, 88dB SFDR, 32-Pin QFN LTC2255 14-Bit, 125Msps, 3V ADC, Lowest Power 395mW, 72.5dB SNR, 88dB SFDR, 32-Pin QFN LTC2284 14-Bit, Dual, 105Msps, 3V ADC, Low Crosstalk 540mW, 72.4dB SNR, 88dB SFDR, 64-Pin QFN LT5512 DC-3GHz High Signal Level Downconverting Mixer DC to 3GHz, 21dBm IIP3, Integrated LO Buffer LT5514 Ultralow Distortion IF Amplifier/ADC Driver with Digitally Controlled Gain 450MHz to 1dB BW, 47dB OIP3, Digital Gain Control 10.5dB to 33dB in 1.5dB/Step LT5515 1.5GHz to 2.5GHz Direct Conversion Quadrature Demodulator High IIP3: 20dBm at 1.9GHz, LT5516 800MHz to 1.5GHz Direct Conversion Quadrature Demodulator High IIP3: 21.5dBm at 900MHz, LT5517 40MHz to 900MHz Direct Conversion Quadrature Demodulator High IIP3: 21dBm at 800MHz, LT5522 600MHz to 2.7GHz High Linearity Downconverting Mixer 4.5V to 5.25V Supply, 25dBm IIP3 at 900MHz, NF = 12.5dB, 50Ω Single-Ended RF and LO Ports 2246hf 16 Linear Technology Corporation LT 0407 • PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com © LINEAR TECHNOLOGY CORPORATION 2007