GQM2195C2A331JB12D

Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series GQM Product Summary GQM Series: Featuring improved low power consumption for mobile telecommunications, the GQM Series is typically used in frequencies from 500MHz to 10GHz. The copper electrodes allow for ultra low ESR, high Q in the GHz frequencies and high RF current handling capability. This series is the best choice for high performance, high power RF designs requiring voltages up to 500VDC. Offered in EIA sizes 0603, 0805 and the new 1111 size with a capacitance range of 0.1 to 100pF, there are a variety of tight tolerance versions available. Features:   GQM Series         Size: 0603, 0805 and 1111 Voltage: 50, 100, 250 and 500VDC Cap Range: 0.1 to 100pF Internal Electrode: Cu Termination: Cu + Ni/Sn plating ESR: Ultra Low Power: High Power (>15W) Frequency Range: 500MHz –10GHz. High Q and Low ESR at VHF, UHF, and Microwave Frequencies Tolerance: Tight Tolerance Available ([W]=+/-0.05pF for 1400 −55°C to 125°C Five cycles 30pFmax.: Q>800+20C C:Nominal Capacitance (pF) Humidity Steady State Appearance: No marking defects Capacitance Change Within ±5% or ± 0.5pF (Whichever is larger) 30pFmin.: Q>350 40±2°C and 90 to 95% humidity for 500±12 hours. 10pF - 30pF: Q>275+5C/2 10pFmax.: Q>200+10C    C: Nominal Capacitance (pF) 32 – Innovator in Electronics Humidity Load Appearance: No marking defects   w ww ww w. m . mu ur Capacitance Change Within ±7.5% or ±0.75 pF (Whichever is larger) ra at a t a. c. co om m   C-29-C Apply the rated voltage at 40±2°C and 90 to 95% Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series Specifications and Test Methods GQM Series GQM Specifications and Test Methods Item Specification Test Method Appearance: No marking defects Capacitance Change Within ±7.5% or ±0.75 pF (Whichever is larger) 30pFmin.: Q 200 Humidity Load 30pFmax.: Q 100+10C/3    C: Nominal Capacitance (puff) Appearance: No marking defects Capacitance Change Within ±3% or ±0.3pF (Whichever is larger) 30pFmin.: Q 350 High Temperature Load Apply the rated voltage at 40±2°C and 90 to 95% humidity for 500±12 hours. Apply 150% of the rated voltage for 1000±12 hours at the maximum operating temperature ±3°C. 10pF - 30pF: Q 275+5C/2 10pFmax.: Q 200+10C    C: Nominal Capacitance (pF) Table A-1 Char. 5C Nominal Values (ppm/°C) Note Max . 0 ± 30 – 55C 0.58 Min. -0.24 Capacitance Change from 25°C（%） −30C Max. Min. 0.4C -0.17 Max. 0.25 —10C Min. -0.11 GQM Series Note: Nominal values denote the temperature coefficient within a range of 25°C to 125°C. C-29-C   w w w w w .w m. u m ru ar ta at .a c . oc m o m   Innovator in Electronics – 33 Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series GQM Technical Data (Typical) Capacitance -–Temperature Temperature Characteristics Characteristics Capacitance C0G Characteristics (GQM) 2.0 Capacitance Change (%) 1.5 1.0 0.5 Spec. (upper) 0.0 Spec. (lower) -0.5 -1.0 -1.5 -75 -50 -25 0 25 50 75 100 125 150 Temperature (°C) Resonant Resonant Frequency Frequency Characteristics Characteristics Resonant Frequency Characteristics GQM GQM Series Series 10G 10G Resonant Frequency Frequency (Hz) (Hz) Resonant GQM Series -2.0 Measurement Measurement Equipment Equipment HP8720 HP8720 GQM187 GQM187 GQM188/21 GQM188/21 1G 1G GQM22 GQM22 100M GG 100M 11 1100 110000 CCapac apacitanc itancee (pF) (pF) 10 34 – Innovator in Electronics   w ww ww w. m . mu ur ra at a t a. c. co om m   C-29-C Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series GQM Technical Data (Typical) ESR - Frequency Characteristics GQM187Series Series GQM187 GQM187 Series 10 10 1pF 1pF 10pF 10pF 10 4 74p7 pFF 1 1pF Coaxial-Line 34A Measurement Equipment Boonton Resonant Coaxial-Line 34A 10pF 47pF 0 .1 0 .1 0 .1 0 .0 1 100M 0 .0 1 100M 1 010G 000M 1 0 010GM FREQUENCY (Hz) 1 010G 000M 1 0 010GM Frequency (Hz) GQM188 Series 0 .0 1 100M 10 10 GQM1881 0Series 010GM GQM188 Series GQM188 Series ESR (ohm) ESR(ohm) ESR (ohm) 1 100pF 1pF 10pF 100pF 1pF 10pF 0 .1 100pF 1 0 .1 0 .0 1 100M 1 0 010GM 1 010G 000M FREQUENCY (Hz) 0 .1 0 .0 1 100M GQM21 Series 10 1 0 010GM 1pF Frequency (Hz) 1 ESR (ohm) ) 100pF 1 0 010GM Frequency (Hz) GQM21 Series 0 .1 10 1 1 010G 000M 10pF GQM21 Series ESR (ohm) 0 .0 1 1 0100M C-29-C 1 010G 000M 10pF Frequency (Hz) 1 10 1pF 1 010G 000M 1pF 10pF 100pF 1pF 10pF  1 0 .1 0 .0 1  w w w 100M w w .w m. u m ru ar ta at1 G.a c . oc m o 1000M FREQUENCY (Hz) m  100pF  Innovator in Electronics – 35 1 010G 000M GQM Series 1 1 ESR (ohm) ESR (ohm) ESR (ohm) GQM187 Series Measurement Measurement Equipment Equipment Boonton BoontonResonant Resonant Coaxial-Line 34A Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series GQM Technical Data (Typical) ESR - Frequency Characteristics GQM21 Series Series (50V/100V) GQM187 GQM187 Series 10 Measurement Measurement Equipment Equipment Boonton Resonant Boonton Resonant Coaxial-Line 34A 10 1 p1Fp F 1 01p0Fp F 4 74p7Fp F ESR (ohm) ESR (ohm) 1 Coaxial-Line 34A 1 0 .1 0 .1 0 .0 1 100M 1 010G 000M 1 0 010GM FREQUENCY (Hz) GQM Series 0 .0 1 100M 1 010G 000M 1 0 010GM GQM188 Series 10 Frequency (Hz) 1pF GQM188 Series 10pF 100pF 10 1 ESR(ohm) 1 GQM21 GQM21Series Series(250V) (250V) 1pF 10pF 100pF 0 .1 ESR (ohm) 1 1pF ESR (ohm) 10pF 100pF 0 .0 1 100M 0 .1 1 0 010GM 1 010G 000M FREQUENCY (Hz) 0.1 GQM21 Series 10 1pF 0 .0 1 100M 10pF 1 0 010GM ESR (ohm) 1 10G 1 0 0 p1 F0 0 0 0 M Frequency (Hz) GQM21 Series 0.01 1 0 100M 1G 0 .1 10G Frequency (Hz) 1pF 10pF 100pF R (ohm) 1 36 – Innovator in Electronics 0 .0 1 100M  w ww ww w. m . mu ur 1 0ra 010aGtM a t a. FREQUENCY (Hz) c. co om m 10G  1 00 0 0 M C-29-C Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series GQM Technical Data (Typical) ESR Frequency Characteristics ESR - FREQUENCY (TYPICAL) GQM22 Series (500V) GQM187 Series 1 Measurement Equipment Boonton Resonant Coaxial-Line 34A 10 1pF 1pF 100pF ESR (ohm) ESR (ohm) 47pF 10pF 1 0.1 10pF 0 .1 0 .0 1 100M 1 010G 000M 1 0 010GM 0.01 GQM188 Series 1 01G 00 100M 100 10 10G Frequency (Hz) 1pF 10pF 100pF ESR(ohm) 1 0 .1 0 .0 1 100M 1 0 010GM 1 010G 000M FREQUENCY (Hz) GQM21 Series 10 1pF 10pF 100pF ESR (ohm) 1 0 .1 0 .0 1 C-29-C   w 100M w w w w .w m. G M c . oc m u m ru ar ta 1a0t 010.a o FREQUENCY (Hz) m   1 010G 0Innovator 00M in Electronics – 37 GQM Series FREQUENCY (Hz) Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series GQM Technical Data (Typical) Q - Frequency Characteristics Q -QFrequency Characteristics - Frequency Characteristics GQM187 GQM187Series Series GQM187 Series 10000 10 GQM187 Series 10000 1pF 10pF 10pF 4 71 pp FF 47pF 10pF 1000 100 47pF 1 ESR (ohm) Q 100 Q 1000 Measurement Measurement Equipment Equipment Measurement Boonton Resonant Boonton Resonant Equipment Coaxial-Line 34A Coaxial-Line 34A Boonton Resonant Coaxial-Line 34A 1pF 0 .1 10 0 .0 1 100M 10 GQM Series 1 100M 1 100M 1 010G 000M 1 0 010GM FREQUENCY (Hz) 1G 1 010G 000M 1000M GQM188 Series Frequency 1G(Hz) 10 1 010G 000M 1000M 1pF Frequency (Hz) 1 10000 ESR(ohm) 10000 1000 10pF GQM188 Series GQM188 Series GQM188 Series 100pF 1pF 10pF 1 01 0p pFF 10pF 0 .1 100pF Q 100 Q 1000 100 0 .0 1 100M 1 0 010GM GQM21 Series 10 10 10 1pF 10pF 1 100pF 1G 1000M 100M 1 1 1 10G 0000M Frequency 1G (Hz) 1 10G 0000M 1000M ESR (ohm) 100M 10000 1 010G 000M FREQUENCY (Hz) Frequency (Hz) 0 .1 GQM21 Series (50V/100V) GQM21 Series (50V/100V) 1pF 10000 1000 38 – Innovator in Electronics 1000 0 .0 1 100M   10pF 1 010ppFF w ww ww w. m . mu ur 1 0 010G M ra at a t a. FREQUENCY (Hz) c. 1 0 p F 1 010G 000M co om m   100pF C-29-C Application Specific Capacitors 10 High Frequency Ceramic Capacitors – GQM Series GQM Technical Data (Typical) 1 100M 1G 1000M 1 10G 0000M Frequency (Hz) Q - Frequency Characteristics GQM21Series Series (50V/100V) (50V/100V) GQM21 GQM187 Series 10000 10 Measurement Equipment Boonton Resonant Coaxial-Line 34A 1pF FF 110p p 10pF 100pF 47pF 1000 ESR (ohm) 1 Q 100 0 .1 10 1 1 010G 000M 1 0 010GM FREQUENCY (Hz) 1G 100M 1 10G 0000M 1000M Frequency (Hz) GQM188 Series 10 1pF GQM21 Series (250V) 10pF 100pF GQM21 Series (250V) ESR(ohm) 1 10000 0 .1 1pF 1000 10pF Q 100pF 0 .0 1 100M 100 1 0 010GM 1 010G 000M FREQUENCY (Hz) GQM21 Series 10 10 1pF 10pF 100pF ESR (ohm) 1 1 100M 1G 10G Frequency (Hz) z z) 0 .1 C-29-C  0 .0 1  100M w w w w w .w m. u m ru ar ta1 0a0t 10GM .a c . oc m o FREQUENCY (Hz) m   in Electronics – 39 1 010G 0Innovator 00M GQM Series 0 .0 1 100M Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series Q - FREQUENCY (TYPICAL) GQM Technical Data (Typical) MURATA P/N: GQM22_500V Measuring equipment: Boonton Resonant Coaxial-Line 34 Q - Frequency Characteristics GQM22 (500V) GQM22 Series Series (500V) GQM187 Series 10000 Measurement Equipment Boonton Resonant Coaxial-Line 34A 10 1pF 10pF 47pF 1pF 1000 1 Q ESR (ohm) 10pF 100pF 0 .1 100 0 .0 1 100M 10 1 010G 000M 1 0 010GM GQM188 Series 10 1 1pF 1G 100M 100 10G 10pF 1000 10000 100pF Frequency (Hz) ESR(ohm) 1 0 .1 0 .0 1 100M 1 0 010GM 1 010G 000M FREQUENCY (Hz) GQM21 Series 10 1pF 10pF 100pF 1 ESR (ohm) GQM Series FREQUENCY (Hz) 0 .1 0 .0 1 40 – Innovator in Electronics   100M w ww ww w. m . mu ur ra at 1 0 010G M FREQUENCY (Hz) a t a. c. co om m 10G   10000M C-29-C 10 10 Application Specific Capacitors 5 5 High Frequency Ceramic Capacitors – GQM Series 0 0 0 0 0.2 0.2 GQM Technical Data0.10.1 (Typical) 0.3 0.4 0.5 0.3 0.4 0.5 Current (Arms) Current (Arms) 0.6 0.6 0.7 0.7 0.8 0.8 Temperature Rise - Current Characteristics GQM187 Series (1GHz) GQM187 Series (1GHz) 40 40 1pF 1pF 2.4pF 35 35 2.4pF 7.5pF Temperature Rise (°C) Temperature Rise (°C) 30 7.5pF 10pF 30 10pF 22pF 25 22pF 25 20 20 15 15 10 10 5 5 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Current (Arms) 0 0.1 0.2 0.4 0.5 0.6 0.7 0.8 Temperature Rise - 0.3Current Characteristics Current (Arms) GQM188 Series (1GHz) GQM188 Series (1GHZ) 40 35 1pF 2pF 4pF 10pF Temperature Rise (°C) 30 25 20 15 10 5 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Current (Arms) GQM187 Series (1GHz) 40 1pF 35  e (°C) C-29-C  30 w 25 2.4pF w w w w .w m. u m ru ar ta at .a c . oc m o m  7.5pF  10pF Innovator in Electronics – 41 22pF GQM Series 0 Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series GQM Technical Data (Typical) GQM21 Series GQM21 Series(1GHz) (1GHz) 40 1.0pF 2.0pF Temperature Rise (°C) 35 4.0pF 10pF 30 25 20 15 10 5 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 GQM Series Current (Arms) GQM22Series Series (1GHz) GQM22 (1GHz) 40 1.2pF 4.7pF 35 Temperature Rise (°C) 10pF 22pF 30 25 20 15 10 5 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Current (Arms) 42 – Innovator in Electronics   w ww ww w. m . mu ur ra at a t a. c. co om m   C-29-C Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series PDF catalog is downloaded from!CAUTION the website (for of Murata Manufacturing co., ltd. Therefore, itís specifications areinsubject to change or oursmoking productsand/or in it may be discontinued without advance notice. Please check with our • Please read rating and storage, operating, rating, soldering, mounting and handling) this catalog to prevent burning, etc. !Note ï This !Note GQM Soldering and Mounting C02E.pdf 07.2.6 sales representatives or product engineers before ordering. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. !Caution Caution (Soldering and Mounting) ■ !Caution (Soldering and Mounting) 1. Mounting Position Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. Component Direction Locate chip horizontal to the direction in which stress acts Chip Mounting Close to Board Separation Point Perforation Chip arrangement Worst A-C-(B~D) Best D Slit 2. Chip Placing An excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting, causing cracked chips. So adjust the suction nozzle's bottom dead point by correcting warp in the board. Normally, the suction nozzle's bottom dead point must be set on the upper surface of the board. Nozzle pressure for chip mounting must be a 1 to 3N static load. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving smoothly. This imposes great force on the chip during mounting, causing cracked chips. And the locating claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained, checked and replaced periodically. Incorrect Suction Nozzle Deflection Correct Board Board Guide 13 Support Pin Continued on the following page. C-29-C   w w w w w .w m. u m ru ar ta at .a c . oc m o m   Innovator in Electronics – 43 83 GQM Series A C B Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series GQM Soldering and Mounting Continued from the preceding page. 3. Reflow Soldering Standard Conditions for Reflow Soldering When sudden heat is applied to the components, the mechanical strength of the components should go down because remarkable temperature change causes deformity inside components. In order to prevent mechanical damage in the components, preheating should be required for both of the components and the PCB board. Preheating conditions are shown in Table 1. It is required to keep temperature differential between the soldering and the components surface (∆T) as small as possible. Solderability of Tin plating termination chip might be deteriorated when a low temperature soldering profile where peak solder temperature is below the Tin melting point is used. Please confirm the solderability of Tin plating termination chip before use. When components are immersed in solvent after mounting, be sure to maintain the temperature difference (∆T) between the component and the solvent within the range shown in the Table 1. Infrared Reflow Temperature (°C) Soldering Peak Temperature ∆T 170°C 150°C 130°C Preheating Time 60-120 seconds 30-60 seconds Vapor Reflow Temperature (°C) Soldering Peak Temperature Gradual Cooling ∆T Preheating Temperature Differential GQM18/21 ∆T 190°C 60-120 seconds GQM22 Time 20 seconds max. ∆T 130°C Allowable Soldering Temperature and Time Soldering Temperature (°C) GQM Series 170°C 150°C 130°C Table 1 Part Number Gradual Cooling 200°C Recommended Conditions Pb-Sn Solder Infrared Reflow Vapor Reflow Lead Free Solder Peak Temperature 230-250°C 230-240°C 240-260°C Atmosphere Air Air Air or N2 Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu 280 270 260 250 240 230 220 0 30 60 90 120 Soldering Time (sec.) In case of repeated soldering, the accumulated soldering time must be within the range shown above. Optimum Solder Amount for Reflow Soldering Overly thick application of solder paste results in excessive fillet height solder. This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack Too little solder paste results in a lack of adhesive strength on the outer electrode, which may result in chips breaking loose from the PCB. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm* min. Optimum Solder Amount for Reflow Soldering 0.2mm* min. *GRM 02/03: 1/3 of Chip Thickness min. Inverting the PCB Make sure not to impose an abnormal mechanical shock on the PCB. 44 – Innovator in Electronics Continued on the following page.   w ww ww w. m . mu ur ra at a t a. c. co om m   C-29-C Application Specific Capacitors Continued from the preceding page. 4. Leaded Component Insertion If the PCB is flexed when leaded componentsCapacitors (such as High Frequency Ceramic – GQM Series transformers and ICs) are being mounted, chips may is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications areinsubject to change or oursmoking productsand/or in it may be discontinued without advance notice. Please check with our • Please read rating and CAUTION (for storage, operating, rating, soldering, mounting and handling) this catalog to prevent burning, etc. Note • This PDF Notecatalog C02E.pdf 07.2.6 sales representatives or product engineers before ordering. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. • This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. crack and solder joints may break. GQM Soldering and Mounting Before mounting leaded components, support the PCB Caution using backup pins or special jigs to prevent warping. Continued from the preceding page. 5. Leaded Flow Soldering 4. Component Insertion Table 2 Lead Free Solder Pb-Sn Solder Part Number Peak Temperature Temperature (%) Soldering Peak Temperature $T 170oC 150oC 130oC Preheating Standard Conditions for Flow Soldering Temperature (%) 60-120 seconds Peak Temperature N2 Air LLL21/31 Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu ERB18/21 $T-150% Time Soldering 5 seconds max. Gradual Cooling Soldering Temperature (%) Allowable Soldering Temperature and Time $T 280170oC 150oC 270 130oC 260 Preheating 250 240 230 60-120 seconds Time 5 seconds max. 13 220 10 20 30 40 Allowable0 Soldering Temperature and Time Soldering Time (sec.) 280 270case of repeated soldering, the accumulated In soldering time must be within the range shown above. 260 250 240 230 220 0 10 20 240-250oCTemperature250-260oC Differential Atmosphere GRM18/21/31 Gradual Cooling 13 30 40 Soldering Time (sec.) In case of repeated soldering, the accumulated soldering time must be within the range shown above. GQM18/21 Optimum Solder Amount for Flow Soldering Recommended The top of theConditions solder fillet should be lower than the thickness of components. If Solder the solder amount is Solder Lead Free Pb-Sn 250-260oC Peak Temperature excessively big, the risk240-250oC of cracking is higher during N2 Airother stressful conditions. Atmosphere board bending or under any Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu Up to Chip Thickness Adhesive Optimum Solder Amount for Flow Soldering The top of the solder fillet should be lower than the thickness of components. If the solder amount is excessively big, the risk of cracking is higher during board bending or under any other stressful conditions. Continued on the following page. Up to Chip Thickness 85 Adhesive Continued on the following page. C-29-C   w w w w w .w m. u m ru ar ta at .a c . oc m o m   85 Innovator in Electronics – 45 GQM Series Recommended Conditions Standard Conditions for Flow Soldering Soldering Temperature (%) When sudden heat is applied to the components, theas If the PCB is flexed when leaded components (such mechanical strength thebeing components should down transformers and ICs)ofare mounted, chipsgo may because temperature crack andremarkable solder joints may break.change causes deformity inside components. And an excessively Before mounting leaded components, support the long PCB soldering timepins or high soldering results in using backup or special jigstemperature to prevent warping. leaching of the outer electrodes, causing poor adhesion or a reduction in capacitance value due to loss of contact electrodes and end termination. 5. between Flow Soldering In order to prevent in the When sudden heat mechanical is applied todamage the components, the components,strength preheating shoud be required for the both mechanical of the components should go down components and the temperature PCB board. Preheating conditions because remarkable change causes are showninside in Table 2. It is required temperature deformity components. And to ankeep excessively long differentialtime between the soldering and the components soldering or high soldering temperature results in surface ($T) asouter smallelectrodes, as possible.causing poor adhesion leaching of the When components are immersed solvent after or a reduction in capacitance valueindue to loss of contact mounting,electrodes be sure toand maintain the temperature difference between end termination. between component and solvent within the range In order tothe prevent mechanical damage in the shown in Table 2. components, preheating shoud be required for the both Do not apply and flowthe soldering to chips not listedconditions in Table 2. components PCB board. Preheating are shown in Table 2. It is required to keep temperature Table 2 differential between the soldering and the components Number Temperature Differential surfacePart ($T) as small as possible. WhenGRM18/21/31 components are immersed in solvent after LLL21/31 mounting, be sure to maintain the temperature difference GQM18/21 $T-150% ERB18/21 between the component and solvent within the range GQM18/21 shown in Table 2. Do not apply flow soldering to chips not listed in Table 2. Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series GQM Soldering and Mounting 6. Correction with a Soldering Iron When sudden heat is applied to the components when using a soldering iron, the mechanical strength of the components will decrease because the extreme temperature change can cause deformations inside the components. In order to prevent mechanical damage to the components, preheating is required for both the components and the PCB board. Preheating conditions (the "Temperature of the Soldering Iron tip", "Preheating Temperature", "Temperature Differential" between the iron tip and the components and the PCB) should be within the conditions of Table 3. It is required to keep the temperature differential between the soldering Iron and the component surfaces (ΔT) as small as possible. After soldering, do not allow the component/PCB to rapidly cool down. The operating time for the re-working should be as short as possible. When re-working time is too long, it may cause solder leaching, and that will cause a reduction in the adhesive strength of the terminations. Table 3 Temperature Differential (ΔT) Temperature of Soldering Iron tip Preheating Temperature GQM18/21 350Υ max. 150Υ min. ΔT 190Υ Air GQM22 280Υ max. 150Υ min. ΔT 130Υ Air Part Number Atmosphere *Applicable for both Pb-Sn and Lead Free Solder. Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu Optimum Solder amount when re-working with a Soldering lron GQM Series In case of sizes smaller than 0603, (GQM18), the top of the solder fillet should be lower than 2/3's of the thickness of the component or 0.5mm whichever is smaller. In case of 0805 and larger sizes (GQM21/22), the top of the solder fillet should be lower than 2/3's of the thickness of the component. If the solder amount is excessive, the risk of cracking is higher during board bending or under any other stressful condition. Solder amount in section. A Soldering iron with a tip of ø3mm or smaller should be used. It is also necessary to keep the soldering iron from touching the components during the re-work. Solder wire with ø0.5mm or smaller is required for soldering. 7. Washing Excessive output of ultrasonic oscillation during cleaning causes PCBs to resonate, resulting in cracked chips or broken solder. Take note not to vibrate PCBs. FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY RESULT, WORST CASE, IN A SHORT CIRCUIT AND FUMING WHEN THE PRODUCT IS USED. 㻭㻨㻰㻦㻱㻦㻐㻓㻓㻔㻕㻮 46 – Innovator in Electronics   w ww ww w. m . mu ur ra at a t a. c. co om m   C-29-C Application Specific Capacitors High Frequency Ceramic Capacitors – GQM Series GQM Design Engineering Kits ASCAP Hi-Frequency 0603 (50 to 100 VDC) 0603 (250 VDC) ■ High Q and Low ESR at VHF, UHF, and Microwave Frequencies ■ 0603 and 0805 sizes with Copper Inner Electrode ■ Tight Tolerance Available ([W]=+/-0.05pF for