LTC2309IUFXTRPBF

LTC2309 8-Channel, 12-Bit SAR ADC with I2C Interface FEATURES n n n n n n n n n n n n n DESCRIPTION The LTC®2309 is a low noise, low power, 8-channel, 12-bit successive approximation ADC with an I2C compatible serial interface. This ADC includes an internal reference and a fully differential sample-and-hold circuit to reduce common mode noise. The LTC2309 operates from an internal clock to achieve a fast 1.3μs conversion time. The LTC2309 operates from a single 5V supply and draws just 300μA at a throughput rate of 1ksps. The ADC enters nap mode when not converting, reducing the power dissipation. The LTC2309 is available in a small 24-pin 4mm × 4mm QFN package. The internal 2.5V reference and 8-channel multiplexer further reduce PCB board space requirements. The low power consumption and small size make the LTC2309 ideal for battery-operated and portable applications, while the 2-wire I2C compatible serial interface makes this ADC a good match for space-constrained systems. L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. 12-Bit Resolution Low Power: 1.5mW at 1ksps, 35μW Sleep Mode 14ksps Throughput Rate Low Noise: SNR = 73.4dB Guaranteed No Missing Codes Single 5V Supply 2-wire I2C Compatible Serial Interface with Nine Addresses Plus One Global for Synchronization Fast Conversion Time: 1.3μs Internal Reference Internal 8-Channel Multiplexer Internal Conversion Clock Unipolar or Bipolar Input Ranges (Software Selectable) 24-Pin 4mm × 4mm QFN Package APPLICATIONS n n n n n n Industrial Process Control Motor Control Accelerometer Measurements Battery-Operated Instruments Isolated and/or Remote Data Acquisition Power Supply Monitoring BLOCK DIAGRAM 5V 10μF 0.1μF 0.1μF 10μF Integral Nonlinearity vs Output Code AD1 AD0 1.00 0.75 0.50 INL (LSB) VREF CH0 CH1 CH2 ANALOG INPUTS 0V TO 4.096V UNIPOLAR CH4 ±2.048V BIPOLAR CH5 CH6 CH7 COM CH3 ANALOG INPUT MUX AVDD DVDD LTC2309 + – 12-BIT SAR ADC I2C PORT SCL SDA 0.25 0 –0.25 –0.50 –0.75 –1.00 INTERNAL 2.5V REF 2.2μF REFCOMP GND 0.1μF 10μF 2309 TA01 0 1024 2048 OUTPUT CODE 3072 4096 2309 G01 2309f 1 LTC2309 ABSOLUTE MAXIMUM RATINGS (Notes 1, 2) GND GND GND UF PACKAGE 24-LEAD (4mm 4mm) PLASTIC QFN TJMAX = 150°C, θJA = 37°C/W EXPOSED PAD (PIN 25) IS GND, MUST BE SOLDERED TO PCB ORDER INFORMATION LEAD FREE FINISH LTC2309CUF#PBF LTC2309IUF#PBF TAPE AND REEL LTC2309CUF#TRPBF LTC2309IUF#TRPBF PART MARKING* 2309 2309 PACKAGE DESCRIPTION 24-Lead (4mm × 4mm) Plastic QFN 24-Lead (4mm × 4mm) Plastic QFN TEMPERATURE RANGE 0°C to 70°C –40°C to 85°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. Consult LTC Marketing for information on non-standard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ REFCOMP AVDD VREF Supply Voltage (AVDD, DVDD) ...................... –0.3V to 6V Analog Input Voltage (Note 3) CH0-CH7, COM, VREF , REFCOMP ...................(GND – 0.3V) to (AVDD + 0.3V) Digital Input Voltage (Note 3).................(GND – 0.3V) to (DVDD + 0.3V) Digital Output Voltage .... (GND – 0.3V) to (DVDD + 0.3V) Power Dissipation ...............................................500mW Operating Temperature Range LTC2309C ................................................ 0°C to 70°C LTC2309I.............................................. –40°C to 85°C Storage Temperature Range................... –65°C to 150°C PIN CONFIGURATION TOP VIEW DVDD GND GND 18 GND 17 SDA 25 16 SCL 15 AD1 14 AD0 13 AVDD 7 8 9 10 11 12 CH2 CH1 CH0 24 23 22 21 20 19 CH3 1 CH4 2 CH5 3 CH6 4 CH7 5 COM 6 2309f 2 LTC2309 CONVERTER AND MULTIPLEXER CHARACTERISTICS PARAMETER Resolution (No Missing Codes) Integral Linearity Error Differential Linearity Error Bipolar Zero Error Bipolar Zero Error Drift Bipolar Zero Error Match Unipolar Zero Error Unipolar Zero Error Drift Unipolar Zero Error Match Bipolar Full-Scale Error Bipolar Full-Scale Error Drift Bipolar Full-Scale Error Match Unipolar Full-Scale Error Unipolar Full-Scale Error Drift Unipolar Full-Scale Error Match CONDITIONS l The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Notes 4, 5) MIN 12 TYP ±0.45 ±0.35 ±1 0.002 ±0.1 ±0.4 0.002 ±0.2 ±0.5 ±0.4 0.05 ±0.4 ±0.4 ±0.3 0.05 ±0.3 MAX ±1 ±1 ±8 ±3 ±6 ±1 ±10 ±9 ±3 ±10 ±6 ±2 UNITS Bits LSB LSB LSB LSB/°C LSB LSB LSB/°C LSB LSB LSB LSB/°C LSB LSB LSB LSB/°C LSB (Note 6) (Note 7) l l l (Note 7) l External Reference (Note 8) REFCOMP = 4.096V External Reference External Reference (Note 8) REFCOMP = 4.096V External Reference l l l l ANALOG INPUT SYMBOL VIN+ VIN– The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) PARAMETER Absolute Input Range (CH0 to CH7) Absolute Input Range (CH0 to CH7, COM) CONDITIONS (Note 9) Unipolar (Note 9) Bipolar (Note 9) VIN = VIN+ – VIN– (Unipolar) VIN = VIN+ – VIN– (Bipolar) Sample Mode Hold Mode l l l l l l MIN –0.05 –0.05 –0.05 TYP MAX AVDD AVDD/2 AVDD VIN+ – VIN– Input Differential Voltage Range IIN CIN CMRR Analog Input Leakage Current Analog Input Capacitance Input Common Mode Rejection Ratio 0 to REFCOMP ±REFCOMP/2 ±1 55 5 70 UNITS V V V V V μA pF pF dB DYNAMIC ACCURACY SYMBOL SINAD SNR THD SFDR The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Notes 4, 10) PARAMETER Signal-to-(Noise + Distortion) Ratio Signal-to-Noise Ratio Total Harmonic Distortion Spurious Free Dynamic Range Channel-to-Channel Isolation Full Linear Bandwidth –3dB Input Linear Bandwidth Aperature Delay Transient Response CONDITIONS fIN = 1kHz fIN = 1kHz fIN = 1kHz, First 5 Harmonics fIN = 1kHz fIN = 1kHz (Note 11) l l l l MIN 71 71 79 Full-Scale Step TYP 73.3 73.4 –88 90 –109 700 25 13 240 MAX –77 UNITS dB dB dB dB dB kHz MHz ns ns 2309f 3 LTC2309 INTERNAL REFERENCE CHARACTERISTICS PARAMETER VREF Output Voltage VREF Output Tempco VREF Output Impedance VREFCOMP Output Voltage VREF Line Regulation CONDITIONS IOUT = 0 IOUT = 0 –0.1mA ≤ IOUT ≤ 0.1mA IOUT = 0 AVDD = 4.75V to 5.25V The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) l MIN 2.47 TYP 2.50 ±25 8 4.096 0.8 MAX 2.53 UNITS V ppm/°C kΩ V mV/V I2C INPUTS AND DIGITAL OUTPUTS SYMBOL VIH VIL VIHA VILA RINH RINL RINF II VHYS VOL tOF tSP CCAX PARAMETER High Level Input Voltage Low Level Input Voltage High Level Input Voltage for Address Pins A1, A0 Low Level Input Voltage for Address Pins A1, A0 Resistance from A1, A0, to VCC to Set Chip Address Bit to 1 Resistance from A1, A0 to GND to Set Chip Address Bit to 0 Resistance from A1, A0 to GND or VCC to Set Chip Address Bit to Float Digital Input Current Hysteresis of Schmitt Trigger Inputs Low Level Output Voltage (SDA) Output Fall Time VH to VIL(MAX) Input Spike Suppression External Capacitance Load On Chip Address Pins (A1, A0) for Valid Float The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) CONDITIONS l l l l l l l l MIN 0.7VCC 0.95VCC TYP MAX 0.3VCC 0.05VCC 10 10 UNITS V V V V kΩ kΩ MΩ 2 –10 0.05VCC 20 + 0.1CB 10 0.4 250 50 10 (Note 9) I = 3mA (Note 12) l l l l l μA V V ns ns pF The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL AVDD DVDD IDD PARAMETER Analog Supply Voltage Digital Supply Voltage Supply Current Nap Mode Sleep Mode Power Dissipation Nap Mode Sleep Mode CONDITIONS l l POWER REQUIREMENTS MIN 4.75 4.75 PD 14ksps Sample Rate SLP Bit = 0, Conversion Done SLP Bit = 1, Conversion Done 14ksps Sample Rate SLP Bit = 0, Conversion Done SLP Bit = 1, Conversion Done l l l TYP 5 5 2.3 210 7 11.5 1.05 35 MAX 5.25 5.25 3 350 15 15 1.75 75 UNITS V V mA μA μA mW mW μW 2309f 4 LTC2309 I2C TIMING CHARACTERISTICS SYMBOL fSCL tHD(SDA) tLOW tHIGH tSU(STA) tHD(DAT) tSU(DAT) tr tf tSU(STO) tBUF PARAMETER SCL Clock Frequency Hold Time (Repeated) Start Condition Low Period of the SCL Pin High Period of the SCL Pin Set-Up Time for a Repeated Start Condition Data Hold Time Data Set-Up Time Rise Time for SDA/SCL Signals Fall Time for SDA/SCL Signals Set-Up Time for Stop Condition Bus Free Time Between a Stop and Start Condition The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) CONDITIONS l l l l l l l MIN 0.6 1.3 0.6 0.6 0 100 20 + 0.1CB 20 + 0.1CB 0.6 1.3 TYP MAX 400 0.9 300 300 (Note 12) (Note 12) l l l l UNITS kHz μs μs μs μs μs ns ns ns μs μs ADC TIMING CHARACTERISTICS SYMBOL fSMPL tCONV tACQ tREFWAKE PARAMETER Throughput Rate (Successive Reads) Conversion Time Acquisition Time REFCOMP Wake-Up Time (Note 13) The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) CONDITIONS l MIN l l TYP 1.3 200 (Note 9) (Note 9) CREFCOMP = 10μF CREF = 2.2μF , MAX 14 1.8 240 UNITS ksps μs ns ms Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All voltage values are with respect to ground with AVDD and DVDD wired together (unless otherwise noted). Note 3: When these pin voltages are taken below ground or above VDD, they will be clamped by internal diodes. These products can handle input currents greater than 100mA below ground or above VDD without latchup. Note 4: AVDD = 5V, DVDD = 5V, fSMPL = 14ksps internal reference unless otherwise noted. Note 5: Linearity, offset and full-scale specifications apply for a single-ended analog input with respect to COM. Note 6: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual endpoints of the transfer curve. The deviation is measured from the center of the quantization band. Note 7: Bipolar zero error is the offset voltage measured from –0.5LSB when the output code flickers between 0000 0000 0000 and 1111 1111 1111. Unipolar zero error is the offset voltage measured from +0.5LSB when the output code flickers between 0000 0000 0000 and 0000 0000 0001. Note 8: Full-scale bipolar error is the worst-case of –FS or +FS untrimmed deviation from ideal first and last code transitions and includes the effect of offset error. Unipolar full-scale error is the deviation of the last code transition from ideal and includes the effect of offset error. Note 9: Guaranteed by design, not subject to test. Note 10: All specifications in dB are referred to a full-scale ±2.048V input with a 2.5V reference voltage. Note 11: Full linear bandwidth is defined as the full-scale input frequency at which the SINAD degrades to 60dB or 10 bits of accuracy. Note 12: CB = capacitance of one bus line in pF (10pF ≤ CB ≤ 400pF). Note 13: REFCOMP wake-up time is the time required for the REFCOMP pin to settle within 0.5LSB at 12-bit resolution of its final value after waking up from SLEEP mode. 2309f 5 LTC2309 TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, AVDD = DVDD = 5V, fSMPL = 14ksps, unless otherwise noted. Integral Nonlinearity vs Output Code 1.00 0.75 0.50 DNL (LSB) INL (LSB) 0.25 0 –0.25 –0.50 –0.75 –1.00 0 1024 2048 OUTPUT CODE 2309 G01 Differential Nonlinearity vs Output Code 1.00 0.75 0.50 0.25 0 –0.25 –0.50 –0.75 3072 4096 –1.00 0 1024 2048 OUTPUT CODE 2309 G02 1kHz Sine Wave 8192 Point FFT Plot 0 –20 –40 –60 –80 –100 –120 –140 SNR = 73.4dB SINAD = 73.3dB THD = –88dB MAGNITUDE (dB) 3072 4096 0 1 2 5 4 3 FREQUENCY (kHz) 6 7 2309 G03 Supply Current vs Sampling Frequency 2.5 2.0 1.5 SUPPLY CURRENT (mA) OFFSET ERROR (LSB) 1.0 0.5 0 –0.5 –1.0 –0.5 0 0.1 1 10 SAMPLING FREQUENCY (ksps) 100 3209 G04 Offset Error vs Temperature 4 Full-Scale Error vs Temperature FULL-SCALE ERROR (LSB) 2.0 2 UNIPOLAR 0 BIPOLAR –2 1.5 UNIPOLAR 1.0 0.5 BIPOLAR –4 –2.0 –50 –25 0 75 50 25 TEMPERATURE (°C) 100 125 –6 –50 –25 50 0 75 25 TEMPERATURE (°C) 100 125 2309 G05 2309 G06 Supply Current vs Temperature 3.0 2.8 2.6 SUPPLY CURRENT (mA) 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 –50 –25 50 25 0 75 TEMPERATURE (°C) 100 125 SLEEP CURRENT (μA) 8 10 Sleep Current vs Temperature 1000 900 800 LEAKAGE CURRENT (nA) 700 600 500 400 300 200 100 0 –50 –25 50 0 75 25 TEMPERATURE (°C) 100 125 Analog Input Leakage Current vs Temperature 6 4 CH (ON) CH (OFF) 2 0 –50 –25 50 25 0 75 TEMPERATURE (°C) 100 125 2309 G07 2309 G08 2309 G09 2309f 6 LTC2309 PIN FUNCTIONS CH3-CH7 (Pins 1-5): Channel 3 to Channel 7 Analog Inputs. CH3-CH7 can be configured as single-ended or differential input channels. See the Analog Input Multiplexer section. COM (Pin 6): Common Input. This is the reference point for all single-ended inputs. It must be free of noise and should be connected to ground for unipolar conversions and midway between GND and REFCOMP for bipolar conversions. VREF (Pin 7): 2.5V Reference Output. Bypass to GND with a minimum 2.2μF tantalum capacitor or low ESR ceramic capacitor. The internal reference may be overdriven by an external 2.5V reference at this pin. REFCOMP (Pin 8): Reference Buffer Output. Bypass to GND with a 10μF tantalum and 0.1μF ceramic capacitor in parallel. Nominal output voltage is 4.096V. The internal reference buffer driving this pin is disabled by grounding VREF , allowing REFCOMP to be overdriven by an external source. GND (Pins 9-11, Pins 18-20): Ground. All GND pins must be connected to a solid ground plane. AVDD (Pins 12, 13): 5V Analog Supply. The range of AVDD is 4.75V to 5.25V. Bypass AVDD to GND with a 0.1μF ceramic and a 10μF tantalum capacitor in parallel. AD0 (Pin 14): Chip Address Control Pin. This pin is configured as a three-state (Low, High, Floating) address control bit for the device I2C address. See Table 2 for address selection. AD1 (Pin 15): Chip Address Control Pin. This pin is configured as a three-state (Low, High, Floating) address control bit for the device I2C address. See Table 2 for address selection. SCL (Pin 16): Serial Clock Pin of the I2C Interface. The LTC2309 can only act as a slave and the SCL pin only accepts an external serial clock. Data is shifted into the SDA pin on the rising edges of the SCL clock and output through the SDA pin on the falling edges of the SCL clock. SDA (Pin 17): Bidirectional Serial Data Line of the I2C Interface. In transmitter mode (Read), the conversion result is output at the SDA pin, while in receiver mode (Write), the DIN word is input at the SDA pin to configure the ADC. The pin is high impedance during the data input mode and is an open-drain output (requires an appropriate pull-up device to VCC) during the data output mode. DVDD (Pin 21): 5V Digital Supply. The range of DVDD is 4.75V to 5.25V. Bypass DVDD to GND with a 0.1μF ceramic and a 10μF tantalum capacitor in parallel. CH0-CH2 (Pins 22-24): Channel 0 to Channel 2 Analog Inputs. CH0-CH2 can be configured as single-ended or differential input channels. See the Analog Input Multiplexer section. GND (Pin 25): Exposed Pad Ground. Must be soldered directly to ground plane. 2309f 7 LTC2309 FUNCTIONAL BLOCK DIAGRAM AVDD CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM INTERNAL 2.5V REF VREF ANALOG INPUT MUX DVDD LTC2309 AD1 AD0 + – 12-BIT SAR ADC I2C PORT SCL SDA 8k GAIN = 1.6384x REFCOMP 2308 BD GND TIMING DIAGRAM Definition of Timing for Fast/Standard Mode Devices on the I2C Bus SDA tLOW tf SCL tHD(SDA) S tHD(DAT) tHIGH tSU(STA) Sr tSU(STO) P S 2309 TD tSU(DAT) tr tf tHD(SDA) tSP tBUF tr S = START, Sr = REPEATED START, P = STOP 2309f 8 LTC2309 APPLICATIONS INFORMATION Overview The LTC2309 is a low noise, 8-channel, 12-bit successive approximation register (SAR) A/D converter with an I2C compatible serial interface. The LTC2309 includes a precision internal reference and a configurable 8-channel analog input multiplexer (MUX). The ADC may be configured to accept single-ended or differential signals and can operate in either unipolar or bipolar mode. A sleep mode option is also provided to further reduce power during inactive periods. The LTC2309 communicates through a 2-wire I2C compatible serial interface. Conversions are initiated by signaling a Stop condition after the part has been successfully addressed for a read/write operation. The device will not acknowledge (NAK) an external request until the conversion is finished. After a conversion is finished, the device is ready to accept a read/write request. Once the LTC2309 is addressed for a read operation, the device begins outputting the conversion result under the control of the serial clock (SCL). There is no latency in the conversion result. There are 12 bits of output data followed by 4 trailing zeros. Data is updated on the falling edges of SCL, allowing the user to reliably latch data on the rising edge of SCL. A write operation may follow the read operation by using a Repeat Start or a Stop condition may be given to start a new conversion. By selecting a write operation, the ADC can be programmed with a 6-bit DIN word. The DIN word configures the MUX and programs various modes of operation of the ADC. During a conversion, the internal 12-bit capacitive charge redistribution DAC output is sequenced through a successive approximation algorithm by the SAR starting from the most significant bit (MSB) to the least significant bit (LSB). The sampled input is successively compared with binary weighted charges supplied by the capacitive DAC using a differential comparator. At the end of a conversion, the DAC output balances the analog input. The SAR contents (a 12-bit data word) that represent the sampled analog input are loaded into 12 output latches that allow the data to be shifted out via the I2C interface. Programming the LTC2309 The various modes of operation of the LTC2309 are programmed by a 6-bit DIN word. The SDI input data bits are loaded on the rising edge of SCL during a write operation, with the S/D bit loaded on the first rising edge and the SLP bit on the sixth rising edge (see Figure 8b in the I2C Interface section). The input data word is defined as follows: S/D O/S S1 S0 UNI SLP S/D = SINGLE-ENDED/DIFFERENTIAL BIT O/S = ODD/SIGN BIT S1 = CHANNEL SELECT BIT 1 S0 = CHANNEL SELECT BIT 0 UNI = UNIPOLAR/BIPOLAR BIT SLP = SLEEP MODE BIT Analog Input Multiplexer The analog input MUX is programmed by the S/D, O/S, S1 and S0 bits of the DIN word. Table 1 lists the MUX configurations for all combinations of the configuration bits. Figure 1a shows several possible MUX configurations and Figure 1b shows how the MUX can be reconfigured from one conversion to the next. Driving the Analog Inputs The analog inputs of the LTC2309 are easy to drive. Each of the analog inputs can be used as a single-ended input relative to the COM pin (CH0-COM, CH1-COM, etc.) or in differential input pairs (CH0 and CH1, CH2 and CH3, CH4 and CH5, CH6 and CH7). Figure 2 shows how to drive COM for single-ended inputs in unipolar and bipolar modes. Regardless of the MUX configuration, the “+” and “–“ inputs are sampled at the same instant. Any unwanted signal that is common to both inputs will be reduced by the common mode rejection of the sample-and-hold circuit. The inputs draw only one small current spike while charging the sample-andhold capacitors during the acquire mode. In conversion 2309f 9 LTC2309 APPLICATIONS INFORMATION 4 Differential 8 Single-Ended 1st Conversion 2nd Conversion + (–) – (+) { + (–) – (+) { + (–) – (+) { + (–) – (+) { CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 + + + + + + + + CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM (–) + –{ + –{ CH2 CH3 CH4 CH5 COM (UNUSED) – + + + { { CH2 CH3 CH4 CH5 COM (–) 2328 F01b Figure 1b. Changing the MUX Assignments “On the Fly” Combinations of Differential and Single-Ended + –{ – +{ + + + + CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM (–) 2309 F01a Unipolar Mode Bipolar Mode COM REFCOMP/2 COM + – 2328 F02 Figure 2. Driving COM in Unipolar and Bipolar Modes Figure 1a. Example of MUX Configurations Table 1. Channel Configuration S/D O/S S1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 S0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 2 3 4 5 6 7 COM mode, the analog inputs draw only a small leakage current. If the source impedance of the driving circuit is low, the ADC inputs can be driven directly. Otherwise, more acquisition time should be allowed for a source with higher impedance. Input Filtering + – + – + – + – – + – + – + – + – – – – – – – – The noise and distortion of the input amplifier and other circuitry must be considered since they will add to the ADC noise and distortion. Therefore, noisy input circuitry should be filtered prior to the analog inputs to minimize noise. A simple 1-pole RC filter is sufficient for many applications. The analog inputs of the LTC2309 can be modeled as a 55pF capacitor (CIN) in series with a 100Ω resistor (RON) as shown in Figure 3a. CIN gets switched to the selected input once during each conversion. Large filter RC time constants will slow the settling of the inputs. It is important that the overall RC time constants be short enough to allow the analog inputs to completely settle to 12-bit resolution within the acquisition time (tACQ) if DC accuracy is important. + + + + + + + + 2309f 10 LTC2309 APPLICATIONS INFORMATION When using a filter with a large CFILTER value (e.g. 1μF), the inputs do not completely settle and the capacitive input switching currents are averaged into a net DC current (IDC). In this case, the analog input can be modeled by an equivalent resistance (REQ = 1/(fSMPL • CIN)) in series with an ideal voltage source (VREFCOMP/2) as shown in Figure 3b. The magnitude of the DC current is then approximately IDC = (VIN – VREFCOMP/2)/REQ, which is roughly proportional to VIN. To prevent large DC drops across the resistor RFILTER, a filter with a small resistor and large capacitor should be chosen. When running at the maximum throughput rate of 14ksps, the input current equals 1.5μA at VIN = 4.096V, which amounts to a full-scale error of 0.5LSB when using a filter resistor (RFILTER) of 333Ω. Applications requiring lower sample rates can tolerate a larger filter resistor for the same amount of full-scale error. INPUT CH0-CH7 RON 100Ω LTC2309 CIN 55pF 2309 F03a ANALOG INPUT 50Ω CH0 2000pF COM LTC2309 REFCOMP 0.1μF 10μF 2309 F04a Figure 4a. Optional RC Input Filtering for Single-Ended Input 1000pF 50Ω DIFFERENTIAL ANALOG INPUTS CH0 1000pF 50Ω CH1 1000pF REFCOMP 0.1μF 10μF 2309 F04b LTC2309 RSOURCE VIN Figure 4b. Optional RC Input Filtering for Differential Inputs CFILTER Figure 3a. Analog Input Equivalent Circuit INPUT CH0-CH7 REQ 1/(fSMPL • CIN) LTC2309 self heating and from damage that may occur during soldering. Metal film surface mount resistors are much less susceptible to both problems. Dynamic Performance RFILTER VIN IDC CFILTER + – VREFCOMP/2 2309 F03b Fast Fourier Transform (FFT) test techniques are used to test the ADC’s frequency response, distortion and noise at the rated throughput. By applying a low distortion sine wave and analyzing the digital output using an FFT algorithm, the ADC’s spectral content can be examined for frequencies outside the fundamental. Signal-to-Noise and Distortion Ratio (SINAD) The signal-to-noise and distortion ratio (SINAD) is the ratio between the RMS amplitude of the fundamental input frequency to the RMS amplitude of all other frequency components at the A/D output. The output is band-limited to frequencies from above DC and below half the sampling frequency. Figure 5 shows a typical SINAD of 73.3dB with a 14kHz sampling rate and a 1kHz input. An SNR of 73.4dB can be achieved with the LTC2309. 2309f Figure 3b. Analog Input Equivalent Circuit for Large Filter Capacitances Figures 4a and 4b show examples of input filtering for single-ended and differential inputs. For the singleended case in Figure 4a, a 50Ω source resistor and a 2000pF capacitor to ground on the input will limit the input bandwidth to 1.6MHz. High quality capacitors and resistors should be used in the RC filter since these components can add distortion. NPO and silver mica type dielectric capacitors have excellent linearity. Carbon surface mount resistors can generate distortion from 11 LTC2309 APPLICATIONS INFORMATION 0 –20 –40 –60 –80 –100 –120 –140 0 1 2 4.096V SNR = 73.4dB SINAD = 73.3dB THD = –88dB 2.5V 2.2μF REFCOMP VREF R1 8k BANDGAP REFERENCE MAGNITUDE (dB) REFERENCE AMP 10μF 0.1μF GND 5 4 3 FREQUENCY (kHz) 6 7 R3 LTC2309 2309 F06a R2 2309 G03 Figure 6a. LTC2309 Reference Circuit 5V 0.1μF VIN LT1790A-2.5 VOUT 2.2μF Figure 5. 1kHz Sine Wave 8192 Point FFT Plot Total Harmonic Distortion (THD) Total harmonic distortion (THD) is the ratio of the RMS sum of all harmonics of the input signal to the fundamental itself. The out-of-band harmonics alias into the frequency band between DC and half the sampling frequency(fSMPL/2). THD is expressed as: THD = 20 log V22 + V32 + V42... + VN2 V1 VREF LTC2309 REFCOMP 10μF 0.1μF GND 2309 F06b + Figure 6b. Using the LT®1790A-2.5 as an External Reference where V1 is the RMS amplitude of the fundamental frequency and V2 through VN are the amplitudes of the second through Nth harmonics. Internal Reference The LTC2309 has an on-chip, temperature compensated bandgap reference that is factory trimmed to 2.5V (Refer to Figure 6a). It is internally connected to a reference amplifier and is available at VREF . VREF should be bypassed to GND with a 2.2μF tantalum capacitor to minimize noise. An 8k resistor is in series with the output so that it can be easily overdriven by an external reference if more accuracy and/or lower drift are required as shown in Figure 6b. The reference amplifier gains the VREF voltage by 1.638 to 4.096V at REFCOMP To compensate the reference amplifier, . bypass REFCOMP with a 10μF ceramic or tantalum capacitor in parallel with a 0.1μF ceramic capacitor for best noise performance. Internal Conversion Clock The internal conversion clock is factory trimmed to achieve a typical conversion time (tCONV) of 1.3μs and a maximum conversion time of 1.8μs over the full operating temperature range. I2C Interface The LTC2309 communicates through an I2C interface. The I2C interface is a 2-wire open-drain interface supporting multiple devices and multiple masters on a single bus. The connected devices can only pull the serial data line (SDA) low and can never drive it high. SDA is required to be externally connected to the supply through a pull-up resistor. When the data line is not being driven low, it is high. Data on the I2C bus can be transferred at rates up to 100kbits/s in the standard mode and up to 400kbits/s in the fast mode. 2309f 12 LTC2309 APPLICATIONS INFORMATION Each device on the I2C bus is recognized by a unique address stored in the device and can only operate either as a transmitter or receiver, depending on the function of the device. A device can also be considered as a master or a slave when performing data transfers. A master is the device which initiates a data transfer on the bus and generates the clock signals to permit the transfer. Devices addressed by the master are considered slaves. The LTC2309 can only be addressed as a slave (see Table 2). Once addressed, it can receive configuration bits (DIN word) or transmit the last conversion result. The serial clock line (SCL) is always an input to the LTC2309 and the serial data line (SDA) is bidirectional. The device supports the standard mode and the fast mode for data transfer speeds up to 400kbits/s (see Timing Diagram section for definition of the I2C timing). The Start and Stop Conditions Referring to Figure 7, a Start (S) condition is generated by transitioning SDA from high to low while SCL is high. The bus is considered to be busy after the Start condition. When the data transfer is finished, a Stop (P) condition is generated by transitioning SDA from low to high while SCL is high. The bus is free after a Stop condition is generated. Start and Stop conditions are always generated by the master. When the bus is in use, it stays busy if a Repeated Start (Sr) is generated instead of a Stop condition. The Repeated Start timing is functionally identical to the Start and is used for writing and reading from the device before the initiation of a new conversion. Start Condition SDA SDA Data Transferring After the Start condition, the I2C bus is busy and data transfer can begin between the master and the addressed slave. Data is transferred over the bus in groups of nine bits, one byte followed by one acknowledge (ACK) bit. The master releases the SDA line during the ninth SCL clock cycle. The slave device can issue an ACK by pulling SDA low or issue a Not Acknowledge (NAK) by leaving the SDA line high impedance (the external pull-up resistor will hold the line high). Change of data only occurs while the SCL line is low. Data Format After a Start condition, the master sends a 7-bit address followed by a read/write (R/W) bit. The R/W bit is 1 for a read request and 0 for a write request. If the 7-bit address matches one of the LTC2309’s 9 pin-selectable addresses, the ADC is selected. When the ADC is addressed during a conversion, it will not acknowledge R/W requests and will issue a NAK by leaving the SDA line high. If the conversion is complete, the LTC2309 issues an ACK by pulling the SDA line low. The LTC2309 has two registers. The 12-bit wide output register contains the last conversion result. The 6-bit wide input register configures the input MUX and the operating mode of the ADC. Output Data Format The output register contains the last conversion result. After each conversion is completed, the device automatically enters either nap or sleep mode depending on the setting of the SLP bit (see Nap Mode and Sleep Mode sections). When the LTC2309 is addressed for a read operation, it acknowledges by pulling SDA low and acts as a transmitter. The master/receiver can read up to two bytes from the LTC2309. After a complete read operation of 2 bytes, a Stop condition is needed to initiate a new conversion. The device will NAK subsequent read operations while a conversion is being performed. Stop Condition S SCL P 2309 F07 SCL Figure 7. Timing Diagrams of Start and Stop Conditions 2309f 13 LTC2309 APPLICATIONS INFORMATION The data output stream is 16 bits long and is shifted out on the falling edges of SCL (see Figure 8a). The first bit is the MSB and the 12th bit is the LSB of the conversion result. The remaining four bits are zero. Figures 14 and 15 are the transfer characteristics for the bipolar and unipolar modes. Data is output on the SDA line in 2’s complement format for bipolar readings or in straight binary for unipolar readings. Input Data Format When the LTC2309 is addressed for a write operation, it acknowledges by pulling SDA low during the low period before the 9th cycle and acts as a receiver. The master/transmitter can then send 1 byte to program the device. The input byte consists of the 6-bit DIN word followed by two bits that are ignored by the ADC and are considered don’t cares (X) (see Figure 8b). The input bits are latched on the rising edge of SCL during the write operation. 1 2 3 4 5 6 7 8 9 1 SCL 2 3 4 5 6 7 8 9 ••• SDA START BY MASTER A6 A5 A4 A3 A2 A1 A0 R/W ACK BY ADC B11 B10 B9 B8 B7 B6 B5 B4 ••• ACK BY MASTER MOST SIGNIFICANT DATA BYTE READ 1 BYTE 1 2 3 4 5 6 7 8 ADDRESS FRAME 9 SCL (CONTINUED) ••• CONVERSION INITIATED SDA (CONTINUED) ••• B3 B2 B1 B0 NAK BY MASTER STOP BY MASTER LEAST SIGNIFICANT DATA BYTE READ 1 BYTE 2309 F08a Figure 8a. Timing Diagram for Reading from the LTC2309 1 SCL 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 CONVERSION INITIATED SDA START BY MASTER ADDRESS FRAME A6 A5 A4 A3 A2 A1 A0 R/W ACK BY ADC S/D O/S S1 S0 UNI SLP X X ACK BY ADC 2309 F08b STOP BY MASTER DIN WORD WRITE 1 BYTE Figure 8b. Timing Diagram for Writing to the LTC2309 2309f 14 LTC2309 APPLICATIONS INFORMATION After power-up, the ADC initiates an internal reset cycle which sets the DIN word to all 0s (S/D = O/S = S0 = S1 = UNI = SLP = 0). A write operation may be performed if the default state of the ADC’s configuration is not desired. Otherwise, the ADC must be properly addressed and followed by a Stop condition to initiate a conversion. Initiating a New Conversion The LTC2309 awakens from either nap or sleep when properly addressed for a read/write operation. A Stop command may then be issued after performing the read/write operation to trigger a new conversion. Issuing a Stop command after the 8th SCL clock pulse of the address frame and before the completion of a read/write operation will also initiate new conversion, but the output result may not be valid due to lack of adequate acquisition time (see Acquisition section). LTC2309 Address The LTC2309 has two address pins (AD0 and AD1) that may be tied high, low, or left floating to enable one of 9 possible addresses (see Table 2). In addition to the configurable addresses listed in Table 2, the LTC2309 also contains a global address (1110111) which may be used for synchronizing multiple LTC2309s or other I2C LTC230X SAR ADCs (see Synchronizing Multiple LTC2309s with Global Address Call section). S 7-BIT ADDRESS CONVERSION NAP R ACK READ P DATA OUTPUT Table 2. Address Assignment AD1 LOW LOW LOW FLOAT FLOAT FLOAT HIGH HIGH HIGH AD0 LOW FLOAT HIGH HIGH FLOAT LOW LOW FLOAT HIGH ADDRESS 0001000 0001001 0001010 0001011 0011000 0011001 0011010 0011011 0101000 Continuous Read In applications where the same input channel is sampled each cycle, conversions can be continuously performed and read without a write cycle (see Figure 9). The DIN word remains unchanged from the last value written into the device. If the device has not been written to since power-up, the DIN word defaults to all 0s (S/D = O/S = S0 = S1 = UNI = SLP = 0). At the end of a read operation, a Stop condition may be given to start a new conversion. At the conclusion of the conversion cycle, the next result may be read using the method described above. If the conversion cycle is not concluded and a valid address selects the device, the LTC2309 generates a NAK signal indicating the conversion cycle is in progress. S 7-BIT ADDRESS NAP R ACK READ P DATA OUTPUT CONVERSION 2309 F09 CONVERSION Figure 9. Consecutive Reading with the Same Configuration 2309f 15 LTC2309 APPLICATIONS INFORMATION Continuous Read/Write Once the conversion cycle is complete, the LTC2309 can be written to and then read from using the Repeated Start (Sr) command. Figure 10 shows a cycle which begins with a data Write, a repeated Start, followed by a Read and concluded with a Stop command. The following conversion begins after all 16 bits are read out of the device or after a Stop command. The following conversion will be performed using the newly programmed data. Synchronizing Multiple LTC2309s with a Global Address Call In applications where several LTC2309s or other I2C SAR ADCs from Linear Technology Corporation are used on the same I2C bus, all converters can be synchronized through the use of a global address call. Prior to issuing the global address call, all converters must have completed a conversion cycle. The master then issues a Start, followed by the global address 1110111, and a write request. All converters will be selected and acknowledge the request. The master then sends a write byte (optional) followed by the Stop command. This will update the channel selection (optional) and simultaneously initiate a conversion for all ADCs on the bus (see Figure 11). In order to synchronize multiple converters without changing the channel, a Stop command may be issued after acknowledgement of the global write command. Global read commands are not allowed and the converters will NAK a global read request. S 7-BIT ADDRESS W ACK WRITE Sr 7-BIT ADDRESS CONVERSION NAP DATA OUTPUT CONVERSION R ACK READ P DATA OUTPUT CONVERSION 2309 F10 Figure 10. Write, Read, Start Conversion SCL SDA LTC2309 LTC2309 LTC2309 S GLOBAL ADDRESS W ACK WRITE (OPTIONAL) P CONVERSION NAP DATA OUTPUT CONVERSION OF ALL LTC2309s 2309 F11 Figure 11. Syncrhonous Multiple LTC2309s with a Global Address Call 2309f 16 LTC2309 APPLICATIONS INFORMATION Nap Mode The ADC enters nap mode after a conversion is complete (tCONV) if the SLP bit is set to a logic 0. The supply current decreases to 210μA in nap mode between conversions, thereby reducing the average power dissipation as the sample rate decreases. For example, the LTC2309 draws an average of 300μA at a 1ksps sampling rate. The LTC2309 keeps only the reference (VREF) and reference buffer (REFCOMP) circuitry active when in nap mode. Sleep Mode The ADC enters sleep mode after a conversion is complete (tCONV) if the SLP bit is set to a logic 1. The ADC draws only 7μA in sleep mode, provided that none of the digital inputs are switching. When the LTC2309 is properly addressed, the ADC is released from sleep mode and requires 200ms (tREFWAKE) to wake up and charge the respective 2.2μF and 10μF bypass capacitors on the VREF and REFCOMP pins. A new conversion should not be initiated before this time as shown in Figure 12. Acquisition The LTC2309 begins acquiring the input signal at different instances depending on whether a read or write operation is being performed. If a read operation is being performed, acquisition of the input signal begins on the rising edge of the 9th clock pulse following the address frame as shown in Figure 13a. If a write operation is being performed, acquisition of the input signal begins on the falling edge of the sixth clock cycle after the DIN word has been shifted in as shown in Figure 13b. The LTC2309 will acquire the signal from the input channel that was most recently programmed by the DIN word. A minimum of 240ns is required to acquire the input signal before initiating a new conversion. S 7-BIT ADDRESS R/W ACK CONVERSION SLEEP tREFWAKE P CONVERSION 2309 F12 Figure 12. Exiting Sleep Mode and Starting a New Conversion 1 SCL ACQUISITION BEGINS SDA A6 A5 A4 A3 A2 A1 A0 R/W tACQ B11 B10 2309 F13a 2 3 4 5 6 7 8 9 1 2 Figure 13a. Timing Diagram Showing Acquisition During a Read Operation 5 SCL ACQUISITION BEGINS SDA A2 A1 A0 R/W S/D O/S S1 S0 UNI SLP X X tACQ 2309 F13b 6 7 8 9 1 2 3 4 5 6 7 8 9 Figure 13b. Timing Diagram Showing Acquisition During a Write Operation 2309f 17 LTC2309 APPLICATIONS INFORMATION OUTPUT CODE (TWO’S COMPLEMENT) 011...111 011...110 BIPOLAR ZERO OUTPUT CODE 111...111 111...110 000...001 000...000 111...111 111...110 FS = 4.096V 1LSB = FS/212 1LSB = 1mV –FS/2 –1 0V 1 LSB LSB INPUT VOLTAGE (V) FS/2 – 1LSB 2309 F14 100...001 100...000 011...111 UNIPOLAR ZERO 011...110 100...001 100...000 000...001 000...000 0V FS = 4.096V 1LSB = FS/212 1LSB = 1mV FS – 1LSB INPUT VOLTAGE (V) 2309 F15 Figure 14. Bipolar Transfer Characteristics (2’s Complement) Figure 15. Unipolar Transfer Characteristics (Straight Binary) Board Layout and Bypassing To obtain the best performance, a printed circuit board with a solid ground plane is required. Layout for the printed board should ensure digital and analog signal lines are separated as much as possible. Care should be taken not to run any digital signals alongside an analog signal. All analog inputs should be shielded by GND. VREF , REFCOMP and AVDD should be bypassed to the ground plane as close to the pin as possible. Maintaining a low impedance path for the common return of these bypass capacitors is essential to the low noise operation of the ADC. These traces should be as wide as possible. See Figure 16 for a suggested layout. Figure 16. Suggested Layout 2309f 18 LTC2309 PACKAGE DESCRIPTION UF Package 24-Lead Plastic QFN (4mm × 4mm) (Reference LTC DWG # 05-08-1697) 0.70 ±0.05 4.50 ± 0.05 2.45 ± 0.05 3.10 ± 0.05 (4 SIDES) PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS BOTTOM VIEW—EXPOSED PAD 0.75 ± 0.05 R = 0.115 TYP PIN 1 NOTCH R = 0.20 TYP OR 0.35 45° CHAMFER 4.00 ± 0.10 (4 SIDES) PIN 1 TOP MARK (NOTE 6) 23 24 0.40 ± 0.10 1 2 2.45 ± 0.10 (4-SIDES) (UF24) QFN 0105 0.200 REF 0.00 – 0.05 NOTE: 1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.25 ± 0.05 0.50 BSC 2309f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19 LTC2309 TYPICAL APPLICATION Driving the LTC2309 with ±10V Input Signals Using a Precision Attenuator 5V 0.1μF IN OUT LT1790-2.5 GND 10V 7 8 50k 450k 10μF 0.1μF 10μF 0.1μF 5V 1μF 450k 2 150k ±10V INPUT SIGNAL 3 50k LT1991 4 –10V 4pF 5 RELATED PARTS PART NUMBER LTC1417 LTC1468/LTC1469 LTC1609 LTC1790 LTC1850/LTC1851 LTC1852/LTC1853 LTC1860/LTC1861 LTC1863/LTC1867 LTC1864/LTC1865 LTC2302/LTC2306 LTC2308 LTC2453 LTC2487/LTC2489/ LTC2493 LTC2495/LTC2497/ LTC2499 DESCRIPTION 14-Bit, 400ksps Serial ADC Single/Dual 90MHz, 22V/μs, 16-bit Accurate Op Amps 16-Bit, 200ksps Serial ADC Micropower Low Dropout Reference 10-Bit/12-Bit, 8-channel, 1.25Msps ADCs 10-Bit/12-Bit, 8-channel, 400ksps ADCs 12-Bit, 1-/2-Channel 250ksps ADCs in MSOP 12-/16-Bit, 8-Channel 200ksps ADCs 16-Bit, 1-/2-Channel 250ksps ADCs in MSOP 12-Bit, 1-/2-Channel 500ksps SPI ADCs in 3mm × 3mm DFN 12-Bit, 8-Channel 500ksps SPI ADC Easy-to-Use, Ultra-Tiny 16-bit I2C Delta Sigma ADC 2-/4-Channel Easy Drive I2C Delta Sigma ADCs 8-/16-Channel Easy Drive I2C Delta Sigma ADCs COMMENTS 20mW, Unipolar or Bipolar, Internal Reference, SSOP-16 Package Low Input Offset: 75μV/125μV 65mW, Configurable Bipolar and Unipolar Input Ranges, 5V Supply 60μA Supply Current, 10ppm/°C, SOT-23 Package Parallel Output, Programmable MUX and Sequencer, 5V Supply Parallel Output, Programmable MUX and Sequencer, 3V or 5V Supply 850μA at 250ksps, 2μA at 1ksps, SO-8 and MSOP packages 450μA at 150ksps, 10μA at 1ksps, SO-8 and MSOP packages 6.5mW, Unipolar or Bipolar, Internal Reference, SSOP-16 Package 2mW, Unipolar or Bipolar, Internal Reference, SSOP-16 Package 850μA at 250ksps, 2μA at 1ksps, SO-8 and MSOP Packages 450μA at 150ksps, 10μA at 1ksps, SO-8 and MSOP Packages 14mW at 500ksps, Single 5V Supply, Software Compatible with LTC2308 5V, Internal Reference, 4mm × 4mm QFN Package, Software Compatible with LTC2302/LTC2306 2LSB INL, 50nA Sleep Current, 60Hz Output Rate, 3mm × 2mm DFN Package 16-/24-Bits, PGA and Temperature Sensor, 15Hz Output Rate, 4mm × 3mm DFN Packages 16-/24-Bits, PGA and Temperature Sensor, 15Hz Output Rate, 5mm × 7mm QFN Packages 2309f LT 0208 • PRINTED IN USA LTC1860L/LTC1861L 3V, 12-bit, 1-/2-Channel 150ksps ADCs LTC1863L/LTC1867L 3V, 12-/16-bit, 8-Channel 175ksps ADCs LTC1864L/LTC1865L 3V, 16-Bit, 1-/2-Channel 150ksps ADCs in MSOP 20 Linear Technology Corporation (408) 432-1900 ● 1630 McCarthy Blvd., Milpitas, CA 95035-7417 FAX: (408) 434-0507 ● www.linear.com © LINEAR TECHNOLOGY CORPORATION 2008 + 1 450k – LT1991 9 150k 10 4pF 6 100Ω 47pF CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM ANALOG INPUT MUX AVDD DVDD LTC2309 AD1 AD0 1.7k 1.7k 450k + – SCL 12-BIT SAR ADC I2C PORT SDA CONTROL LOGIC (FPGA, CPLD, DSP ETC) , INTERNAL 2.5V REF VREF 2.2μF REFCOMP GND 0.1μF 10μF 2309 TA02