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FPF2G120BF07AS

FPF2G120BF07AS

  • 厂商:

    MURATA-PS(村田)

  • 封装:

  • 描述:

  • 数据手册
  • 价格&库存
FPF2G120BF07AS 数据手册
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FPF2G120BF07AS F2, 3ch Boost module with NTC General Description * typical appearance The FPF2G120BF07AS is the 3ch boost topology which is providing an optimized solution for the multi-string solar application. And the integrated high speed field stop IGBTs and SiC diodes are providing lower conduction and switching losses. Furthermore, the screw clamp provides a fast and reliable mounting method. Electrical Features Package Code: F2 • High Efficiency • Low Conduction and Switching Losses • High Speed Field Stop IGBT • SiC SBD for Boost Diode • Built-in NTC for Temperature Monitoring Mechanical Features • Compact Size : F2 Package • Soldering Pin • Al2O3 Substrate with Low Thermal Resistance Applications • Solar Inverter Related Materials • AN-5077: Design Considerations for High Power Module Internal Circuit Diagram (HPM) Package Marking and Ordering Information Device Device Marking Package PCM Packing Type Quantity / Tray FPF2G120BF07AS FPF2G120BF07AS F2 X Tray 14 FPF2G120BF07ASP FPF2G120BF07ASP F2 O Tray 14 ©2015 Fairchild Semiconductor Corporation FPF2G120BF07AS Rev. 1.1 1 www.fairchildsemi.com FPF2G120BF07AS - F2, 3ch Boost module with NTC June 2015 Symbol TC = 25oC unless otherwise noted. Description Condition Rating Units Boost IGBT VCES Collector-Emitter Voltage 650 V VGES Gate-Emitter Voltage ± 20 V Transient Gate-Emitter Voltage IC Continuous Collector Current TC = 80 °C, TJmax = 175 °C limited by TJmax ICM Pulsed Collector Current PD Maximum Power Dissipation TJ Operating Junction Temperature ± 25 V 40 A 80 A 156 W - 40 to + 150 °C Protection Diode VRRM Peak Repetitive Reverse Voltage IF Continuous Forward Current IFM Maximum Forward Current TC = 80 °C, TJmax = 175 °C 60Hz Single Half-Sine Wave 650 V 15 A 30 A IFSM Non-repetitive Peak Surge Current 150 A I2t - value Surge Current Integral Value 93 A2s PD Maximum Power Dissipation 140 W TJ Operating Junction Temperature - 40 to + 150 °C VRRM Peak Repetitive Reverse Voltage 650 V IF Continuous Forward Current TC = 80 °C, TJmax = 175 °C 15 A IFM Maximum Forward Current 30 A IFSM Non-repetitive Peak Surge Current 60Hz Single Half-Sine Wave 120 A I2t - value Surge Current Integral Value 60 A2s PD Maximum Power Dissipation 98 W TJ Operating Junction Temperature - 40 to + 150 °C Storage Temperature - 40 to + 125 °C Boost Diode Module TSTG VISO Isolation Voltage Iso._Material Internal Isolation Material TMOUNT Mounting Torque Creepage Terminal to Heat Sink Terminal to Terminal 6.3 mm Clearance Terminal to Heat Sink 10.0 mm Terminal to Terminal 5.0 mm ©2015 Fairchild Semiconductor Corporation FPF2G120BF07AS Rev. 1.1 AC 1 min. 2 2500 V Al2O3 - 2.0 to 5.0 N•m 11.5 mm www.fairchildsemi.com FPF2G120BF07AS - F2, 3ch Boost module with NTC Absolute Maximum Ratings Symbol Parameter Conditions Min. Typ. Max. Units 650 - - V Boost IGBT Off Characteristics BVCES Collector-Emitter Breakdown Voltage VGE = 0 V, IC = 1 mA ICES Collector Cut-off Current VCE = VCES, VGE = 0 V - - 250 A IGES Gate-Emitter Leakage Current VGE = VGES, VCE = 0 V - - ±2 A On Characteristics VGE(th) Gate-Emitter Threshold Voltage VGE = VCE, IC = 40 mA 3.9 5.1 6.8 V VCE(sat) Collector-Emitter Saturation Voltage IC = 40 A, VGE = 15 V - 1.55 2.2 V IC = 40 A, VGE = 15 V, TC = 125 °C - 1.85 - V RLEAD Lead Resistance of Pin to Chip per Chip - 3.3 - m VCC = 300 V IC = 40 A VGE = 15 V RG = 15  Inductive Load TC = 25 °C - 24 - ns - 24 - ns - 132 - ns Switching Characteristics td(on) Turn-On Delay Time tr Rise Time td(off) Turn-Off Delay Time tf Fall Time EON Turn-On Switching Loss per Pulse EOFF Turn-Off Switching Loss per Pulse td(on) Turn-On Delay Time tr Rise Time td(off) Turn-Off Delay Time VCC = 300 V IC = 40 A VGE = 15 V RG = 15  Inductive Load TC = 125 °C tf Fall Time EON Turn-On Switching Loss per Pulse EOFF Turn-Off Switching Loss per Pulse Qg Total Gate Charge VCC = 300 V, IC = 40 A, VGE = 15 V RJC Thermal Resistance of Junction to Case - 17 - ns - 0.40 - mJ - 0.28 - mJ - 22 - ns - 27 - ns - 148 - ns - 17 - ns - 0.59 - mJ - 0.37 - mJ - 65 - nC per Chip - - 0.96 °C/W IF = 15 A - 1.05 1.4 V IF = 15 A, TC = 125 °C - 0.95 - V m Protection Diode VF Diode Forward Voltage RLEAD Lead Resistance of Pin to Chip per Chip - 2.4 - IR Reverse Leakage Current VR = 650 V - - 250 A RJC Thermal Resistance of Junction to Case per Chip - - 1.07 °C/W - 1.45 1.9 V Boost Diode VF Diode Forward Voltage IF = 15 A IF = 15 A, TC = 125 °C - 1.75 - V RLEAD Lead Resistance of Pin to Chip per Chip - 2.8 - m A IR Reverse Leakage Current VR = 650 V - - 60 Irr Reverse Recovery Current - 9.2 - A QC Total Capacitive Charge VR = 300 V, IF = 15 A, di / dt = 1390 A/us TC = 25 °C - 60 - nC - 4.9 - J - 9.2 - A nC Erec Reverse Recovery Energy Irr Reverse Recovery Current QC Total Capacitive Charge Erec RJC - 65 - Reverse Recovery Energy VR = 300 V, IF = 15 A, di / dt = 1390 A/us TC = 125 °C - 4.9 - J Thermal Resistance of Junction to Case per Chip - - 1.52 °C/W ©2015 Fairchild Semiconductor Corporation FPF2G120BF07AS Rev. 1.1 3 www.fairchildsemi.com FPF2G120BF07AS - F2, 3ch Boost module with NTC Electrical Characteristics TC = 25°C unless otherwise noted. Symbol Parameter Conditions Min. Typ. Max. Units k NTC(Thermistor) RNTC Rated Resistance TC = 25 °C - 10 - TC = 100 °C - 936 -  Tolerance TC = 25 °C -3 - +3 % PD Power Dissipation TC = 25 °C - - 20 mW BValue B-Constant B25/50 - 3450 - K B25/100 - 3513 - K ©2015 Fairchild Semiconductor Corporation FPF2G120BF07AS Rev. 1.1 4 www.fairchildsemi.com FPF2G120BF07AS - F2, 3ch Boost module with NTC Electrical Characteristics TC = 25°C unless otherwise noted. Fig 1. Typical Output Characteristics - IGBT Fig 2. Typical Output Characteristics - IGBT 80 VGE = 19 V 17 V 15 V 13 V 11 V 9V 60 Collector Current, IC [A] Collector Current, IC [A] 80 40 20 TC = 25 °C 0 0.0 0.5 1.0 1.5 2.0 2.5 VGE = 19 V 17 V 15 V 13 V 11 V 9V 60 40 20 TC = 125 °C 0 0.0 3.0 0.5 Collector-Emitter Voltage, VCE [V] 2.5 3.0 2.0 Common Emitter VGE = 15 V TC = 25°C TC = 80°C TC = 125°C 40 20 0.5 with an inductive load VCE = 300 V VGE = 15 V Rg = 15  TC = 25 °C TC = 125 °C 1.6 Switching Loss [mJ] 60 0 0.0 1.0 1.5 2.0 2.5 0.8 EOFF 0.4 0.0 3.0 Fig 5. Switching Loss vs. Gate Resistance - IGBT EON 1.2 0 10 20 30 40 50 60 70 Collector Current, IC [A] Collector-Emitter Voltage, VCE [V] 80 Fig 6. Transient Thermal Impedance - IGBT 10 with an inductive load VCE = 300 V VGE = 15 V IC = 40 A TC = 25 °C TC = 125 °C 1.0 0.8 Thermal Response, ZJC [C/W] 1.2 Switching Loss [mJ] 2.0 Fig 4. Switching Loss vs. Collector Current - IGBT 80 EON 0.6 0.4 EOFF 0.2 0.0 1.5 Collector-Emitter Voltage, VCE [V] Fig 3. Typical Saturation Voltage Characteristics - IGBT Collector Current, IC [A] 1.0 0 10 20 30 40 60 70 Gate Resistance, RG [] ©2015 Fairchild Semiconductor Corporation FPF2G120BF07AS Rev. 1.1 50 80 90 1 0.5 0.3 0.1 0.1 0.05 0.01 t1 Single Pulse t2 Duty Factor, D = t1/t2 TJ - TC = PDM*ZJC(t) 1E-3 1E-5 100 PDM 0.02 0.01 1E-4 1E-3 0.01 0.1 1 Rectangular Pulse Duration, t1 [sec] 5 www.fairchildsemi.com FPF2G120BF07AS - F2, 3ch Boost module with NTC Typical Performance Characteristics Fig 7. Typical Forward Voltage Drop - Protection Diode Fig 8. Transient Thermal Impedance - Protection Diode 30 10 Forward Current, IF [A] 25 Thermal Response, ZJC(t) [C/W] TC = 25°C TC = 80°C TC = 125°C 20 15 10 5 0 0.0 0.3 0.6 0.9 Forward Voltage, VF [V] 1.2 0.5 0.3 0.1 0.1 0.05 0.02 0.01 PDM t1 0.01 Single Pulse t2 Duty Factor, D = t1/t2 TJ - TC = PDM*ZJC(t) 1E-3 1E-5 1.5 1E-4 1E-3 0.01 0.1 1 Rectangular Pulse Duration, t1 [sec] Fig 9. Typical Forward Voltage Drop - Boost Diode Fig 10. Reverse Recovery Energy vs. Forward Current - Boost Diode 30 8 Reverse Recovery Energy, Erec [uJ] TC = 25°C TC = 80°C TC = 125°C 25 Forward Current, IF [A] 1 20 15 10 5 0 0.0 0.5 1.0 1.5 2.0 Forward Voltage, VF [V] 2.5 Rg = 15  VR = 300V TC = 125°C 6 4 2 0 3.0 0 5 10 15 20 25 Forward Current, IF [V] 30 Fig 11. Reverse Recovery Energy vs. Gate Resistance Fig 12. Transient Thermal Impedance - Boost Diode - Boost Diode 10 IF = 15 A VR = 300V TC = 125°C Thermal Response, ZJC(t) [C/W] Reverse Recovery Energy, Erec [uJ] 8 6 4 2 0 0 20 40 Gate Resistance, RG [] ©2015 Fairchild Semiconductor Corporation FPF2G120BF07AS Rev. 1.1 60 80 1 0.5 0.3 0.1 0.1 0.05 0.02 0.01 t1 0.01 Single Pulse t2 Duty Factor, D = t1/t2 TJ - TC = PDM*ZJC(t) 1E-3 1E-5 100 PDM 1E-4 1E-3 0.01 0.1 1 Rectangular Pulse Duration, t1 [sec] 6 www.fairchildsemi.com FPF2G120BF07AS - F2, 3ch Boost module with NTC Typical Performance Characteristic FPF2G120BF07AS - F2, 3ch Boost module with NTC Internal Circuit Diagram DC+1 DC+2 D1 DC+3 D2 L1 D3 L2 T1 L3 T2 Q1 Q2 Q3 G1 G2 G3 E1 E2 E3 DC-1 DC-2 DC-3 Package Outlines [mm] 0.64±0.03 62.8 ±0.5 48.0 ±0.3 53.0 ±0.1 4.5 ±0.1 42.5 ±0.15 5.0 ±0.1 1.4±0.2 2.3 X 8.5 SIDE VIEW 16.4±0.2 22.7 ±0.3 25.5 25.5 24.0 51.0 ±0.15 24.0 56.7±0.3 20.8 TOP VIEW 17.6 14.4 14.4 11.2 8.0 16.4±0.5 8.0 4.8 4.8 E1 G1 9.6 12.8 16.0 DC-1 DC DC +1 +1 DC DC -1 -1 DC DC +2 +2 DC DC -2 -2 3.2 L1 L1 L2 L2 L3 L3 DC DC +3 +3 DC DC -3 -3 26.5 21.3 12.8 16.0 E2 G2 T1 DC-1 T2 E3 G3 DC DC -2 -2 D C DC -3 -3 26.5 21.3 FRONT VIEW NOTES: UNLESS OTHERWISE SPECIFIED A) THIS PACKAGE DOES NOT COMPLY TO ANY CURRENT PACKAGING STANDARD B) ALL DIMENSIONS ARE IN MILLIMETERS C) 3CH-BOOST MODULE TYPE D) DRAWING FILENAME : 20BF07ASREV3 4x 2.8 2x 9.0 PCB HOLE POSITION - PIN-GRID 3.2mm - TOLERANCE OF PCB HOLE PATTERN ©2015 Fairchild Semiconductor Corporation FPF2G120BF07AS Rev. 1.1 12.0±0.35 1.6 0.1 7 www.fairchildsemi.com FPF2G120BF07AS - F2, 3ch Boost module with NTC ©2015 Fairchild Semiconductor Corporation FPF2G120BF07AS Rev. 1.1 8 www.fairchildsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com © Semiconductor Components Industries, LLC N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 1 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative www.onsemi.com
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