LTC3406BES5-1.2#TRMPBF 数据手册
LTC3406B-1.2
1.5MHz, 600mA
Synchronous Step-Down
Regulator in ThinSOT
U
FEATURES
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DESCRIPTIO
The LTC ®3406B-1.2 is a high efficiency monolithic synchronous buck regulator using a constant frequency,
current mode architecture. Supply current with no load is
300µA dropping to 1µF) supply bypass capacitors. The
discharged bypass capacitors are effectively put in parallel
with COUT, causing a rapid drop in VOUT. No regulator can
deliver enough current to prevent this problem if the load
switch resistance is low and it is driven quickly. The only
solution is to limit the rise time of the switch drive so that
the load rise time is limited to approximately (25 • CLOAD).
Thus, a 10µF capacitor charging to 3.3V would require a
250µs rise time, limiting the charging current to about
130mA.
3. Keep the (–) plates of CIN and COUT as close as possible.
Design Example
As a design example, assume the LTC3406B-1.2 is used
in a single lithium-ion battery-powered cellular phone
application. The VIN will be operating from a maximum of
4.2V down to about 2.7V. The load current requirement
is a maximum of 0.6A but most of the time it will be in
standby mode, requiring only 2mA. Efficiency at both low
and high load currents is important. With this information we can calculate L using equation (1),
L=
1. The power traces, consisting of the GND trace, the SW
trace and the VIN trace should be kept short, direct and
wide.
2. Does the (+) plate of CIN connect to VIN as closely as
possible? This capacitor provides the AC current to the
internal power MOSFETs.
1
(3)
Substituting VIN = 4.2V, ∆IL = 240mA and f = 1.5MHz in
equation (3) gives:
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC3406B-1.2. These items are also illustrated graphically in Figures 3 and 4. Check the following in your layout:
⎛ 1.2V ⎞
1
1.2V⎜ 1 −
( f)(∆IL ) ⎝ VIN ⎟⎠
L=
1.2V
⎛ 1.2V ⎞
⎜1 −
⎟ = 2.38 µH
1.5MHz(240mA) ⎝ 4.2V ⎠
A 2.2µH inductor works well for this application. For best
efficiency choose a 720mA or greater inductor with less
than 0.2Ω series resistance.
CIN will require an RMS current rating of at least 0.3A ≅
ILOAD(MAX)/2 at temperature and COUT will require an ESR
of less than 0.25Ω. In most cases, a ceramic capacitor will
satisfy this requirement.
VIA TO VOUT
VIA TO VIN
RUN
VIN
LTC3406B-1.2
2
–
GND VOUT
5
PIN 1
COUT
VOUT
+
3
L1
SW
VIN
LTC3406B-1.2
VOUT
4
L1
CIN
SW
VIN
3406B12 F03
BOLD LINES INDICATE HIGH CURRENT PATHS
COUT
CIN
GND
3406B12 F04
Figure 3. LTC3406B-1.2 Layout Diagram
Figure 4. LTC3406B-1.2 Suggested Layout
sn3406b12 3406b12fs
10
LTC3406B-1.2
U
TYPICAL APPLICATIO S
Single Li-Ion 1.2V/600mA Regulator for Lowest Profile, ≤1mm High
VIN
2.7V TO 4.2V
4
CIN**
4.7µF
CER
VIN
SW
3
2.2µH†
COUT1*
10µF
CER
LTC3406B-1.2
1
RUN
VOUT
GND
VOUT
1.2V
5
3406B12 TA02
2
*MURATA GRM219R60JI06KE19B
**AVX06036D475MAT
†
FDK MIPW3226D2R2M
Efficiency vs Output Current
Load Step
Load Step
100
90
EFFICIENCY (%)
80
70
VOUT
100mV/DIV
AC COUPLED
VOUT
100mV/DIV
AC COUPLED
IL
500mA/DIV
IL
500mA/DIV
ILOAD
500mA/DIV
ILOAD
500mA/DIV
VIN = 2.7V
60
50
VIN = 4.2V
40
30
20
10
0.1
3406B12 TA04
20µs/DIV
VIN = 3.6V
ILOAD = 0mA TO 600mA
VIN = 3.6V
1
10
100
OUTPUT CURRENT (mA)
20µs/DIV
VIN = 3.6V
ILOAD = 200mA TO 600mA
3406B12 TA05
1000
3406B12 TA03
U
PACKAGE DESCRIPTIO
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
0.62
MAX
0.95
REF
2.90 BSC
(NOTE 4)
1.22 REF
1.4 MIN
3.85 MAX 2.62 REF
2.80 BSC
1.50 – 1.75
(NOTE 4)
PIN ONE
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.95 BSC
0.80 – 0.90
0.09 – 0.20
(NOTE 3)
0.20 BSC
0.01 – 0.10
1.00 MAX
DATUM ‘A’
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
1.90 BSC
S5 TSOT-23 0302
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
sn3406b12 3406b12fs
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
LTC3406B-1.2
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DESCRIPTION
COMMENTS
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