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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
FCD5N60 / FCU5N60
N-Channel SuperFET® MOSFET
600 V, 4.6 A, 950 mΩ
Features
Description
• 650 V @ TJ = 150°C
SuperFET® MOSFET is Fairchild Semiconductor’s first generation of high voltage super-junction (SJ) MOSFET family that is
utilizing charge balance technology for outstanding low onresistance and lower gate charge performance. This technology
is tailored to minimize conduction loss, provide superior switching performance, dv/dt rate and higher avalanche energy. Consequently, SuperFET MOSFET is very suitable for the switching
power applications such as PFC, server/telecom power, FPD
TV power, ATX power and industrial power applications.
• Typ. RDS(on) = 810 mΩ
• Ultra Low Gate Charge (Typ. Qg = 16 nC)
• Low Effective Output Capacitance (Typ. Coss(eff.) = 32 pF)
• 100% Avalanche Tested
• RoHS Compliant
Application
• LCD/LED TV and Monitor
• Lighting
• Solar Inverter
• AC-DC Power Supply
D
D
G
S
I-PAK
D-PAK
G
D
G
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted.
Symbol
VDSS
S
FCD5N60TM
FCD5N60TM_WS
FCU5N60TU
600
Parameter
Drain to Source Voltage
ID
Drain Current
IDM
Drain Current
VGSS
Gate to Source Voltage
- Continuous (TC = 25oC)
V
4.6
- Continuous (TC = 100oC)
- Pulsed
Unit
A
2.9
(Note 1)
13.8
A
±30
V
mJ
EAS
Single Pulsed Avalanche Energy
(Note 2)
159
IAR
Avalanche Current
(Note 1)
4.6
A
EAR
Repetitive Avalanche Energy
(Note 1)
5.4
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
4.5
V/ns
(TC = 25oC)
PD
Power Dissipation
TJ, TSTG
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
TL
- Derate Above 25oC
54
W
0.43
W/oC
-55 to +150
oC
300
oC
FCD5N60TM
FCD5N60TM_WS
FCU5N60TU
Unit
Thermal Characteristics
Symbol
Parameter
RθJC
Thermal Resistance, Junction to Case, Max.
2.3
RθJA
Thermal Resistance, Junction to Ambient, Max.
83
©2008 Fairchild Semiconductor Corporation
FCD5N60 / FCU5N60 Rev. C2
1
o
C/W
www.fairchildsemi.com
FCD5N60 / FCU5N60 — N-Channel SuperFET® MOSFET
August 2014
Part Number
FCD5N60TM
Top Mark
FCD5N60
Package
D-PAK
Packing Method
Tape and Reel
Reel Size
330 mm
Tape Width
16 mm
Quantity
2500 units
FCD5N60TM_WS
FCD5N60
D-PAK
Tape and Reel
330 mm
16 mm
2500 units
FCU5N60TU
FCU5N60
IPAK
Tube
N/A
N/A
75 units
Electrical Characteristics TC = 25oC unless otherwise noted.
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ΔBVDSS
/ ΔTJ
BVDS
Breakdown Voltage Temperature
Coefficient
Drain to Source Avalanche Breakdown
Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate to Body Leakage Current
VGS = 0 V, ID = 250 μA, TC = 25oC
600
-
-
V
VGS = 0 V, ID = 250 μA, TC = 150oC
-
650
-
V
ID = 250 μA, Referenced to 25oC
-
0.6
-
V/oC
VGS = 0 V, ID = 4.6 A
-
700
-
V
VDS = 600 V, VGS = 0 V
-
-
1
VDS = 480 V, TC = 125oC
-
-
10
VGS = ±30 V, VDS = 0 V
-
-
±100
3.0
-
5.0
V
-
0.81
0.95
Ω
-
3.8
-
S
μA
nA
On Characteristics
VGS(th)
RDS(on)
Gate Threshold Voltage
VGS = VDS, ID = 250 μA
Static Drain to Source On Resistance
gFS
Forward Transconductance
VGS = 10 V, ID = 2.3 A
VDS = 40 V, ID = 2.3 A
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Coss
Output Capacitance
VDS = 480 V, VGS = 0 V, f = 1 MHz
Coss(eff.)
Effective Output Capacitance
VDS = 0 V to 400 V, VGS = 0 V
VDS = 25 V, VGS = 0 V,
f = 1 MHz
-
470
600
pF
-
250
320
pF
-
22
-
pF
-
12
-
pF
-
32
-
pF
-
12
30
ns
-
40
90
ns
-
47
95
ns
-
22
55
ns
-
16
-
nC
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg(tot)
Total Gate Charge at 10V
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller” Charge
VDD = 300 V, ID = 4.6 A,
VGS = 10 V, RG = 25 Ω
(Note 4)
VDS = 480 V, ID = 4.6 A,
VGS = 10 V
(Note 4)
-
2.8
-
nC
-
7
-
nC
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain to Source Diode Forward Current
-
-
4.6
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
-
-
13.8
A
VSD
Drain to Source Diode Forward Voltage
VGS = 0 V, ISD = 4.6 A
-
-
1.4
V
trr
Reverse Recovery Time
-
295
-
ns
Qrr
Reverse Recovery Charge
VGS = 0 V, ISD = 4.6 A
dIF/dt = 100 A/μs
-
2.7
-
μC
Notes:
1. Repetitive rating: pulse-width limited by maximum junction temperature.
2. IAS = 2.3 A, VDD = 50 V, RG = 25 Ω, starting TJ = 25°C.
3. ISD ≤ 4.6 A, di/dt ≤ 200 A/μs, VDD ≤ BVDSS, starting TJ = 25°C.
4. Essentially independent of operating temperature typical characteristics.
©2008 Fairchild Semiconductor Corporation
FCD5N60 / FCU5N60 Rev. C2
2
www.fairchildsemi.com
FCD5N60 / FCU5N60 — N-Channel SuperFET® MOSFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
VGS
Top :
15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
Bottom : 5.5 V
1
ID , Drain Current [A]
ID, Drain Current [A]
1
10
0
10
* Notes :
1. 250μs Pulse Test
10
o
150 C
o
25 C
0
10
o
-55 C
* Note
1. VDS = 40V
o
2. TC = 25 C
-1
10
2. 250μs Pulse Test
-1
-1
0
10
10
1
10
10
2
4
6
8
10
VGS , Gate-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperatue
2.5
1
ID , Drain Current [A]
RDS(ON) [Ω],
Drain-Source On-Resistance
3.0
VGS = 10V
2.0
1.5
VGS = 20V
1.0
10
o
150 C
o
25 C
0
10
o
-55 C
* Note
1. VDS = 40V
o
2. 250μs Pulse Test
* Note : TJ = 25 C
0.5
0.0
-1
2.5
5.0
7.5
10.0
12.5
10
15.0
2
4
Figure 5. Capacitance Characteristics
10
12
Ciss = Cgs + Cgd (Cds = shorted)
VDS = 100V
Coss = Cds + Cgd
VGS, Gate-Source Voltage [V]
Crss = Cgd
Capacitance [pF]
8
Figure 6. Gate Charge Characteristics
1500
* Notes :
1. VGS = 0 V
1000
2. f = 1 MHz
Coss
500
6
VGS , Gate-Source Voltage [V]
ID, Drain Current [A]
Ciss
Crss
0
0
10
10
VDS = 250V
VDS = 400V
8
6
4
2
* Note : ID = 4.6A
0
1
0
5
10
15
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]
©2008 Fairchild Semiconductor Corporation
FCD5N60 / FCU5N60 Rev. C2
10
3
www.fairchildsemi.com
FCD5N60 / FCU5N60 — N-Channel SuperFET® MOSFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
RDS(ON), (Normalized)
3.0
1.1
1.0
* Notes :
1. VGS = 0 V
0.9
2. ID = 250 μA
Drain-Source On-Resistance
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
1.2
2.5
2.0
1.5
1.0
* Notes :
1. VGS = 10 V
0.5
2. ID = 2.3 A
0.8
-100
-50
0
50
100
150
0.0
-100
200
-50
0
Figure 9. Maximum Safe Operating Area
2
4
10 us
1
ID, Drain Current [A]
ID, Drain Current [A]
200
5
10
100 us
0
10
DC
1 ms
10 ms
100 ms
* Notes :
o
1. TC = 25 C
-1
150
Figure 10. Maximum Drain Current
vs. Case Temperature
Operation in This Area
is Limited by R DS(on)
10
100
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
10
50
o
o
3
2
1
o
2. TJ = 150 C
3. Single Pulse
-2
10
0
10
1
2
10
0
25
3
10
10
50
75
100
125
150
o
VDS, Drain-Source Voltage [V]
TC, Case Temperature [ C]
D = 0 .5
10
0
0 .2
* N o te s :
o
1 . Z θ JC (t) = 2 .3 C /W M a x.
0 .1
2 . D u ty F a c to r, D = t 1 /t 2
0 .0 5
10
3 . T J M - T C = P D M * Z θ J C (t)
0 .0 2
-1
PDM
0 .0 1
θJC
o
ZθJC(t),
Thermal Response
Response [[oC/W]
ZθJC
Thermal
C/W]
Z(t),(t),
Thermal Response
Figure 11. Transient Thermal Response Curve
t1
s in g le p u ls e
10
t2
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t 1 , S q u a re W a v e P u ls e D u ra tio n [s e c ]
©2008 Fairchild Semiconductor Corporation
FCD5N60 / FCU5N60 Rev. C2
4
www.fairchildsemi.com
FCD5N60 / FCU5N60 — N-Channel SuperFET® MOSFET
Typical Performance Characteristics (Continued)
50KΩ
200nF
12V
FCD5N60 / FCU5N60 — N-Channel SuperFET® MOSFET
VGS
Same Type
as DUT
Qg
10V
300nF
VDS
VGS
Qgs
Qgd
DUT
IG = const.
3mA
Charge
Figure 12. Gate Charge Test Circuit & Waveform
VDS
RG
RL
VDS
90%
VDD
VGS
VGS
DUT
V
10V
GS
10%
td(on)
tr
td(off)
t on
tf
t off
Figure 13. Resistive Switching Test Circuit & Waveforms
BVDSS
1
EAS = ---- L IAS2 -------------------2
BVDSS - VDD
L
VDS
BVDSS
IAS
ID
RG
V
10V
GS
GS
VDD
ID (t)
VDS (t)
VDD
DUT
tp
tp
Time
Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms
©2008 Fairchild Semiconductor Corporation
FCD5N60 / FCU5N60 Rev. C2
5
www.fairchildsemi.com
FCD5N60 / FCU5N60 — N-Channel SuperFET® MOSFET
DUT
+
VDS
_
I SD
L
Driver
RG
VGS
VGS
( Driver )
Same Type
as DUT
VDD
• dv/dt controlled by RG
• ISD controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
I SD
( DUT )
di/dt
IRM
Body Diode Reverse Current
VDS
( DUT )
Body Diode Recovery dv/dt
VSD
VDD
Body Diode
Forward Voltage Drop
Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms
©2008 Fairchild Semiconductor Corporation
FCD5N60 / FCU5N60 Rev. C2
6
www.fairchildsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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