ARRAYC-30035-144P-PCB

ArrayC Series Silicon Photomultiplier (SiPM) 4-Side Scaleable Arrays ON Semiconductor’s range of C-Series, SMT (surface mount technology) SiPM sensors have been used to create compact and scaleable arrays. The sensors are mounted onto PCB boards with minimal dead space. The ArrayC products are available in a variety of formats, and formed of pixels of different sizes. Details of the arrays available are given in the Ordering Information table on page 29 of this document. The back of each ArrayC has either one or more multi-way connectors, or a BGA (ball grid array), that allow access to the fast output* and standard I/O from each pixel in the array, and a common I/O from the summed substrates of the pixels. The ArrayC products with connectors can be used to interface with the user’s own readout via the mating connector, or to ON Semiconductor’s Breakout Boards (BOBs). The BOBs allow for easy access to the pixel signals and performance evaluation of the arrays. ArrayC products with the BGA can be reflow soldered to the user’s readout boards, or purchased ready-mounted on an Evaluation Board (EVB) for easy testing. The BGA ArrayC products cannot be removed from their EVBs. This contrasts with an ArrayC that has connectors, where multiple arrays can be evaluated with a single BOB. ArrayC Inputs and Outputs (I/O) www.onsemi.com S2 S1 F1 Common Sn+1 Figure 1 summarizes the array schematic for a portion of an ArrayC. Each SiPM sensor in the array has three electrical connections: fast output*, standard output and common. The substrates (cathodes) of all sensors are summed together to form the common I/O. Each individual fast output* and standard I/O (anode) are routed to its own output pin. The pixel-level performance of the sensors in the array can be found in the C-Series datasheet. Table of Contents ARRAYC−60035−4P−BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 ARRAYC−60035−4P−GEVB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 ARRAYC−60035−64P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 ARRAYX−BOB6−64S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 ARRAYX−BOB6−64S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 ARRAYC−30035−16P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 ARRAYX−BOB3−16P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 ARRAYX−BOB3−16S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 ARRAYC−30035−144P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 ARRAYX−BOB3−144P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Biasing and Readout from the Standard Breakout Boards . . . . 24 Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 F2 Fn+1 Sn+2 Fn+2 Figure 1. Signal connections at the pixel level of an ArrayC ATTENTION! Great care should be taken when disconnecting the ArrayC PCBs from the mating connectors, either on one of the BOBs, or the user’s own boards. The board should be gently levered up, working progressively around the board to lever the PCB from the connector a little on all sides, and then repeating the process until the connectors are free from each other. Note that a BGA ArrayC cannot be removed from its EVB. * The ARRAYC-60035-4P does not have access to the fast output. © Semiconductor Components Industries, LLC, 2018 March, 2019 − Rev. 7 1 Publication Order Number: ARRAYC−SERIES/D ArrayC Series ARRAYC-60035-4P-BGA (2 x 2 ARRAY OF 6 mm SMT SENSORS) Array Size 2x2 Sensor Type 60035 Readout Pixel Board Size 14.2 x 14.2 mm2 Pixel Pitch No. Connections No. Connectors 7.2 mm 9 3 x 3 BGA The ARRAYC-60035-4P is comprised of 4 individual 6mm C-Series sensors arranged in a 2 x 2 array. The performance of the individual pixels and details of the bias to apply can be found in the C-Series datasheet. Connections to each sensor are provided by a BGA (ball grid array). The BGA can be used to mount the array on the user’s board using reflow soldering. The 4 SiPM sensors have all substrate connections (cathodes) connected together to form a common I/O. The 3 x 3 BGA provides connections as follows: • 4 x standard I/O • 5 x common I/O • There is NO fast output Schematics for the ARRAYC-60035-4P-BGA The complete ARRAYC-60035-4P-BGA CAD and solder footprint is available to download. www.onsemi.com 2 ArrayC Series BGA Connections for the ARRAYC-60035-4P-BGA The fiducial is indicated in the image below. It marks the location of both pin A1 and pixel 1. Fiducial ARRAYC-60035-4P-BGA - Solder Footprint and Reflow Solder Profile Pin. No Function A1 Anode 1 A2 Anode 2 A3 Common Cathode B1 Anode 3 B2 Anode 4 B3 Common Cathode C1 Common Cathode C2 Common Cathode C3 Common Cathode proper bonding and positioning of the array. After soldering, allow at least three minutes for the component to cool to room temperature before further operations. Solder reflow conditions must be in compliance with J-STD-20, table 5.2. This is summarized in Figure 2. The number of passes should not be more than 2. The BGA package is compatible with standard reflow solder processes (J-STD-20) and so is ideal for high-volume manufacturing. The ARRAYC-60035-4P-BGA should be mounted according to specified soldering pad patterns, as given in of the CAD file. Solder paste (we recommend using no-clean solder paste) must be evenly applied to each soldering pad to insure Solder Reflow Profile 300 Max 10 s at 260°C Max 260°C Temperature (5C) 250 Max 4°C/s 217°C 200 180°C 150 Max 6°C/s 60~100 s 60 to 120 s 100 50 0 0 50 100 150 200 250 300 Time (s) Figure 2. Solder reflow profile. Conditions must be in compliance with J-STD-20, table 5.2 www.onsemi.com 3 ArrayC Series ARRAYC-60035-4P-GEVB (ARRAYC-60035-4P-BGA Evaluation Board) The ARRAYC-60035-4P-GEVB is an evaluation board allowing easy access to the signals of a ARRAYC-600354P-BGA via pins. The ARRAYC-60035-4P-GEVB has the array on the front and pins on the back of the PCB. The pins are compatible with a standard 8-pin DIL socket for evaluation purposes. Alternatively, the pins can be directly soldered into through-holes in the user’s readout PCB. Four of the pins are connected to the anodes of the individual pixels and the other four pins are connected to the common cathode. An example mating 8-pin DIL socket is the 110-93-308-41-001000 from Mill-Max. The GEVB PCB is slightly smaller than the actual array, allowing for tiling. The GEVB does NOT provide access to the fast output. Pin. No Function 1 Anode 1 2 Common Cathode 3 Anode 3 4 Common Cathode 5 Common Cathode 6 Anode 4 7 Common Cathode 8 Anode 2 Schematics for the ARRAYC-60035-4P-GEVB The complete ARRAYC-60035-4P-GEVB CAD and solder footprint is available to download. www.onsemi.com 4 ArrayC Series ARRAYC-60035-64P-PCB (8 x 8 ARRAY OF 6 mm SMT SENSORS) Array Size 8x8 Sensor Type 60035 Readout Pixel Board Size 57.4 x 57.4 mm2 Pixel Pitch No. Connections No. Connectors 7.2 mm 160 2 x 80-way The ARRAYC-60035-64P is comprised of 64 individual 6mm SMT sensors arranged in a 8 x 8 array. The performance of the individual pixels and details of the bias to apply can be found in the C-Series datasheet. The connections to each array are provided by two Samtec 80-way connectors, type QTE-040-03-F-D-A. These connectors mate with the Samtec QSE-04001-F-D-A board-to-board connector and the Samtec EQCD High Speed Cable Assemblies. The 64 SiPM pixels all have substrate connections (cathode) summed to form a common I/O. The 80-way connectors provide connections as follows: • 64 x fast output • 64 x standard I/O • 32 x common I/O Schematics for the ARRAYC-60035-64P-PCB The complete ARRAYC-60035-64P-PCB CAD is available to download. www.onsemi.com 5 ArrayC Series Figure 3. Connector schematic for the ARRAYC-60035-64P www.onsemi.com 6 ArrayC Series Table 1. Connector Pin-Outs for the ARRAYC-60035-64P-PCB J1 J2 PIN SIGNAL PIN SIGNAL PIN SIGNAL PIN SIGNAL 1 S17 2 S1 1 S49 2 S33 3 F17 4 F1 3 F49 4 F33 5 S25 6 S9 5 S57 6 S41 7 F25 8 F9 7 F57 8 F41 9 S18 10 S2 9 S50 10 S34 11 F18 12 F2 11 F50 12 F34 13 S26 14 S10 13 S58 14 S42 15 F26 16 F10 15 F58 16 F42 17 S19 18 S3 17 S51 18 S35 19 F19 20 F3 19 F51 20 F35 21 S27 22 S11 21 S59 22 S43 23 F27 24 F11 23 F59 24 F43 25 S20 26 S4 25 S52 26 S36 27 F20 28 F4 27 F52 28 F36 29 S28 30 S12 29 S60 30 S44 31 F28 32 F12 31 F60 32 F44 33 CM 34 CM 33 CM 34 CM 35 CM 36 CM 35 CM 36 CM 37 CM 38 CM 37 CM 38 CM 39 CM 40 CM 39 CM 40 CM 41 S21 42 S5 41 S53 42 S37 43 F21 44 F5 43 F53 44 F37 45 S29 46 S13 45 S61 46 S45 47 F29 48 F13 47 F61 48 F45 49 S22 50 S6 49 S54 50 S38 51 F22 52 F6 51 F54 52 F38 53 S30 54 S14 53 S62 54 S46 55 F30 56 F14 55 F62 56 F46 57 S23 58 S7 57 S55 58 S39 59 F23 60 F7 59 F55 60 F39 61 S31 62 S15 61 S63 62 S47 63 F31 64 F15 63 F63 64 F47 65 S24 66 S8 65 S56 66 S40 67 F24 68 F8 67 F56 68 F40 69 S32 70 S16 69 S64 70 S48 71 F32 72 F16 71 F64 72 F48 73 CM 74 CM 73 CM 74 CM 75 CM 76 CM 75 CM 76 CM 77 CM 78 CM 77 CM 78 CM 79 CM 80 CM 79 CM 80 CM CM Common I/O Sn Standard I/O of pixel n Fn Fast output of pixel n www.onsemi.com 7 ArrayC Series ARRAYX-BOB6-64P (ARRAYC-60035-64P Breakout Board) The ARRAYX-BOB6-64P is an evaluation board allowing easy access to all the signals of a ON Semiconductor ARRAYC-60035-64P, 6 mm 8 x 8 SiPM array. The Breakout Board features two Samtec 80-way connectors, type QSE-040-01-F-D-A. These connectors mate with the Samtec QTE-040-03-F-D-A board-to- board connector on the array. Since the connectors are keyed, orientating the array on the BOB is straightforward. All signals on the array are routed via the mating connectors to header pins. These pins are formed of four 50-way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and J6. Each of the four headers also has 8 pins left unconnected to allow prototyping for evaluation purposes. The layout of the board can be seen in Figure 4. The three SMA connectors on the board can be connected via the supplied jumper cable to any of the array header pins and used for accessing signals or suppling bias voltage. Four 7 mm holes are aligned on a 25 mm grid to allow mounting of the board on an optical breadboard. See Appendices A and B for examples of Breakout Board usage. Schematics for the ARRAYC-60035-4P-EVB Figure 4. Layout of the ARRAYX-BOB6-64P. The dimensions of the board are 112 mm x 112 mm www.onsemi.com 8 ArrayC Series Table 2. HEADER SIGNALS ON THE ARRAYX-BOB6-64P Pin J3 J4 J5 J6 1 2 NC NC NC NC NC NC NC 3 4 NC NC NC NC NC NC NC NC 5 6 CM CM CM CM CM CM CM CM 7 8 CM CM CM CM CM CM CM CM 9 10 F1 S1 F49 S49 F17 S17 F21 S21 11 12 F9 S9 F57 S57 F25 S25 F29 S29 13 14 F2 S2 F50 S50 F18 S18 F22 S22 15 16 F10 S10 F58 S58 F26 S26 F30 S30 17 18 F3 S3 F51 S51 F19 S19 F23 S23 19 20 F11 S11 F59 S59 F27 S27 F31 S31 21 22 F4 S4 F52 S52 F20 S20 F24 S24 23 24 F12 S12 F60 S60 F28 S28 F32 S32 25 26 CM CM CM CM CM CM CM CM 27 28 F5 S5 F53 S53 F33 S33 F37 S37 29 30 F13 S13 F61 S61 F41 S41 F45 S45 31 32 F6 S6 F54 S54 F34 S34 F38 S38 33 34 F14 S14 F62 S62 F42 S42 F46 S46 35 36 F7 S7 F55 S55 F35 S35 F39 S39 37 38 F15 S15 F63 S63 F43 S43 F47 S47 39 40 F8 S8 F56 S56 F36 S36 F40 S40 41 42 F16 S16 F64 S64 F44 S44 F48 S48 43 44 CM CM CM CM CM CM CM CM 45 46 CM CM CM CM CM CM CM CM 47 48 NC NC NC NC NC NC NC NC 49 50 NC NC NC NC NC NC NC NC NC Not Connected CM Common I/O Sn Standard I/O of pixel n Fn Fast output of pixel n www.onsemi.com 9 NC ArrayC Series ARRAYX-BOB6-64S (Summed Breakout Board for the ARRAYC-60035-64P) These pins are formed of four 50-way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and J6. Each of the four headers also has 10 pins that connect to the common cathode (CM) and 8 pins left unconnected (NC) to allow prototyping for evaluation purposes. Two SMA connectors and Balun transformers are provided with 4-pin headers to allow any fast signal to be connected directly to the SMA or via the transformer using jumper wires. Summed output: A summed output (the anodes of pixels 1 to 64 connected together) is routed to jumper pins (SM) in close proximity to a third SMA connector. Four 7 mm holes are placed on a 25 mm grid to allow mounting of the board on an optical breadboard. The ARRAYX-BOB6-64S is an evaluation board allowing easy access to the sum of all of standard pixel signals of a ON Semiconductor ARRAYC-60035-64P, 6 mm 8x 8 SiPM array, in addition to all of the individual fast output signals. The Breakout Board features two Samtec 80-way connectors, type QSE-040-01-F-D-A. These connectors mate with the Samtec QTE-040-03-F-D-A board-to-board connector on the array. Since the connectors are keyed, orientating the array on the BOB is straightforward. A schematic of the board is shown in Figure 5 below. Fast signals: All of the fast output signals (Fn) from the array are routed via the mating connectors to header pins. Figure 5. Layout of the ARRAYX-BOB6-64S. The dimensions of the board are 112 mm x 112 mm www.onsemi.com 10 ArrayC Series Table 3. HEADER SIGNALS ON THE ARRAYX-BOB6-64S Pin J3 J4 J5 J6 1 2 CM CM CM CM CM CM CM CM 3 4 CM CM CM CM CM CM CM CM 5 6 NC NC NC NC NC NC NC NC 7 8 NC NC NC NC NC NC NC NC 9 10 F1 F1 F49 F49 F17 F17 F21 F21 11 12 F9 F9 F57 F57 F25 F25 F29 F29 13 14 F2 F2 F50 F50 F18 F18 F22 F22 15 16 F10 F10 F58 F58 F26 F26 F30 F30 17 18 F3 F3 F51 F51 F19 F19 F23 F23 19 20 F11 F11 F59 F59 F27 F27 F31 F31 21 22 F4 F4 F52 F52 F20 F20 F24 F24 23 24 F12 F12 F60 F60 F28 F28 F32 F32 25 26 CM CM CM CM CM CM CM CM 27 28 F5 F5 F53 F53 F33 F33 F37 F37 29 30 F13 F13 F61 F61 F41 F41 F45 F45 31 32 F6 F6 F54 F54 F34 F34 F38 F38 33 34 F14 F14 F62 F62 F42 F42 F46 F46 35 36 F7 F7 F55 F55 F35 F35 F39 F39 37 38 F15 F15 F63 F63 F43 F43 F47 F47 39 40 F8 F8 F56 F56 F36 F36 F40 F40 41 42 F16 F16 F64 F64 F44 F44 F48 F48 43 44 NC NC NC NC NC NC NC NC 45 46 NC NC NC NC NC NC NC NC 47 48 CM CM CM CM CM CM CM CM 49 50 CM CM CM CM CM CM CM CM NC Not Connected CM Common I/O Fn Fast output of pixel n www.onsemi.com 11 ArrayC Series ARRAYC-30035-16P-PCB (4 x 4 ARRAY OF 3 mm SMT SENSORS) Array Size 4x4 Sensor Type 30035 Readout Pixel Board Size 16.6 x 16.6 mm2 Pixel Pitch No. Connections No. Connectors 4.2 mm 40 1 x 40-way The ARRAYC-30035-16P-PCB is comprised of 16 individual 3 mm C-Series sensors arranged in a 4 x 4 array. The performance of the individual pixels and details of the bias to apply can be found in the C-Series datasheet. Connections to each sensor are provided by a 40-way Hirose plug-type board-to-board connector DF17(2.0)40DP-0.5V(57). These connectors mate with the Hirose DF17(3.0)-40DS-0.5V(57). The 16 SiPM pixels have all substrates (cathodes) connected together to form a common I/O. The 40-way connector provides connections as follows: • 16 x fast output • 16 x standard I/O • 8 x common I/O Schematics for the ARRAYC-30035-16P-PCB The complete ARRAYC-30035-16P-PCB CAD is available to download. www.onsemi.com 12 ArrayC Series Connector Pin-Outs for the ARRAYC-30035-16P-PCB Figure 6. Connector schematic for the ARRAYC-30035-16P PIN SIGNAL PIN SIGNAL 1 CM 40 CM 2 CM 39 CM 3 S1 38 S9 4 F1 37 F9 5 S5 36 S13 6 F5 35 F13 7 S2 34 S10 8 F2 33 F10 9 S6 32 S14 10 F6 31 F14 11 S3 30 S11 12 F3 29 F11 13 S7 28 S15 14 F7 27 F15 15 S4 26 S12 16 F4 25 F12 17 S8 24 S16 18 F8 23 F16 19 CM 22 CM 20 CM 21 CM CM Common I/O Sn Standard I/O of pixel n Fn Fast output of pixel n www.onsemi.com 13 ArrayC Series ARRAYX-BOB3-16P (ARRAYC-30035-16P Breakout Board) The ARRAYX-BOB3-16P is an evaluation board allowing easy access to the signals from a ON Semiconductor ARRAYC-30035-16P, 3 mm 4 x 4 SiPM array. See Figure 7 for details on orientating the array correctly on the BOB. The Breakout Board has a centrally located Hirose 40-way connector DF17(2.0)-40DS-0.5V(57). This connector mates with the Hirose DF17(2.0)-40DP0.5V(57) board-to-board connector on the ARRAYC30035-16P. All signals on the ARRAY are routed via the mating connector to header pins. These pins are formed by two 20-way (10 x 2 row) 2.54 mm pitch headers; J2 and J3. Three SMA connectors and Balun transformers are provided with 4-pin headers to allow any signal to be connected directly to the SMA or via the transformer using jumper wires. Four 7 mm holes are aligned on a 25 mm grid to allow mounting of the board on an optical breadboard. See Appendices A and B for examples of Breakout Board usage. Pixel 4 Pixel 1 Pixel 16 Pixel 13 Figure 7. Layout of the ArrayX-BOB3-16P (left). The board dimensions are 62 mm x 62 mm. The underside of the ArrayC-30035-16P is also shown (right). The pixel numbering is shown, and can be matched the pixel numbers that are marked on the BOB, as indicated. This allows for the correct orientation of the array on the BOB www.onsemi.com 14 ArrayC Series Header Signals for the ARRAYX-BOB3-16P PIN J2 J3 1 2 CM CM CM 3 4 S1 F1 S9 F9 5 6 S5 F5 S13 F13 7 8 S2 F2 S10 F10 9 10 S6 F6 S14 F14 11 12 S3 F3 S11 F11 13 14 S7 F17 S15 F15 15 16 S4 F4 S12 F12 17 18 S8 F6 S16 F16 19 20 NC NC NC NC NC Not Connected CM Common I/O Sn Standard I/O of pixel n Fn Fast output of pixel n www.onsemi.com 15 CM ArrayC Series ARRAYX-BOB3-16S (Summed Breakout Board for the ARRAYC-30035-16P) These pins are formed by two 20-way (10 x 2 row) 2.54 mm pitch headers; J2 and J3. Each of the headers also has 2 pins that connect to the common cathode (CM) and 2 pins left unconnected (NC) to allow prototyping for evaluation purposes. Two SMA connectors and Balun transformers are provided with 4-pin headers to allow any fast signal to be connected directly to the SMA or via the transformer using jumper wires. Summed output: A summed output (the anodes of pixels 1 to 16 connected together) is routed to jumper pins (SM) in close proximity to a third SMA connector. Four 7 mm holes are placed on a 25 mm grid to allow mounting of the board on an optical breadboard. The ARRAYX-BOB3-16S is an evaluation board allowing easy access to the sum of all of standard pixel signals of a ON Semiconductor ARRAYC-30035-16P, 3 mm 4 x 4 SiPM array, in addition to all of the individual fast output signals. The Summed Breakout Board has a centrally located Hirose 40-way connector DF17(2.0)-40DS-0.5V(57). This connector mates with the Hirose DF17(2.0)- 40DP-0.5V(57) board-to-board connector on the ARRAYC-30035-16P. See Figure 7 in the previous section for information on orientating the array on the BOB. A schematic of the board is shown in Figure 8 below. Fast signals: All of the fast output signals (Fn) from the array are routed via the mating connectors to header pins. Figure 8. Layout of the ARRAYX-BOB3-16S. The board dimensions are 62 mm x 62 mm www.onsemi.com 16 ArrayC Series Header Signals for the ARRAYX-BOB3-16S PIN J2 J3 1 2 CM 3 4 F1 F1 F9 F9 5 6 F5 F5 F13 F13 7 8 F2 F2 F10 F10 9 10 F6 F6 F14 F14 11 12 F3 F3 F11 F11 13 14 F7 F7 F15 F15 15 16 F4 F4 F12 F12 17 18 F8 F8 F16 F16 19 20 CM NC CM NC NC Not Connected CM Common I/O Sn Standard I/O of pixel n Fn Fast output of pixel n NC www.onsemi.com 17 CM NC ArrayC Series ARRAYC-30035-144P-PCB (12 x 12 ARRAY OF 3 mm SMT SENSORS) Array Size 12 x 12 Sensor Type 30035 Readout Pixel Board Size 50.2 x 50.2 mm2 Pixel Pitch No. Connections No. Connectors 4.2 mm 320 4 x 80-way The ARRAYC-30035-144P is comprised of 144 individual 3 mm C-Series sensors arranged in a 12 x 12 array. The performance of the individual pixels and details of the bias to apply can be found in the C-Series datasheet. Connections to each sensor are provided by four Samtec 80-way connectors, type QTE-040-03-F-D-A. These connectors mate with the Samtec QSE-040-01-F-D-A board-to-board connector and the Samtec EQCD High Speed Cable Assemblies. The 144 SiPM sensors have all substrate connections (cathodes) connected together to form a common I/O. The 80-way connectors provide connections as follows: • 144 x fast output • 144 x standard I/O • 32 x common I/O Schematics for the ARRAYC-30035-144P-PCB The complete ARRAYC-30035-144P-PCB CAD is available to download. www.onsemi.com 18 ArrayC Series Connector Schematics for the ARRAYC-30035-144P Figure 9. Connector pin-outs for the ARRAYC-30035-144P www.onsemi.com 19 ArrayC Series Table 4. Connector Pin-Outs for the ARRAYC-30035-144P J1 J2 PIN SIGNAL PIN SIGNAL PIN SIGNAL PIN SIGNAL 1 S25 2 S1 1 S61 2 S37 3 F25 4 F1 3 F61 4 F37 5 S14 6 S13 5 S50 6 S49 7 F14 8 F13 7 F50 8 F49 9 S26 10 S2 9 S62 10 S38 11 F26 12 F2 11 F62 12 F38 13 S27 14 S3 13 S63 14 S39 15 F27 16 F3 15 F63 16 F39 17 S28 18 S15 17 S64 18 S51 19 F28 20 F15 19 F64 20 F51 21 CM 22 S4 21 CM 22 S40 23 CM 24 F4 23 CM 24 F40 25 S17 26 S5 25 S53 26 S41 27 F17 28 F5 27 F53 28 F41 29 S29 30 CM 29 S65 30 CM 31 F29 32 CM 31 F65 32 CM 33 S30 34 S16 33 S66 34 S52 35 F30 36 F16 35 F66 36 F52 37 S18 38 S6 37 S54 38 S42 39 F18 40 F6 39 F54 40 F42 41 S19 42 S7 41 S55 42 S43 43 F19 44 F7 43 F55 44 F43 45 S31 46 S21 45 S67 46 S57 47 F31 48 F21 47 F67 48 F57 49 S32 50 CM 49 S68 50 CM 51 F32 52 CM 51 F68 52 CM 53 S20 54 S8 53 S56 54 S44 55 F20 56 F8 55 F56 56 F44 57 CM 58 S9 57 CM 58 S45 59 CM 60 F9 59 CM 60 F45 61 S33 62 S22 61 S69 62 S58 63 F33 64 F22 63 F69 64 F58 65 S34 66 S10 65 S70 66 S46 67 F34 68 F10 67 F70 68 F46 69 S35 70 S11 69 S71 70 S47 71 F35 72 F11 71 F71 72 F47 73 S23 74 S24 73 S59 74 S60 75 F23 76 F24 75 F59 76 F60 77 S36 78 S12 77 S72 78 S48 79 F36 80 F12 79 F72 80 F48 www.onsemi.com 20 ArrayC Series J4 J3 PIN SIGNAL PIN SIGNAL PIN SIGNAL PIN SIGNAL 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71 73 75 77 79 S97 F97 S86 F86 S98 F98 S99 F99 S100 F100 CM CM S89 F89 S101 F101 S102 F102 S90 F90 S91 F91 S103 F103 S104 F104 S92 F92 CM CM S105 F105 S106 F106 S107 F107 S95 F95 S108 F108 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 74 76 78 80 S73 F73 S85 F85 S74 F74 S75 F75 S87 F87 S76 F76 S77 F77 CM CM S88 F88 S78 F78 S79 F79 S93 F93 CM CM S80 F80 S81 F81 S94 F94 S82 F82 S83 F83 S96 F96 S84 F84 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71 73 75 77 79 S133 F133 S122 F122 S134 F134 S135 F135 S136 F136 CM CM S125 F125 S137 F137 S138 F138 S126 F126 S127 F127 S139 F139 S140 F140 S128 F128 CM CM S141 F141 S142 F142 S143 F143 S131 F131 S144 F144 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 74 76 78 80 S109 F109 S121 F121 S110 F110 S111 F111 S123 F123 S112 F112 S113 F113 CM CM S124 F124 S114 F114 S115 F115 S129 F129 CM CM S116 F116 S117 F117 S130 F130 S118 F118 S119 F119 S132 F132 S120 F120 NC Not Connected CM Common I/O Sn Standard I/O of pixel n Fn Fast output of pixel n www.onsemi.com 21 ArrayC Series ARRAYX-BOB3-144P (ARRAYC-30035-144P Breakout Board) The ARRAYX-BOB3-144P is an evaluation board allowing easy access to the signals from a ON Semiconductor ARRAYC-30035-144P, 3 mm 12 x 12 SiPM array. The Breakout Board is comprised of four Samtec 80-way connectors, type QSE-040-01-F-D-A. These connectors mate with the Samtec QTE-040-03-FD- A board-to-board connector on the array. Since the connectors are keyed, orientating the array on the BOB is straightforward. All signals on the array are routed via the mating connectors to header pins. These pins are formed by eight 50-way (25 x 2 row) 2.54 mm pitch headers. Three SMA connectors and Balun transformers are provided with 4-pin headers to allow any signal to be connected directly to the SMA or via the transformer using jumper wires. Four 7 mm holes are placed on a 25 mm grid to allow mounting of the board on an optical breadboard. The layout of the board is shown in Figure 10. See Appendices A and B for examples of Breakout Board usage. Figure 10. Layout of the ARRAYX-BOB3-144P. The board dimensions are 112 mm x 112 mm www.onsemi.com 22 ArrayC Series Table 5. HEADER SIGNALS ON THE ARRAYX-BOB3-144P Pin 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 J1 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 CM S25 S14 S26 S27 S28 S17 S29 S30 S18 S19 S31 S32 S20 S33 S34 S35 S23 S36 NC 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 CM S133 S122 S134 S135 S136 S125 S137 S138 S126 S127 S139 S140 S128 S141 S142 S143 S131 S144 NC Pin 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 J2 CM F25 F14 F26 F27 F28 F17 F29 F30 F18 F19 F31 F32 F20 F33 F34 F35 F23 F36 NC CM S52 S40 S39 S49 S54 S65 S64 S62 S61 S88 S76 S85 S75 S97 S98 S100 S101 S90 NC CM F133 F122 F134 F135 F136 F125 F137 F138 F126 F127 F139 F140 F128 F141 F142 F143 F131 F144 NC CM S43 S44 S58 S47 S48 S67 S56 S70 S59 S79 S80 S84 S83 S94 S95 S106 S92 S103 NC J13 NC Not Connected CM Common I/O Sn Standard I/O of pixel n Fn Fast output of pixel n J7 CM F52 F40 F39 F49 F54 F65 F64 F62 F61 F88 F76 F85 F75 F97 F98 F100 F101 F90 NC CM S1 S13 S2 S3 S15 S4 S5 S16 S6 S7 S21 S8 S9 S22 S10 S11 S24 S12 NC CM F43 F44 F58 F47 F48 F67 F56 F70 F59 F79 F80 F84 F83 F94 F95 F106 F92 F103 NC CM S109 S121 S110 S111 S123 S112 S113 S124 S114 S115 S129 S116 S117 S130 S118 S119 S132 S120 NC J15 CM S42 S41 S51 S38 S37 S66 S53 S63 S50 S78 S77 S73 S74 S87 S86 S99 S89 S102 NC CM F109 F121 F110 F111 F123 F112 F113 F124 F114 F115 F129 F116 F117 F130 F118 F119 F132 F120 NC CM S57 S45 S46 S60 S55 S68 S69 S71 S72 S93 S81 S96 S82 S108 S107 S105 S104 S91 NC J16 www.onsemi.com 23 J8 CM F1 F13 F2 F3 F15 F4 F5 F16 F6 F7 F21 F8 F9 F22 F10 F11 F24 F12 NC CM F42 F41 F51 F38 F37 F66 F53 F63 F50 F78 F77 F73 F74 F87 F86 F99 F89 F102 NC J18 CM F57 F45 F46 F60 F55 F68 F69 F71 F72 F93 F81 F96 F82 F108 F107 F105 F104 F91 NC ArrayC Series Biasing and Readout from the Standard Breakout Boards addition, each SMA has a balun transformer in close proximity for impedance matching of the fast signals, shown in Figure 13. To interface signals from the array to the SMA connectors, there is a 4-pin header, shown in Figures 11 and 12. The pins are labelled; Fin, Fout, I (Inner) and O (Outer). • Fin provides the input to the balun transformer. • Fout is the output of the balun transformer. • I provides direct connection to the inner part of the SMA connector. • O provides direct connection to the outer part of the SMA connector. The purpose of the Breakout Boards is to allow easy access to either standard or fast I/O from individual pixels for testing purposes. It should be stressed that the breakout boards are for evaluation purposes only and do not allow for full readout of all pixels simultaneously. The various Breakout Boards described in this document have features in common. All pixel fast and standard signals are brought out to headers. The header pins can be interfaced with the SMA connectors with the option of routing the signal via a balun transformer. The common I/O consists of all of the substrate connections summed together. It is not recommended to apply the bias to the common I/O. The Breakout Boards are each shipped with 3 x shunt jumpers and 6 x 10 cm wire cables (3 x red, 3 x black) with crimp sockets at each end. All header pins are suitable for use with wire wrapping in addition to the jumpers and crimp socket leads supplied. The ‘NC’ signals are unconnected pins that can be used for prototyping. Balun Transformer The Balun transformer (RFMD RFXF9503) allows impedance matching of the fast output signal to the readout electronics. For a customer considering their own design, the Balun is not required if the readout amplifiers are placed in close proximity to the sensor pixels of the array. For optimized timing performance, the impedance matching and signal propagation from the SiPM sensor to the readout electronics must be carefully considered. SMA Connector Each Breakout Board has three SMA connectors that can be used for supplying bias voltage and accessing signals. In Figure 11. (right) photo and (left) schematic of the BOB SMA, balun transformer and 4-pin header arrangement. www.onsemi.com 24 ArrayC Series RFMD RFXF9503 JX Fin SG Fout SMA Output I SG O SG SG = Local signal ground Each SMT/Balun/4 Way Header circuits has its own local signal ground Figure 12. Schematic of the 4-pin header and balun transformer EMI Considerations For a system design, it is recommended that the customer consider shielding of all lines. The readout requirements for a SiPM are similar to that of a PMT and similar care should be taken with both sensor types. In comparison to an APD which has significantly lower gain than a SiPM, the SiPM will provide much improved resistance to EMI due to the higher gain of the SiPM sensor. It has been shown that the EMI (Electromagnetic Interference) can be picked up on the unshielded wires on the BOB. It is recommended that customers who experience excessive EMI seek to reduce the EMI in their lab, ideally at the EMI source. If this is not possible then improved shielding should be used. In all cases, testing of the SiPM sensor should be performed in total darkness. www.onsemi.com 25 ArrayC Series APPENDIX A - EXAMPLE OF USING THE BREAKOUT BOARD TO READOUT FAST SIGNALS The Figure 13 shows the ARRAYX-BOB6-64P set up for readout of fast signals from pixel 49 Figure 13. Example of an ARRAYC-60035-64P connected to an ARRAYX-BOB664P for the readout of the fast signal from pixel 49. To access the fast output from pixel 49, the F49 header pin is then connected to the Fin of SMA2. This is the input to the balun transformer for impedance matching of the fast signals. Fout (the output of the balun transformer) is then connected via a shunt jumper to the inner (“I”) of SMA2, with the outer (“O”) again connected to the common cathode (“C”). The schematic of the balun transformer is shown in Figure 12. The fast output from SMA2 will need amplification if the signal amplitudes are small. Here, SMA1 is used for supplying Vbias and SMA2 for reading out the fast output from pixel 49. In this example an ARRAYC-60035-64P is assumed and so the “S” (standard I/O) is the anode. To bias the array, the inner (“I”) of SMA1 is connected to the S49 header pin. The cathode is common to all pixels and is connected via a “C” pin on the header to the outer (“O”) of SMA1. Refer to Figure 1 for signal connections for the C-Series array. Vbias is then applied to SMA1, which for an ArrayC sensors has a negative polarity with respect to the common cathode. www.onsemi.com 26 ArrayC Series APPENDIX B - EXAMPLE OF USING THE BREAKOUT BOARD TO READOUT STANDARD SIGNALS The Figure 14 shows the ARRAYX-BOB6-64P set up for readout of standard signals (anode-cathode) from pixel 49. −ve bias 50  10 nF 0V Figure 14. Example of an ARRAYC-60035-64P connected to an ARRAYX-BOB6-64P for the readout of the standard (anode-cathode) signal from pixel 49 (left), with simplified readout schematic (right). To access the standard output, the S49 header pin is then connected to the inner (“I”) of SMA2 via a decoupling capacitor of 10 nF. The outer (“O”) of SMA 2 is again connected to the common cathode (“C”). The standard signal is then available from SMA2. Here, SMA 1 is used for supplying Vbias and SMA2 for reading out the standard output from pixel 49. In this example an ARRAYC-60035-64P is assumed and so the “S” (standard I/O) is the anode. To bias the array, the inner (“I”) of SMA1 is connected to the S49 (anode) header pin via a load resistor of 50 Ω. The cathode is common to all pixels and is connected via a “C” pin on the header to the outer (“O”) of SMA1. Vbias is then applied to SMA1, which for an ArrayC sensors has a negative polarity with respect to the common cathode. www.onsemi.com 27 ArrayC Series APPENDIX C - EXAMPLE OF USING THE SUMMED BREAKOUT BOARD The Figure 15 shows the ARRAYX-BOB6-64S set up for readout of all of the pixels summed together. −ve bias 50  10 nF 0V Figure 15. Example of an ARRAYC-60035-64P connected to an ARRAYX-BOB6-64S for the summed readout of all of the pixels (left), with simplified readout schematic (right). Vbias is then applied to SMA1, which for an ArrayC has a negative polarity with respect to the common. To access the summed standard output, the second SM header pin is then connected to the inner (“I”) of SMA2 via a decoupling capacitor of 10 nF. The outer (“O”) of SMA2 is again connected to the common cathode (“CM”). The summed signal is then available from SMA2. SMA 1 is used for supplying Vbias and SMA2 for reading out the summed standard output from all pixels in the ARRAYC-60035-64P. To bias the array, the inner (“I”) of SMA1 is connected to the SM (summed anode) pin on the same header, via a load resistor of 50 . The cathode is also common to all pixels and is connected via a “CM” pin to the outer (“O”) of SMA1. www.onsemi.com 28 ArrayC Series ORDERING INFORMATION Microcell Size (Total Number per Pixel) Product Code Array Size I/O Interface 2x2 BGA 8x8 Connector 4x4 Connector 12 x 12 Connector 6 mm Sensor Arrays ARRAYC-60035-4P-BGA ARRAYC-60035-64P-PCB 35 mm (18,980 microcells) 3 mm Sensor ARRAYs ARRAYC-30035-16P-PCB 35 mm (4,774 microcells) ARRAYC-30035-144P-PCB Optional Breakout Boards ARRAYX-BOB6-64P-GEVK Breakout board with connectors for use with the 8 x 8 arrays of 6 mm pixels ARRAYX-BOB3-16P-GEVK Breakout board with connectors for use with the 4 x 4 arrays of 3 mm pixels ARRAYX-BOB3-144P-GEVK Breakout board with connectors for use with the 12 x 12 arrays of 3 mm pixels Optional Summed Breakout Boards ARRAYX-BOB6-64S-GEVK Summed breakout board for use with the 8 x 8 array of 6 mm pixels ARRAYX-BOB6-16S-GEVK Summed breakout board for use with the 4 x 4 array of 3 mm pixels Evaluation Board with ARRAYC Permanently Attached ARRAYC-60035-4P-GEVB Evaluation board with a permanently attached 2 x 2 array of 6 mm pixels SensL is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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