DXP18CN7510TL

Reference Only Spec No.JEFK243A-0003E-01 P1/9 Micro Chip Transformer DXP18CN□□□□T□ Reference Specification 1. Scope This reference specification applies to Micro Chip Transformer DXP18CN Series. 2. Part Numbering (ex.) DX P 18 C N 75 (1) (2) (3) (4) (5) (6) (1) Micro Chip Transformer (2) Structure (P: Film Type) (3) Dimension (LW) (4) Type of Transformer (C: Coupler) (5) Category 10 (7) T L (8) (9) (6) Port Impedance (75 : 75ohm) (7) Coupling (10: 10dB/15:15dB) (8) Main Application (T: Terrestrial) (9) Packing Code L:Taping / B:Bulk 3. Electrical Specification Customer Part Number Murata Part Number DXP18CN7510TL DXP18CN7510TB DXP18CN7515TL DXP18CN7515TB Operating Temperature : -40 to +85°C Freq. Range [MHz] Port Impedance [ohm] Insertion Loss [dB max.] Coupling [dB typ.] Isolation [dB min.] Rated Power [dBm] 50～870 75 ALL 2.3 10 18 20 50～870 75 ALL 1.5 15 20 20 Storage Temperature : -40 to +85°C 4. Standard Testing Condition Temperature : Ordinary Temperature 15 to 35°C Humidity : Ordinary Humidity 25 to 85%(RH) Temperature : 20 ± 2°C Humidity : 60 to 70%(RH) Atmospheric Pressure : 86 to106kPa 5. Style and Dimensions ■Dimension ■Eqivalent Circuit (5) (4) (1) (2) (3) 1.6±0.1 0.2±0.1 (6)In (5)GND 0.8±0.1 (6) 0.4±0.1 0.45±0.1 Polarity Marking 0.15±0.1 (Top View) (4)Sub Out (1)Main (2)GND (3)Termination Out 0.3±0.1 (Bottom View) : Electrode (in mm) ■Unit Mass (typ.) 0.003g ■ TN (Termination) Terminal Please terminate TN terminal with 75 ohm to the circuit ground. 6. Marking Polarity Marking is on the upper surface of a Product. MURATA MFG.CO.,LTD Spec No.JEFK243A-0003E-01 7. Electrical Performance No. 7.1 Item Insertion Loss (IL) Specification Meet item 3. Reference Only P2/9 Definition and Measurement Method Insertion Loss is given by S12 mag extracted from the below circuit. Parasitics and loss factors caused by the test board have to be removed. Port Impedance [ohm]: All 75 ohm IL[dB] = 20log10(S12) MO Port1 Coupling Meet item 3. Port2 GND GND TN Port3 7.2 IN SO Port4 Coupling is given by S42 mag extracted from the below circuit. Parasitics and loss factors caused by the test board have to be removed. Port Impedance [ohm]: All 75 ohm Coupling[dB] = 20log10(S42) MO Port1 GND TN Port3 7.3 Isolation Meet item 3. IN Port2 GND SO Port4 Isolation is given by S41 mag extracted from the below circuit. Parasitics and loss factors caused by the test board have to be removed. Port Impedance [ohm]: All 75 ohm Coupling[dB] = 20log10(S41) MO Port1 GND TN Port3 MURATA MFG.CO.,LTD IN Port2 GND SO Port4 Spec No.JEFK243A-0003E-01 8. Mechanical Performance No. 8.1 8.2 8.3 Reference Only P3/9 Item Appearance and Dimensions Solderability Specification Meet all dimension on item 5. Test Method Visual Inspection and measurement with microscope. The electrodes shall be at least 95% covered with new solder coating. Resistance to Soldering Heat Meet Table 1. Table 1 Appearance IL Coupling Isolation Flux:Ethanol solution of rosin,25(wt)% Pre-Heating : 150±10°C 60s to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240±5°C Immersion Time : 3±1 seconds Immersion and emersion rates : 25mm/s Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : : 150±10°C 60s to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270±5°C Immersion Time : 10±1 seconds Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 4 to 48 hours. It shall be dropped on concrete or steel board. Method : free fall Height : 1 m The Number of Times : 3 times It shall be soldered on the substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 15 minutes 8.4 Drop 8.5 Vibration No damaged Meet Item 3. 2 8.6 Total Amplitude 3.0mm or Acceleration 196m/s whichever is smaller Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) It shall be soldered on the Glass-epoxy substrate. Deflection : 3mm (t=1.0mm). Keeping time : 5 seconds Speed of Applying Force : 0.5mm/s Bending Strength Pressure jig R230 F Deflection 45 45 Product (in mm) 9. Environmental Performance(Products shall be soldered on the substrate.) No. 9.1 Item Temperature Cycle 9.2 Humidity 9.3 Heat Resistance 9.4 Cold Resistance Specification Meet Table 1. Test Method 1 Cycle Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min Step 2 Ordinary Temp. / within 3 min Step 3 +85(+3°C,-0°C) / 30(+3,-0) min Step 4 Ordinary Temp. / within 3 min Total of 100 cycles. Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 70±2°C Humidity : 90~95%(RH) Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 85±2°C Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. Temperature : -40± 2°C Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. MURATA MFG.CO.,LTD Reference Only Spec No.JEFK243A-0003E-01 10. Frequency Characteristics (Typ.) P4/9 8 0.5 8.5 20 9 1.5 2 2.5 Isolation[dB] 分配量[dB] Coupling [dB] 1 IL[dB] 18 Isolation [dB] Insertion Loss [dB] DXP18CN7510T 0 9.5 10 10.5 11 12 0 100 200 300 400 500 Freq[MHz] 600 700 800 900 24 26 28 11.5 3 22 30 0 100 200 300 400 500 Freq[MHz] 600 700 800 900 0 100 200 300 400 500 Freq[MHz] 600 700 800 900 DXP18CN7515T 13.5 18 0.5 14 20 22 2 2.5 3 Isolation[dB] 1.5 14.5 Isolation [dB] 分配量[dB] 1 Coupling [dB] Insertion Loss IL[dB][dB] 0 15 15.5 16 100 200 300 400 500 Freq[MHz] 600 700 800 900 26 28 30 32 16.5 0 24 34 0 100 200 300 400 500 Freq[MHz] 600 700 800 900 0 100 200 300 400 500 Freq[MHz] 600 700 800 11. Specification of Packaging 11.1 Appearance and Dimensions ( 8mm-wide,Plastic tape) 0.1 0.20±0.05 0 Direction of feed (2.75) 1.82±0.05 Sproket Hole 8.0±0.2 3.5±0.05 1.75±0.1 1.5± 0.90±0.05 4.0±0.1 4.0±0.1 2.0±0.05 0.6±0.05 11.2 Specification of Taping (1)Packing quantity(Standard quantity) 5000 pcs. / reel (2)Packing Method Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3) Spliced point The cover tape have no spliced point. (4) Sprocket Hole Sprocket hole shall be located on the left hand side toward the direction of feed. (5)Missing components number Missing components number within 0.1% of the number per reel or 1 pc, whichever is greater, and are not continuous. The specified quantity per reel is kept. 11.3 Pull Strength of the Tape Package Plastic Tape Cover Tape 11.4 Peeling force of the Cover Tape 0.2 to 0.7N(Minimum value is Typical) Peeling verosity is 300 mm / min 5N min. 10N min. 165 to 180 degree F Cover tape Plastic tape MURATA MFG.CO.,LTD 900 Reference Only Spec No.JEFK243A-0003E-01 P5/9 11.5 Dimensions of Leader-tape, Trailer and Reel Leader Trailer 2.0±0.5 160 min. 190 min. 210 min. Empty tape Top tape Label  13.0±0.2 1  60± 0  21.0±0.8 9± 10 Direction of feed 13±1.4 0  180± 3 11.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS Marking(2), Quantity, etc 1) « Expression of Inspection No. » □□ OOOO  (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O,N,D Third, Fourth digit : Day 2) « Expression of RoHS Marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) 11.7 Marking for Outside package Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS Marking (2), Quantity, etc 11.8 Specification of Outer Case Label H D W 12. Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order. ! △ Caution Limitation of Application Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and / or reliability to the applications listed in the above. 13. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 13.1 TN (Termination) Terminal Please terminate TN terminal with 75 ohm to the circuit ground, unless otherwise, it may affect on the performance of this part. MURATA MFG.CO.,LTD Reference Only Spec No.JEFK243A-0003E-01 13.2 Flux and Solder Flux Use rosin-based flux, (with converting chlorine content 0.06 to 0.1(wt)%. ), but not highly acidic flux (with Halogen content exceeding 0.2(wt)% conversion to chlorine). Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of the solder paste should be 100 to 150µm. 13.3 Standard Land Dimensions (Reflow) 0.20 0.20 0.45 1.30 0.40 Resist Copper foil pattern No pattern 0.40 (in mm) 13.4 Assembling Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. 13.5 Standard Soldering Condition (1) Soldering Condition Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (℃) 260℃/10s 245±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Time（ｓ） Limit Profile above 230°C、60s max. 260°C、10s 2 times MURATA MFG.CO.,LTD P6/9 Spec No.JEFK243A-0003E-01 Reference Only P7/9 (2) Reworking with Soldering iron The following conditions must be strictly followed when using a soldering iron after being mounted by reflow soldering. Tip temperature / Soldering time : 350°C max / 3(+1,-0)s Soldering iron output :30W max Tip diameter : 3mm Reworking should be limited to 2 times. Notes: Do not touch the products directly with the soldering iron. (3) Solder Volume Solder shall be used not to be exceeded the upper limits as shown below. Upper limit Upper limit Recommendable Recommendable t 1/3 T ≦ t ≦ T (T:thickness of electrodes) Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 13.6 Resin coating The electric characteristics may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 13.7 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ Products shall be location the sideways a Direction (Length : a P.C.B. shall be designed so that products are far from the portion of perforation. × P.C.B. ○ ○ The portion of perforation shall be designed as narrow as possible and shall be designed so as not to be applied the stress in the case of P.C.B. separation.  Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) P8/9 Portion of Perforation Portion of Perforation Product × ○ P.C.B. × Product Hole < Products Placing > Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B. Pick- up nozzle < P.C.B. Separation > P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. Product P.C.B. 13.9 Cleaning Conditions Support pin Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B.. ・Power : 20W/ l max. ・Frequency : 28kHz to 40kHz ・Time : 5 minutes max. (3) Cleaner 1. Alternative cleaner  Isopropyl alcohol (IPA) 2. Aqueous agent  PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 13.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 13.11 Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. MURATA MFG.CO.,LTD Spec No.JEFK243A-0003E-01 Reference Only P9/9 13.12 Storage Condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment conditions ·Products should be stored in the warehouse on the following conditions. Temperature ： -10 ~ +40°C Humidity ： 15 to 85% relative humidity No rapid change on temperature and humidity. · Products should not be storaged in corrosive gases, such as sulfureous, acid gases, alkaline gases, to prevent the following deterioration. Poor solderability due to the oxidized electrode. · Products should be storaged on the palette for the prevention of the influence from humidity,dust and so on. · Products should be storaged in the warehouse without heat shock, vibration, direct sunlight and so on. · Products should not be storaged under the air tights packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 14. ! △ Notes (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD