MX25L6402AMI-40

MX25L6402A Macronix NBit TM M emory Family 64M-BIT [x 1] CMOS SERIAL eLite FlashTM MEMORY FEATURES GENERAL • 67,108,864 x 1 bit structure • 128 Equal Sectors with 64K byte each - Any sector can be erased • Single Power Supply Operation - 2.7 to 3.6 volt for read, erase, and program operations • Latch-up protected to 100mA from -1V to Vcc +1V • Low Vcc write inhibit is equal to or less than 2.2V PERFORMANCE • Auto Erase and Auto Program Algorithm - Automatically erases and verifies data at selected sector - Automatically programs and verifies data at selected page by an internal algroithm that automatically times the program pulse widths (Any page to be programed should have page in the erased state first) • Status Register Feature - Provides detection of program and erase operation • High Performance - Fast access time: 25MHz serial clock (50pF + 1TTL Load) - Fast program time: 2ms/page (typical, 128-byte per page) - Fast erase time: 2s/sector (typical, 64K-byte per sector) - Acceleration mode: - Program time: 1.6ms/page (typical) - Erase time: 1.6s/sector (typical) Low Power Consumption - Low active read current: 24mA (typical) at 25MHz - Low active programming current: 35mA (typical) - Low active erase current: 35mA (typical) - Low standby current: 5uA (typical, CMOS) Minimum 100 erase/program cycle completion. - Provides auto erase/ program error report - Provides detection of parallel mode (for production throughputs increasing) HARDWARE FEATURES • SCLK Input - Serial clock input • SI Input - Serial Data Input • SO/PO7 Output - Serial Data Output/Parallel mode PO7 output • ACC Pin - Program/erase acceleration • RESET# Pin - to reset • PO0~PO6 Output - for parallel mode • PACKAGE - 28-pin SOP (330mil) • • SOFTWARE FEATURES • Input Data Format - 1-byte Command code, 3-byte address, 1-byte byte address P/N: PM1040 REV. 1.0, SEP. 29, 2004 1 MX25L6402A GENERAL DESCRIPTION The MX25L6402A is a CMOS 67,108,864 bit serial eLite FlashTM Memory, which is configured as 8,388,608 x 8 internally. The MX25L6402A features a serial peripheral interface and software protocol allowing operation on a simple 3- wire bus. The three bus signals are a clock input (SCLK), a serial data input (SI), and a serial data output (SO). SPI access to the device is enabled by CS# input. The MX25L6402A provide sequential read operation on whole chip. User may start to read from any byte of the array. While the end of the array is reached, the device will wrap around to the beginning of the array and continuously outputs data until CS# goes high. After program/erase command is issued, auto program/ erase algorithms which program/erase and verify the specified page locations will be executed. Program command is executed on a page (128 bytes) basis, and erase command is executed on both chip and sector (64K bytes) basis. To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read command can be issued to detect completion and error flag status of a program or erase operation. To increase user's factory throughputs, a parallel mode is provided. The performance of read/program is dramatically improved than serial mode. When the device is not in operation and CS# is high, it is put in standby mode and draws less than 5uA DC current. The MX25L6402A utilizes MXIC's proprietary memory cell which reliably stores memory contents even after 100 program and erase cycles. PIN CONFIGURATIONS 28-PIN SOP (330 mil) NC DU RESET# NC NC NC NC NC NC NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 PO6 GND VCC PO5 PO4 PO3 SI SO/PO7 CS# SCLK ACC PO2 PO1 PO0 PIN DESCRIPTION SYMBOL CS# SI SO/PO7 SCLK ACC VCC GND DU(1) NC PO0~PO6 RESET# DESCRIPTION Chip Select Serial Data Input Serial Data Output/Paralled Data Output Clock Input 12V for program/erase acceleration + 3.3V Power Supply Ground Do Not Use(for Test Mode only) No Internal Connection Parallel data output (PO0~PO6 can be connected to NC in serial mode) Reset MX25L6402A Note: 1.DU pin is used for in-house testing and can be tied to VCC, GND or open for normal operation. There is a weak pull-up resister from VCC to DU pin. P/N: PM1040 2 REV. 1.0, SEP. 29, 2004 MX25L6402A BLOCK DIAGRAM Address Generator X-Decoder Memory Array SI Data Register Y-Decoder SRAM Buffer Sense Amplifier HV Generator SO Output Buffer CS#, ACC, RESET# Mode Logic State Machine SCLK Clock Generator P/N: PM1040 3 REV. 1.0, SEP. 29, 2004 MX25L6402A COMMAND DEFINITION Command (byte) 1st 2nd 3rd 4th 5th 6th 7th 8th 9th Action 52H AD1 AD2 AD3 BA X X X X n bytes read out until CS goes high Output status byte until CS goes high Clear status byte Output vendor code until CS goes high Start to erase at CS rising edge Start to erase at CS rising edge Load n bytes data to buffer until CS goes high & start to program Enter and stay in parallel mode until power off 83H X 89H 85H X F1H AD1 AD2 F4H X X F2H AD1 AD2 AD3 BA 55H Read Array Status Read Clear Status Read ID Sector Erase Chip Erase Page Program Parallel Mode Note: 1.X is dummy cycle and is necessary 2.AD1 to AD3 are address input data 3.BA is byte address 1-byte command code Bit7(MSB) Bit6 3-byte address(0 to 0FFFH) AD1: X X AD2: A16 A15 AD3: X X 1-byte byte address(0 to 7FH) BA: X A6 Note: A22 to A16=Sector address Bit5 A22 A14 X A5 Bit4 A21 A13 X A4 Bit3 A20 A12 X A3 Bit2 A19 A11 X A2 Bit1 A18 A10 A8 A1 Bit0 A17 A9 A7 A0 P/N: PM1040 4 REV. 1.0, SEP. 29, 2004 MX25L6402A DEVICE OPERATION 1.Before a command is issued, status register should be checked to ensure device is ready for the intended operation. 2.When incorrect command is inputted to this LSI, this LSI becomes standby mode and keeps the standby mode until next CS falling edge. In standby mode, SO pin of this LSI should be High-Z. 3.When correct command is inputted to this LSI, this LSI becomes active mode and keeps the active mode until next CS rising edge. COMMAND DESCRIPTION (1) Read Array This command is sent with the 4-byte address (command included), and the byte address, followed by four dummy bytes sent to give the device time to stabilize. The device will then send out data starting at the byte address until CS goes high. The clock to clock out the data is supplied by the master SPI. The read operation is executed on whole array. If the end of the array is reached then the device will wrap around to the beginning of the array. (2) Read Status Register When this command is sent, the device will continuously send out the status register contents starting at bit7. The clock to clock out the data is supplied by the master SPI. bit7 program/erase completion Note1 bit6 parallel mode 1=in parallel 0=not in parallel mode bit5 NA bit4 erase error 1=error bit3 program error 1=error bit2 NA bit1 NA bit0 ready/busy 1=ready 0=busy Bit 6,5,2,1 = Reserve for future use. Bit 4 = "1" -----> There is an error occurred in last erase operation. = "0" -----> There is no error occurred in last erase operation. Bit 3 = "1" -----> There is an error occurred in last program operation. = "0" -----> There is no error occurred in last program operation. Bit 0 ="1" -----> Device is in ready mode. ="0" -----> Device is in busy mode. Note 1: The initial value of Bit7 is "1". Bit7 will have "1" to "0" transit only after program/erase operation is completed. Bit7 will shift from "0" to "1" only after issued program/erase/Clear status register command. Please note the Bit7=0 if program/ erase fail. Note 2: The value of Bit 0 is "1", no matter the result of program/erase is pass or fail. (3) Clear Status Register This command only resets erase error bit (bit 4) and program error bit (bit 3) . These two bits are set by on-chip state machine during program/erase operation, and can only be reset by issuing a clear status register command or by powering down VCC . If status register indicates that error occurred in the last program/erase operation, any further program/erase operation will be prohibited until status register is cleared. (4) Read ID This command is sent with an extra dummy byte( 2-byte command). The device will clock out manufacturer code (C2H) and device code (9CH) when this command is issued. The clock to clock out the data is supplied by the master SPI. P/N: PM1040 REV. 1.0, SEP. 29, 2004 5 MX25L6402A (5) Sector/Chip Erase This command is sent with the sector address(A22~A16) when operating Sector Erase. The device will start the erase sequence after CS# goes high without any further input. A sector should be erased in a typical of 2sec. The average current is less than 26mA. The chip erase operation does not require the sector address input but two extra dummy bytes are necessary. During this operation, customer can also access Read Status & Read ID operations. (6) Page Program This command is sent with the page number(A22~A7), and 128-byte page address(A6~A0), followed by programming data. The 128-byte page address (A6-A0) must start from 0. One to 128 bytes of data can be loaded into the buffer of the device until CS# goes high. If the end of the page is reached, then the device will wrap around to the beginning of the page. The device will program the specified page with buffered data(Until CS# goes high) without any further input. The typical page program time is 2mS. The average current is less than 26mA. During this operation, customer can also access Read Status & Read ID operations. (7) Standby Mode When CS# is high and there is no operation in progress, the device is put in standby mode. Typical standby current is less than 5uA. (8) Parallel Mode (Highly recommended for production throughputs increasing) The parallel mode provides 8 bit outputs for increasing throughputs of factory production purpose. The parallel mode requires 55H command code, after writing the parallel mode command and then CS# going high, after that, the eLite FlashTM Memory can be available to accept read/program/read status/read ID command as the normal writing command procedure. The eLite FlashTM Memory will be in parallel mode until VCC power-off. a. Only effective for Read Array, Read Status, Read ID & Page Program write data period. (refer to page 16,18,21,23) b. For normal write command (by SI), No effect c.Under parallel mode, the fastest access clock freq. will be changed to 1.25MHz(SCLK pin clock freq.) d. For parallel mode, the tAA will be change to 50ns. POWER-ON STATE After power-up, the device is placed in the standby state with following status: The status register is reset with following status : Bit 7 = "1" -----> Refer to page 5 for detail. Bit 6 = "0" -----> Device is not in parallel mode. Bit 5,2,1 = Reserve for future use. Bit 4 = "0" -----> Erase error flag is reset. Bit 3 = "0" -----> Program error flag is reset. Bit 0="1" -----> Device is in ready state. P/N: PM1040 6 REV. 1.0, SEP. 29, 2004 MX25L6402A RESET OPERATION The RESET# pin provides a hardware method of resetting the device to reading array data. When the RESET# pin is driven low for at least a period of tRP, the device immediately terminates any operation in progress, tri-states all output pins, and ignores all commands for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity. Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS + 0.3V, the device draws reset current (ICC4). If RESET# is held at VIL but not within VSS + 0.3V, the reset current will be greater. The RESET# pin may be tied to system reset circuitry. A system reset would that also reset the SPI memory. Refer to the AC Characteristics tables for RESET# parameters. DATA SEQUENCE Output data is serially sent out through SO pin, synchronized with the rising edge of SCLK, whereas input data is serially read in through SI pin, synchronized with the rising edge of SCLK. The bit sequence for both input and output data is bit 7 (MSB) first, then bit 6, bit 5, ...., and bit 0.(LSB) ADDRESS SEQUENCE The address assignment is described as follows : BA: Byte address Bit sequence: AD1:First Address Bit sequence: AD2:Second Address Bit sequence: AD3:Thrid Address Bit sequence: X X A16 X A6 X A15 X A5 A22 A14 X A4 A21 A13 X A3 A20 A12 X A2 A19 A11 X A1 A18 A10 A8 A0 A17 A9 A7 P/N: PM1040 7 REV. 1.0, SEP. 29, 2004 MX25L6402A Auto Page Program Flow Chart Auto Chip Erase Flow Chart START START F2H F4H Set Chip Erase AD1 Dummy Command. AD2 Set Page Program Command. Dummy AD3 83H Set Read Status Register Command. BA Dummy Data are written (Until CS goes high) Read Status Register NO 83H Set Read Status Register Command. Dummy Bit 7= 0? YES Read Status Register Bit 4 = 0? NO YES Bit7 = 0? NO Chip Erase Completed YES Erase Error NO NO Bit3 = 0? Operation Done, Device stays at Read Status Register Mode until CS goes high. To Continue Other Operation, Do Clear Status Register Command First YES Pgae Program Completed Program Error YES Program Another Page NO Operation Done, Device stays at Read Status Register Mode until CS goes high. To Continue Other Operation, Do Clear Status Register Command First. P/N: PM1040 8 REV. 1.0, SEP. 29, 2004 MX25L6402A Auto Sector Erase Flow Chart Parallel Mode for Read/Program Flow Chart START START F1H 55H Set Sector Eraes AD1 Command. Auto Page Program, Read, Read ID or Read Status AD2 83H Set Read Status Register Command. Dummy Power-off to exit Read Status Register Bit7 = 0? NO YES NO Bit4 = 0? YES Sector Erase Completed Erase Error YES Erase Another Sector ? To Continue Other Operation, Do Clear Status Register Command First. NO Operation Done, Device stays at Read Status Register Mode until CS goes high. P/N: PM1040 9 REV. 1.0, SEP. 29, 2004 MX25L6402A ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS RATING Ambient Operating Temperature Storage Temperature Applied Input Voltage Applied Output Voltage VALUE 0° C to 70° C for Commercial grade -40° C to 85° C for Industrial grade -55° C to 125° C -0.5V to 4.6V -0.5V to 4.6V 3.During voltage transitions, all pins may overshoot to 4.6V or -0.5V for period up to 20ns. 4.All input and output pins may overshoot to VCC+0.5V while VCC+0.5V is smaller than or equal to 4.6V. NOTICE: 1.Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is stress rating only and functional operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. 2.Specifications contained within the following tables are subject to change. VCC to Ground Potential -0.5V to 4.6V Maximum Negative Overshoot Waveform 20ns Maximum Positive Overshoot Waveform 0V -0.5V 4.6V 3.6V 20ns CAPACITANCE TA = 25° C, f = 1.0 MHz SYMBOL CIN COUT PARAMETER Input Capacitance Output Capacitance MIN. TYP MAX. 10 10 UNIT pF pF CONDITIONS VIN = 0V VOUT = 0V P/N: PM1040 10 REV. 1.0, SEP. 29, 2004 MX25L6402A INPUT TEST WAVEFORMS AND MEASURESMENT LEVEL 3.0V 1.5V AC Measurement Level 0V Note:Input pulse rise and fall time are < 10ns OUTPUT LOADING DEVICE UNDER TEST 2.7K ohm +3.3V CL 6.2K ohm DIODES=IN3064 OR EQUIVALENT CL=50pF Including jig capacitance P/N: PM1040 11 REV. 1.0, SEP. 29, 2004 MX25L6402A DC CHARACTERISTICS (Temperature = -40° C to 85° C for Industrial grade, VCC = 2.7V ~ 3.6V) (Temperature = 0° C to 70° C for Commercial grade, VCC = 2.7V ~ 3.6V) SYMBOL PARAMETER ILI ILO ISB1 ISB2 ICC1 ICC2 ICC3 ICC4 VHH VIL VIH VOL VOH Input Load Current Output Leakage Current VCC Standby Current(CMOS) VCC Standby Current(TTL) VCC Read VCC Program Current VCC Erase Current VCC Reset Current Voltage for ACC Program Acceleration Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage 0.8VCC -0.5 0.7VCC 0.3VCC VCC+0.5 0.4 V V V V IOL = 500uA, VCC=2/3 x VCC IOH = -100uA, VCC=VCC min. 1 1 1 11.5 35 5 70 50 12.5 mA uA V Erase in Progress RESET# = GND ± 0.3V VCC=3.0V~3.6V 1 1 24 35 29 60 mA mA 1 3 mA 1 5 50 uA 1 ± 10 uA NOTES 1,3 MIN. TYP MAX. ±2 UNITS uA TEST CONDITIONS VCC = VCC Max VIN = VCC or GND VCC = VCC Max VIN = VCC or GND VCC = VCC Max CS# = VCC ± 0.2V VCC = VCC Max CS# = VIH f=25MHz (serial) f=1.25MHz (parallel) Program in Progress NOTES: 1. Typical values at VCC = 3.3V, T = 25° C. These currents are valid for all product versions (package and speeds). 2. Typical value is calculated by simulation. 3. For the DU pin only, the maximum input load current is ±5uA when DU pin=VIL (there is weak pull-up resistor from VCC to DU pin.) P/N: PM1040 12 REV. 1.0, SEP. 29, 2004 MX25L6402A AC CHARACTERISTICS (Temperature = -40° C to 85° C for Industrial grade, VCC = 2.7V ~ 3.6V) SYMBOL fSCLK tCYC tSKH tSKL tR tF tCSA tCSB tCSH tCSR tCSF tCSHR tRP tRST tRFT tDS tDH tAA tDOH tDOZ PARAMETER Clock Frequency Clock Cycle Time Clock High Time Clock Low Time Clock Rise Time Clock Fall Time CS# Lead Clock Time CS# Lag Clock Time CS# High Time CS# Rise Time CS# Fall Time RESET# High Time to Write Command Valid RESET# Pulse Width RESET# Rise Time RESET# Fall Time SI Setup Time SI Hold Time Access Time SO Hold Time SO Floating Time 5 20 Serial Parallel 5 0 30 50 20 500 500 100 100 Min. Serial Parallel Serial Parallel Serial Parallel Serial Parallel Serial Parallel Serial Parallel Typ. Max. 25 1.25 Units MHz MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns us us ns ns ns ns ns ns (Temperature = 0° C to 70° C for Commercial grade, VCC = 2.7V ~ 3.6V) Condition 40 800 20 400 20 150 5 100 5 100 40 40 80 50 50 f=25MHz f=1.25MHz f=25MHz f=1.25MHz NOTES: 1. Typical value is calculated by simulation. P/N: PM1040 13 REV. 1.0, SEP. 29, 2004 MX25L6402A SERIAL DATA INPUT/OUTPUT TIMING tCSB tCSA tCYC tCSH CS# SCLK tSKH tSKL SI BIT 7 BIT 0 tDH tDS SO tAA BIT 7 tDOH BIT 0 tDOZ P/N: PM1040 14 REV. 1.0, SEP. 29, 2004 MX25L6402A STANDBY TIMING WAVEFORM CS# SCLK SI SO Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit1 Bit 0 Hi-Z 1st byte When incorrect command is inputted to this LSI, this LSI becomes standby mode and keeps the standby mode until next CS# falling edge. In standby mode, SO pin of this LSI should be High-Z. While CS#=VIH, current=standby current, while CS#=VIL and commands are issuing, or commands are invalid, current=24mA(typ.) to 29mA(max.). RESET# TIMING WAVEFORM 3V VCC(3.3V) VDD tRP (500ns) VIH RESET# VIL tRST VIH tRFT CS# VIL tCSR Reset state tCSHR (500ns) tCSF tRP: RESET#=Vil hold time from VCC min. P/N: PM1040 15 REV. 1.0, SEP. 29, 2004 MX25L6402A READ ARRAY TIMING WAVEFORM (Serial) CS# SCLK SI SO Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit7 Bit6 Bit5 Bit4 Hi-Z 1st byte (52h) 2nd byte (AD1) CS# SCLK SI SO 9th byte (Dummy) Bit1 Bit0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit7 Bit6 Bit5 1st data output byte 2nd data output byte CS# SCLK SI SO Bit3 Bit2 Bit1 Bit0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hi-Z (N-1)th data output byte Nth data output byte NOTES: 1. 1st Byte='52h' 2. 2nd Byte=Address 1(AD1), A17=BIT 0, A18=BIT1, A19=BIT2, A20=BIT3, A21=BIT4, A22=BIT5. 3. 3rd Byte=Address 2(AD2), A9=BIT0, A10=BIT1,......A16=BIT7 4. 4th Byte=Address 3(AD3), A7=BIT0, A8=BIT1 5. 5th Byte=Byte Address(BA), A0=BIT0, A1=BIT1,......A6=BIT6 6. 6th-9th Bytes for SI ==> Dummy Bytes (Don't care) 7. From Byte 10, SO Would Output Array Data P/N: PM1040 16 REV. 1.0, SEP. 29, 2004 MX25L6402A READ ARRAY TIMING WAVEFORM (Parallel) CS# SCLK SI SO7,SO6, …SO0 CS# SCLK SI SO7,SO6, …SO0 CS# SCLK SI SO7,SO6, …SO0 …………. By N te Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit7 Bit6 Bit5 Bit4 Hi-Z 1st byte (52h) 2nd byte (AD1) Bit1 Bit0 …………. By 1 te Byte 2 9th byte (Dummy) Hi-Z NOTES: 1. 1st Byte='52h' 2. 2nd Byte=Address 1(AD1), A17=BIT 0, A18=BIT1, A19=BIT2, A20=BIT3, A21=BIT4, A22=BIT5. 3. 3rd Byte=Address 2(AD2), A9=BIT0, A10=BIT1,......A16=BIT7. 4. 4th Byte=Address 3(AD3), A7=BIT0, A8=BIT1. 5. 5th Byte=Byte Address(BA), A0=BIT0, A1=BIT1,......A6=BIT6. 6. 6th-9th Bytes for SI ==> Dummy Bytes (Don't care). 7. From Byte 10, SO Would Output Array Data. 8. Under parallel mode, the fastest access clock freq. will be changed to 1.25MHz(SCLK pin clock freq.). 9. To read array in parallel mode requires a parallel mode command (55H) before the read command. Once in the parallel mode, eLite FlashTM Memory will not exit parallel mode until power-off. P/N: PM1040 17 REV. 1.0, SEP. 29, 2004 MX25L6402A READ STATUS REGISTER TIMING WAVEFORM (Serial) CS# SCLK SI SO Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit7 Bit6 Bit5 Bit4 Hi-Z 1st byte (83h) 2nd byte (Dummy) CS# SCLK SI SO 2nd byte (Dummy) Bit1 Bit0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit7 Bit6 Bit5 1st status output byte 2nd status output byte CS# SCLK SI SO Bit3 Bit2 Bit1 Bit0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hi-Z (N-1)th status output byte Nth status output byte NOTES: 1. BIT 7=0 ==> Program/Erase completed 2. BIT 4=1 ==>Erase Error 3. BIT 3=1 ==>Program Error 4. BIT 1,2,5==> Reserve for future use 5. BIT 0=1 ==> Device is in ready state 6. BIT 6=0 ==> Device is not in parallel mode P/N: PM1040 18 REV. 1.0, SEP. 29, 2004 MX25L6402A READ STATUS REGISTER TIMING WAVEFORM (Parallel) CS# SCLK SI SO7,SO6, …SO0 CS# SCLK SI SO7,SO6, …SO0 CS# SCLK SI SO7,SO6, …SO0 …………. Byte N Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit7 Bit6 Bit5 Bit4 Hi-Z 1st byte (83h) 2nd byte (Dummy) Bit1 Bit0 …………. By 1 te By 2 te 2nd byte (Dummy) Hi-Z NOTES: 1. BIT 7=0 ==> Program/Erase completed 2. BIT 6=0 ==> Device is not in parallel mode 2. BIT 4=1 ==>Erase Error 3. BIT 3=1 ==>Program Error 4. BIT 1,2,5 ==> Reserve for future use 5. Bit 0=1 ==> Device is in ready state 6. Under parallel mode, the fastest access clock freq. will be changed to 1.25MHz(SCLK pin clock freq.). 7. To read status register in parallel mode, which requires a parallel mode command (55H) before the read status register command. Once in the parallel mode, eLite FlashTM Memory will not exit parallel mode until power-off. P/N: PM1040 19 REV. 1.0, SEP. 29, 2004 MX25L6402A CLEAR STATUS REGISTER TIMING WAVEFORM CS# SCLK SI SO Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Hi-Z 1st byte (89h) NOTES: 1. 1st Byte='89h' ==> CLEAR STATUS REGISTER 2. SO at Hi-Z state P/N: PM1040 20 REV. 1.0, SEP. 29, 2004 MX25L6402A READ ID TIMING WAVEFORM (Serial) CS# SCLK SI SO Bit7 Bit6 Bit0 Bit7 Bit6 Bit0 Hi-Z 1st byte (85h) 2nd byte (Dummy) Bit7 Bit6 Bit0 Bit7 Bit6 1st ID byte (C2h) 2nd ID byte (9CH) CS# SCLK SI SO Bit3 Bit2 Bit1 Bit0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hi-Z (N-1) ID byte N ID byte NOTES: 1. 1st Byte:85h. 2. 2nd Byte:Dummy Byte. 3. 3rd Byte:Output Manufacture Code(C2h). 4. 4th Byte:Output Device Code(9CH). 5. The 2 bytes ID output will be wrap around. P/N: PM1040 21 REV. 1.0, SEP. 29, 2004 MX25L6402A READ ID TIMING WAVEFORM (Parallel) CS# SCLK SI SO7,SO6, …SO0 CS# SCLK SI SO7,SO6, …SO0 ………….. Byte N Bit7 Bit6 Bit0 Bit7 Bit6 Bit0 ………….. Hi-Z 1st byte (85h) 2nd byte (Dummy) Byte 1 Byte 2 Hi-Z NOTES: 1. 1st Byte:85h. 2. 2nd Byte:Dummy Byte. 3. 3rd Byte:Output Manufacture Code(C2h). 4. 4th Byte:Output Device Code(9CH). 5. The 2 bytes ID output will be wrap around. 6. Under parallel mode, the fastest access clock freq. will be changed to 1.25MHz(SCLK pin clock freq.). 7. To read ID in parallel mode, which requires a parallel mode command (55H) before the read ID command. Once in the parallel mode, eLite FlashTM Memory will not exit parallel mode until power-off. P/N: PM1040 22 REV. 1.0, SEP. 29, 2004 MX25L6402A AUTO PAGE PROGRAM TIMING WAVEFORM (Serial) CS# SCLK SI SO Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Hi-Z 1st byte (F2h) 2nd byte (AD1) CS# SCLK SI SO 5th byte (BA) 1st write data byte 2nd write data byte Bit 1 Bit0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit0 Bit 7 Bit 6 CS# SCLK SI SO (N-1)th write data byte Nth write data byte Bit 3 Bit 2 Bit 1 Bit 0 Bit7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Hi-Z NOTES: 1. 1st Byte:F2h. 2. 2nd Byte:Address AD1. 3. 3rd Byte:Address AD2 4. 4th Byte:Address AD3 5. 5th Byte:Address BA. 6. 6th byte:1st write data byte. 7. When the last byte of the page will be written, the Byte Address will be wrap around to the first byte of the Page. 8. The 128-byte page address (A6~A0) must start from 0. P/N: PM1040 23 REV. 1.0, SEP. 29, 2004 MX25L6402A AUTO PAGE PROGRAM TIMING WAVEFORM (Parallel) CS# SCLK SI SO7,SO6, …SO0 CS# SCLK SI SO7,SO6, …SO0 Bit1 Bit0 …………. Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit7 Bit6 Bit5 Bit4 Hi-Z 1st byte (F2h) 2nd byte (AD1) Byte 1 Byte 2 5th byte (BA) CS# SCLK SI SO7,SO6, …SO0 …………. By N te Hi-Z NOTES: 1. 1st Byte:F2h. 2. 2nd Byte:Address AD1. 3. 3rd Byte:Address AD2 4. 4th Byte:Address AD3 5. 5th Byte:Address BA. 6. 6th byte:1st write data byte. 7. When the last byte of the page will be written, the Byte Address will be wrap around to the first byte of the Page. 8. The 128-byte page address (A6~A0) must start from 0. 9. Under parallel mode, the fastest access clock freq. will be changed to 1.25MHz(SCLK pin clock freq.). 10. To program in parallel mode, which requires a parallel mode command (55H) before the page program command. Once in the parallel mode, eLite FlashTM Memory will not exit parallel mode until power-off. P/N: PM1040 24 REV. 1.0, SEP. 29, 2004 MX25L6402A ACCELERATED PROGRAM TIMING DIAGRAM 12V VHH ACC VIL or VIH tVHH tVHH VIL or VIH Note: tVHH (VHH Rise and Fall Time) min. 250ns AUTO SECTOR/CHIP ERASE TIMING WAVEFORM CS# SCLK SI SO Bit 7 Bit 6 Bit 5 Bit 0 Bit 7 Bit 6 Bit 5 Bit 0 Bit7 Bit 6 Bit 0 Hi-Z 1st byte - F1h for Sector Erase - F4h for Chip Erase 2nd byte - AD1 for sector - Dummy for chip 3rd byte - AD2 for sector - Dummy for chip Hi-Z NOTES: 1. 1st byte:F1h for Sector Erase. 2. 2nd byte:Address AD1 for Sector Erase, Dummy byte for chip erase. 3. 3rd byte:Address AD2 for Sector Erase, Dummy byte for chip erase. P/N: PM1040 25 REV. 1.0, SEP. 29, 2004 MX25L6402A ERASE AND PROGRAMMING PERFORMANCE PARAMETER Chip Erase Time Chip Erase Time (with ACC=12V) Sector erase Time Sector erase Time (with ACC=12V) Page Programming Time Page Programming Time (with ACC=12V) Chip Programming Time Chip Programming Time (with ACC=12V) TYP. (1) 160 128 2 1.6 2 1.6 240 180 Max. (2) 512 410 16 13 8 6.4 480 360 UNIT s s s s mS mS s s Excludes system level overhead(3) Comments Note (4) Note (4) Note (4) Note (4) Excludes system level overhead(3) Note: 1. Typical program and erase time assumes the following conditions: 25° C, 3.0V, and all bits are programmed by checkerboard pattern. 2. Under worst conditions of 70° C and 3.0V. Maximum values are up to including 100 program/erase cycles. 3. System-level overhead is the time required to execute the command sequences for the page program command. 4. Excludes 00H programming prior to erasure. (In the pre-programming step of the embedded erase algorithm, all bits are programmed to 00H before erasure) LATCH-UP CHARACTERISTICS MIN. Input Voltage with respect to GND on ACC Input Voltage with respect to GND on all power pins, SI, CS# Input Voltage with respect to GND on SO Current Includes all pins except VCC. Test conditions: VCC = 3.0V, one pin at a time. -1.0V -1.0V -1.0V -100mA MAX. 12.5V 2 VCCmax VCC + 1.0V +100mA P/N: PM1040 26 REV. 1.0, SEP. 29, 2004 MX25L6402A ORDERING INFORMATION PART NO. MX25L6402AMC-40 MX25L6402AMC-40G MX25L6402AMI-40 MX25L6402AMI-40G Access Time 25MHz 25MHz 25MHz 25MHz Operating Current 24mA 24mA 24mA 24mA Standby Current 50uA 50uA 50uA 50uA Temperature Range 0° C to 70° C 0° C to 70° C -40° C to 85° C -40° C to 85° C 28 pin SOP (330 mil) 28 pin SOP (330 mil) 28 pin SOP (330 mil) 28 pin SOP (330 mil) Pb-free Pb-free Package Remark P/N: PM1040 27 REV. 1.0, SEP. 29, 2004 MX25L6402A PACKAGE IMFORMATION P/N: PM1040 28 REV. 1.0, SEP. 29, 2004 MX25L6402A REVISION HISTORY Revision No. Description 1.0 1. Removed title "Preliminary" on page 1 Page P1 Date SEP/29/2004 P/N: PM1040 29 REV. 1.0, SEP. 29, 2004 M X25L6402A MACRONIX INTERNATIONAL CO., LTD. Headquarters: TEL:+886-3-578-6688 FAX:+886-3-563-2888 Europe Office : TEL:+32-2-456-8020 FAX:+32-2-456-8021 Hong Kong Office : TEL:+86-755-834-335-79 FAX:+86-755-834-380-78 Japan Office : Kawasaki Office : TEL:+81-44-246-9100 FAX:+81-44-246-9105 Osaka Office : TEL:+81-6-4807-5460 FAX:+81-6-4807-5461 Singapore Office : TEL:+65-6346-5505 FAX:+65-6348-8096 Taipei Office : TEL:+886-2-2509-3300 FAX:+886-2-2509-2200 MACRONIX AMERICA, INC. TEL:+1-408-262-8887 FAX:+1-408-262-8810 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.