Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
GQM Product Summary
GQM Series:
Featuring improved
low power consumption for mobile
telecommunications, the GQM Series is
typically used in frequencies from 500MHz
to 10GHz. The copper electrodes allow for
ultra low ESR, high Q in the GHz frequencies
and high RF current handling capability. This
series is the best choice for high performance,
high power RF designs requiring voltages up
to 500VDC. Offered in EIA sizes 0603, 0805
and the new 1111 size with a capacitance
range of 0.1 to 100pF, there are a variety of
tight tolerance versions available.
Features:
GQM Series
Size: 0603, 0805 and 1111
Voltage: 50, 100, 250 and 500VDC
Cap Range: 0.1 to 100pF
Internal Electrode: Cu
Termination: Cu + Ni/Sn plating
ESR: Ultra Low
Power: High Power (>15W)
Frequency Range: 500MHz –10GHz. High Q and Low ESR at VHF, UHF, and
Microwave Frequencies
Tolerance: Tight Tolerance Available ([W]=+/-0.05pF for 1400
−55°C to 125°C Five cycles
30pFmax.: Q>800+20C
C:Nominal Capacitance (pF)
Humidity Steady State
Appearance: No marking defects
Capacitance Change Within ±5% or
± 0.5pF (Whichever is larger)
30pFmin.: Q>350
40±2°C and 90 to 95% humidity for 500±12 hours.
10pF - 30pF: Q>275+5C/2
10pFmax.: Q>200+10C
C: Nominal Capacitance (pF)
32 – Innovator in Electronics
Humidity Load
Appearance: No marking defects
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Capacitance Change Within ±7.5% or
±0.75 pF (Whichever is larger)
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C-29-C
Apply the rated voltage at 40±2°C and 90 to 95%
Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
Specifications and Test Methods
GQM Series
GQM Specifications and Test Methods
Item
Specification
Test Method
Appearance: No marking defects
Capacitance Change Within ±7.5% or
±0.75 pF (Whichever is larger)
30pFmin.: Q 200
Humidity Load
30pFmax.: Q 100+10C/3
C: Nominal Capacitance (puff)
Appearance: No marking defects
Capacitance Change Within ±3% or
±0.3pF (Whichever is larger)
30pFmin.: Q 350
High Temperature Load
Apply the rated voltage at 40±2°C and 90 to 95%
humidity for 500±12 hours.
Apply 150% of the rated voltage for 1000±12 hours
at the maximum operating temperature ±3°C.
10pF - 30pF: Q 275+5C/2
10pFmax.: Q 200+10C
C: Nominal Capacitance (pF)
Table A-1
Char.
5C
Nominal Values
(ppm/°C) Note
Max .
0 ± 30
– 55C
0.58
Min.
-0.24
Capacitance Change from 25°C(%)
−30C
Max.
Min.
0.4C
-0.17
Max.
0.25
—10C
Min.
-0.11
GQM Series
Note: Nominal values denote the temperature coefficient within a range of 25°C to 125°C.
C-29-C
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Innovator in Electronics – 33
Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
GQM Technical Data (Typical)
Capacitance -–Temperature
Temperature Characteristics
Characteristics
Capacitance
C0G Characteristics (GQM)
2.0
Capacitance Change (%)
1.5
1.0
0.5
Spec. (upper)
0.0
Spec. (lower)
-0.5
-1.0
-1.5
-75
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Resonant
Resonant Frequency
Frequency Characteristics
Characteristics
Resonant Frequency Characteristics
GQM
GQM Series
Series
10G
10G
Resonant Frequency
Frequency (Hz)
(Hz)
Resonant
GQM Series
-2.0
Measurement
Measurement
Equipment
Equipment
HP8720
HP8720
GQM187
GQM187
GQM188/21
GQM188/21
1G
1G
GQM22
GQM22
100M
GG
100M
11
1100
110000
CCapac
apacitanc
itancee (pF)
(pF)
10
34 – Innovator in Electronics
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Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
GQM Technical Data (Typical)
ESR - Frequency Characteristics
GQM187Series
Series
GQM187
GQM187 Series
10
10
1pF
1pF
10pF
10pF
10
4 74p7 pFF
1
1pF
Coaxial-Line
34A
Measurement
Equipment
Boonton Resonant
Coaxial-Line 34A
10pF
47pF
0 .1
0 .1
0 .1
0 .0 1
100M
0 .0 1
100M
1 010G
000M
1 0 010GM
FREQUENCY (Hz)
1 010G
000M
1 0 010GM
Frequency (Hz)
GQM188
Series
0 .0 1
100M
10
10
GQM1881 0Series
010GM
GQM188 Series
GQM188
Series
ESR (ohm)
ESR(ohm)
ESR (ohm)
1
100pF
1pF
10pF
100pF
1pF
10pF
0 .1
100pF
1
0 .1
0 .0 1
100M
1 0 010GM
1 010G
000M
FREQUENCY (Hz)
0 .1
0 .0 1
100M
GQM21 Series
10
1 0 010GM
1pF
Frequency (Hz)
1
ESR (ohm)
)
100pF
1 0 010GM
Frequency (Hz)
GQM21 Series
0 .1
10
1
1 010G
000M
10pF
GQM21 Series
ESR (ohm)
0 .0 1
1 0100M
C-29-C
1 010G
000M
10pF
Frequency (Hz)
1
10
1pF
1 010G
000M
1pF
10pF
100pF
1pF
10pF
1
0 .1
0 .0 1
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FREQUENCY (Hz)
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Innovator in Electronics – 35
1 010G
000M
GQM Series
1
1
ESR (ohm)
ESR (ohm) ESR (ohm)
GQM187 Series
Measurement
Measurement
Equipment
Equipment
Boonton
BoontonResonant
Resonant
Coaxial-Line 34A
Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
GQM Technical Data (Typical)
ESR - Frequency Characteristics
GQM21
Series Series
(50V/100V)
GQM187
GQM187 Series
10
Measurement
Measurement
Equipment
Equipment
Boonton Resonant
Boonton Resonant
Coaxial-Line 34A
10
1 p1Fp F
1 01p0Fp F
4 74p7Fp F
ESR (ohm)
ESR (ohm)
1
Coaxial-Line 34A
1
0 .1
0 .1
0 .0 1
100M
1 010G
000M
1 0 010GM
FREQUENCY (Hz)
GQM Series
0 .0 1
100M
1 010G
000M
1 0 010GM
GQM188
Series
10
Frequency (Hz)
1pF
GQM188 Series
10pF
100pF
10
1
ESR(ohm)
1
GQM21
GQM21Series
Series(250V)
(250V)
1pF
10pF
100pF
0 .1
ESR (ohm)
1
1pF
ESR (ohm)
10pF
100pF
0 .0 1
100M
0 .1
1 0 010GM
1 010G
000M
FREQUENCY (Hz)
0.1
GQM21 Series
10
1pF
0 .0 1
100M
10pF
1 0 010GM
ESR (ohm)
1
10G
1 0 0 p1
F0 0 0 0 M
Frequency (Hz)
GQM21 Series
0.01
1 0 100M
1G
0 .1
10G
Frequency (Hz)
1pF
10pF
100pF
R (ohm)
1
36 – Innovator in Electronics
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C-29-C
Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
GQM Technical Data (Typical)
ESR Frequency
Characteristics
ESR - FREQUENCY
(TYPICAL)
GQM22 Series (500V)
GQM187 Series
1
Measurement
Equipment
Boonton Resonant
Coaxial-Line 34A
10
1pF
1pF
100pF
ESR (ohm)
ESR (ohm)
47pF
10pF
1
0.1
10pF
0 .1
0 .0 1
100M
1 010G
000M
1 0 010GM
0.01
GQM188
Series
1 01G
00
100M
100
10
10G
Frequency (Hz)
1pF
10pF
100pF
ESR(ohm)
1
0 .1
0 .0 1
100M
1 0 010GM
1 010G
000M
FREQUENCY (Hz)
GQM21 Series
10
1pF
10pF
100pF
ESR (ohm)
1
0 .1
0 .0 1
C-29-C
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FREQUENCY (Hz)
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in Electronics – 37
GQM Series
FREQUENCY (Hz)
Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
GQM Technical Data (Typical)
Q - Frequency Characteristics
Q -QFrequency
Characteristics
- Frequency Characteristics
GQM187
GQM187Series
Series
GQM187 Series
10000
10
GQM187 Series
10000
1pF
10pF
10pF
4 71 pp FF
47pF
10pF
1000
100
47pF
1
ESR (ohm)
Q
100
Q
1000
Measurement
Measurement
Equipment
Equipment
Measurement
Boonton
Resonant
Boonton
Resonant
Equipment
Coaxial-Line 34A
Coaxial-Line 34A
Boonton Resonant
Coaxial-Line 34A
1pF
0 .1
10
0 .0 1
100M
10
GQM Series
1
100M
1
100M
1 010G
000M
1 0 010GM
FREQUENCY (Hz)
1G
1 010G
000M
1000M
GQM188
Series
Frequency
1G(Hz)
10
1 010G
000M
1000M
1pF
Frequency (Hz)
1
10000
ESR(ohm)
10000
1000
10pF
GQM188 Series
GQM188
Series
GQM188 Series
100pF
1pF
10pF
1 01 0p pFF
10pF
0 .1
100pF
Q
100
Q
1000
100
0 .0 1
100M
1 0 010GM
GQM21 Series
10
10
10
1pF
10pF
1
100pF
1G
1000M
100M
1
1
1 10G
0000M
Frequency
1G (Hz)
1 10G
0000M
1000M
ESR (ohm)
100M
10000
1 010G
000M
FREQUENCY (Hz)
Frequency (Hz)
0 .1
GQM21 Series (50V/100V)
GQM21 Series (50V/100V)
1pF
10000
1000
38 – Innovator in Electronics
1000
0 .0 1
100M
10pF
1 010ppFF
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Application Specific Capacitors
10
High Frequency Ceramic Capacitors – GQM Series
GQM Technical
Data (Typical)
1
100M
1G
1000M
1 10G
0000M
Frequency
(Hz)
Q - Frequency
Characteristics
GQM21Series
Series (50V/100V)
(50V/100V)
GQM21
GQM187 Series
10000
10
Measurement
Equipment
Boonton Resonant
Coaxial-Line 34A
1pF
FF
110p p
10pF
100pF
47pF
1000
ESR (ohm)
1
Q
100
0 .1
10
1
1 010G
000M
1 0 010GM
FREQUENCY
(Hz)
1G
100M
1 10G
0000M
1000M
Frequency (Hz)
GQM188 Series
10
1pF
GQM21 Series (250V)
10pF
100pF
GQM21 Series (250V)
ESR(ohm)
1
10000
0 .1
1pF
1000
10pF
Q
100pF
0 .0 1
100M
100
1 0 010GM
1 010G
000M
FREQUENCY (Hz)
GQM21 Series
10
10
1pF
10pF
100pF
ESR (ohm)
1
1
100M
1G
10G
Frequency (Hz)
z
z)
0 .1
C-29-C
0 .0 1
100M
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FREQUENCY (Hz)
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1 010G
0Innovator
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GQM Series
0 .0 1
100M
Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
Q - FREQUENCY (TYPICAL)
GQM Technical Data (Typical)
MURATA P/N: GQM22_500V
Measuring equipment: Boonton Resonant Coaxial-Line 34
Q - Frequency Characteristics
GQM22
(500V)
GQM22 Series
Series (500V)
GQM187 Series
10000
Measurement
Equipment
Boonton Resonant
Coaxial-Line 34A
10
1pF
10pF
47pF
1pF
1000
1
Q
ESR (ohm)
10pF
100pF
0 .1
100
0 .0 1
100M
10
1 010G
000M
1 0 010GM
GQM188 Series
10
1
1pF
1G
100M
100
10G
10pF
1000
10000
100pF
Frequency (Hz)
ESR(ohm)
1
0 .1
0 .0 1
100M
1 0 010GM
1 010G
000M
FREQUENCY (Hz)
GQM21 Series
10
1pF
10pF
100pF
1
ESR (ohm)
GQM Series
FREQUENCY (Hz)
0 .1
0 .0 1
40 – Innovator in Electronics
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FREQUENCY (Hz)
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C-29-C
10
10
Application Specific Capacitors
5
5
High Frequency Ceramic Capacitors – GQM Series
0
0
0
0
0.2
0.2
GQM Technical Data0.10.1
(Typical)
0.3
0.4
0.5
0.3
0.4
0.5
Current (Arms)
Current (Arms)
0.6
0.6
0.7
0.7
0.8
0.8
Temperature Rise - Current Characteristics
GQM187 Series (1GHz)
GQM187 Series (1GHz)
40
40
1pF
1pF
2.4pF
35
35
2.4pF
7.5pF
Temperature Rise (°C)
Temperature Rise (°C)
30
7.5pF
10pF
30
10pF
22pF
25
22pF
25
20
20
15
15
10
10
5
5
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Current (Arms)
0
0.1
0.2
0.4
0.5
0.6
0.7
0.8
Temperature
Rise
- 0.3Current
Characteristics
Current (Arms)
GQM188 Series (1GHz)
GQM188 Series (1GHZ)
40
35
1pF
2pF
4pF
10pF
Temperature Rise (°C)
30
25
20
15
10
5
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Current (Arms)
GQM187 Series (1GHz)
40
1pF
35
e (°C)
C-29-C
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10pF Innovator in Electronics – 41
22pF
GQM Series
0
Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
GQM Technical Data (Typical)
GQM21
Series
GQM21
Series(1GHz)
(1GHz)
40
1.0pF
2.0pF
Temperature Rise (°C)
35
4.0pF
10pF
30
25
20
15
10
5
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
GQM Series
Current (Arms)
GQM22Series
Series (1GHz)
GQM22
(1GHz)
40
1.2pF
4.7pF
35
Temperature Rise (°C)
10pF
22pF
30
25
20
15
10
5
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Current (Arms)
42 – Innovator in Electronics
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Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
itís specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note ï This
!Note
GQM Soldering and Mounting
C02E.pdf
07.2.6
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution
Caution (Soldering and Mounting)
■ !Caution (Soldering and Mounting)
1. Mounting Position
Choose a mounting position that minimizes the stress
imposed on the chip during flexing or bending of the
board.
Component Direction
Locate chip
horizontal to the
direction in
which stress
acts
Chip Mounting Close to Board Separation Point
Perforation
Chip arrangement
Worst A-C-(B~D) Best
D
Slit
2. Chip Placing
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. So adjust the suction nozzle's
bottom dead point by correcting warp in the board.
Normally, the suction nozzle's bottom dead point must be
set on the upper surface of the board. Nozzle pressure
for chip mounting must be a 1 to 3N static load.
Dirt particles and dust accumulated between the suction
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes great force on the chip
during mounting, causing cracked chips. And the locating
claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction
nozzle and the locating claw must be maintained,
checked and replaced periodically.
Incorrect
Suction Nozzle
Deflection
Correct
Board
Board Guide
13
Support Pin
Continued on the following page.
C-29-C
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Innovator in Electronics – 43
83
GQM Series
A
C
B
Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
GQM Soldering and Mounting
Continued from the preceding page.
3. Reflow Soldering
Standard Conditions for Reflow Soldering
When sudden heat is applied to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity inside components. In order to prevent
mechanical damage in the components, preheating should
be required for both of the components and the PCB board.
Preheating conditions are shown in Table 1. It is required to
keep temperature differential between the soldering and
the components surface (∆T) as small as possible.
Solderability of Tin plating termination chip might be
deteriorated when a low temperature soldering profile where
peak solder temperature is below the Tin melting point is
used. Please confirm the solderability of Tin plating
termination chip before use.
When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (∆T)
between the component and the solvent within the range
shown in the Table 1.
Infrared Reflow
Temperature (°C)
Soldering
Peak Temperature
∆T
170°C
150°C
130°C
Preheating
Time
60-120 seconds 30-60 seconds
Vapor Reflow
Temperature (°C)
Soldering
Peak Temperature
Gradual
Cooling
∆T
Preheating
Temperature Differential
GQM18/21
∆T 190°C
60-120 seconds
GQM22
Time
20 seconds max.
∆T 130°C
Allowable Soldering Temperature and Time
Soldering Temperature (°C)
GQM Series
170°C
150°C
130°C
Table 1
Part Number
Gradual
Cooling
200°C
Recommended Conditions
Pb-Sn Solder
Infrared Reflow Vapor Reflow
Lead Free Solder
Peak Temperature
230-250°C
230-240°C
240-260°C
Atmosphere
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
280
270
260
250
240
230
220
0
30
60
90
120
Soldering Time (sec.)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Optimum Solder Amount for Reflow Soldering
Overly thick application of solder paste results in
excessive fillet height solder.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
the chips to crack
Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
Make sure the solder has been applied smoothly to the
end surface to a height of 0.2mm* min.
Optimum Solder Amount for Reflow Soldering
0.2mm* min.
*GRM 02/03: 1/3 of Chip Thickness min.
Inverting the PCB
Make sure not to impose an abnormal mechanical shock on
the PCB.
44 – Innovator in Electronics
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Application Specific Capacitors
Continued from the preceding page.
4. Leaded Component Insertion
If the PCB
is flexed when leaded
componentsCapacitors
(such as
High
Frequency
Ceramic
– GQM Series
transformers
and
ICs)
are
being
mounted,
chips
may
is downloaded
from the
website
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
CAUTION
(for
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
Note • This PDF
Notecatalog
C02E.pdf
07.2.6
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
crack and solder joints may break.
GQM
Soldering and Mounting
Before mounting leaded components, support the PCB
Caution
using backup pins or special jigs to prevent warping.
Continued from the preceding page.
5. Leaded
Flow Soldering
4.
Component Insertion
Table 2
Lead Free Solder
Pb-Sn Solder
Part Number
Peak Temperature
Temperature (%)
Soldering
Peak Temperature
$T
170oC
150oC
130oC
Preheating
Standard Conditions for Flow Soldering
Temperature (%)
60-120 seconds
Peak Temperature
N2
Air
LLL21/31
Pb-Sn Solder:
Sn-37Pb
Lead Free
Solder: Sn-3.0Ag-0.5Cu
ERB18/21
$T-150%
Time
Soldering
5 seconds max.
Gradual
Cooling
Soldering Temperature (%)
Allowable Soldering Temperature and Time
$T
280170oC
150oC
270
130oC
260
Preheating
250
240
230
60-120 seconds
Time
5 seconds max.
13
220
10
20
30
40
Allowable0 Soldering
Temperature
and
Time
Soldering Time (sec.)
280
270case of repeated soldering, the accumulated
In
soldering
time must be within the range shown above.
260
250
240
230
220
0
10
20
240-250oCTemperature250-260oC
Differential
Atmosphere
GRM18/21/31
Gradual
Cooling
13
30
40
Soldering Time (sec.)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
GQM18/21
Optimum Solder Amount for Flow Soldering
Recommended
The top of theConditions
solder fillet should be lower than the
thickness of components.
If Solder
the solder amount
is Solder
Lead Free
Pb-Sn
250-260oC
Peak
Temperature
excessively
big, the risk240-250oC
of cracking is higher
during
N2
Airother stressful conditions.
Atmosphere
board
bending or under any
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Up to Chip Thickness
Adhesive
Optimum Solder Amount for Flow Soldering
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively big, the risk of cracking is higher during
board bending or under any other stressful conditions.
Continued on the following page.
Up to Chip Thickness
85
Adhesive
Continued on the following page.
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Innovator in Electronics – 45
GQM Series
Recommended Conditions
Standard Conditions for Flow Soldering
Soldering Temperature (%)
When
sudden
heat is
applied
to the
components,
theas
If
the PCB
is flexed
when
leaded
components
(such
mechanical strength
thebeing
components
should
down
transformers
and ICs)ofare
mounted,
chipsgo
may
because
temperature
crack
andremarkable
solder joints
may break.change causes
deformity
inside components.
And an excessively
Before
mounting
leaded components,
support the long
PCB
soldering
timepins
or high
soldering
results in
using
backup
or special
jigstemperature
to prevent warping.
leaching of the outer electrodes, causing poor adhesion
or a reduction in capacitance value due to loss of contact
electrodes and end termination.
5. between
Flow Soldering
In order
to prevent
in the
When
sudden
heat mechanical
is applied todamage
the components,
the
components,strength
preheating
shoud
be required
for the
both
mechanical
of the
components
should
go down
components
and the temperature
PCB board. Preheating
conditions
because
remarkable
change causes
are showninside
in Table
2. It is required
temperature
deformity
components.
And to
ankeep
excessively
long
differentialtime
between
the
soldering
and the components
soldering
or high
soldering
temperature
results in
surface ($T)
asouter
smallelectrodes,
as possible.causing poor adhesion
leaching
of the
When
components
are immersed
solvent
after
or
a reduction
in capacitance
valueindue
to loss
of contact
mounting,electrodes
be sure toand
maintain
the temperature difference
between
end termination.
between
component
and solvent
within
the range
In
order tothe
prevent
mechanical
damage
in the
shown in Table
2.
components,
preheating
shoud be required for the both
Do not apply and
flowthe
soldering
to chips
not listedconditions
in Table 2.
components
PCB board.
Preheating
are shown in Table 2. It is required to keep temperature
Table
2
differential
between the soldering and the components
Number
Temperature Differential
surfacePart
($T)
as small as possible.
WhenGRM18/21/31
components are immersed in solvent after
LLL21/31
mounting,
be sure to maintain the temperature difference
GQM18/21
$T-150%
ERB18/21
between
the component and solvent within the range
GQM18/21
shown
in Table 2.
Do not apply flow soldering to chips not listed in Table 2.
Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
GQM Soldering and Mounting
6. Correction with a Soldering Iron
When sudden heat is applied to the components when using a soldering iron, the mechanical strength of
the components will decrease because the extreme temperature change can cause deformations inside the
components. In order to prevent mechanical damage to the components, preheating is required for both
the components and the PCB board. Preheating conditions (the "Temperature of the Soldering Iron tip",
"Preheating Temperature", "Temperature Differential" between the iron tip and the components and the
PCB) should be within the conditions of Table 3. It is required to keep the temperature differential
between the soldering Iron and the component surfaces (ΔT) as small as possible.
After soldering, do not allow the component/PCB to rapidly cool down.
The operating time for the re-working should be as short as possible. When re-working time is too long,
it may cause solder leaching, and that will cause a reduction in the adhesive strength of the terminations.
Table 3
Temperature
Differential
(ΔT)
Temperature
of Soldering
Iron tip
Preheating
Temperature
GQM18/21
350Υ max.
150Υ min.
ΔT
190Υ
Air
GQM22
280Υ max.
150Υ min.
ΔT
130Υ
Air
Part Number
Atmosphere
*Applicable for both Pb-Sn and Lead Free Solder. Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Optimum Solder amount when re-working with a Soldering lron
GQM Series
In case of sizes smaller than 0603, (GQM18), the top of the
solder fillet should be lower than 2/3's of the thickness of the
component or 0.5mm whichever is smaller. In case of 0805
and larger sizes (GQM21/22), the top of the solder fillet
should be lower than 2/3's of the thickness of the component.
If the solder amount is excessive, the risk of cracking is higher
during board bending or under any other stressful condition.
Solder amount
in section.
A Soldering iron with a tip of ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from touching
the components during the re-work.
Solder wire with ø0.5mm or smaller is required for soldering.
7. Washing
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
broken solder. Take note not to vibrate PCBs.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
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46 – Innovator in Electronics
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Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
GQM Design Engineering Kits
ASCAP Hi-Frequency
0603 (50 to 100 VDC)
0603 (250 VDC)
■ High Q and Low ESR at VHF, UHF, and Microwave Frequencies
■ 0603 and 0805 sizes with Copper Inner Electrode
■ Tight Tolerance Available ([W]=+/-0.05pF for