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BAS31 — Small Signal Diode
BAS31
Small Signal Diode
Connection Diagram
3
3
3
L21
2
1
1
2
1
2
SOT-23
Ordering Information
Part Number
Top Mark
Package
Packing Method
BAS31
L21
SOT-23 3L
Tape and Reel, 7 inch Reel, 3000 pcs
BAS31-D87Z
L21
SOT-23 3L
Tape and Reel, 13 inch Reel, 10000 pcs
Absolute Maximum Ratings(1), (2)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Value
Unit
VRRM
Maximum Repetitive Reverse Voltage
120
V
IF(AV)
Average Rectified Forward Current
200
mA
IFSM
Non-Repetitive Peak Forward
Surge Current
TSTG
Storage Temperature Range
TJ
Operating Junction Temperature
Pulse Width = 1.0 second
1.0
Pulse Width = 1.0 microsecond
2.0
A
-55 to +150
°C
150
°C
Notes:
1. These ratings are based on a maximum junction temperature of 150°C.
2. These are steady-state limits. ON Semiconductor should be consulted on applications involving pulsed or lowduty-cycle operations.
© 2001 Semiconductor Components Industries, LLC.
August-2017, Rev. 2
Publication Order Number:
BAS31/D
Values are at TA = 25°C unless otherwise noted.
Symbol
PD
RθJA
Parameter
Value
Unit
Power Dissipation
350
mW
Thermal Resistance, Junction-to-Ambient
357
°C/W
Electrical Characteristics
Values are at TA = 25°C unless otherwise noted.
Symbol
VR
VF
Parameter
Breakdown Voltage
Forward Voltage
Conditions
IR = 1.0 mA
Min.
Max.
120
Unit
V
IF = 10 mA
750
mV
IF = 50 mA
840
mV
IF = 100 mA
900
mV
IF = 200 mA
1.00
V
IF = 400 mA
1.25
V
VR = 90 V
100
nA
VR = 90 V, TA = 150°C
100
μA
IR
Reverse Current
CT
Total Capacitance
VR = 0, f = 1.0 MHz
35
pF
trr
Reverse Recovery Time
IF = IR = 30 mA, IRR = 3.0 mA,
RL = 100 Ω
50
ns
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2
BAS31 — Small Signal Diode
Thermal Characteristics
BAS31 — Small Signal Diode
IR - REVERSE CURRENT (nA)
325
Ta= 25°C
300
275
3
5
10
20
30
50
I R - REVERSE CURRENT (uA)
IIRR - REVERSE CURRENT (nA)
100
Ta= 25°C
80
70
60
50
40
30
20
180
200
220
240
VR - REVERSE VOLTAGE (V)
30
20
10
0
55
255
400
350
300
250
725
Ta= 25°C
700
650
600
550
500
10
Figure 5. Forward Voltage vs. Forward Current
VF - 0.1 to 10 mA
2
3
5
10
20 30
50
IF - FORWARD CURRENT (uA)
100
Figure 4. Forward Voltage vs. Forward Current
VF - 1.0 to 100 μA
VVFF - FORWARD VOLTAGE (mV)
VVF F - FORWARD VOLTAGE (mV)
Ta= 25°C
450
1
Figure 3. Reverse Current vs. Reverse Voltage
IR - 180 to 255 V
0.2 0.3 0.5
1
2
3
5
I F - FORWARD CURRENT (mA)
75
95
115 135 155 175 195
V R - REVERSE VOLTAGE (V)
Figure 2. Reverse Current vs. Reverse Voltage
IR - 55 to 205 V
GENERAL RULE: The Reverse Current of a diode will approximately
double for every ten Degree C increase in Temperature
450
0.1
Ta= 25°C
40
GENERAL RULE: The Reverse Current of a diode will approximately
double for every ten (10) Degree C increase in Temperature
Figure 1. Reverse Voltage vs. Reverse Current
BV - 1.0 to 100 μA
90
50
100
V
VFF - FORWARD VOLTAGE (mV)
VVRR - REVERSE VOLTAGE (V)
Typical Performance Characteristics
1.4
Ta= 25°C
1.3
1.2
1.1
1
0.9
0.8
0.7
10
20
30
50
100
200 300
IF - FORWARD CURRENT (mA)
500
800
Figure 6. Forward Voltage vs. Forward Current
VF - 10 to 800 mA
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3
BAS31 — Small Signal Diode
1.3
Ta= -40°C
600
Ta= 25°C
400
Ta= +80°C
1.2
1.1
1
0.9
200
0.8
0.001 0.003 0.01 0.03 0.1 0.3
1
I F - FORWARD CURRENT (mA)
3
10
500
I - CURRENT (mA)
50
40
30
20
0
IF = IR = 30 mA
Rloop = 100 Ohms
1
1.5
2
2.5
Irr - REVERSE RECOVERY CURRENT (mA)
3
Figure 9. Reverse Recovery Time vs.
Reverse Recovery Current (Irr)
400
300
100
0
0
PD - POWER DISSIPATION (mW)
SOT-23 Pkg
100
50
100
150
IO - AVERAGE TEMPERATURE ( oC)
14 15
-F
OR
WA
RD
CU
RR
EN
TS
TE
AD
50
100
150
o
TA - AMBIENT TEMPERATURE ( C)
Figure 10. Average Rectified Current(IO) and
Forward Current (IF) vs. Ambient Temperature(TA)
300
0
12
Y
Io - A
ST
VER
AT
AGE
E
REC
-m
TIFIE
D CU
A
RRE
NT mA
200
400
0
4
6
8
10
REVERSE VOLTAGE (V)
IR
500
200
2
Figure 8. Capacitance vs. Reverse Voltage
Figure 7. Forward Voltage vs. Ambient Temperature
VF - 1.0 μA - 10 mA (- 40 to +80°C)
REVERSE RECOVERY (nS)
Ta= 25°C
800
CAPACITANCE (pF)
VVFF - FORWARD VOLTAGE (mV)
Typical Performance Characteristics (Continued)
200
Figure 11. Power Derating Curve
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4
0.95
2.92±0.20
3
1.40
1.30+0.20
-0.15
1
2.20
2
0.60
0.37
(0.29)
0.95
0.20
1.00
A B
1.90
1.90
LAND PATTERN
RECOMMENDATION
SEE DETAIL A
1.20 MAX
0.10
0.00
(0.93)
0.10
C
C
2.40±0.30
NOTES: UNLESS OTHERWISE SPECIFIED
GAGE PLANE
0.23
0.08
0.25
0.20 MIN
(0.55)
SEATING
PLANE
A) REFERENCE JEDEC REGISTRATION
TO-236, VARIATION AB, ISSUE H.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE INCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M - 1994.
E) DRAWING FILE NAME: MA03DREV10
SCALE: 2X
Figure 12. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE
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5
BAS31 — Small Signal Diode
Physical Dimensions
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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