ArrayC Series
Silicon Photomultiplier
(SiPM) 4-Side Scaleable
Arrays
ON Semiconductor’s range of C-Series, SMT (surface mount
technology) SiPM sensors have been used to create compact and
scaleable arrays. The sensors are mounted onto PCB boards with
minimal dead space. The ArrayC products are available in a variety of
formats, and formed of pixels of different sizes. Details of the arrays
available are given in the Ordering Information table on page 29 of
this document.
The back of each ArrayC has either one or more multi-way
connectors, or a BGA (ball grid array), that allow access to the fast
output* and standard I/O from each pixel in the array, and a common
I/O from the summed substrates of the pixels. The ArrayC products
with connectors can be used to interface with the user’s own readout
via the mating connector, or to ON Semiconductor’s Breakout Boards
(BOBs). The BOBs allow for easy access to the pixel signals and
performance evaluation of the arrays.
ArrayC products with the BGA can be reflow soldered to the user’s
readout boards, or purchased ready-mounted on an Evaluation Board
(EVB) for easy testing. The BGA ArrayC products cannot be removed
from their EVBs. This contrasts with an ArrayC that has connectors,
where multiple arrays can be evaluated with a single BOB.
ArrayC Inputs and Outputs (I/O)
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S2
S1
F1
Common
Sn+1
Figure 1 summarizes the array schematic for a portion of an ArrayC.
Each SiPM sensor in the array has three electrical connections: fast
output*, standard output and common.
The substrates (cathodes) of all sensors are summed together to
form the common I/O.
Each individual fast output* and standard I/O (anode) are routed to
its own output pin.
The pixel-level performance of the sensors in the array can be found
in the C-Series datasheet.
Table of Contents
ARRAYC−60035−4P−BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
ARRAYC−60035−4P−GEVB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
ARRAYC−60035−64P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ARRAYX−BOB6−64S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ARRAYX−BOB6−64S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
ARRAYC−30035−16P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
ARRAYX−BOB3−16P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
ARRAYX−BOB3−16S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
ARRAYC−30035−144P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
ARRAYX−BOB3−144P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Biasing and Readout from the Standard Breakout Boards . . . . 24
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
F2
Fn+1
Sn+2
Fn+2
Figure 1. Signal connections at the pixel
level of an ArrayC
ATTENTION!
Great care should be taken when disconnecting the
ArrayC PCBs from the mating connectors, either on one
of the BOBs, or the user’s own boards.
The board should be gently levered up, working
progressively around the board to lever the PCB from the
connector a little on all sides, and then repeating the
process until the connectors are free from each other.
Note that a BGA ArrayC cannot be removed from its EVB.
* The ARRAYC-60035-4P does not have access to the fast output.
© Semiconductor Components Industries, LLC, 2018
March, 2019 − Rev. 7
1
Publication Order Number:
ARRAYC−SERIES/D
ArrayC Series
ARRAYC-60035-4P-BGA (2 x 2 ARRAY OF 6 mm SMT SENSORS)
Array Size
2x2
Sensor Type
60035
Readout
Pixel
Board Size
14.2 x 14.2
mm2
Pixel Pitch
No. Connections
No. Connectors
7.2 mm
9
3 x 3 BGA
The ARRAYC-60035-4P is comprised of 4 individual
6mm C-Series sensors arranged in a 2 x 2 array.
The performance of the individual pixels and details of the
bias to apply can be found in the C-Series datasheet.
Connections to each sensor are provided by a BGA (ball
grid array). The BGA can be used to mount the array on the
user’s board using reflow soldering.
The 4 SiPM sensors have all substrate connections
(cathodes) connected together to form a common I/O. The
3 x 3 BGA provides connections as follows:
• 4 x standard I/O
• 5 x common I/O
• There is NO fast output
Schematics for the ARRAYC-60035-4P-BGA
The complete ARRAYC-60035-4P-BGA CAD and solder footprint is available to download.
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2
ArrayC Series
BGA Connections for the ARRAYC-60035-4P-BGA
The fiducial is indicated in the image below. It marks the
location of both pin A1 and pixel 1.
Fiducial
ARRAYC-60035-4P-BGA - Solder Footprint and Reflow
Solder Profile
Pin. No
Function
A1
Anode 1
A2
Anode 2
A3
Common Cathode
B1
Anode 3
B2
Anode 4
B3
Common Cathode
C1
Common Cathode
C2
Common Cathode
C3
Common Cathode
proper bonding and positioning of the array. After soldering,
allow at least three minutes for the component to cool to
room temperature before further operations.
Solder reflow conditions must be in compliance with
J-STD-20, table 5.2. This is summarized in Figure 2. The
number of passes should not be more than 2.
The BGA package is compatible with standard reflow
solder processes (J-STD-20) and so is ideal for high-volume
manufacturing. The ARRAYC-60035-4P-BGA should be
mounted according to specified soldering pad patterns, as
given in of the CAD file.
Solder paste (we recommend using no-clean solder paste)
must be evenly applied to each soldering pad to insure
Solder Reflow Profile
300
Max 10 s at 260°C
Max 260°C
Temperature (5C)
250
Max 4°C/s
217°C
200
180°C
150
Max 6°C/s
60~100 s
60 to 120 s
100
50
0
0
50
100
150
200
250
300
Time (s)
Figure 2. Solder reflow profile. Conditions must be in compliance with J-STD-20, table 5.2
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3
ArrayC Series
ARRAYC-60035-4P-GEVB
(ARRAYC-60035-4P-BGA Evaluation Board)
The ARRAYC-60035-4P-GEVB is an evaluation board
allowing easy access to the signals of a ARRAYC-600354P-BGA via pins.
The ARRAYC-60035-4P-GEVB has the array on the
front and pins on the back of the PCB. The pins are
compatible with a standard 8-pin DIL socket for evaluation
purposes. Alternatively, the pins can be directly soldered
into through-holes in the user’s readout PCB. Four of the
pins are connected to the anodes of the individual pixels and
the other four pins are connected to the common cathode. An
example
mating
8-pin
DIL
socket
is
the
110-93-308-41-001000 from Mill-Max.
The GEVB PCB is slightly smaller than the actual array,
allowing for tiling.
The GEVB does NOT provide access to the fast output.
Pin. No
Function
1
Anode 1
2
Common Cathode
3
Anode 3
4
Common Cathode
5
Common Cathode
6
Anode 4
7
Common Cathode
8
Anode 2
Schematics for the ARRAYC-60035-4P-GEVB
The complete ARRAYC-60035-4P-GEVB CAD and solder footprint is available to download.
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4
ArrayC Series
ARRAYC-60035-64P-PCB (8 x 8 ARRAY OF 6 mm SMT SENSORS)
Array Size
8x8
Sensor Type
60035
Readout
Pixel
Board Size
57.4 x 57.4
mm2
Pixel Pitch
No. Connections
No. Connectors
7.2 mm
160
2 x 80-way
The ARRAYC-60035-64P is comprised of 64 individual
6mm SMT sensors arranged in a 8 x 8 array.
The performance of the individual pixels and details of the
bias to apply can be found in the C-Series datasheet.
The connections to each array are provided by two
Samtec 80-way connectors, type QTE-040-03-F-D-A.
These connectors mate with the Samtec QSE-04001-F-D-A board-to-board connector and the Samtec EQCD
High Speed Cable Assemblies. The 64 SiPM pixels all have
substrate connections (cathode) summed to form a common
I/O. The 80-way connectors provide connections as follows:
• 64 x fast output
• 64 x standard I/O
• 32 x common I/O
Schematics for the ARRAYC-60035-64P-PCB
The complete ARRAYC-60035-64P-PCB CAD is available to download.
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5
ArrayC Series
Figure 3. Connector schematic for the ARRAYC-60035-64P
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6
ArrayC Series
Table 1. Connector Pin-Outs for the ARRAYC-60035-64P-PCB
J1
J2
PIN
SIGNAL
PIN
SIGNAL
PIN
SIGNAL
PIN
SIGNAL
1
S17
2
S1
1
S49
2
S33
3
F17
4
F1
3
F49
4
F33
5
S25
6
S9
5
S57
6
S41
7
F25
8
F9
7
F57
8
F41
9
S18
10
S2
9
S50
10
S34
11
F18
12
F2
11
F50
12
F34
13
S26
14
S10
13
S58
14
S42
15
F26
16
F10
15
F58
16
F42
17
S19
18
S3
17
S51
18
S35
19
F19
20
F3
19
F51
20
F35
21
S27
22
S11
21
S59
22
S43
23
F27
24
F11
23
F59
24
F43
25
S20
26
S4
25
S52
26
S36
27
F20
28
F4
27
F52
28
F36
29
S28
30
S12
29
S60
30
S44
31
F28
32
F12
31
F60
32
F44
33
CM
34
CM
33
CM
34
CM
35
CM
36
CM
35
CM
36
CM
37
CM
38
CM
37
CM
38
CM
39
CM
40
CM
39
CM
40
CM
41
S21
42
S5
41
S53
42
S37
43
F21
44
F5
43
F53
44
F37
45
S29
46
S13
45
S61
46
S45
47
F29
48
F13
47
F61
48
F45
49
S22
50
S6
49
S54
50
S38
51
F22
52
F6
51
F54
52
F38
53
S30
54
S14
53
S62
54
S46
55
F30
56
F14
55
F62
56
F46
57
S23
58
S7
57
S55
58
S39
59
F23
60
F7
59
F55
60
F39
61
S31
62
S15
61
S63
62
S47
63
F31
64
F15
63
F63
64
F47
65
S24
66
S8
65
S56
66
S40
67
F24
68
F8
67
F56
68
F40
69
S32
70
S16
69
S64
70
S48
71
F32
72
F16
71
F64
72
F48
73
CM
74
CM
73
CM
74
CM
75
CM
76
CM
75
CM
76
CM
77
CM
78
CM
77
CM
78
CM
79
CM
80
CM
79
CM
80
CM
CM
Common I/O
Sn
Standard I/O of pixel n
Fn
Fast output of pixel n
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7
ArrayC Series
ARRAYX-BOB6-64P
(ARRAYC-60035-64P Breakout Board)
The ARRAYX-BOB6-64P is an evaluation board
allowing easy access to all the signals of a
ON Semiconductor ARRAYC-60035-64P, 6 mm 8 x 8
SiPM array.
The Breakout Board features two Samtec 80-way
connectors, type QSE-040-01-F-D-A. These connectors
mate with the Samtec QTE-040-03-F-D-A board-to- board
connector on the array. Since the connectors are keyed,
orientating the array on the BOB is straightforward.
All signals on the array are routed via the mating
connectors to header pins. These pins are formed of four
50-way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and
J6. Each of the four headers also has 8 pins left unconnected
to allow prototyping for evaluation purposes. The layout of
the board can be seen in Figure 4.
The three SMA connectors on the board can be connected
via the supplied jumper cable to any of the array header pins
and used for accessing signals or suppling bias voltage. Four
7 mm holes are aligned on a 25 mm grid to allow mounting
of the board on an optical breadboard.
See Appendices A and B for examples of Breakout Board
usage.
Schematics for the ARRAYC-60035-4P-EVB
Figure 4. Layout of the ARRAYX-BOB6-64P. The dimensions of the board are 112 mm x 112 mm
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8
ArrayC Series
Table 2. HEADER SIGNALS ON THE ARRAYX-BOB6-64P
Pin
J3
J4
J5
J6
1
2
NC
NC
NC
NC
NC
NC
NC
3
4
NC
NC
NC
NC
NC
NC
NC
NC
5
6
CM
CM
CM
CM
CM
CM
CM
CM
7
8
CM
CM
CM
CM
CM
CM
CM
CM
9
10
F1
S1
F49
S49
F17
S17
F21
S21
11
12
F9
S9
F57
S57
F25
S25
F29
S29
13
14
F2
S2
F50
S50
F18
S18
F22
S22
15
16
F10
S10
F58
S58
F26
S26
F30
S30
17
18
F3
S3
F51
S51
F19
S19
F23
S23
19
20
F11
S11
F59
S59
F27
S27
F31
S31
21
22
F4
S4
F52
S52
F20
S20
F24
S24
23
24
F12
S12
F60
S60
F28
S28
F32
S32
25
26
CM
CM
CM
CM
CM
CM
CM
CM
27
28
F5
S5
F53
S53
F33
S33
F37
S37
29
30
F13
S13
F61
S61
F41
S41
F45
S45
31
32
F6
S6
F54
S54
F34
S34
F38
S38
33
34
F14
S14
F62
S62
F42
S42
F46
S46
35
36
F7
S7
F55
S55
F35
S35
F39
S39
37
38
F15
S15
F63
S63
F43
S43
F47
S47
39
40
F8
S8
F56
S56
F36
S36
F40
S40
41
42
F16
S16
F64
S64
F44
S44
F48
S48
43
44
CM
CM
CM
CM
CM
CM
CM
CM
45
46
CM
CM
CM
CM
CM
CM
CM
CM
47
48
NC
NC
NC
NC
NC
NC
NC
NC
49
50
NC
NC
NC
NC
NC
NC
NC
NC
NC
Not Connected
CM
Common I/O
Sn
Standard I/O of pixel n
Fn
Fast output of pixel n
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9
NC
ArrayC Series
ARRAYX-BOB6-64S (Summed Breakout Board for the
ARRAYC-60035-64P)
These pins are formed of four 50-way (25 x 2 row) 2.54 mm
pitch headers; J3, J4, J5 and J6. Each of the four headers also
has 10 pins that connect to the common cathode (CM) and
8 pins left unconnected (NC) to allow prototyping for
evaluation purposes.
Two SMA connectors and Balun transformers are
provided with 4-pin headers to allow any fast signal to be
connected directly to the SMA or via the transformer using
jumper wires.
Summed output: A summed output (the anodes of pixels
1 to 64 connected together) is routed to jumper pins (SM) in
close proximity to a third SMA connector. Four 7 mm holes
are placed on a 25 mm grid to allow mounting of the board
on an optical breadboard.
The ARRAYX-BOB6-64S is an evaluation board
allowing easy access to the sum of all of standard pixel
signals of a ON Semiconductor ARRAYC-60035-64P,
6 mm 8x 8 SiPM array, in addition to all of the individual fast
output signals. The Breakout Board features two Samtec
80-way connectors, type QSE-040-01-F-D-A. These
connectors mate with the Samtec QTE-040-03-F-D-A
board-to-board connector on the array. Since the connectors
are keyed, orientating the array on the BOB is
straightforward. A schematic of the board is shown in
Figure 5 below.
Fast signals: All of the fast output signals (Fn) from the
array are routed via the mating connectors to header pins.
Figure 5. Layout of the ARRAYX-BOB6-64S. The dimensions of the board are 112 mm x 112 mm
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10
ArrayC Series
Table 3. HEADER SIGNALS ON THE ARRAYX-BOB6-64S
Pin
J3
J4
J5
J6
1
2
CM
CM
CM
CM
CM
CM
CM
CM
3
4
CM
CM
CM
CM
CM
CM
CM
CM
5
6
NC
NC
NC
NC
NC
NC
NC
NC
7
8
NC
NC
NC
NC
NC
NC
NC
NC
9
10
F1
F1
F49
F49
F17
F17
F21
F21
11
12
F9
F9
F57
F57
F25
F25
F29
F29
13
14
F2
F2
F50
F50
F18
F18
F22
F22
15
16
F10
F10
F58
F58
F26
F26
F30
F30
17
18
F3
F3
F51
F51
F19
F19
F23
F23
19
20
F11
F11
F59
F59
F27
F27
F31
F31
21
22
F4
F4
F52
F52
F20
F20
F24
F24
23
24
F12
F12
F60
F60
F28
F28
F32
F32
25
26
CM
CM
CM
CM
CM
CM
CM
CM
27
28
F5
F5
F53
F53
F33
F33
F37
F37
29
30
F13
F13
F61
F61
F41
F41
F45
F45
31
32
F6
F6
F54
F54
F34
F34
F38
F38
33
34
F14
F14
F62
F62
F42
F42
F46
F46
35
36
F7
F7
F55
F55
F35
F35
F39
F39
37
38
F15
F15
F63
F63
F43
F43
F47
F47
39
40
F8
F8
F56
F56
F36
F36
F40
F40
41
42
F16
F16
F64
F64
F44
F44
F48
F48
43
44
NC
NC
NC
NC
NC
NC
NC
NC
45
46
NC
NC
NC
NC
NC
NC
NC
NC
47
48
CM
CM
CM
CM
CM
CM
CM
CM
49
50
CM
CM
CM
CM
CM
CM
CM
CM
NC
Not Connected
CM
Common I/O
Fn
Fast output of pixel n
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11
ArrayC Series
ARRAYC-30035-16P-PCB (4 x 4 ARRAY OF 3 mm SMT SENSORS)
Array Size
4x4
Sensor Type
30035
Readout
Pixel
Board Size
16.6 x 16.6
mm2
Pixel Pitch
No. Connections
No. Connectors
4.2 mm
40
1 x 40-way
The ARRAYC-30035-16P-PCB is comprised of 16
individual 3 mm C-Series sensors arranged in a 4 x 4 array.
The performance of the individual pixels and details of the
bias to apply can be found in the C-Series datasheet.
Connections to each sensor are provided by a 40-way
Hirose plug-type board-to-board connector DF17(2.0)40DP-0.5V(57). These connectors mate with the Hirose
DF17(3.0)-40DS-0.5V(57). The 16 SiPM pixels have all
substrates (cathodes) connected together to form a common
I/O. The 40-way connector provides connections as follows:
• 16 x fast output
• 16 x standard I/O
• 8 x common I/O
Schematics for the ARRAYC-30035-16P-PCB
The complete ARRAYC-30035-16P-PCB CAD is available to download.
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12
ArrayC Series
Connector Pin-Outs for the ARRAYC-30035-16P-PCB
Figure 6. Connector schematic for the ARRAYC-30035-16P
PIN
SIGNAL
PIN
SIGNAL
1
CM
40
CM
2
CM
39
CM
3
S1
38
S9
4
F1
37
F9
5
S5
36
S13
6
F5
35
F13
7
S2
34
S10
8
F2
33
F10
9
S6
32
S14
10
F6
31
F14
11
S3
30
S11
12
F3
29
F11
13
S7
28
S15
14
F7
27
F15
15
S4
26
S12
16
F4
25
F12
17
S8
24
S16
18
F8
23
F16
19
CM
22
CM
20
CM
21
CM
CM
Common I/O
Sn
Standard I/O of pixel n
Fn
Fast output of pixel n
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13
ArrayC Series
ARRAYX-BOB3-16P
(ARRAYC-30035-16P Breakout Board)
The ARRAYX-BOB3-16P is an evaluation board
allowing easy access to the signals from a
ON Semiconductor ARRAYC-30035-16P, 3 mm 4 x 4
SiPM array. See Figure 7 for details on orientating the array
correctly on the BOB.
The Breakout Board has a centrally located Hirose
40-way connector DF17(2.0)-40DS-0.5V(57). This
connector mates with the Hirose DF17(2.0)-40DP0.5V(57) board-to-board connector on the ARRAYC30035-16P. All signals on the ARRAY are routed via the
mating connector to header pins. These pins are formed by
two 20-way (10 x 2 row) 2.54 mm pitch headers; J2 and J3.
Three SMA connectors and Balun transformers are
provided with 4-pin headers to allow any signal to be
connected directly to the SMA or via the transformer using
jumper wires. Four 7 mm holes are aligned on a 25 mm grid
to allow mounting of the board on an optical breadboard.
See Appendices A and B for examples of Breakout Board
usage.
Pixel 4
Pixel 1
Pixel 16
Pixel 13
Figure 7. Layout of the ArrayX-BOB3-16P (left). The board dimensions are 62 mm x 62 mm. The underside of the
ArrayC-30035-16P is also shown (right). The pixel numbering is shown, and can be matched the pixel numbers
that are marked on the BOB, as indicated. This allows for the correct orientation of the array on the BOB
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14
ArrayC Series
Header Signals for the ARRAYX-BOB3-16P
PIN
J2
J3
1
2
CM
CM
CM
3
4
S1
F1
S9
F9
5
6
S5
F5
S13
F13
7
8
S2
F2
S10
F10
9
10
S6
F6
S14
F14
11
12
S3
F3
S11
F11
13
14
S7
F17
S15
F15
15
16
S4
F4
S12
F12
17
18
S8
F6
S16
F16
19
20
NC
NC
NC
NC
NC
Not Connected
CM
Common I/O
Sn
Standard I/O of pixel n
Fn
Fast output of pixel n
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15
CM
ArrayC Series
ARRAYX-BOB3-16S (Summed Breakout Board for the
ARRAYC-30035-16P)
These pins are formed by two 20-way (10 x 2 row) 2.54 mm
pitch headers; J2 and J3. Each of the headers also has 2 pins
that connect to the common cathode (CM) and 2 pins left
unconnected (NC) to allow prototyping for evaluation
purposes.
Two SMA connectors and Balun transformers are
provided with 4-pin headers to allow any fast signal to be
connected directly to the SMA or via the transformer using
jumper wires.
Summed output: A summed output (the anodes of pixels
1 to 16 connected together) is routed to jumper pins (SM) in
close proximity to a third SMA connector. Four 7 mm holes
are placed on a 25 mm grid to allow mounting of the board
on an optical breadboard.
The ARRAYX-BOB3-16S is an evaluation board
allowing easy access to the sum of all of standard pixel
signals of a ON Semiconductor ARRAYC-30035-16P,
3 mm 4 x 4 SiPM array, in addition to all of the individual
fast output signals. The Summed Breakout Board has a
centrally
located
Hirose
40-way
connector
DF17(2.0)-40DS-0.5V(57). This connector mates with the
Hirose DF17(2.0)- 40DP-0.5V(57) board-to-board
connector on the ARRAYC-30035-16P. See Figure 7 in the
previous section for information on orientating the array on
the BOB. A schematic of the board is shown in Figure 8
below.
Fast signals: All of the fast output signals (Fn) from the
array are routed via the mating connectors to header pins.
Figure 8. Layout of the ARRAYX-BOB3-16S. The board dimensions are 62 mm x 62 mm
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16
ArrayC Series
Header Signals for the ARRAYX-BOB3-16S
PIN
J2
J3
1
2
CM
3
4
F1
F1
F9
F9
5
6
F5
F5
F13
F13
7
8
F2
F2
F10
F10
9
10
F6
F6
F14
F14
11
12
F3
F3
F11
F11
13
14
F7
F7
F15
F15
15
16
F4
F4
F12
F12
17
18
F8
F8
F16
F16
19
20
CM
NC
CM
NC
NC
Not Connected
CM
Common I/O
Sn
Standard I/O of pixel n
Fn
Fast output of pixel n
NC
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17
CM
NC
ArrayC Series
ARRAYC-30035-144P-PCB (12 x 12 ARRAY OF 3 mm SMT SENSORS)
Array Size
12 x 12
Sensor Type
30035
Readout
Pixel
Board Size
50.2 x 50.2
mm2
Pixel Pitch
No. Connections
No. Connectors
4.2 mm
320
4 x 80-way
The ARRAYC-30035-144P is comprised of 144
individual 3 mm C-Series sensors arranged in a 12 x 12
array.
The performance of the individual pixels and details of the
bias to apply can be found in the C-Series datasheet.
Connections to each sensor are provided by four Samtec
80-way connectors, type QTE-040-03-F-D-A. These
connectors mate with the Samtec QSE-040-01-F-D-A
board-to-board connector and the Samtec EQCD High
Speed Cable Assemblies. The 144 SiPM sensors have all
substrate connections (cathodes) connected together to form
a common I/O. The 80-way connectors provide connections
as follows:
• 144 x fast output
• 144 x standard I/O
• 32 x common I/O
Schematics for the ARRAYC-30035-144P-PCB
The complete ARRAYC-30035-144P-PCB CAD is available to download.
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18
ArrayC Series
Connector Schematics for the ARRAYC-30035-144P
Figure 9. Connector pin-outs for the ARRAYC-30035-144P
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19
ArrayC Series
Table 4. Connector Pin-Outs for the ARRAYC-30035-144P
J1
J2
PIN
SIGNAL
PIN
SIGNAL
PIN
SIGNAL
PIN
SIGNAL
1
S25
2
S1
1
S61
2
S37
3
F25
4
F1
3
F61
4
F37
5
S14
6
S13
5
S50
6
S49
7
F14
8
F13
7
F50
8
F49
9
S26
10
S2
9
S62
10
S38
11
F26
12
F2
11
F62
12
F38
13
S27
14
S3
13
S63
14
S39
15
F27
16
F3
15
F63
16
F39
17
S28
18
S15
17
S64
18
S51
19
F28
20
F15
19
F64
20
F51
21
CM
22
S4
21
CM
22
S40
23
CM
24
F4
23
CM
24
F40
25
S17
26
S5
25
S53
26
S41
27
F17
28
F5
27
F53
28
F41
29
S29
30
CM
29
S65
30
CM
31
F29
32
CM
31
F65
32
CM
33
S30
34
S16
33
S66
34
S52
35
F30
36
F16
35
F66
36
F52
37
S18
38
S6
37
S54
38
S42
39
F18
40
F6
39
F54
40
F42
41
S19
42
S7
41
S55
42
S43
43
F19
44
F7
43
F55
44
F43
45
S31
46
S21
45
S67
46
S57
47
F31
48
F21
47
F67
48
F57
49
S32
50
CM
49
S68
50
CM
51
F32
52
CM
51
F68
52
CM
53
S20
54
S8
53
S56
54
S44
55
F20
56
F8
55
F56
56
F44
57
CM
58
S9
57
CM
58
S45
59
CM
60
F9
59
CM
60
F45
61
S33
62
S22
61
S69
62
S58
63
F33
64
F22
63
F69
64
F58
65
S34
66
S10
65
S70
66
S46
67
F34
68
F10
67
F70
68
F46
69
S35
70
S11
69
S71
70
S47
71
F35
72
F11
71
F71
72
F47
73
S23
74
S24
73
S59
74
S60
75
F23
76
F24
75
F59
76
F60
77
S36
78
S12
77
S72
78
S48
79
F36
80
F12
79
F72
80
F48
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20
ArrayC Series
J4
J3
PIN
SIGNAL
PIN
SIGNAL
PIN
SIGNAL
PIN
SIGNAL
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
S97
F97
S86
F86
S98
F98
S99
F99
S100
F100
CM
CM
S89
F89
S101
F101
S102
F102
S90
F90
S91
F91
S103
F103
S104
F104
S92
F92
CM
CM
S105
F105
S106
F106
S107
F107
S95
F95
S108
F108
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
S73
F73
S85
F85
S74
F74
S75
F75
S87
F87
S76
F76
S77
F77
CM
CM
S88
F88
S78
F78
S79
F79
S93
F93
CM
CM
S80
F80
S81
F81
S94
F94
S82
F82
S83
F83
S96
F96
S84
F84
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
S133
F133
S122
F122
S134
F134
S135
F135
S136
F136
CM
CM
S125
F125
S137
F137
S138
F138
S126
F126
S127
F127
S139
F139
S140
F140
S128
F128
CM
CM
S141
F141
S142
F142
S143
F143
S131
F131
S144
F144
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
S109
F109
S121
F121
S110
F110
S111
F111
S123
F123
S112
F112
S113
F113
CM
CM
S124
F124
S114
F114
S115
F115
S129
F129
CM
CM
S116
F116
S117
F117
S130
F130
S118
F118
S119
F119
S132
F132
S120
F120
NC
Not Connected
CM
Common I/O
Sn
Standard I/O of pixel n
Fn
Fast output of pixel n
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21
ArrayC Series
ARRAYX-BOB3-144P
(ARRAYC-30035-144P Breakout Board)
The ARRAYX-BOB3-144P is an evaluation board
allowing easy access to the signals from a
ON Semiconductor ARRAYC-30035-144P, 3 mm 12 x 12
SiPM array.
The Breakout Board is comprised of four Samtec 80-way
connectors, type QSE-040-01-F-D-A. These connectors
mate with the Samtec QTE-040-03-FD- A board-to-board
connector on the array. Since the connectors are keyed,
orientating the array on the BOB is straightforward.
All signals on the array are routed via the mating
connectors to header pins. These pins are formed by eight
50-way (25 x 2 row) 2.54 mm pitch headers.
Three SMA connectors and Balun transformers are
provided with 4-pin headers to allow any signal to be
connected directly to the SMA or via the transformer using
jumper wires. Four 7 mm holes are placed on a 25 mm grid
to allow mounting of the board on an optical breadboard.
The layout of the board is shown in Figure 10.
See Appendices A and B for examples of Breakout Board
usage.
Figure 10. Layout of the ARRAYX-BOB3-144P. The board dimensions are 112 mm x 112 mm
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22
ArrayC Series
Table 5. HEADER SIGNALS ON THE ARRAYX-BOB3-144P
Pin
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
J1
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
CM
S25
S14
S26
S27
S28
S17
S29
S30
S18
S19
S31
S32
S20
S33
S34
S35
S23
S36
NC
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
CM
S133
S122
S134
S135
S136
S125
S137
S138
S126
S127
S139
S140
S128
S141
S142
S143
S131
S144
NC
Pin
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
J2
CM
F25
F14
F26
F27
F28
F17
F29
F30
F18
F19
F31
F32
F20
F33
F34
F35
F23
F36
NC
CM
S52
S40
S39
S49
S54
S65
S64
S62
S61
S88
S76
S85
S75
S97
S98
S100
S101
S90
NC
CM
F133
F122
F134
F135
F136
F125
F137
F138
F126
F127
F139
F140
F128
F141
F142
F143
F131
F144
NC
CM
S43
S44
S58
S47
S48
S67
S56
S70
S59
S79
S80
S84
S83
S94
S95
S106
S92
S103
NC
J13
NC
Not Connected
CM
Common I/O
Sn
Standard I/O of pixel n
Fn
Fast output of pixel n
J7
CM
F52
F40
F39
F49
F54
F65
F64
F62
F61
F88
F76
F85
F75
F97
F98
F100
F101
F90
NC
CM
S1
S13
S2
S3
S15
S4
S5
S16
S6
S7
S21
S8
S9
S22
S10
S11
S24
S12
NC
CM
F43
F44
F58
F47
F48
F67
F56
F70
F59
F79
F80
F84
F83
F94
F95
F106
F92
F103
NC
CM
S109
S121
S110
S111
S123
S112
S113
S124
S114
S115
S129
S116
S117
S130
S118
S119
S132
S120
NC
J15
CM
S42
S41
S51
S38
S37
S66
S53
S63
S50
S78
S77
S73
S74
S87
S86
S99
S89
S102
NC
CM
F109
F121
F110
F111
F123
F112
F113
F124
F114
F115
F129
F116
F117
F130
F118
F119
F132
F120
NC
CM
S57
S45
S46
S60
S55
S68
S69
S71
S72
S93
S81
S96
S82
S108
S107
S105
S104
S91
NC
J16
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23
J8
CM
F1
F13
F2
F3
F15
F4
F5
F16
F6
F7
F21
F8
F9
F22
F10
F11
F24
F12
NC
CM
F42
F41
F51
F38
F37
F66
F53
F63
F50
F78
F77
F73
F74
F87
F86
F99
F89
F102
NC
J18
CM
F57
F45
F46
F60
F55
F68
F69
F71
F72
F93
F81
F96
F82
F108
F107
F105
F104
F91
NC
ArrayC Series
Biasing and Readout from the Standard Breakout
Boards
addition, each SMA has a balun transformer in close
proximity for impedance matching of the fast signals, shown
in Figure 13. To interface signals from the array to the SMA
connectors, there is a 4-pin header, shown in Figures 11 and
12. The pins are labelled; Fin, Fout, I (Inner) and O (Outer).
• Fin provides the input to the balun transformer.
• Fout is the output of the balun transformer.
• I provides direct connection to the inner part of the
SMA connector.
• O provides direct connection to the outer part of the
SMA connector.
The purpose of the Breakout Boards is to allow easy
access to either standard or fast I/O from individual pixels
for testing purposes. It should be stressed that the breakout
boards are for evaluation purposes only and do not allow for
full readout of all pixels simultaneously.
The various Breakout Boards described in this document
have features in common. All pixel fast and standard signals
are brought out to headers. The header pins can be interfaced
with the SMA connectors with the option of routing the
signal via a balun transformer. The common I/O consists of
all of the substrate connections summed together. It is not
recommended to apply the bias to the common I/O.
The Breakout Boards are each shipped with 3 x shunt
jumpers and 6 x 10 cm wire cables (3 x red, 3 x black) with
crimp sockets at each end.
All header pins are suitable for use with wire wrapping in
addition to the jumpers and crimp socket leads supplied.
The ‘NC’ signals are unconnected pins that can be used for
prototyping.
Balun Transformer
The Balun transformer (RFMD RFXF9503) allows
impedance matching of the fast output signal to the readout
electronics. For a customer considering their own design,
the Balun is not required if the readout amplifiers are placed
in close proximity to the sensor pixels of the array.
For optimized timing performance, the impedance
matching and signal propagation from the SiPM sensor to
the readout electronics must be carefully considered.
SMA Connector
Each Breakout Board has three SMA connectors that can
be used for supplying bias voltage and accessing signals. In
Figure 11. (right) photo and (left) schematic of the BOB SMA, balun transformer and
4-pin header arrangement.
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24
ArrayC Series
RFMD RFXF9503
JX
Fin
SG
Fout
SMA Output
I
SG
O
SG
SG = Local signal ground
Each SMT/Balun/4 Way Header circuits has its own local signal ground
Figure 12. Schematic of the 4-pin header and balun transformer
EMI Considerations
For a system design, it is recommended that the customer
consider shielding of all lines. The readout requirements for
a SiPM are similar to that of a PMT and similar care should
be taken with both sensor types. In comparison to an APD
which has significantly lower gain than a SiPM, the SiPM
will provide much improved resistance to EMI due to the
higher gain of the SiPM sensor.
It has been shown that the EMI (Electromagnetic
Interference) can be picked up on the unshielded wires on
the BOB. It is recommended that customers who experience
excessive EMI seek to reduce the EMI in their lab, ideally
at the EMI source. If this is not possible then improved
shielding should be used. In all cases, testing of the SiPM
sensor should be performed in total darkness.
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25
ArrayC Series
APPENDIX A - EXAMPLE OF USING THE BREAKOUT BOARD TO READOUT FAST SIGNALS
The Figure 13 shows the ARRAYX-BOB6-64P set up for readout of fast signals from pixel 49
Figure 13. Example of an ARRAYC-60035-64P connected to an ARRAYX-BOB664P for the readout of the fast signal from pixel 49.
To access the fast output from pixel 49, the F49 header pin
is then connected to the Fin of SMA2. This is the input to the
balun transformer for impedance matching of the fast
signals. Fout (the output of the balun transformer) is then
connected via a shunt jumper to the inner (“I”) of SMA2,
with the outer (“O”) again connected to the common cathode
(“C”). The schematic of the balun transformer is shown in
Figure 12. The fast output from SMA2 will need
amplification if the signal amplitudes are small.
Here, SMA1 is used for supplying Vbias and SMA2 for
reading out the fast output from pixel 49. In this example an
ARRAYC-60035-64P is assumed and so the “S” (standard
I/O) is the anode.
To bias the array, the inner (“I”) of SMA1 is connected to
the S49 header pin. The cathode is common to all pixels and
is connected via a “C” pin on the header to the outer (“O”)
of SMA1. Refer to Figure 1 for signal connections for the
C-Series array. Vbias is then applied to SMA1, which for an
ArrayC sensors has a negative polarity with respect to the
common cathode.
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26
ArrayC Series
APPENDIX B - EXAMPLE OF USING THE BREAKOUT BOARD TO READOUT STANDARD SIGNALS
The Figure 14 shows the ARRAYX-BOB6-64P set up for readout of standard signals (anode-cathode) from pixel 49.
−ve bias
50
10 nF
0V
Figure 14. Example of an ARRAYC-60035-64P connected to an ARRAYX-BOB6-64P for the readout of
the standard (anode-cathode) signal from pixel 49 (left), with simplified readout schematic (right).
To access the standard output, the S49 header pin is then
connected to the inner (“I”) of SMA2 via a decoupling
capacitor of 10 nF. The outer (“O”) of SMA 2 is again
connected to the common cathode (“C”). The standard
signal is then available from SMA2.
Here, SMA 1 is used for supplying Vbias and SMA2 for
reading out the standard output from pixel 49. In this
example an ARRAYC-60035-64P is assumed and so the “S”
(standard I/O) is the anode.
To bias the array, the inner (“I”) of SMA1 is connected to
the S49 (anode) header pin via a load resistor of 50 Ω. The
cathode is common to all pixels and is connected via a “C”
pin on the header to the outer (“O”) of SMA1. Vbias is then
applied to SMA1, which for an ArrayC sensors has a
negative polarity with respect to the common cathode.
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27
ArrayC Series
APPENDIX C - EXAMPLE OF USING THE SUMMED BREAKOUT BOARD
The Figure 15 shows the ARRAYX-BOB6-64S set up for readout of all of the pixels summed together.
−ve bias
50
10 nF
0V
Figure 15. Example of an ARRAYC-60035-64P connected to an ARRAYX-BOB6-64S for the summed
readout of all of the pixels (left), with simplified readout schematic (right).
Vbias is then applied to SMA1, which for an ArrayC has a
negative polarity with respect to the common.
To access the summed standard output, the second SM
header pin is then connected to the inner (“I”) of SMA2 via
a decoupling capacitor of 10 nF. The outer (“O”) of SMA2
is again connected to the common cathode (“CM”). The
summed signal is then available from SMA2.
SMA 1 is used for supplying Vbias and SMA2 for reading
out the summed standard output from all pixels in the
ARRAYC-60035-64P.
To bias the array, the inner (“I”) of SMA1 is connected to
the SM (summed anode) pin on the same header, via a load
resistor of 50 . The cathode is also common to all pixels and
is connected via a “CM” pin to the outer (“O”) of SMA1.
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28
ArrayC Series
ORDERING INFORMATION
Microcell Size
(Total Number per Pixel)
Product Code
Array Size
I/O Interface
2x2
BGA
8x8
Connector
4x4
Connector
12 x 12
Connector
6 mm Sensor Arrays
ARRAYC-60035-4P-BGA
ARRAYC-60035-64P-PCB
35 mm (18,980 microcells)
3 mm Sensor ARRAYs
ARRAYC-30035-16P-PCB
35 mm (4,774 microcells)
ARRAYC-30035-144P-PCB
Optional Breakout Boards
ARRAYX-BOB6-64P-GEVK
Breakout board with connectors for use with the 8 x 8 arrays of 6 mm pixels
ARRAYX-BOB3-16P-GEVK
Breakout board with connectors for use with the 4 x 4 arrays of 3 mm pixels
ARRAYX-BOB3-144P-GEVK
Breakout board with connectors for use with the 12 x 12 arrays of 3 mm pixels
Optional Summed Breakout Boards
ARRAYX-BOB6-64S-GEVK
Summed breakout board for use with the 8 x 8 array of 6 mm pixels
ARRAYX-BOB6-16S-GEVK
Summed breakout board for use with the 4 x 4 array of 3 mm pixels
Evaluation Board with ARRAYC Permanently Attached
ARRAYC-60035-4P-GEVB
Evaluation board with a permanently attached 2 x 2 array of 6 mm pixels
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