GQM2195C2E101JB12D

High Q and High Power Chip Multilayer Ceramic Capacitors for General Purpose GQM2195C2E101JB12_ (0805, C0G:EIA, 100pF, DC250V) _: packaging code Reference Sheet 1.Scope This product specification is applied to High Q and High Power Chip Multilayer Ceramic Capacitors used for General Electronic equipment. 　　 2.MURATA Part NO. System (Ex.) GQM 21 9 (2)T Dimensions (1)L/W Dimensions 5C 2E 101 (4)Rated (3)Temperature Characteristics (5)Nominal Capacitance Voltage J (6)Capacitance Tolerance B12 (7)Murata’s Control Code 3. Type & Dimensions (1)-1 L (1)-2 W (2) T e 2.0±0.15 1.25±0.15 0.85±0.15 0.2 to 0.7 (Unit:mm) g 0.7 min. 4.Rated value (3) Temperature Characteristics (Public STD Code):C0G(EIA) Temp. coeff Temp. Range or　Cap. Change (Ref.Temp.) 0±30 ppm/°C 25 to 125 °C (25 °C) (4) Rated Voltage DC 250 V (6) (5) Nominal Capacitance Capacitance Tolerance 100 pF ±5 % Specifications and Test Methods (Operating Temp. Range) -55 to 125 °C 5.Package mark (8) Packaging Packaging Unit D f180mm Reel PAPER W8P4 4000 pcs./Reel Product specifications in this catalog are as of Jun.5,2017,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and !Cautions first. GQM2195C2E101JB12-01 1 D (8)Packaging Code ■ Specifications and Test Methods No 1 Item Rated Voltage Test Method (Ref. Standard:JIS C 5101, IEC60384） The rated voltage is defined as the maximum voltage Specification Shown in Rated value. which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, should be maintained within the rated voltage range. 2 Appearance No defects or abnormalities. Visual inspection. 3 Dimension Within the specified dimensions. Using Measuring instrument of dimension. 4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations Test Voltage : 250% of the rated voltage Applied Time : 1s to 5 s Charge/discharge current : 50mA max. 5 Insulation Resistance(I.R.) More than 10,000MΩ Measurement Point 　　 : Between the terminations Measurement Voltage : Charging Time DC Rated Voltage : 2 min Charge/discharge current : 50mA max. Measurement Temperature : Room Temperature 6 Capacitance Shown in Rated value. 7 Q 30pF and over Measurement Temperature : Room Temperature Capacitance C≦1000pF : Q≧1400 30pF and below : Q≧800+20C Frequency Voltage 1.0+/-0.1MHz 0.5 to 5.0Vrms C:Nominal Capacitance(pF) 8 Temperature Characteristics Nominal values of the temperature coefficient is shown in The capacitance change should be measured after 5 min of Capacitance Rated value. at each specified temp. stage. But,the Capacitance Change under 20℃/25℃ is shown in Table A. Capacitance value as a reference is the value in step 3. Capacitance Drift The capacitance drift is calculated by dividing the differences Within +/-0.2% or +/-0.05pF between the maximum and minimum measured values in the (Whichever is larger.) step 1,3 and 5 by the cap. value in step 3. Step 1 2 3 4 5 9 Adhesive Strength No removal of the terminations or other defect of Termination should occur. Temperature(C) Reference Temp.+/-2 Min. Operating Temp.+/-3 Reference Temp.+/-2 Max. Operating Temp.+/-3 Reference Temp.+/-2 Solder the capacitor on the test substrate shown in Fig.3. Type GQM18 GQM21 Applied Force(N) 5 10 Holding Time : 10+/-1s Applied Direction : In parallel with the test substrate and vertical with the capacitor side. 10 Vibration Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. Capacitance Within the specified initial value. Kind of Vibration Q Within the specified initial value. Total amplitude : A simple harmonic motion 10Hz to 55Hz to 10Hz (1min) : 1.5mm This motion should be applied for a period of 2h in each 3 mutually perpendicular directions(total of 6h). 11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1. Capacitance Within +/-5% or +/-0.5pF Pressurization method : Shown in Fig.2 Change (Whichever is larger) Flexure　 Bending test Holding Time 12 Solderability 95% of the terminations is to be soldered evenly and continuously. 2 : 5+/-1s Soldering Method : Reflow soldering Test Method : Solder bath method Flux JEMCNS-0022E 　　　: 1mm Solution of rosin ethanol 25(mass)% Preheat : 80℃ to 120℃ for 10s to 30s Solder : Sn-3.0Ag-0.5Cu Solder Temp. : 245+/-5℃ Immersion time : 2+/-0.5s No Item 13 Resistance to Specification Test Method Test Method (Ref. Standard:JIS C 5101, IEC60384） : Solder bath method Appearance No defects or abnormalities. Solder : Sn-3.0Ag-0.5Cu Capacitance Within +/-2.5% or +/- 0.25pF Solder Temp. : 270+/-5℃ Change (Whichever is larger) Immersion time : 10+/-0.5s Q Within the specified initial value. Exposure Time : 24+/-2h Preheat : 120℃ to 150℃ for 1 min I.R. Within the specified initial value. Soldering Heat 　　　　 Voltage proof No defects. 14 Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. Capacitance Within +/-2.5% or +/- 0.25pF Perform the 5 cycles according to the four heat treatments Change (Whichever is larger) shown in the following table. Q Within the specified initial value. Sudden Change I.R. Within the specified initial value. Voltage proof No defects. Step Temp.(C) Time (min) 1 Min.Operating Temp.+0/-3 30+/-3 2 Room Temp. 2 to 3 3 Max.Operating Temp.+3/-0 30+/-3 4 Room Temp 2 to 3 Exposure Time 15 High : 24+/-2h Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. High Humidity Capacitance Within +/-7.5% or +/- 0.75pF Test Temperature : 40+/-2℃ (Steady) Change (Whichever is larger) Test Humidity : 90%RH to 95%RH Q 30pF and over　 : Q≧200 Test Time 30pF and below : Q≧100+10C/3 Applied Voltage Temperature 16 Durability C:Nominal Capacitance(pF) Charge/discharge current : 50mA max. I.R. More than 500MΩ Exposure Time Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. Capacitance Within +/-3% or +/- 0.3pF Test Temperature Change (Whichever is larger) Test Time Q 30pF and over　　　　　　　　　　　　 : Q≧350 Applied Voltage 10pF and over , 30pF and below : Q≧275+5C/2 Charge/discharge current : 50mA max. 10pF and below　　　　　　　　　　　 : Q≧200+10C Exposure Time C:Nominal Capacitance (pF) More than 1,000MΩ I.R. Table A Char. 2C 5C/5G -55℃ Max. 0.82 0.58 JEMCNS-0022E : 500+/-12h : DC Rated Voltage Min. -0.45 -0.24 Capacitance Change from 20C/25C (%) -30℃ -25℃ Max. Min. Max. Min. 0.49 -0.27 0.40 -0.17 - -10℃ Max. 0.33 0.25 3 Min. -0.18 -0.11 : 24+/-2h : Max. Operating Temp. +/-3℃ : 1000+/-12h : 200% of the rated voltage : 24+/-2h Substrate Bending test ・Test substrate Material : Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin) Thickness : 1.6mm Copper foil thickness : 0.035mm *1,2：2.0±0.05 φ1.5 +0.1 -0 a a 1.0 1.2 Ｂ c c 40 Type GQM18 GQM21 Dimension (mm) b 3.0Ａ 4.0 4.0±0.1 ＊1 c 1.2 1.65 ＊2 3.5±0.05 f4.5 8.0±0.3 b Land 1.75±0.1 　　　　　　　　　　　: Solder resist (Coat with heat resistant resin for solder) 0.05以下 100 t Fig.1 (in mm) ・Kind of Solder : Sn-3.0Ag-0.5Cu ・Pressurization method 20 50 min. Pressurization speed 1.0mm/s Pressurize tor R5 Flexure Support Capacitance meter 45 45 Fig.2 (in mm) Adhesive Strength of Termination, Vibration, Temperature Sudden Change, High Temperature High Humidity(Steady) , Durability ・Test substrate Material : Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin) Thickness : 1.6mm or 0.8mm Copper foil thickness : 0.035mm ・Kind of Solder : Sn-3.0Ag-0.5Cu ・Land Dimensions Chip Capacitor Land c Type GQM18 GQM21 b a a 1.0 1.2 Solder Resist Fig.3 JEMCNS-0022E 4 Dimension (mm) b 3.0 4.0 c 1.2 1.65 PACKAGING GQM Type 1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K) 1.1 Minimum Quantity(pcs./reel) φ180mm reel φ330mm reel Plastic Tape Paper Tape Plastic Tape Paper Tape Code:L Code:J/F Code:K Code:D/E Code:W 50000(W8P2) 10000(W8P2) 20000(W8P1) 4000 10000 4000 10000 4000 4000 4000 1000 Type GQM15 GQM187 GQM188 GQM21(LWT Dimensions Tolerance:±0.1) GQM21(LWT Dimensions Tolerance:±0.15) GQM22 1.2 Dimensions of Tape (1)GQM15 3.5±0.05 *2 Ｂ Ａ Ａ Ｂ *1 +0.1 φ1.5 -0 *1,2：2.0± 1.75±0.1 4.0±0.1 8.0±0.3 *1,*2：2.0±0.05 (in mm) 0.05 max. t Type Dimensions　(Chip) L GQM15 5 1.0±0.05 *3 Nominal value W T 0.5±0.05 0.5±0.05 A *3 B *3 t 0.65 1.15 0.8 max. 　(2)GQM15