BGM220P Wireless Gecko Bluetooth
Module Data Sheet
The BGM220P is a module designed and built to meet the performance, security, and reliability requirements of battery-powered
IoT products running on Bluetooth networks.
Based on the EFR32BG22 SoC, the BGM220P enables Bluetooth® Low Energy connectivity while delivering best-in-class RF range and performance, future-proof capability for
feature and OTA firmware updates, enhanced security features, and low energy consumption.
BGM220P modules are a full solution that comes with fully-upgradeable, robust software
stacks, world-wide regulatory certifications, advanced development and debugging
tools, and support that will minimize and simplify the engineering and development of
your end-products helping to accelerate their time-to-market.
The BGM220P is intended for a broad range of applications, including:
• Asset Tags and Beacons
• Sports, Fitness, and Wellness devices
• Portable Medical
• Connected Home
• Industrial and Building Automation
• Bluetooth mesh Low Power Node
Crystals
Core / Memory
ARM CortexTM M33 processor
with DSP extensions,
FPU and TrustZone
ETM
Debug Interface
38.4 MHz
Flash Program
Memory
LDMA
Controller
RAM Memory
32.768
kHz
KEY FEATURES
• Bluetooth 5.2
• Bluetooth mesh Low Power Node
• Built-in antenna
• Up to 8 dBm TX power
• -98.9 dBm BLE RX sensitivity at 1 Mbps
• 32-bit ARM Cortex-M33 core at up to 76.8
MHz
• 512/32 kB of Flash/RAM memory
• Optimal selection of MCU peripherals
• Up to 25 GPIO pins
• 12.9 mm x 15.0 mm
Clock Management
HF Crystal
Oscillator
HF
RC Oscillator
Fast Startup
RC Oscillator
LF RC
Oscillator
LF Crystal
Oscillator
Ultra LF RC
Oscillator
Energy
Management
Security
Voltage
Regulator
DC-DC
Converter
Crypto Acceleration
Power-On
Reset
Brown-Out
Detector
True Random
Number Generator
32-bit bus
Peripheral Reflex System
Antenna
Chip Antenna
Matching
Radio Subsystem
RFSENSE
w/ OOK Detect
DEMOD
RX/TX Frontend
with Integrated
+8 dBm PA
IFADC
AGC
Frequency
Synthesizer
MOD
Serial
Interfaces
ARM CortexTM
M0+ Radio
Controller
I/O Ports
Timers and Triggers
Analog I/F
USART
External
Interrupts
Timer/
Counter
Protocol
Timer
ADC
BUFC RAM
PDM
General
Purpose I/O
Low Energy
Timer
Watchdog
Timer
Temperature
Sensor
FRC
EUART
Pin Reset
Real Time
Capture
Counter
Back-Up Real
Time Counter
CRC
I2C
Pin Wakeup
Lowest power mode with peripheral operational:
EM0—Active
EM1—Sleep
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EM2—Deep Sleep
EM3—Stop
EM4—Shutoff
Rev. 1.0
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Feature List
1. Feature List
• Supported Protocols
• Bluetooth Low Energy (Bluetooth 5.2)
• Direction finding
• 1M, 2M and LE Coded PHYs
• Bluetooth Mesh Low Power Node
• Wireless System-on-Chip
• 2.4 GHz radio
• TX power up to +8 dBm
• High-performance 32-bit ARM Cortex-M33® with DSP instruction and floating-point unit for efficient signal processing
• 512 kB flash program memory
• 32 kB RAM data memory
• Embedded Trace Macrocell (ETM) for advanced debugging
• High-Receiver Performance
• -106.7 dBm sensitivity (0.1% BER) at 125 kbps GFSK
• -102.5 dBm sensitivity (0.1% BER) at 500 kbps GFSK
• -98.9 dBm sensitivity (0.1% BER) at 1 Mbps GFSK
• -96.2 dBm sensitivity (0.1% BER) at 2 Mbps GFSK
• Low-Energy Consumption
• 4.3 mA RX current at 1 Mbps GFSK
• 4.8 mA TX current at 0 dBm output power
• 10.6 mA TX current at 8 dBm output power
• 26 µA/MHz in Active Mode (EM0)
• 1.40 μA EM2 DeepSleep current (RTCC running from
LFXO, Full RAM retention)
• Regulatory Certifications
• FCC
• CE
• IC/ISEDC
• MIC/TELEC
• KCC
• Wide Operating Range
• 1.8 to 3.8 V
• -40 to +105°C
• Dimensions
• 12.9 mm x 15.0 mm x 2.2 mm
• Security Features
• Secure Boot with Root of Trust and Secure Loader (RTSL)
• Hardware Cryptographic Acceleration for AES128/256,
SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA,
and ECDH
• True Random Number Generator (TRNG) compliant with
NIST SP800-90 and AIS-31
• ARM® TrustZone®
• Secure Debug with lock/unlock
• Wide Selection of MCU Peripherals
• Analog to Digital Converter (ADC)
• 12-bit @ 1 Msps
• 16-bit @ 76.9 ksps
• Up to 25 General Purpose I/O pins with output state retention and asynchronous interrupts
• 8 Channel DMA Controller
• 12 Channel Peripheral Reflex System (PRS)
• 4 × 16-bit Timer/Counter with 3 Compare/Capture/PWM
channels
• 1 × 32-bit Timer/Counter with 3 Compare/Capture/PWM
channels
• 32-bit Real Time Counter
• 24-bit Low Energy Timer for waveform generation
• 1 × Watchdog Timer
• 2 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
• 1 × Enhanced Universal Asynchronous Receiver/Transmitter (EUART)
• 2 × I2C interface with SMBus support
• Digital microphone interface (PDM)
• RFSENSE with selective OOK mode
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Rev. 1.0 | 2
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Ordering Information
2. Ordering Information
Table 2.1. Ordering Information
Antenna
RF
Shield
Bluetooth 5.2
8 dBm
• Direction finding
Built-in
Bluetooth 5.2
Built-in
Ordering Code
Protocol Stack
BGM220PC22HNA2
BGM220PC22WGA2
TX Power
Rating
8 dBm
Flash
(kB)
RAM
(kB)
LF Clock
GPIO
Temp Range
Yes
512
32
Crystal
24
-40 to 105 °C
Yes
352
32
Precision
LFRCO
25
-40 to 85 °C
Note:
1. LE Long Range (125 kbps and 500 kbps) PHYs are only supported on part numbers which include direction-finding capability.
2. End-product manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with
the formal certification test reports.
3. Devices are pre-programmed with BGAPI UART DFU bootloader v1.10.2.
4. Throughout this document, the devices in the table above may be referred to by their product family name (e.g. BGM220P), by
model name (BGM220P22A), or by full ordering code.
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Rev. 1.0 | 3
Table of Contents
1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 Block Diagram .
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3.2 EFR32BG22 SoC .
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3.3 Antenna .
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3.4 Power Supply .
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4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Absolute Maximum Ratings.
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4.2 General Operating Conditions .
4.2.1 DC-DC Operating Limits .
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.10
4.3 MCU Current Consumption with 3 V Supply .
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.11
4.4 Radio Current Consumption with 3 V Supply .
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4.5 RF Transmitter General Characteristics for the 2.4 GHz Band .
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4.6 RF Receiver General Characteristics for the 2.4 GHz Band .
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.14
4.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate .
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.15
4.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate .
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.16
4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate .
.17
4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate .
.18
4.11 High-Frequency Crystal
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.19
4.12 Low-Frequency Crystal .
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.19
4.13 Precision Low Frequency RC Oscillator (LFRCO) .
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.19
4.14 GPIO Pins .
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.20
4.15 Microcontroller Peripherals
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.21
4.16 Typical Performance Curves . . . .
4.16.1 Antenna Radiation and Efficiency .
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.21
.22
5. Reference Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . .
23
5.1 Network Co-Processor (NCP) Application with UART Host .
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.23
5.2 SoC Application
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.24
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6. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.1 31-Pin PCB Module With LF Crystal Device Pinout .
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.25
6.2 31-Pin PCB Module With Precision LFRCO Device Pinout .
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.27
6.3 Alternate Function Table.
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.28
6.4 Analog Peripheral Connectivity
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.29
6.5 Digital Peripheral Connectivity .
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.30
silabs.com | Building a more connected world.
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Rev. 1.0 | 4
7. Design Guidelines
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.1 Layout and Placement .
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.33
7.2 Proximity to Other Materials
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.34
7.3 Proximity to Human Body .
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.34
8. Package Specifications
8.1 Dimensions .
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.35
8.2 PCB Land Pattern .
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.36
8.3 Package Marking .
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.37
9. Soldering Recommendations
10. Tape and Reel
. . . . . . . . . . . . . . . . . . . . . . . . 38
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
11. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
11.1 Qualified Antennas .
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11.2 EU - CE .
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11.3 USA - FCC .
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11.4 ISED Canada .
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.43
11.5 Proximity to Human Body .
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11.6 Japan - MIC
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.46
11.7 South Korea - KC
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.47
11.8 Bluetooth Qualification .
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.47
12. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
48
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Rev. 1.0 | 5
BGM220P Wireless Gecko Bluetooth Module Data Sheet
System Overview
3. System Overview
3.1 Block Diagram
The BGM220P module combines an energy-friendly MCU with a highly integrated radio transceiver in a PCB module with a robust,
integrated antenna. This section gives a short introduction to the features of the module.
The block diagram for the BGM220P module is shown in Figure 3.1 BGM220P Block Diagram on page 6. The wireless module includes the EFR32BG22 wirelss System on a Chip (SoC), required decoupling capacitors and inductors, 38.4 MHz and 32.768 kHz crystals, RF matching circuit, and integrated chip antenna.
1.8 - 3.8 V
2400 – 2483.5 MHz
Antenna
VDD
Supply Decoupling
and DC-DC Support
RF Match
Silicon Labs
EFR32BG22
HF XTAL
38.4 MHz
LF XTAL*
32.768 kHz
(up to 25)
RF SHIELD
GPIO
GND
*LF XTAL included in BGM220PC22HNAx
Figure 3.1. BGM220P Block Diagram
A simplified internal schematic for the BGM220P module is shown in Figure 3.2 BGM220P Module Schematic on page 6.
EFR32BG22
VDD
VREGVDD
IOVDD
AVDD
4.7µF
VREGSW
2.2µH
RF2G4_IO
PA0x
PB0x
PC0x
PD0x
PD01
DVDD
RFVDD
PAVDD
4.7µF
2.2µF
DECOUPLE
Matching
Network
PD00
HFXTAL_I
HFXTAL_O
PAx (0-8)
PBx (0-4)
PCx (0-7)
PDx (2-3)
32.768 kHz
PD01
(BGM220xxxxWGAx only)
(BGM220xxxxHNAx only)
38.4 MHz
Figure 3.2. BGM220P Module Schematic
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Rev. 1.0 | 6
BGM220P Wireless Gecko Bluetooth Module Data Sheet
System Overview
3.2 EFR32BG22 SoC
The EFR32BG22 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 512 kB of flash memory, a rich set
of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG22 Wireless Gecko Reference
Manual and the EFR32BG22 Data Sheet for details.
3.3 Antenna
BGM220P modules include a ceramic chip antenna on board with the characteristics detailed in the table below.
Table 3.1. Antenna Efficiency and Peak Gain
Parameter
With optimal layout Note
Efficiency
-1 dB
Peak gain
1.86 dBi
Antenna efficiency, gain and radiation pattern are highly dependent on the application PCB layout and mechanical design. Refer
to Design Guidelines for recommendations to achieve optimal antenna performance.
3.4 Power Supply
The BGM220P requires a single nominal supply level of 3.0 V to operate. All necessary decoupling and filtering components are included in the module.
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Rev. 1.0 | 7
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4. Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
• Typical values are based on TA=25 °C and VDD supply at 3.0 V, by production test and/or technology characterization.
• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,
unless stated otherwise.
4.1 Absolute Maximum Ratings
Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of
the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
Parameter
Symbol
Storage temperature range
Min
Typ
Max
Unit
TSTG
-40
—
+105
°C
Voltage on VDD supply pin
VDDMAX
-0.3
—
3.8
V
Voltage ramp rate on VDD
supply pin
VDDRAMPMAX
—
—
1.0
V / µs
DC voltage on any GPIO pin
VDIGPIN
-0.3
—
VVDD + 0.3
V
Total current into VDD pin
IVDDMAX
Source
—
—
200
mA
Total current into GND pin
IGNDMAX
Sink
—
—
200
mA
Current per I/O pin
IIOMAX
Sink
—
—
50
mA
Source
—
—
50
mA
Sink
—
—
200
mA
Source
—
—
200
mA
Current for all I/O pins
IIOALLMAX
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Test Condition
Rev. 1.0 | 8
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.2 General Operating Conditions
This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum
values of all other tables are specifed over this operating range, unless otherwise noted.
Table 4.2. General Operating Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Operating ambient temperature range
TA
-G temperature grade
-40
—
+85
°C
-N temperature grade
-40
—
+105
°C
VDD operating supply voltage
VVDD
DCDC in regulation1
2.2
3.0
3.8
V
DCDC in bypass
1.8
3.0
3.8
V
VSCALE2, MODE = WS1
—
—
76.8
MHz
VSCALE2, MODE = WS0
—
—
40
MHz
VSCALE1, MODE = WS0
—
—
40
MHz
VSCALE2
—
—
50
MHz
VSCALE1
—
—
40
MHz
VSCALE2
—
—
76.8
MHz
VSCALE1
—
—
40
MHz
VSCALE2
—
—
76.8
MHz
VSCALE1
—
—
40
MHz
VSCALE2 or VSCALE1
—
38.4
—
MHz
HCLK and SYSCLK frequen- fHCLK
cy
PCLK frequency
fPCLK
EM01 Group A clock frequency
fEM01GRPACLK
EM01 Group B clock frequency
fEM01GRPBCLK
Radio HCLK frequency
fRHCLK
Note:
1. The supported maximum VVDD in regulation mode is a function of temperature and 10-year lifetime average load current. See
more details in 4.2.1 DC-DC Operating Limits.
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Rev. 1.0 | 9
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.2.1 DC-DC Operating Limits
The maximum supported voltage on the VDD supply pin is limited under certain conditions. Maximum input voltage is a function of temperature and the average load current over a 10-year lifetime. Figure 4.1 Lifetime average load current limit vs. Maximum input voltage
on page 10 shows the safe operating region under specific conditions. Exceeding this safe operating range may impact the reliability
and performance of the DC-DC converter.
Average Lifetime ILOAD (mA)
The average load current for an application can typically be determined by examining the current profile during the time the device is
powered. For example, an application that is continuously powered which spends 99% of the time asleep consuming 2 µA and 1% of
the time active and consuming 10 mA has an average lifetime load current of about 102 µA.
60
Tj ≤ 105 °C
5
3.3
Maximum VVDD (V)
3.8
Figure 4.1. Lifetime average load current limit vs. Maximum input voltage
Maximum ILOAD (mA)
The minimum input voltage for the DC-DC in EM0/EM1 mode is a function of the maximum load current, and the peak current setting.
Figure 4.2 Transient maximum load current vs. Minimum input voltage on page 10 shows the max load current vs. input voltage for
different DC-DC peak inductor current settings.
60
36
IPEAK = 150 mA
IPEAK = 90 mA
5
1.8
2.2
Minimum VVDD (V)
Figure 4.2. Transient maximum load current vs. Minimum input voltage
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Rev. 1.0 | 10
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.3 MCU Current Consumption with 3 V Supply
Unless otherwise indicated, typical conditions are: Module supply voltage = 3.0 V. Voltage scaling level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C.
Table 4.3. MCU Current Consumption with 3 V Supply
Parameter
Symbol
Current consumption in EM0 IACTIVE
mode with all peripherals disabled
Current consumption in EM1 IEM1
mode with all peripherals disabled
Current consumption in EM2 IEM2_VS
mode, VSCALE0
Current consumption in EM3 IEM3_VS
mode, VSCALE0
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Test Condition
Min
Typ
Max
Unit
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running while loop from flash,
VSCALE2
—
27
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running CoreMark loop from flash,
VSCALE2
—
37
—
µA/MHz
38.4 MHz crystal, CPU running
Prime from flash
—
28
—
µA/MHz
38.4 MHz crystal, CPU running
while loop from flash
—
26
—
µA/MHz
38.4 MHz crystal, CPU running
CoreMark loop from flash
—
38
—
µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
—
22
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running Prime from flash,
VSCALE2
—
28
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal,
VSCALE2
—
17
—
µA/MHz
38.4 MHz crystal
—
17
—
µA/MHz
38 MHz HFRCO
—
13
—
µA/MHz
Full RAM retention and RTC running from LFXO
—
1.40
—
µA
Full RAM retention and RTC running from LFRCO
—
1.40
—
µA
Full RAM retention and RTC running from LFRCO in precision
mode
—
1.75
—
µA
24 kB RAM retention and RTC
running from LFXO
—
1.32
—
µA
24 kB RAM retention and RTC
running from LFRCO in precision
mode
—
1.66
—
µA
8 kB RAM retention and RTC running from LFXO
—
1.21
—
µA
8 kB RAM retention and RTC running from LFRCO
—
1.20
—
µA
8 kB RAM retention and RTC running from ULFRCO
—
1.05
—
µA
Rev. 1.0 | 11
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
Parameter
Symbol
Current consumption in EM4 IEM4
mode
Additional current in EM2 or
EM3 when any peripheral in
PD0B is enabled1
Test Condition
No BURTC, No LF Oscillator,
DCDC bypassed
IPD0B_VS
Min
Typ
Max
Unit
—
0.17
—
µA
—
0.37
—
µA
Note:
1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the
peripherals in each power domain.
4.4 Radio Current Consumption with 3 V Supply
RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across
process variation at TA = 25 °C.
Table 4.4. Radio Current Consumption with 3 V Supply
Parameter
Symbol
System current consumption IRX_ACTIVE
in receive mode, active packet reception
System current consumption IRX_LISTEN
in receive mode, listening for
packet
System current consumption ITX
in transmit mode
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Test Condition
Min
Typ
Max
Unit
125 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.5
—
mA
500 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.5
—
mA
1 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.3
—
mA
2 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.8
—
mA
125 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.4
—
mA
500 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.4
—
mA
1 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.2
—
mA
2 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.7
—
mA
f = 2.4 GHz, CW, 0 dBm output
power
—
4.8
—
mA
f = 2.4 GHz, CW, 6 dBm output
power
—
8.8
—
mA
f = 2.4 GHz, CW, 8 dBm output
power
—
10.6
—
mA
Rev. 1.0 | 12
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.5 RF Transmitter General Characteristics for the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.5. RF Transmitter General Characteristics for the 2.4 GHz Band
Parameter
Symbol
RF tuning frequency range
FRANGE
Maximum TX power1
POUTMAX
Minimum active TX Power
Output power variation vs
VDD supply voltage variation, frequency = 2450 MHz
Output power variation vs
temperature, Frequency =
2450 MHz
POUTMIN
POUTVAR_V
POUTVAR_T
Output power variation vs RF POUTVAR_F
frequency
Test Condition
Min
Typ
Max
Unit
2400
—
2483.5
MHz
8 dBm output power
—
8.2
—
dBm
6 dBm output power
—
6.4
—
dBm
0 dBm output power
—
0.3
—
dBm
8 dBm output power
—
-27
—
dBm
6 dBm output power
—
-27
—
dBm
0 dBm output power
—
-28
—
dBm
8 dBm output power with VDD
voltage swept from 1.8 V to 3.0 V
—
0.04
—
dB
6 dBm output power with VDD
voltage swept from 1.8 V to 3.0 V
—
0.04
—
dB
0 dBm output power, with VDD
voltage swept from 1.8 to 3.0 V
—
0.04
—
dB
8 dBm output power, (-40 to +105
°C)
—
0.9
—
dB
6 dBm output power, (-40 to +105
°C)
—
0.3
—
dB
0 dBm output power, (-40 to +105
°C)
—
1.3
—
dB
8 dBm output power, (-40 to +85
°C)
—
0.8
—
dB
6 dBm output power, (-40 to +85
°C)
—
0.4
—
dB
0 dBm output power, (-40 to +85
°C)
—
1.0
—
dB
8 dBm output power
—
0.2
—
dB
6 dBm output power
—
0.2
—
dB
0 dBm output power
—
0.2
—
dB
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices covered in this data sheet can be found in the Max TX Power column of the Ordering Information Table.
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Rev. 1.0 | 13
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.6 RF Receiver General Characteristics for the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.6. RF Receiver General Characteristics for the 2.4 GHz Band
Parameter
Symbol
RF tuning frequency range
FRANGE
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Test Condition
Min
Typ
Max
Unit
2400
—
2483.5
MHz
Rev. 1.0 | 14
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.7. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-98.9
—
dBm
Signal is reference signal, 255
byte payload1
—
-97.4
—
dBm
With non-ideal signals3 1
—
-96.9
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
8.7
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 5 4 6
—
-6.6
—
dB
Interferer is reference signal at -1
MHz offset1 5 4 6
—
-6.5
—
dB
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-40.9
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-39.9
—
dB
Interferer is reference signal at +3
MHz offset1 5 4 6
—
-45.9
—
dB
Interferer is reference signal at -3
MHz offset1 5 4 6
—
-46.2
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-23.5
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 6
—
-40.9
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 6
—
-6.6
—
dB
n = 3 (see note7)
—
-17.1
—
dBm
Intermodulation performance IM
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -67 dBm.
5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
6. With allowed exceptions.
7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4
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Rev. 1.0 | 15
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.8. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-96.2
—
dBm
Signal is reference signal, 255
byte payload1
—
-94.6
—
dBm
With non-ideal signals3 1
—
-94.4
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
8.8
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-9.2
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-6.6
—
dB
Interferer is reference signal at +4
MHz offset1 5 4 6
—
-43.3
—
dB
Interferer is reference signal at -4
MHz offset1 5 4 6
—
-44.0
—
dB
Interferer is reference signal at +6
MHz offset1 5 4 6
—
-48.6
—
dB
Interferer is reference signal at -6
MHz offset1 5 4 6
—
-50.7
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-23.8
—
dB
Selectivity to image frequency ± 2 MHz
C/IIM_1
Interferer is reference signal at image frequency +2 MHz with 1
MHz precision1 6
—
-43.3
—
dB
Interferer is reference signal at image frequency -2 MHz with 1 MHz
precision1 6
—
-9.2
—
dB
n = 3 (see note7)
—
-18.8
—
dBm
Intermodulation performance IM
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -64 dBm.
5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
6. With allowed exceptions.
7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4
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Rev. 1.0 | 16
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.9. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-102.5
—
dBm
Signal is reference signal, 255
byte payload1
—
-101.2
—
dBm
With non-ideal signals3 1
—
-100.2
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
2.7
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 5 4 6
—
-8.0
—
dB
Interferer is reference signal at -1
MHz offset1 5 4 6
—
-7.9
—
dB
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-46.5
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-49.9
—
dB
Interferer is reference signal at +3
MHz offset1 5 4 6
—
-48.9
—
dB
Interferer is reference signal at -3
MHz offset1 5 4 6
—
-53.8
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-48.3
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 6
—
-49.9
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 6
—
-46.5
—
dB
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -72 dBm.
5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
6. With allowed exceptions.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.10. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-106.7
—
dBm
Signal is reference signal, 255
byte payload1
—
-106.4
—
dBm
With non-ideal signals3 1
—
-105.8
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
0.9
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 5 4 6
—
-13.6
—
dB
Interferer is reference signal at -1
MHz offset1 5 4 6
—
-13.4
—
dB
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-52.6
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-55.8
—
dB
Interferer is reference signal at +3
MHz offset1 5 4 6
—
-53.7
—
dB
Interferer is reference signal at -3
MHz offset1 5 4 6
—
-59.0
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-52.7
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 6
—
-53.7
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 6
—
-52.6
—
dB
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -79 dBm.
5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
6. With allowed exceptions.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.11 High-Frequency Crystal
Table 4.11. High-Frequency Crystal
Parameter
Symbol
Crystal frequency
Test Condition
Min
Typ
Max
Unit
fHFXTAL
—
38.4
—
MHz
Initial calibrated accuracy
ACCHFXTAL
-10
+/-5
10
ppm
Temperature drift
DRIFTHFXTAL
-20
—
20
ppm
Min
Typ
Max
Unit
—
32.768
—
kHz
-40 °C to +85 °C
-100
—
100
ppm
-40 °C to +105 °C
-150
—
150
ppm
Min
Typ
Max
Unit
—
32.768
—
kHz
-3
—
3
%
-500
—
500
ppm
Normal mode
—
204
—
µs
Precision mode1
—
11.7
—
ms
Normal mode
—
175
—
nA
Precision mode1, T = stable at 25
°C 3
—
655
—
nA
Across specified temperature
range
4.12 Low-Frequency Crystal
Table 4.12. Low-Frequency Crystal
Parameter
Symbol
Crystal frequency1
fLFXTAL
Temperature drift
DRIFTLFXTAL
Test Condition
Note:
1. Nominal frequency tolerance of the crystal is ± 20 ppm.
4.13 Precision Low Frequency RC Oscillator (LFRCO)
Table 4.13. Precision Low Frequency RC Oscillator (LFRCO)
Parameter
Symbol
Nominal oscillation frequency
FLFRCO
Frequency accuracy
FLFRCO_ACC
Test Condition
Normal mode
Precision mode1, across operating temperature range2
Startup time
Current consumption
tSTARTUP
ILFRCO
Note:
1. The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4.
2. Includes ± 40 ppm frequency tolerance of the HFXO crystal.
3. Includes periodic re-calibration against HFXO crystal oscillator.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.14 GPIO Pins
Unless otherwise indicated, typical conditions are: VDD = 3.0 V.
Table 4.14. GPIO Pins
Parameter
Symbol
Test Condition
Leakage current
ILEAK_IO
Input low voltage1
VIL
Input high voltage1
Hysteresis of input voltage
VIH
VHYS
Min
Typ
Max
Unit
MODEx = DISABLED, VDD = 3.0
V
—
2.5
—
nA
Any GPIO pin
—
—
0.3 * VDD
V
RESETn
—
—
0.3 * DVDD
V
0.7 * VDD
—
—
V
RESETn
0.7 * DVDD
—
—
V
Any GPIO pin
0.05 * VDD
—
—
V
0.05 *
DVDD
—
—
V
Sinking 20mA, VDD = 3.0 V
—
—
0.2 * VDD
V
Sinking 8mA, VDD = 1.62 V
—
—
0.4 * VDD
V
Sourcing 20mA, VDD = 3.0 V
0.8 * VDD
—
—
V
Sourcing 8mA, VDD = 1.62 V
0.6 * VDD
—
—
V
VDD = 3.0V, Cload = 50pF, SLEWRATE = 4, 10% to 90%
—
8.4
—
ns
VDD = 1.7V, Cload = 50pF, SLEWRATE = 4, 10% to 90%
—
13
—
ns
VDD = 3.0V, Cload = 50pF, SLEWRATE = 4, 90% to 10%
—
7.1
—
ns
VDD = 1.7V, Cload = 50pF, SLEWRATE = 4, 90% to 10%
—
11.9
—
ns
GPIO pull-up to VDD: MODEn =
DISABLE, DOUT=1. GPIO pulldown to VSS: MODEn = WIREDORPULLDOWN, DOUT = 0.
RESETn pin pull-up to DVDD.
35
44
55
kΩ
MODE = INPUT, DOUT = 1
—
27
—
ns
Any GPIO pin
RESETn
Output low voltage
Output high voltage
GPIO rise time
GPIO fall time
Pull up/down resistance
VOL
VOH
TGPIO_RISE
TGPIO_FALL
RPULL
Maximum filtered glitch width TGF
Note:
1. GPIO input thresholds are proportional to the VDD pin. RESETn input thresholds are proportional to the internal DVDD supply,
which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC
is inactive.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.15 Microcontroller Peripherals
The MCU peripherals set available in BGM220P modules includes:
• ADC: 12-bit at 1 Msps, 16-bit at 76.9 ksps
• 16-bit and 32-bit Timers/Counters
• 24-bit Low Energy Timer for waveform generation
• 32-bit Real Time Counter
• USART (UART/SPI/SmartCards/IrDA/I2S)
• EUART (UART/IrDA)
• I2C peripheral interfaces
• PDM interface
• 12 Channel Peripheral Reflex System
For details on their electrical performance, consult the relevant portions of Section 4 in the SoC datasheet.
To learn which GPIO ports provide access to every peripheral, consult Analog Peripheral Connectivity and Digital Peripheral Connectivity.
4.16 Typical Performance Curves
Typical performance curves indicate typical characterized performance under the stated conditions.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Electrical Characteristics
4.16.1 Antenna Radiation and Efficiency
Typical BGM220P radiation patterns and efficiency for the on-board chip antenna under optimal operating conditions are plotted in the
figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the
module is mounted on, as well as on the proximity of any mechanical design to the antenna.
Figure 4.3. Typical 2D Antenna Radiation Patterns and Efficiency
Top Left: Phi 0o, Top Right: Phi 90o, Bottom Left: Theta 90o, Bottom Right: Radiation Efficiency vs Application Board GND Plane Width
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Rev. 1.0 | 22
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Reference Diagrams
5. Reference Diagrams
5.1 Network Co-Processor (NCP) Application with UART Host
The BGM220P can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, programming/debug interface, and host interface connections are shown in the figure below. For more details, refer to AN958: Debugging
and Programming Interfaces for Custom Designs.
SWO (PA03)
SWCLK (PA01)
PTI_DATA (PC04)
PC07
PB02
PC06
PB01
PC05
PB00
PC04
PA02
PC01
SWO
PA03
PC00
PA04
*PD01
VDD
GND
PD02
PC02
SWDIO
PD03
PC03
PA01
PA08
PA00
SWCLK
PA07
Mini Simplicity Debug Connector
PB03
PA06
2
4
6
8
10
RESETn
PA05
SWDIO (PA02)
PTI_FRAME (PC05)
1
3
5
7
9
GND
PB04
VDD
RESETn
BGM220P
GND
VDD
GND
RESETn
PTI_FRAME
PTI_DATA
(recommended)
*PD01 available only on
select models
VDD
VDD
GPIO
Host CPU
RESETn
RX
TX
GND
CTS
RTS
Figure 5.1. UART NCP Configuration
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Reference Diagrams
5.2 SoC Application
The BGM220P can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and programming/debug interface connections are shown in the figure below. For more details, refer to AN958: Debugging and Programming Interfaces for Custom Designs.
BGM220P
GND
GND
RESETn
PB04
RESETn
PB03
PC07
PB02
PC06
PB01
PC05
PB00
PC04
PTI_DATA
PA00
PC03
(recommended)
GND
PD02
*PD01
PD03
PC00
PA04
PA08
PA03
PA07
PC01
SWO
PA06
PC02
PA02
PA05
PA01
VDD
SWCLK
SWDIO
GND
PTI_FRAME
*PD01 available only on
select models
VDD
VDD
RESETn
SWDIO (PA02)
PTI_FRAME (PC05)
1
3
5
7
9
2
4
6
8
10
SWO (PA03)
SWCLK (PA01)
PTI_DATA (PC04)
Mini Simplicity Debug Connector
Figure 5.2. Stand-Alone SoC Configuration
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
6. Pin Definitions
6.1 31-Pin PCB Module With LF Crystal Device Pinout
Figure 6.1. 31-Pin PCB Module With LF Crystal Device Pinout
The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see 6.3 Alternate Function Table, 6.4 Analog Peripheral Connectivity, and 6.5 Digital Peripheral
Connectivity.
Table 6.1. 31-Pin PCB Module With LF Crystal Device Pinout
Pin Name
Pin(s)
Description
Pin Name
Pin(s)
Description
GND
1
Ground
PB04
2
GPIO
PB03
3
GPIO
PB02
4
GPIO
PB01
5
GPIO
PB00
6
GPIO
PA00
7
GPIO
PA01
8
GPIO
PA02
9
GPIO
PA03
10
GPIO
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
Pin Name
Pin(s)
Description
Pin Name
Pin(s)
Description
PA04
11
GPIO
GND
12
Ground
VDD
13
Power supply
PA05
14
GPIO
PA06
15
GPIO
PA07
16
GPIO
PA08
17
GPIO
PD03
18
GPIO
PD02
19
GPIO
GND
20
Ground
NC
21
Do not connect
PC00
22
GPIO
PC01
23
GPIO
PC02
24
GPIO
PC03
25
GPIO
PC04
26
GPIO
PC05
27
GPIO
PC06
28
GPIO
30
Reset Pin. The RESETn pin is pulled up
to an internal DVDD supply. An external
pull-up is not recommended. To apply
an external reset source to this pin, it is
required to only drive this pin low during
reset, and let the internal pull-up ensure
that reset is released. The RESETn pin
can be left unconnected if no external
reset switch or source is used.
PC07
29
GPIO
GND
31
Ground
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RESETn
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
6.2 31-Pin PCB Module With Precision LFRCO Device Pinout
Figure 6.2. 31-Pin PCB Module With Precision LFRCO Device Pinout
The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see 6.3 Alternate Function Table, 6.4 Analog Peripheral Connectivity, and 6.5 Digital Peripheral
Connectivity.
Table 6.2. 31-Pin PCB Module With Precision LFRCO Device Pinout
Pin Name
Pin(s)
Description
Pin Name
Pin(s)
Description
GND
1
Ground
PB04
2
GPIO
PB03
3
GPIO
PB02
4
GPIO
PB01
5
GPIO
PB00
6
GPIO
PA00
7
GPIO
PA01
8
GPIO
PA02
9
GPIO
PA03
10
GPIO
PA04
11
GPIO
GND
12
Ground
VDD
13
Power supply
PA05
14
GPIO
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
Pin Name
Pin(s)
Description
Pin Name
Pin(s)
Description
PA06
15
GPIO
PA07
16
GPIO
PA08
17
GPIO
PD03
18
GPIO
PD02
19
GPIO
GND
20
Ground
PD01
21
GPIO
PC00
22
GPIO
PC01
23
GPIO
PC02
24
GPIO
PC03
25
GPIO
PC04
26
GPIO
PC05
27
GPIO
PC06
28
GPIO
30
Reset Pin. The RESETn pin is pulled up
to an internal DVDD supply. An external
pull-up is not recommended. To apply
an external reset source to this pin, it is
required to only drive this pin low during
reset, and let the internal pull-up ensure
that reset is released. The RESETn pin
can be left unconnected if no external
reset switch or source is used.
PC07
29
GPIO
GND
31
Ground
RESETn
6.3 Alternate Function Table
A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows what functions are
available on each device pin.
Table 6.3. GPIO Alternate Function Table
GPIO
Alternate Function
PB03
GPIO.EM4WU4
PB01
GPIO.EM4WU3
PB00
IADC0.VREFN
PA00
IADC0.VREFP
PA01
GPIO.SWCLK
PA02
GPIO.SWDIO
PA03
GPIO.SWV
GPIO.TDO
PA04
GPIO.TDI
GPIO.TRACECLK
PA05
GPIO.EM4WU0
PD02
GPIO.EM4WU9
PC00
GPIO.EM4WU6
PC05
GPIO.EM4WU7
PC07
GPIO.EM4WU8
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GPIO.TRACEDATA0
GPIO.THMSW_EN
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
6.4 Analog Peripheral Connectivity
Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative
inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the
device Reference Manual for more details on the ABUS and analog peripherals.
Table 6.4. ABUS Routing Table
Peripheral
IADC0
Signal
PA
PB
PC
PD
EVEN
ODD
EVEN
ODD
EVEN
ODD
EVEN
ODD
ana_neg
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
ana_pos
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
6.5 Digital Peripheral Connectivity
Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port.
Table 6.5. DBUS Routing Table
Peripheral.Resource
PORT
PA
PB
PC
PD
CMU.CLKIN0
Available
Available
CMU.CLKOUT0
Available
Available
CMU.CLKOUT1
Available
Available
CMU.CLKOUT2
Available
Available
EUART0.CTS
Available
Available
Available
Available
EUART0.RTS
Available
Available
Available
Available
EUART0.RX
Available
Available
Available
Available
EUART0.TX
Available
Available
Available
Available
FRC.DCLK
Available
Available
FRC.DFRAME
Available
Available
FRC.DOUT
Available
Available
I2C0.SCL
Available
Available
Available
Available
I2C0.SDA
Available
Available
Available
Available
I2C1.SCL
Available
Available
I2C1.SDA
Available
Available
LETIMER0.OUT0
Available
Available
LETIMER0.OUT1
Available
Available
MODEM.ANT0
Available
Available
Available
Available
MODEM.ANT1
Available
Available
Available
Available
MODEM.ANT_ROLL_OVER
Available
Available
MODEM.ANT_RR0
Available
Available
MODEM.ANT_RR1
Available
Available
MODEM.ANT_RR2
Available
Available
MODEM.ANT_RR3
Available
Available
MODEM.ANT_RR4
Available
Available
MODEM.ANT_RR5
Available
Available
MODEM.ANT_SW_EN
Available
Available
MODEM.ANT_SW_US
Available
Available
MODEM.ANT_TRIG
Available
Available
MODEM.ANT_TRIG_STOP
Available
Available
MODEM.DCLK
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Available
Available
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
Peripheral.Resource
PORT
PA
PB
PC
PD
MODEM.DIN
Available
Available
MODEM.DOUT
Available
Available
PDM.CLK
Available
Available
Available
Available
PDM.DAT0
Available
Available
Available
Available
PDM.DAT1
Available
Available
Available
Available
PRS.ASYNCH0
Available
Available
PRS.ASYNCH1
Available
Available
PRS.ASYNCH10
Available
Available
PRS.ASYNCH11
Available
Available
PRS.ASYNCH6
Available
Available
PRS.ASYNCH7
Available
Available
PRS.ASYNCH8
Available
Available
PRS.ASYNCH9
Available
Available
PRS.ASYNCH2
Available
Available
PRS.ASYNCH3
Available
Available
PRS.ASYNCH4
Available
Available
PRS.ASYNCH5
Available
Available
PRS.SYNCH0
Available
Available
Available
Available
PRS.SYNCH1
Available
Available
Available
Available
PRS.SYNCH2
Available
Available
Available
Available
PRS.SYNCH3
Available
Available
Available
Available
TIMER0.CC0
Available
Available
Available
Available
TIMER0.CC1
Available
Available
Available
Available
TIMER0.CC2
Available
Available
Available
Available
TIMER0.CDTI0
Available
Available
Available
Available
TIMER0.CDTI1
Available
Available
Available
Available
TIMER0.CDTI2
Available
Available
Available
Available
TIMER1.CC0
Available
Available
Available
Available
TIMER1.CC1
Available
Available
Available
Available
TIMER1.CC2
Available
Available
Available
Available
TIMER1.CDTI0
Available
Available
Available
Available
TIMER1.CDTI1
Available
Available
Available
Available
TIMER1.CDTI2
Available
Available
Available
Available
TIMER2.CC0
Available
Available
TIMER2.CC1
Available
Available
TIMER2.CC2
Available
Available
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
Peripheral.Resource
PORT
PA
PB
PC
PD
TIMER2.CDTI0
Available
Available
TIMER2.CDTI1
Available
Available
TIMER2.CDTI2
Available
Available
TIMER3.CC0
Available
Available
TIMER3.CC1
Available
Available
TIMER3.CC2
Available
Available
TIMER3.CDTI0
Available
Available
TIMER3.CDTI1
Available
Available
TIMER3.CDTI2
Available
Available
TIMER4.CC0
Available
Available
TIMER4.CC1
Available
Available
TIMER4.CC2
Available
Available
TIMER4.CDTI0
Available
Available
TIMER4.CDTI1
Available
Available
TIMER4.CDTI2
Available
Available
USART0.CLK
Available
Available
Available
Available
USART0.CS
Available
Available
Available
Available
USART0.CTS
Available
Available
Available
Available
USART0.RTS
Available
Available
Available
Available
USART0.RX
Available
Available
Available
Available
USART0.TX
Available
Available
Available
Available
USART1.CLK
Available
Available
USART1.CS
Available
Available
USART1.CTS
Available
Available
USART1.RTS
Available
Available
USART1.RX
Available
Available
USART1.TX
Available
Available
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Design Guidelines
7. Design Guidelines
7.1 Layout and Placement
For optimal performance of the BGM220P,
•
•
•
•
•
Place the module aligned to the edge of the application PCB, as illustrated in the figures below.
Leave the antenna clearance area void of any traces, components, or copper on all layers of the application PCB.
Connect all ground pads directly to a solid ground plane.
Place the ground vias as close to the ground pads as possible.
Avoid plastic or any other dielectric material in contact with the antenna.
Align module edge with PCB edge
GND
Place vias close to
each of the
module’s GND pads
Antenna Clearance
No metal in this area
GND
Wireless Module
(Top View)
GND
GND
Place vias along all PCB edges
Figure 7.1. Recommended Layout for BGM220P
The figure below illustrates layout scenarios that will lead to severely degraded RF performance for the module.
Copper
Clearance
Area
GND plane width
X
Figure 7.2. Non-Optimal Layout Examples
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Design Guidelines
The width of the GND plane to the sides the module will impact the efficiency of the on-board chip antenna. To achieve optimal performance, a GND plane width of 50 mm is recommended. See 4.16.1 Antenna Radiation and Efficiency for reference.
7.2 Proximity to Other Materials
Avoid plastic or any other dielectric material in contact with the antenna. Conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region, but this will also negatively impact antenna efficiency and reduce range.
Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB
ground planes.
7.3 Proximity to Human Body
Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Package Specifications
8. Package Specifications
8.1 Dimensions
Figure 8.1. Module Dimensions
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Package Specifications
8.2 PCB Land Pattern
Figure 8.2. Recommended Land Pattern
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Package Specifications
8.3 Package Marking
The figure below shows the module markings engraved on the RF shield.
Figure 8.3. BGM220P Top Marking
Mark Description
The package marking consists of:
• BGM220Pxxxxxxx - Part number designation
• Model: BGM220Pxxx - Model number designation
• QR Code: YYWWMMABCDE
• YY – Last two digits of the assembly year.
• WW – Two-digit workweek when the device was assembled.
• MMABCDE – Silicon Labs unit code
• YYWWTTTTTT
• YY – Last two digits of the assembly year.
• WW – Two-digit workweek when the device was assembled.
• TTTTTT – Manufacturing trace code. The first letter is the device revision.
• Certification marks such as the CE logo, FCC and IC IDs, etc will be engraved on the grayed out area, according to regulatory body
requirements.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Soldering Recommendations
9. Soldering Recommendations
It is recommended that final PCB assembly of the BGM220P follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface
mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements.
CLASS 1 General Electronic Products
Includes products suitable for applications where the major requirement is function of the completed assembly.
CLASS 2 Dedicated Service Electronic Products
Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not
critical. Typically the end-use environment would not cause failures.
CLASS 3 High Performance/Harsh Environment Electronic Products
Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated,
end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical
systems.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Tape and Reel
10. Tape and Reel
BGM220P modules are delivered to the customer in cut tape (100 pcs) or reel (1000 pcs) packaging with the dimensions below. All
dimensions are given in mm unless otherwise indicated.
Figure 10.1. Carrier Tape Dimensions
Figure 10.2. Reel Dimensions
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Certifications
11. Certifications
This section details the regulatory certification status of the module in various regions.
The address for the module manufacturer and certification applicant is:
SILICON LABORATORIES FINLAND OY
Alberga Business Park, Bertel Jungin aukio 3,
02600 Espoo, Finland
11.1 Qualified Antennas
BGM220P modules have been tested and certified with the on-board chip antenna. Performance characteristics for the chip antenna
are presented in Table 3.1 Antenna Efficiency and Peak Gain on page 7 and 4.16.1 Antenna Radiation and Efficiency.
11.2 EU - CE
The BGM220P modules are in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU).
Please note that every application using the BGM220P module will need to perform the radio EMC tests on the end product, according
to EN 301 489-17.
It is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product as a whole. The specific product assembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF radiated testing with the
end-product assembly.
A formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/.
11.3 USA - FCC
This device complies with Part 15 of the FCC Rules when operating with the embedded antenna. Operation is subject to the following
two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.
FCC RF Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance.
This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s)
exposed in the RF Exposure Analysis.
This transmitter also meets the Portable requirements at distances equal or above those listed for convenience in Table 11.1 Minimum
Separation Distances for SAR Evaluation Exemption on page 45.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC
multi-transmitter product procedures.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Certifications
OEM Responsibilities to comply with FCC Regulations
This module has been tested for compliance to FCC Part 15.
OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot
checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accordance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01.
• General Considerations
This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement. However, such requirement is typically applicable to the final host. Thus, the final host will still need to be reassessed for compliance to this portion of rule requirements, if applicable.
• Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end-user regarding how to install or remove this RF module in
the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warnings as shown in this manual.
• OEM/Host Manufacturer Responsibilities
OEM / Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US
market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the FCC
rules. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and
combined equipment.
Separation
• To meet the SAR exemption for portable conditions, the minimum separation distance indicated in Table 11.1 Minimum Separation
Distances for SAR Evaluation Exemption on page 45 must be maintained between the human body and the radiator (antenna) at
all times.
• This transmitter module is tested in a standalone mobile RF exposure condition, and in case of any co-located radio transmitter being allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the
exceptions rules to be applied, a separate additional SAR evaluation will be required, ultimately leading to a Class II Permissive
Change, or more rarely to a new grant.
• Important Note: In the event that these conditions cannot be met, then for the FCC authorization to remain valid the final product
will have to undergo additional testing to evaluate the RF exposure, and a permissive change will have to be applied. The evaluation
(SAR) is in the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with the
help of the customer's own Telecommunication Certification Body typically acting as the grant holder’s agent.
End Product Labeling
BGM220P modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside another device,
then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case,
the final end product must be labeled in a visible area with the following:
"Contains Transmitter Module FCC ID: QOQ-GM220P"
Or
"Contains FCC ID: QOQ-GM220P"
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
As long as all conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for
testing their end-product for any additional compliance requirements required with this module installed.
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Rev. 1.0 | 41
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Certifications
Class B Device Notice
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC
Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio / TV technician for help.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Certifications
11.4 ISED Canada
ISED
This radio transmitter (IC: 5123A-GM220P) has been approved by Innovation, Science and Economic Development Canada (ISED
Canada, formerly Industry Canada) to operate with the embedded antenna and with the antenna type(s) listed in 11.1 Qualified Antennas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain
listed, are strictly prohibited for use with this device.
This device complies with ISED’s license-exempt RSS standards. Operation is subject to the following two conditions:
1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device
RF Exposure Statement
Exception from routine SAR evaluation limits are given in RSS-102 Issue 5.
The module meets the given requirements when the minimum separation distance to human body is as indicated in Table 11.1 Minimum Separation Distances for SAR Evaluation Exemption on page 45.
RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above those stated in
Table 11.1 Minimum Separation Distances for SAR Evaluation Exemption on page 45. If the separation distance is less than stated in
Table 11.1 Minimum Separation Distances for SAR Evaluation Exemption on page 45. the OEM integrator is responsible for evaluating the SAR.
OEM Responsibilities to comply with IC Regulations
The module has been certified for integration into products only by OEM integrators under the following conditions:
• The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (antenna) and all persons at all times.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.
Important Note: In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate
the RF exposure in order for the ISED authorization to remain valid, and a permissive change will have to be applied with the help of
the customer's own Telecommunication Certification Body typically acting as the certificate holder’s agent.
End Product Labeling
The BGM220P module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then
the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the
final end product must be labeled in a visible area with the following:
“Contains Transmitter Module IC: 5123A-GM220P ”
or
“Contains IC: 5123A-GM220P”
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
As long as all the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital
device emissions, PC peripheral requirements, etc.).
CAN ICES-003 (B)
This Class B digital apparatus complies with Canadian ICES-003.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Certifications
ISEDC (Français)
Le présent émetteur radio (IC: 5123A-GM220P) a été approuvé par Innovation, Sciences et Développement Économique Canada (ISED Canada, anciennement Industrie Canada) pour fonctionner avec l'antenne intégrée et le ou les types d'antenne énumérés à la section 11.1 Qualified Antennas, avec le gain maximal admissible indiqué. Les types d'antenne non inclus dans cette liste, ayant un gainsupérieur au gain maximal indiqué, sont strictement interdits d'utilisation avec cet appareil. .
Ce composant est conforme aux normes RSS, exonérées de licence d'ISED. Son mode de fonctionnement est soumis aux deux conditions suivantes:
1. Ce composant ne doit pas générer d’interférences.
2. Ce composant doit pouvoir être soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement.
Déclaration d'exposition RF
L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5.
Les modèles BGM220P respectent les exigences d’exemption prévues lorsque la distance de séparation minimale entre le(s) antenne(s) et le corps humain est conforme aux valeurs indiquées dans le Table 11.1 Minimum Separation Distances for SAR Evaluation
Exemption on page 45.
La déclaration d’exposition RF ou l'évaluation DAS n'est pas nécessaire lorsque la distance de séparation est identique ou supérieure à
celle indiquée ci-dessus. Si la distance de séparation est inférieure à celle mentionnées plus haut, il incombe à l'intégrateur OEM de
procédé à une évaluation DAS.
La déclaration d’exposition RF ou l'évaluation SAR n'est pas nécessaire lorsque la distance de séparation est identique ou supérieure à
celle indiquée ci-dessus. Si la distance de séparation est inférieure à celle mentionnées plus haut, il incombe à l'intégrateur OEM de
procédé à une évaluation SAR.
Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré
Le module a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions suivantes:
• L'antenne doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur
(antenne) et toutes les personnes avoisinante, ce à tout moment.
• Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée
plus haut.
Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Cependant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pourrait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de périphériques PC, etc.).
Remarque Importante:Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation
avec un autre émetteur), l'autorisation ISED n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être
apposé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le
transmetteur) et de l'obtention d'une autorisation ISED distincte.
Étiquetage des produits finis
Les modules BGM220P sont étiquetés avec leur propre ID IC. Si l'ID IC n'est pas visible lorsque le module est intégré au sein d'un
autre produit, cet autre produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module
intégré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes:
“Contient le module transmetteur: 5123A-GM220P ”
or
“Contient le circuit: 5123A-GM220P”
L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer
ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio.
CAN ICES-003 (B)
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
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Rev. 1.0 | 44
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Certifications
11.5 Proximity to Human Body
When using the module in an application where the radio is located close to the human body, the human RF exposure must be evaluated. FCC, ISED, and CE all have different standards for evaluating the RF exposure, and because of this, each standard requires a
different minimum separation distance between the module and human body. Certification of BGM220P allows for the minimum separation distances detailed in the table below in portable use cases (less than 20 cm from human body). The module is approved for the
mobile use case (more than 20 cm) without any need for RF exposure evaluation.
Table 11.1. Minimum Separation Distances for SAR Evaluation Exemption
Certification
BGM220P22A
FCC
Bluetooth LE: 0 mm
ISED
Bluetooth LE: 14 mm
CE
The RF exposure must always be evaluated using the end-product when transmitting with power
levels higher than 20 mW (13 dBm).
For FCC and ISED, using the module in end-products where the separation distance from the human body is smaller than that listed
above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a Class 2 Permissive Change or
Change of ID to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the endproduct in all cases when transmitting at more than the power level indicated in the table.
Note: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a
reduced range is to be expected.
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BGM220P Wireless Gecko Bluetooth Module Data Sheet
Certifications
11.6 Japan - MIC
The BGM220P22A are certified in Japan with certification number 020-200011.
It is the end-product manufacturer's responsibility to ensure that the module is configured to meet the limits documented in the formal
certification test report available at https://www.silabs.com/. If needed, refer to the API reference manual(s) to learn how to configure
the maximum RF TX power for the normal operations.
Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host
equipment places the certification mark and certification number on the outside of the host equipment. This combination of mark and
number, and their relative placement, is depicted in figure 11.1, and depending on the size of the module it might also appear on the top
shield markings of the radio module. The certification mark and certification number must be placed close to the text in the Japanese
language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host
and radio module to verify if they are actually using a radio device which is approved for use in Japan
Certification Text to be Placed on the Outside Surface of the Host Equipment:
Translation of the text:
“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under
the Radio Law.”
The "Giteki" marking shown in the figures below must be affixed to an easily noticeable section of the specified radio equipment.
Note that additional information may be required if the device is also subject to a telecom approval.
Figure 11.1. GITEKI Mark and ID
Figure 11.2. GITEKI Mark
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Rev. 1.0 | 46
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Certifications
11.7 South Korea - KC
The BGM220P22A modules have a RF certification for import and use in South-Korea.
Certification number is: R-R-BGT-GM220P
When integrating the RF-certified module, an end-product is exempted from doing the RF emission testing, as long as the recommended design guidance is followed, and the approved antennas are used.
EMC testing, and any other relevant test, might still be required for full compliance.
11.8 Bluetooth Qualification
The BGM220P modules come with a pre-qualified RF-PHY component having Declaration ID of D044525 and QDID of 146980.
This component can be combined with the latest Link Layer and Host pre-qualified components when in the process of qualifying the
end-product via the SIG’s Launch Studio.
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Rev. 1.0 | 47
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Revision History
12. Revision History
Revision 1.0
June, 2020
• Figure 3.1 BGM220P Block Diagram on page 6: Clarified that LF XTAL only included in BGM220PC22HNAx device.
• Updated 4.2.1 DC-DC Operating Limits to relax lifetime safe operating region.
• Updated 5. Reference Diagrams to mark PTI interface as recommended in figures.
• Updated 4. Electrical Characteristics with latest characterization results and limits.
• Updated 11. Certifications with final certification details.
Revision 0.5
March, 2020
•
•
•
•
•
•
•
•
•
Updated 4. Electrical Characteristics with latest characterization results.
In the front page block diagram, updated the lowest energy mode for LETIMER.
Update part numbers in 2. Ordering Information to reflect new ordering code scheme.
In 2. Ordering Information, added note about referencing by family, model, or ordering code.
Added supply voltage, crystal frequencies and RF frequencies to Figure 3.1 BGM220P Block Diagram on page 6.
Added certification sections: 11.8 Bluetooth Qualification, 11.6 Japan - MIC and 11.7 South Korea - KC.
Updated 8.3 Package Marking with latest revision.
Added section 10. Tape and Reel.
Added section 5. Reference Diagrams.
Revision 0.1
August, 2019
Initial release.
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Rev. 1.0 | 48
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