BLM18HB331SN1D

Spec. No. JENF243A-0004R-01 P.1/9 GHz Noise Suppression Chip Ferrite Bead BLM18H□□□□SN1□ Reference Specification 1. Scope This reference specification applies to Chip Ferrite Bead BLM18H_SN Series. 2. Part Numbering (ex.) BL M (1) (2) 18 (3) HG (4) 601 (5) S (6) N (7) 1 (8) D (9) (1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz (6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk) 3. Rating MURATA Part Number BLM18HE601SN1D BLM18HE601SN1B BLM18HE102SN1D BLM18HE102SN1B BLM18HE152SN1D BLM18HE152SN1B BLM18HG471SN1D BLM18HG471SN1B BLM18HG601SN1D BLM18HG601SN1B BLM18HG102SN1D BLM18HG102SN1B BLM18HD471SN1D BLM18HD471SN1B BLM18HD601SN1D BLM18HD601SN1B BLM18HD102SN1D BLM18HD102SN1B BLM18HB121SN1D BLM18HB121SN1B BLM18HB221SN1D BLM18HB221SN1B BLM18HB331SN1D BLM18HB331SN1B BLM18HK331SN1D BLM18HK331SN1B BLM18HK471SN1D BLM18HK471SN1B BLM18HK601SN1D BLM18HK601SN1B BLM18HK102SN1D BLM18HK102SN1B at 100MHz (Note) Rated Current (mA) DC Resistance ( max. ) at Typical 85℃ at 125℃ Initial Values Values After Testing at 1GHz Remark 600±25% 300 min. 600 800*1 600*1 0.25 0.30 1000±25% 500 min. 1000 600*1 500*1 0.35 For 0.40 Large Current 1500±25% 750 min. 1500 500*1 400*1 0.50 0.55 470±25% 400 min. 600 200 0.85 600±25% 450 min. 700 200 1.0 For 1.1 general use 1000±25% 750 min. 1000 100 1.6 1.7 470±25% 700 min. 1000 100 1.2 1.3 600±25% 850 min. 1200 100 1.5 1.6 1000±25% 1100 min. 1700 50 1.8 0.95 120±25% 500±40% 200 0.5 1.9 For high speed 0.6 signal line 220±25% 1100±40% 100 0.8 0.9 330±25% 1600±40% 50 1.2 1.3 330±25% 400±40% 200 0.5 0.6 470±25% 600±40% 200 0.7 600±25% 700±40% 100 0.9 0.8 For Digital 1.0 Interface 1000±25% 1200±40% 50 1.5 1.6  Operating Temperature : -55°C to +125°C  Storage Temperature : -55°C to +125°C (Note) As for the Rated current marked with *1, Rated Current is derated as right figure depending on the operating temperature. R a te d C u rre n t (A ) Customer Part Number Impedance () (Under Standard Testing Condition) Rated current at 85°C Rated current at 125°C MURATA MFG.CO., LTD. 0 85 125 Operating Temperature (°C) Spec. No. JENF243A-0004R-01 P.2/9 4. Style and Dimensions 1.6±0.15 0.8±0.15 0.8±0.15 ■ Equivalent Circuit 0.4±0.2 ( ) Resistance element becomes dominant at high frequencies. : Electrode (in mm) ■ Unit Mass (Typical value) 0.005g 5. Marking No marking. 6. Standard Testing Conditions  Unless otherwise specified  Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) 7. Specifications 7-1. Electrical Performance No. Item Specification 7-1-1 Impedance Meet item 3. 7-1-2 DC Resistance Meet item 3. 7-2. Mechanical Performance No. Item Specification 7-2-1 Appearance and Meet item 4. Dimensions 7-2-2 Bonding Meet Table 1. Strength Table 1 Appearance Impedance Change (at 100MHz) DC Resistance No damage  In case of doubt  Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa Test Method Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire Test Method Visual Inspection and measured with Slide Calipers. It shall be soldered on the substrate. Applying Force(F) : 6.8N Applying Time : 5s±1s Applied direction:Parallel to substrate Side view Ｆ Within ±30% Ｆ R0.5 Meet item 3. Substrate 7-2ｰ3 Bending Strength It shall be soldered on the substrate. Substrate: Glass-epoxy 100mm40mm1.0mm Deflection : 2.0mm Speed of Applying Force : 0.5mm/s Keeping Time : 30s Pressure jig R340 F Deflection 45mm MURATA MFG.CO., LTD. 45mm Product Spec. No. JENF243A-0004R-01 No. Item 7-2ｰ4 Vibration P.3/9 Specification Meet Table 1. 7-2-5 Resistance to Soldering Heat 7-2ｰ6 Drop Products shall be no failure after tested. 7-2-7 Solderability The electrodes shall be at least 95% covered with new solder coating. 7-3. Environmental Performance It shall be soldered on the substrate. No. Item Specification 7-3-1 Temperature Meet Table 1. Cycle 7-3-2 Humidity 7-3-3 Heat Life 7-3-4 Cold Resistance Meet Table 2. Table 2 Appearance Impedance Change (at 100MHz) DC Resistance Meet Table 1. No damage Within ±30% (for BLM18HE Within ±40%) Test Method It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270°C±5°C Immersion Time : 10s±0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 48h±4h. It shall be dropped on concrete or steel board. Method : free fall Height : 75cm Attitude from which the product is dropped : 3 direction The number of times : 3 times for each direction (Total 9 times) Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 3s±1s Immersion and emersion rates : 25mm/s Test Method 1 cycle: 1 step:-55 °C(+0 °C,-3 °C) / 30min±3min 2 step:Ordinary temp. / 10min to 15min 3 step:+125 °C(+3 °C,-0 °C) / 30min±3min 4 step: Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48h±4h. Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. Temperature : 125°C±3°C Applying Current : Rated Current (at 125°C) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. Meet item 3. Temperature : -55±2°C Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. MURATA MFG.CO., LTD. Spec. No. JENF243A-0004R-01 P.4/9 +0.1 1.85±0.1 3.5± 0.05  1.5 -0 8.0±0.3 2.0±0.05 4.0±0.1 4.0±0.1 1.75±0.1 8. Specification of Packaging 8-1. Appearance and Dimensions (8mm-wide paper tape) 1.05±0.1 1.1max. Direction of feed (in mm) (1) Taping Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed by top tape and bottom tape. (2) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point The base tape and top tape have no spliced point (4) Cavity There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8-2. Tape Strength (1) Pull Strength Top tape Bottom tape 5N min. (2) Peeling off force of Top tape 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min 165 to 180 degree Bottom tape Top tape F Base tape 8-3. Taping Condition (1) Standard quantity per reel Quantity per 180mm reel: 4000 pcs. / reel (2) There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows. (3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(1), RoHS marking (2), Quantity, etc) 1) « Expression of Inspection No. » □□ (1) (1) Factory Code (2) Date OOOO  (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking (2) , Quantity , etc) MURATA MFG.CO., LTD. Spec. No. JENF243A-0004R-01 P.5/9 (6) Dimensions of reel and taping(leader-tape, trailer-tape) 8-4. Specification of Outer Case Label H D Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order. W 9. ! Caution 9-1.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Disaster prevention / crime prevention equipment (7)Traffic signal equipment (8)Transportation equipment (vehicles, trains, ships, etc.) (9)Data-processing equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1. Land pattern designing Standard land dimensions (Flow and Reflow soldering) Chip Ferrite Bead c a Solder Resist b Pattern Soldering Flow Reflow a 0.8 0.7 b 2.5 2.0 c 0.7 0.7 (in mm) 10-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 m MURATA MFG.CO., LTD. Spec. No. JENF243A-0004R-01 P.6/9 (2) Soldering conditions Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Pre-heating Heating Cycle of flow Standard Profile 150°C, 60s min. 250°C, 4s~6s 2 times Standard Profile Time. (s) Limit Profile 265°C±3°C, 5s max. 2 times □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150°C~180°C, 90s±30s above 220°C, 30s~60s 245°C±3°C 2 times Time. (s) Limit Profile above 230°C, 60s max. 260°C, 10s 2 times MURATA MFG.CO., LTD. Spec. No. JENF243A-0004R-01 P.7/9 10-3. Reworking with soldering iron Pre-heating: 150°C, 1 min Tip temperature: 350°C max. Soldering time : 3(+1,-0) seconds. Soldering iron output: 80W max.  Tip diameter:φ3mm max.  Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 10-4. Solder Volume Solder shall be used not to be exceed as shown below. Upper Limit Recommendable t 1/3T≦t≦T (T: Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 10-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a b 〈 Poor example〉 Products shall be located in the sideways direction (Length: ab) to the mechanical stress. 〈 Good example〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Perforation Stress Level A > D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended MURATA MFG.CO., LTD. Spec. No. JENF243A-0004R-01 P.8/9 10-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10-9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA) (2) During ultrasonic cleaning, under some cleaning conditions, the resonation of PCB should be caused by its vibration. Be sure to do the test cleaning with actual cleaning equipment before production and confirm that product does not be damaged by cleaning. (3)Cleaner 1.Cleaner Isopropyl alcohol (IPA) 2.Aqueous agent PINE ALPHA ST-100S (4)There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5)Other cleaning Please contact us. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11. Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.  Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. Avoid storing the product by itself bare (i.e.exposed directly to air). (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. MURATA MFG.CO., LTD. Spec. No. JENF243A-0004R-01 11. P.9/9 ! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.