BLM18HB121SN1D

Spec. No. JENF243A-0004P-01 Reference Only P1/8 GHz Noise Suppression Chip Ferrite Bead BLM18H□□□□SN1□ Reference Specification 1. Scope This reference specification applies to Chip Ferrite Bead BLM18H_SN Series. 2. Part Numbering (ex.) BL M 18 HG 601 S N 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz (6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk) 3. Rating Customer Part Number MURATA Part Number Impedance () (Under Standard Testing Condition) Rated Current (mA) at 1GHz at Typical 85℃ at 100MHz BLM18HE601SN1D BLM18HE601SN1B BLM18HE102SN1D BLM18HE102SN1B BLM18HE152SN1D BLM18HE152SN1B BLM18HG471SN1D BLM18HG471SN1B BLM18HG601SN1D BLM18HG601SN1B BLM18HG102SN1D BLM18HG102SN1B BLM18HD471SN1D BLM18HD471SN1B BLM18HD601SN1D BLM18HD601SN1B BLM18HD102SN1D BLM18HD102SN1B BLM18HB121SN1D BLM18HB121SN1B BLM18HB221SN1D BLM18HB221SN1B BLM18HB331SN1D BLM18HB331SN1B BLM18HK331SN1D BLM18HK331SN1B BLM18HK471SN1D BLM18HK471SN1B BLM18HK601SN1D BLM18HK601SN1B BLM18HK102SN1D BLM18HK102SN1B (Note) 600±25% 300 min. 600 1000±25% 500 min. 1000 at 125℃ *1 *1 800 600 *1 *1 600 500 *1 *1 500 400 DC Resistance ( max. ) Remark Initial Values Values After Testing 0.25 0.30 0.35 For 0.40 Large Current 0.50 0.55 0.95 1500±25% 750 min. 1500 470±25% 400 min. 600 200 0.85 600±25% 450 min. 700 200 1.0 For 1.1 general use 1000±25% 750 min. 1000 100 1.6 1.7 470±25% 700 min. 1000 100 1.2 1.3 600±25% 850 min. 1200 100 1.5 1.6 1000±25% 1100 min. 1700 50 1.8 120±25% 500±40% 200 0.5 1.9 For high speed 0.6 signal line 220±25% 1100±40% 100 0.8 0.9 330±25% 1600±40% 50 1.2 1.3 330±25% 400±40% 200 0.5 0.6 470±25% 600±40% 200 0.7 600±25% 700±40% 100 0.9 0.8 For Digital 1.0 Interface 1000±25% 1200±40% 50 1.5 1.6   Operating Temperature : -55°C to +125°C  Storage Temperature : -55°C to +125°C MURATA MFG.CO., LTD. Reference Only R a te d C u rre n t ( A ) Spec. No. JENF243A–0004N-01 (Note) As for the Rated current marked with *1, Rated Current is derated as right figure depending on the operating temperature. P 2/ 8 Rated current at 85°C Rated current at 125°C 0 85 125 Operating Temperature (°C) 4. Style and Dimensions 1.6±0.15 0.8±0.15 0.8±0.15 ■ Equivalent Circuit 0.4±0.2 ( Resistance element becomes dominant at high frequencies. ) : Electrode ■ Unit Mass (Typical value) 0.005g (in mm) 5. Marking No marking. 6. Standard Testing Conditions  Unless otherwise specified  Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) 7. Specifications 7-1. Electrical Performance No. Item Specification 7-1-1 Impedance Meet item 3. 7-1-2 DC Resistance Meet item 3. 7-2. Mechanical Performance No. Item Specification 7-2-1 Appearance and Meet item 4. Dimensions 7-2-2 Bonding Meet Table 1. Strength Table 1 Appearance No damage Impedance Change Within ±30% (at 100MHz) DC Meet item 3. Resistance  In case of doubt  Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa Test Method Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz Measuring Equipment : Agilent 4291A or the equivalent Test Fixture : Agilent 16192A or the equivalent Measuring Equipment : Digital multi meter Test Method Visual Inspection and measured with Slide Calipers. It shall be soldered on the substrate. Applying Force(F) : 6.8N Applying Time : 5s±1s Applied direction:Parallel to substrate Side view Ｆ Ｆ R0.5 Substrate MURATA MFG CO., LTD. Spec. No. JENF243A–0004N-01 No. Item 7-2 ｰ 3Bending Strength Reference Only Specification Meet Table 1. P 3/ 8 Test Method It shall be soldered on the substrate. Substrate: Glass-epoxy 100mm40mm1.0mm Deflection : 2.0mm Speed of Applying Force : 0.5mm/s Keeping Time : 30s Pressure jig R340 F Deflection 45mm 7-2 ｰ 4Vibration 7-2-5 Resistance to Soldering Heat 7-2 ｰ 6Drop Products shall be no failure after tested. 7-2-7 Solderability The electrodes shall be at least 95% covered with new solder coating. 7-3. Environmental Performance It shall be soldered on the substrate. No. Item Specification 7-3-1 Temperature Meet Table 1. Cycle 7-3-2 Humidity 45mm Product It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) Pre-Heating : 150°C±10°C, 60s∼90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270°C±5°C Immersion Time : 10s±0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 48h±4h. It shall be dropped on concrete or steel board. Method : free fall Height : 75cm Attitude from which the product is dropped : 3 direction The number of times : 3 times for each direction (Total 9 times) Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C±10°C, 60s∼90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 3s±1s Immersion and emersion rates : 25mm/s Test Method 1 cycle: 1 step:-55 °C(+0 °C,-3 °C) / 30min±3min 2 step:Ordinary temp. / 10min to 15min 3 step:+125 °C(+3 °C,-0 °C) / 30min±3min 4 step: Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48h±4h. Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. MURATA MFG CO., LTD. Spec. No. JENF243A–0004N-01 Reference Only P 4/ 8 No. Item 7-3-3 Heat Life Specification Meet Table 2. Table 2 Appearance No damage Impedance Within ±30% Change (for BLM18HE (at 100MHz) Within ±40%) DC Meet item 3. Resistance Test Method Temperature : 125°C±3°C Applying Current : Rated Current (at 125°C) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. 7-3-4 Cold Resistance Meet Table 1. Temperature : -55±2°C Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. +0.1 1.85±0.1 3.5± 0.05  1.5 -0 8.0±0.3 2.0±0.05 4.0±0.1 4.0±0.1 1.75±0.1 8. Specification of Packaging 8-1. Appearance and Dimensions (8mm-wide paper tape) (in mm) 1.05±0.1 1.1max. Direction of feed (1) Taping Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed by top tape and bottom tape. (2) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point The base tape and top tape have no spliced point (4) Cavity There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8-2. Tape Strength (1) Pull Strength Top tape 5N min. Bottom tape (2) Peeling off force of Top tape 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min 165 to 180 degree Bottom tape Top tape F Base tape 8-3. Taping Condition (1) Standard quantity per reel Quantity per 180mm reel: 4000 pcs. / reel (2) There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows. (3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. MURATA MFG CO., LTD. Reference Only Spec. No. JENF243A–0004N-01 P 5/ 8 (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(1), RoHS marking (2), Quantity, etc) 1) « Expression of Inspection No. » □□ OOOO (1) (1) Factory Code (2) Date (2)  (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking (2) , Quantity , etc) (6) Dimensions of reel and taping(leader-tape, trailer-tape) Leader Trailer 2.0±0.5 160 min. 190 min. 210 min. Empty tape Top tape Label  13.0±0.2 1  60± 0  21.0±0.8 9± 10 Direction of feed 13±1.4 0  180± 3 (in mm) 8-4. Specification of Outer Case Label H D W 9. Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order. ! Caution 9-1.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Disaster prevention / crime prevention equipment (7)Traffic signal equipment (8)Transportation equipment (vehicles, trains, ships, etc.) (9)Applications of similar complexity and /or reliability requirements to the applications listed in the above MURATA MFG CO., LTD. Spec. No. JENF243A–0004N-01 Reference Only P 6/ 8 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1. Land pattern designing Standard land dimensions (Flow and Reflow soldering) Chip Ferrite Bead Soldering Flow Reflow c a Solder Resist b Pattern a 0.7 b 2.2 to 2.6 1.8 to 2.0 c 0.7 (in mm) 10-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 m (2) Soldering conditions Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Pre-heating Heating Cycle of flow Standard Profile 150°C, 60s min. 250°C, 4s~6s 2 times Standard Profile Time. (s) Limit Profile 265°C±3°C, 5s max. 2 times MURATA MFG CO., LTD. Reference Only Spec. No. JENF243A–0004N-01 P 7/ 8 □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s∼60s 60s max. 90s±30s Time. (s) Standard Profile 150°C~180°C, 90s±30s above 220°C, 30s~60s 245°C±3°C 2 times Pre-heating Heating Peak temperature Cycle of reflow 10-3. Reworking with soldering iron Pre-heating: 150°C, 1 min Tip temperature: 350°C max. Soldering time : 3(+1,-0) seconds. Limit Profile above 230°C, 60s max. 260°C, 10s 2 times Soldering iron output: 80W max.  Tip diameter:φ3mm max.  Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 10-4. Solder Volume Solder shall be used not to be exceed as shown below. Upper Limit Recommendable 1/3T≦t≦T (T: Chip thickness) t Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 10-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a b 〈 Poor example〉 Products shall be located in the sideways direction (Length: ab) to the mechanical stress. 〈 Good example〉 (2)Products location on P.C.B. separation. Seam b C B D A Slit Length:a b Products (A, B, C, D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of ACB  D. a 10-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. MURATA MFG CO., LTD. Spec. No. JENF243A–0004N-01 Reference Only P 8/ 8 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. ) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10-9. Cleaning Conditions Products shall be cleaned on the following conditions. (1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA) (2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20W/l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3)Cleaner 1.Cleaner Isopropyl alcohol (IPA) 2.Aqueous agent PINE ALPHA ST-100S (4)There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5)Other cleaning Please contact us. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11. Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.  Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be stored under the airtight packaged condition. (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11 ! Notes (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD.