DLP11SN201HL2L

Reference Only Spec No. JEFL243E-0004W Chip Common Mode Choke Coil DLP11SN□□□□L2□ P1/9 Reference Specification 1.Scope This reference specification applies to Chip Common Mode Choke Coil DLP11SN Series. 2.Part Numbering (ex.) DL P 11 S N (1) (2) (3) (4) (5) (1) Chip Common Mode Choke Coil (2) Structure (P : Film Type) (3) Dimension (L×W) (4) Type (5) Category 201 (6) 3.Rating Customer Part Number H L 2 L (7) (8) (9) (10) (6) Impedance (Typ. at 100MHz) (7) Circuit S : Standard H : Characteristic Impedance 100Ω system (8) Features (9) Number of Line (10) Packaging Code L : Taping / B : Bulk Common Mode Impedance Rated Withstanding Rated (at 100MHz, Under Voltage Voltage Current Standard Testing Condition) Murata Part Number DLP11SN670SL2L DLP11SN670SL2B DLP11SN900HL2L DLP11SN900HL2B DLP11SN121SL2L DLP11SN121SL2B DLP11SN161SL2L DLP11SN161SL2B DLP11SN201HL2L DLP11SN201HL2B DLP11SN241HL2L DLP11SN241HL2B DLP11SN281HL2L DLP11SN281HL2B DLP11SN331HL2L DLP11SN331HL2B DC Resistance 67Ω ±20% 180mA 1.3Ω±25% 90Ω ±20% 150mA 1.5Ω±25% 120Ω ±20% 140mA 2.0Ω±25% 160Ω ±20% 120mA 2.7Ω±25% Insulation Resistance 5V(DC) 12.5V(DC) 200Ω±20% 110mA 3.1Ω±25% 240Ω±20% 100mA 3.5Ω±25% 280Ω±20% 90mA 4.2Ω±25% 330Ω±20% 80mA 4.9Ω±25% Operating Temperature : -40 to +85°C 4. Standard Testing Conditions Temperature : Ordinary Temperature 15 to 35°C Humidity : Ordinary Humidity 25 to 85%(RH) Storage Temperature 100MΩ min. : -40 to +85°C Temperature : 20 ± 2°C Humidity : 60 to 70%(RH) Atmospheric Pressure : 86 to106kPa 5.Style and Dimensions (1) (2) (4) (3) ■ Equivalent Circuits (Top View) (1) (2) (4) (3) 0.82±0.10 0.30±0.10 No polarity 0.55±0.10 (Bottom View) 1.00±0.10 (Side View) :Electrode (in : mm) 0.25 +0.10/-0.05 1.25±0.10 MURATA MFG.CO., LTD ■ Unit Mass (Typical value) 0.005g Spec No. JEFL243E-0004W Reference Only P2/9 6.Marking No Marking. 7. Electrical Performance No. 7.1 Item Common Mode Impedance Specification Meet item 3. 7.2 Withstanding Voltage Products shall not be damaged. 7.3 DC Resistance (Rdc) Meet item 3. 7.4 Insulation Resistance (I.R.) Test Method Measuring Frequency : 100±1MHz (ref.item 10.) Measuring Equipment : KEYSIGHT 4291A or the equivalents (In case of doubt in standard condition, the heat treatment (200°C,about 10 min)shall be applied. Test Voltage : 2.5 times for Rated Voltage Time : 1 to 5 s Charge Current : 1 mA max.(ref.item 10.) Measuring current : 100mA max.(ref.item 10.) Measuring voltage : Rated Voltage Measuring time : 1 min max. (ref.item 10.) 8.Mechanical Performance No. 8.1 8.2 8.3 Item Appearance and Dimensions Solderability Specification Meet item 5. Test Method Visual Inspection and measured with Slide Calipers. The electrodes shall be at least 95% covered with new solder coating. Resistance to Soldering Heat Meet Table 1. Table 1 Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C, 1min Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 245±3°C Immersion Time : 3±1 s Immersion and emersion rates : 25 mm / s Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C ,1min Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270±5°C Immersion Time : 10±1 s Immersion and emersion rates : 25 mm / s Then measured arter exposure in the room condition for 4 to 48 h. It shall be dropped on concrete or steel board. Method : free fall Height : 1m The Number of Times : 3 times It shall be soldered on the substrate. Oscillation Frequency : 10 to 55 to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 h in each of 3 mutually perpendicular directions. Substrate : (t =1.0 mm). Deflection : 2 mm Speed of Applying Force : 0.5 mm / s Keeping time : 30 s 8.4 Drop 8.5 Vibration 8.6 Bending Strength Appearance Common Mode Impedance Change I.R. DC Resistance Change No damaged within ± 20% 100MΩ min. within ± 30% Meet Table 2. Table 2 Appearance No damaged DC Resistance within ± 30% Change Pressure jig R230 F Deflection 45 MURATA MFG.CO., LTD 45 Product Reference Only Spec No. JEFL243E-0004W P3/9 9.Environmental Performance (Products shall be soldered on the glass-epoxy substrate) No. 9.1 Item Temperature Cycle 9.2 Humidity 9.3 Heat life 9.4 Cold Resistance Specification Meet Table 1. Test Method 1 Cycle Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min Step 2 Ordinary Temp. / within 3 min Step 3 +85(+3°C,-0°C) / 30(+3,-0) min Step 4 Ordinary Temp. / within 3 min Total of 100 cycles. Then measured after exposure in the room condition for 4 to 48 h. Temperature : 40±2°C Humidity : 90 to 95 % (RH) Time : 1000 h(+48 h,-0 h) Then measured after exposure in the room condition for 4 to 48 h. Temperature : 85±2°C Test Voltage : 2 times for Rated Voltage Time : 1000 h(+48 h,-0 h) Then measured after exposure in the room condition for 4 to 48 h. (ref. Item 10.) Temperature : -40± 2°C Time : 1000 h(+48 h,-0 h) Then measured after exposure in the room condition for 4 to 48 h. 10. Terminal to be Tested. When measuring and supplying the voltage,the following terminal is applied. No. 10.1 10.2 10.3 Item Common Mode Impedance Withstanding Voltage Insulation Resistance Heat Life DC Resistance Terminal to be Tested ＩＮ ＯＵＴ ＩＮ ＯＵＴ ＩＮ Ｏ ＵＴ ＩＮ ＯＵＴ 11. Measuring method for common mode impedance. Measured common mode impedance may be included measurement error due to stray capacitance, residual inductance of test fixture. To correct this error, the common mode impedance should be calculate as follows; (1) Measure admittance of the fixture(opened), Go Bo. (2) Measure impedance of the fixture(shorted), Rs Xs. (3) Measure admittance of the specimen, Gm Bm. (4) Calculate corrected impedance Z using the formula below. Z = (Rx2+Xx2) 1/2 Where Rx = Gm - Go － Rs (Gm-Go)２ + (Bm-Bo)２ Xx = - (Bm - Bo) － Xs (Gm-Go)２ + (Bm-Bo)２ 12. P.C.B., Flux, Solder and Soldering condition Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except the case of being specified special condition. MURATA MFG.CO., LTD Spec No. JEFL243E-0004W Reference Only P4/9 13.Impedance Frequency Characteristics(Typical) 10000 DLP11SN331HL2 DLP11SN281HL2 DLP11SN241HL2 1000 Impedance (Ω) Common mode DLP11SN201HL2 DLP11SN161SL2 DLP11SN121SL2 DLP11SN900HL2 DLP11SN670SL2 100 10 DLP11SN331HL2 DLP11SN281HL2 DLP11SN241HL2 DLP11SN201HL2 DLP11SN161SL2 Differential mode DLP11SN121SL2 DLP11SN900HL2 DLP11SN670SL2 1 1 10 100 Frequency (MHz) MURATA MFG.CO., LTD 1000 10000 Reference Only Spec No. JEFL243E-0004W P5/9 +0.1 φ 1.5- 0 4.0±0.1 Cavity 1.4±0.1 3.5±0.05 Sprocket Hole 0.25±0.05 2.0±0.05 1.2±0.1 4.0±0.1 *Dimension of the Cavity is measured 8.0±0.2 14.1 Appearance and Dimensions ( 8mm-wide,Plastic tape) 1.75±0.1 14. Specification of Packaging at the bottom side. 0.98±0.05 (in:mm) Direction of feed 14.2 Specification of Taping (1)Packing quantity(Standard quantity) 3000 pcs. / reel (2)Packing Method Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3)Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4)Spliced point The cover tape have no spliced point. (5)Missing components number Missing components number within 0.1% of the number per reel or 1 pc.,whichever is greater,and are not continuous. The specified quantity per reel is kept. 14.3 Pull Strength of Plastic Tape Plastic Tape Cover Tape 5N min. 10N min. 14.4 Peeling off force of Cover Tape 0.2 to 0.7N(Minimum value is Typical) Speed of Peeling off : 300 mm/min. 165 to 180 degree F Cover tape Plastic tape 14.5 Dimensions of Leader-tape, Trailer and Reel Leader Trailer 2.0±0.5 160 min. 190 min. 210 min. Empty tape Top tape Label φ 13.0±0.2 1 φ 60± 0 φ 21.0±0.8 9± 10 Direction of feed 13±1.4 0 φ 180± 3 (in:mm) 14.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2), Quantity, etc ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day ∗2) « Expression of RoHS Marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) MURATA MFG.CO., LTD Reference Only Spec No. JEFL243E-0004W P6/9 14.7 Marking for Outside package Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS Marking (∗2), Quantity, etc 14.8 Specification of Outer Case Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. Label H D W 15. ! △ Caution 15.1 Mounting Direction Mount products in right direction. Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also flames or other serious trouble. Ｚ right direction Ｚ wrong direction 15.2 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and / or reliability requirements to the applications listed in the above. 16. Notice This product is designed for solder mounting. (reflow soldering only) Please consult us in advance for applying other mounting method such as conductive adhesive. 16.1 Flux and Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance. 16.2 Assembling Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. 16.3 Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 16.4 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 Products shall be location the sideways Direction (Length : a D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Perforation A C B D Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 16.5 Attention Regarding P.C.B. Design < The Arrangement of Products > P.C.B. shall be designed so that products are far from the portion of perforation. Portion of Perforation × P.C.B. ○ ○ The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation. Portion of Perforation P.C.B. Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) Product × ○ × Product Hole Pick- up nozzle < Products Placing > Product Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B. during placing the products on the other P.C.B. side of P.C.B. Support pin < P.C.B. Separation > P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. 16.6 Attention Regarding P.C.B. Mounting In case of mounting by use of mounting machine, please choose nozzle which can pick up components of 1005 size or the equivalents. MURATA MFG.CO., LTD Reference Only Spec No. JEFL243E-0004W P8/9 16.7 Standard Land Dimensions (1) (2) (4) (3) 0.55 0.85 0.30 0.55 *(1)(2)(3)(4)Indicates terminal number Resist Copper foil pattern No pattern 1.95 (in : mm) 16.8 Soldering(Reflow soldering) Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Limit Profile above 230°C、60s max. 260°C、10s 2 times (1) Standard printing pattern of solder paste • Standard thickness of the solder paste should be 100 to 150µm. • Use the solder paste printing pattern of the right pattern. • For the resist and copper foil pattern, use standard land dimensions. • Use Sn-3.0Ag-0.5Cu solder. 0.55 Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times 0.30 Pre-heating Heating Peak temperature Cycle of reflow Time (s) 0.70 0.55 (2) Reworking with Soldering iron • The following conditions shall be strictly followed when using a soldering iron after being mounted by reflow soldering. · Pre-heating: 150°C, 1 min · Soldering iron output: 30W max. · Tip temperature: 380°C max. · Tip diameter:φ3mm max. · Soldering time : 3(+1,-0) s. · Times : 2times max. • Do not touch the products directly with the tip of the soldering iron. (3) Solder Volume Solder shall be used not to be exceeded the upper limits as shown below. Upper Limit Recommendable Upper Limit Recommendable t 1/3 T ≦ ｔ ≦ T （T : Chip thickness） Accordingly increasing the solder volume, the mechanical stress to product is also increased. Excessive solder volume may cause the failure of mechanical or electrical performance. MURATA MFG.CO., LTD 0.70 (in：mm) Spec No. JEFL243E-0004W Reference Only P9/9 16.9 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B.. ・Power : 20W/ l max. ・Frequency : 28kHz to 40kHz ・Time : 5 min max. (3) Cleaner 1. Alternative cleaner • Isopropyl alcohol (IPA) 2. Aqueous agent • PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 16.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 16.11 Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 16.12 Storage Conditions (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition • Products should be stored in the warehouse on the following conditions. Temperature : -10 to +40°C Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity • Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to prevent the following deterioration. Poor solderability due to the oxidized electrode. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 17. ! △ Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD