Reference Only
Spec No.JEFK243A-0004C-01
Micro Chip Transformer
P1/10
DXP2ABN7514T□ Reference Specification
1. Scope
This reference specification applies to Micro Chip Transformer.
2. Part Numbering
(ex.)
DX P
2A
B
N
(1)
(2) (3) (4) (5)
(1) Micro Chip Transformer
(2) Structure (P: Film Type)
(3) Dimension (L×W)
(4) Type of Transformer (B:Balun)
(5) Category
75
(6)
14
(7)
T
L
(8) (9)
(6) Port Impedance (75 : 75ohm)
(7) Impedance ratio (14: one to four)
(8) Main Application (T:50~870MHz)
(9) Packing Code L:Taping / B:Bulk
3. Electrical Specification
Murata
Part Number
Freq.
Range
[MHz]
input-output
Impedance
[ohm]
Insertion
Loss
[dB]
CMRR
[dB]
Return
Loss
[dB]
Rated
Power
[dBm]
DC
Resistance
DXP2ABN7514TL
DXP2ABN7514TB
50~870
75-300
1.8max.
20 min.
6min.
20
2.0Ω(typ.)
Customer
Part Number
Operating Temperature : -40 to +85°C
Storage Temperature : -40 to +85°C
4. Standard Testing Condition
Temperature : Ordinary Temperature 15 to 35°C
Humidity : Ordinary Humidity 25 to 85%(RH)
5. Style and Dimensions
■Dimension
Temperature : 20 ± 2°C
Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
■Eqivalent Circuit
0.5±0.1
0.25±0.1
0.82±0.1
0.25±0.15
(1)
(2)
(3)
(4)
(6)
(7)
(8)
1.0±0.1
(5)
2.0±0.1
No polarity.
□ :Electrode
(in mm)
■Unit Mass(typ.)
0.008g
6. Marking
No Marking.
MURATA MFG.CO.,LTD
Spec No.JEFK243A-0004C-01
7. Electrical Performance
No.
7.1
Item
Insertion
Loss
(IL)
Specification
Meet item 3.
Reference Only
P2/10
Definition and Measurement Method
Insertion Loss is given by Sds21 mag extracted from the below circuit.
Parasitics and loss factors caused by the test board have to be removed.
Port Impedance [ohm]
Port1
7514T
75
Port2
150
Port3
150
IL[dB] = 20log10(Sds21)
Where
Sds21 is S-parameter of single mode stimulus - Differential mode response
7.2
CMRR
Meet item 3.
(Ref.10)
CMRR is given by the following equation, S-parameters are extracted from
the below circuit.
Parasitics and loss factors caused by the test board have to be removed.
Port Impedance [ohm]
Port1
7514T
75
Port2
150
Port3
150
CMRR[dB] = 20log10(Sds21/Scs21)
Where
Sds21 is S-parameter of single mode stimulus - Differential mode response
Scs21 is S-parameter of single mode stimulus - Common mode response
(Ref.10)
7.3
Return
Loss
(RL)
Meet item 3.
Insertion Loss is given by Sss11 mag extracted from the below circuit.
Parasitics and loss factors caused by the test board have to be removed.
Port Impedance [ohm]
Port1
7514T
75
Port2
150
Port3
150
RL[dB] = 20log10(Sss11)
Where
Sss11 is S-parameter of single mode stimulus – Refletcion response
(Ref.10)
MURATA MFG.CO.,LTD
Spec No.JEFK243A-0004C-01
No.
7.4
Item
DC Resistance
(Rdc)
Reference Only
Specification
Meet item 3.
P3/10
Definition and Measurement Method
Measuring current : 80mA max.(ref.item 10.)
Rdc
Rdc
Rdc
Rdc
8. Mechanical Performance
No.
8.1
8.2
8.3
Item
Appearance
and
Dimensions
Solderability
Specification
Meet all dimension on item 5.
Test Method
Visual Inspection and measurement with microscope.
The electrodes shall be at least
95% covered with new solder
coating.
Flux:Ethanol solution of rosin,25(wt)%
Pre-Heating : 150±10°C 60s to 90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245±5°C
Immersion Time : 3±1 seconds
Immersion and emersion rates : 25mm/s
Resistance
to Soldering
Heat
Meet Table 1.
Table 1
Appearance
IL
CMRR
Return Loss
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : : 150±10°C 60s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270±5°C
Immersion Time : 10±1 seconds
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room
condition for 4 to 48 hours.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 1 m
The Number of Times : 10 times
It shall be soldered on the substrate.
Oscillation Frequency : 10 to 2000 to 10Hz
for 20 minutes
8.4
Drop
8.5
Vibration
8.6
Bending
Strength
No damaged
Meet Item 3.
Meet Table 2.
Table 2
Appearance
No damaged
DC Resistance
within ± 30%
Change
Total Amplitude 3.0mm or Acceleration 196m/s2
whichever is smaller
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions. (Total 6 hours)
It shall be soldered on the Glass-epoxy substrate.
Deflection : 2mm
(t=1.0mm).
Keeping time : 30s
Speed of Applying Force : 0.5mm/s
Pressure jig
R230
F
Deflection
45
45
Product
(in mm)
MURATA MFG.CO.,LTD
Reference Only
Spec No.JEFK243A-0004C-01
9. Environmental Performance(Products shall be soldered on the substrate.)
No.
9.1
Item
Heat Shock
9.2
Humidity
9.3
Heat
Resistance
9.4
Cold
Resistance
Specification
Meet Table 1.
P4/10
Test Method
1 Cycle
Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min
Step 2 +85(+3°C,-0°C) / 30(+3,-0) min
Total of 200 cycles.
Then measured after exposure in the room condition for
4 to 48 hours.
Temperature : 40±2°C
Humidity : 90~95%(RH)
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Temperature : 85±2°C
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Temperature : -40± 2°C
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
10. Terminal to be Tested.
When measuring and suppling the voltage,the following terminal is applied.
No.
Item
10.1 Insertion Loss
(IL)
CMRR
Return Loss
(RL)
(Measurement Terminal)
10.2 DC Resistance
(Measurement Terminal)
Terminal to be Tested
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
11. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are
specified in item 16 except the case of being specified special condition.
MURATA MFG.CO.,LTD
Terminal
Spec No.JEFK243A-0004C-01
12. Frequency Characteristics (Typ.)
Reference Only
CMRR
0.0
50
-0.5
40
CMRR[dB]
IL[dB]
Insertion Loss
-1.0
-1.5
-2.0
30
20
10
0
100 200 300 400 500 600 700 800 900
Freq[MHz]
0
100 200 300 400 500 600 700 800 900
Freq[MHz]
Return Loss
AmplitudeBalance
0
1.0
-10
0.5
AB[dB]
RL[dB]
P5/10
-20
-30
0.0
-0.5
-40
-50
-1.0
0
100 200 300 400 500 600 700 800 900
Freq[MHz]
0
100 200 300 400 500 600 700 800 900
Freq[MHz]
Phase Balance
200
PB[Deg]
100
0
-100
-200
0
100 200 300 400 500 600 700 800 900
Freq[MHz]
13. Specification of Packaging
4.0±0.1
2.2±0.1
0.25±0.05
Sprocket
Hole
送り穴
Direction
of feed
引出し方向
8.0±0.2
φ1.5± 0.1
0
1.75±0.1
Appearance and Dimensions ( 8mm-wide,Plastic tape)
(2.75)3.5±0.05
13.1
1.2±0.1
4.0±0.1 2.0±0.05
0.98±0.05
MURATA MFG.CO.,LTD
Reference Only
Spec No.JEFK243A-0004C-01
13.2
P6/10
Specification of Taping
(1)Packing quantity(Standard quantity) 3000 pcs. / reel
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3)Sprocket Hole
Sprockrt hole shall be located on the left hand side toward the direction of feed.
(4)Spliced point
The cover tape have no spliced point.
(5)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
13.3
13.4
Pull Strength of Plastic Tape
Plastic Tape
Cover Tape
5N min.
10N min.
Peeling off force of Cover Tape
0.2 to 0.7N(Minimum value is Typical)
Speed of Peeling off : 300 mm/min.
165 to 180 degree
F
Cover tape
Plastic tape
13.5
Dimensions of Leader-tape, Trailer and Reel
Leader
Trailer
2.0±0.5
160 min.
190 min.
210 min.
Empty tape
Top tape
Label
φ 13.0±0.2
1
φ 60± 0
φ 21.0±0.8
9± 10
Direction of feed
13±1.4
0
φ 180± 3
13.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2), Quantity, etc
∗1) « Expression of Inspection No. »
□□ OOOO ×××
(1) Factory Code
(2) Date
(3) Serial No.
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
∗2) « Expression of RoHS Marking »
ROHS – Y (△)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(1) (2)
13.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS Marking (∗2), Quantity, etc
13.8 Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
∗ Above Outer Case size is typical. It depends on a quantity of an
order.
MURATA MFG.CO.,LTD
Spec No.JEFK243A-0004C-01
14.
Reference Only
P7/10
!
△
Caution
14.1
Mounting Direction
Mount products in right direction.
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also
flames or other serious trouble.
14.2
Limitation of Application
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life, body
or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability to the
applications listed in the above.
15. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
15.1 Flux and Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
15.2 Assembling
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
15.3 Resin coating
The electric characteristics may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you
select resin. In prior to use, please make the reliability evaluation with the product mounted in your application
set.
15.4 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
[Products direction]
Products shall be location the sideways
a
Direction (Length : awraping direction 2.
MURATA MFG.CO.,LTD
Spec No.JEFK243A-0004C-01
Reference Only
(2)Products location on P.C.B. separation
Products(A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A>C>B ≅ D.
Seam
b
A
P8/10
C
B
D
Slit
Length:a< b
a
Portion of
Perforation
15.5 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are far from the portion
of perforation.
×
P.C.B.
○
○
The portion of perforation shall be designed as narrow as possible
and shall be designed so as not to be applied the stress in the case
of P.C.B. separation.
Portion of
Perforation
Products shall not be arranged on the line of a series of holes when
there are big holes in P.C.B. (Because the stress concentrate on the
line of holes.)
Product
×
○
P.C.B.
×
Product
Hole
< Products Placing >
Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B.
during placing the products on the other side of P.C.B.
Pick- up nozzle
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
Product
P.C.B.
Support pin
15.6
Attention Regarding P.C.B. Mounting
In case of mounting by use of mounting machine, please choose nozzle which can pick up
components of 2012 size or the equivalents.
15.7 Standard Land Dimensions
MURATA MFG.CO.,LTD
Spec No.JEFK243A-0004C-01
Reference Only
P9/10
15.8 Standard Soldering Condition
(1) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃/10s
245±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time(s)
Standard Profile
150~180°C 、90s±30s
above 220°C、30s~60s
245±3°C
2 times
Limit Profile
above 230°C、60s max.
260°C、10s
2 times
(2) Standard printing pattern of solder paste
• Standard thickness of the solder paste should be 100 to 150µm.
• Use the solder paste printing pattern of the right pattern.
• For the resist and copper foil pattern, use standard land dimensions.
• Use Sn-3.0Ag-0.5Cu solder.
0.25
0.55
0.4
0.55
(3) Reworking with Soldering iron
0.5
• The following conditions shall be strictly followed when using a soldering iron after
being mounted by reflow soldering.
· Pre-heating: 150°C, 1 min
· Soldering iron output: 30W max.
· Tip temperature: 380°C max.
· Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
• Do not touch the products directly with the tip of the soldering iron.
(4) Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Upper Limit
Upper Limit
Recommendable
Recommendable
t
1/3T ≤ t ≤ T (T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO.,LTD
(in mm)
Spec No.JEFK243A-0004C-01
Reference Only
P10/10
15.9 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
・Power : 20W/ l max. ・Frequency : 28kHz to 40kHz ・Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner • Isopropyl alcohol (IPA)
2. Aqueous agent
• PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
15.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
15.11 Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such
as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
15.12 Storage Condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
·Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ +40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity.
· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration. Poor solderability due to the oxidized electrode.
· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
!
16.△
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD