LBCA2HNZYZ-711

Preliminary Specification Number: SP-HNZY-N Bluetooth Low Energy Module Data Sheet Dialog Semiconductor Chipset for Bluetooth 4.2 Tentative P/N : LBCA2HNZYZ-TEMP Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 1/22 Revision History Revision Code Date Oct.24.2013 A Feb.13.2014 B Mar.20.2014 Description First issue 4. Dimensions and Terminal Configurations Added Dimensions of m6 and m7 5. Revised Absolute Maximum Ratings 6. Revised Operating Condition 10. Revised RF Characteristics 12. Recommended Land Pattern Corrected to Top view 11. packing Information Added the figure of Tape and Reel 1. Revised Scope Added the weight C Apr.23.2014 D Apr.29.2014 E Jun.04.2014 F Jul.02.2014 G Nov.6.2014 5.Revised Absolute Maximum Ratings 8.Revised Sleep Clock for 32kHz Crystal 10.Revised RF Characteristics 13.Revised Application Circuit 11.Revised Packing Information 5.Revised Absolute Maximum Ratings 6. Operating Conditions 10.Revised RF Characteristics 4.Revised Dimensions and Terminal Configurations 10.Revised RF Characteristics 13.Revised Application Circuit 1.Scope 2.Part Number 3.RoHS Compliance 5.Dimensions and Terminal Configurations 6. Absolute Maximum Ratings 7.Operating Conditions 9.Sleep Clock: Recommended Operating Conditions 14.Application Circuit 15,Other Attentions H I J K Feb.12.2014 Feb.23.2015 Feb.27.2015 Aug.10.2018 L Oct.24.2018 M Jun.19.2020 N Jun.22.2020 16.Wireless / BT Certification Numbers 14. Application Circuit 16. Wireless / BT Certification Numbers 14. Application Circuit 16. Wireless / BT Certification Numbers Front Page BT Spec Version 16. Wireless / BT Certification Numbers 16. Wireless / BT Certification Numbers Modified Soldering Conditions. 12. Packing Information Modified 1 pin mark information. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 2/22 TABLE OF CONTENTS TABLE OF CONTENTS ............................................................................................................................. 2 1. Scope ................................................................................................................................................. 3 2. Part Number....................................................................................................................................... 3 3. RoHS Compliance ............................................................................................................................. 3 4. Block Diagram ................................................................................................................................... 3 5. Dimensions and Terminal Configurations ..................................................................................... 4 6. Absolute Maximum Ratings............................................................................................................. 7 7. Recommend Operating Condition .................................................................................................. 7 8. DC Characteristics ............................................................................................................................ 8 9. Sleep Clock: Recommended Operating Conditions ..................................................................... 8 10. Power Sequence ............................................................................................................................... 9 11. RF Characteristics .......................................................................................................................... 10 12. Packing Information ....................................................................................................................... 11 13. Recommended Land Pattern ......................................................................................................... 14 14. Application Circuit .......................................................................................................................... 15 15. Other Attentions .............................................................................................................................. 18 16. Wireless / BT Certification Numbers ............................................................................................ 18 17. NOTICE............................................................................................................................................. 19 18. PRECONDITION TO USE OUR PRODUCTS ................................................................................. 22 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 3/22 1. Scope This specification is applied to the Bluetooth low energy module. - Interface - IC - Reference Clock - Weight - MSL : GPIO(supporting UART / SPI / I2C) : DA14580-01 (Dialog Semiconductor) : Internal Crystal. : 0.107g :3 2. Part Number Sample Design Kit Daughter Board LBCA2HNZYZ-TEMP LBCA2HNZYZ-TEMP-DK LBCA2HNZYZ-TEMP-D-MU 3. RoHS Compliance This component can meet with RoHS compliance. 4. Block Diagram External X’tal / TCXO (32.768kHz) X’tal (16MHz) Antenna BLE IC LC Network for DCDC UART /SPI/I2C GPIO/ADC Quadrature Decoder Power Source Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 4/22 5. Dimensions and Terminal Configurations Pin 1 Marking (unit: mm) Dimension Mark Dimensions Mark Dimensions Mark Dimensions Mark Dimensions L 7.4±0.25 W 7.0±0.25 T 1.0 Max a1 0.3±0.1 a2 0.3±0.1 b1 0.3±0.2 b2 0.425±0.2 b3 0.425±0.2 c1 0.6±0.1 c2 0.6±0.1 e1 0.35±0.1 e2 0.35±0.1 e3 0.35±0.1 e4 0.5±0.1 e5 0.5±0.1 e6 0.4±0.1 e7 0.5±0.1 e8 0.5±0.1 m1 0.3±0.1 m2 0.6±0.1 m3 0.3±0.1 m4 0.3±0.1 m5 0.6±0.1 m6 3.3±0.2 m7 0.3±0.2 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 5/22 Terminal Configurations 36 13 37 14 15 16 17 18 19 20 12 22 11 31 32 33 34 10 30 29 28 27 35 25 7 6 1 Terminal Name P0_5 Connection to IC Terminal P0_5 2 P0_7 P0_7 3 4 P0_6 SWCLK P0_6 SWCLK 5 SWDIO SWDIO 6 7 8 9 10 GND VBAT GND XTAL32KP XTAL32KM GND VBAT GND XTAL32KP XTAL32KM 11 P0_3 P0_3 12 P0_2 P0_2 13 14 15 16 17 18 ANTout ANTin GND GND GND GND GND GND GND GND No. 23 24 9 8 21 5 4 3 2 1 26 Description INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. INPUT JTAG clock signal INPUT/OUTPUT. JTAG Data input/output. Bidirectional data and control communication Ground INPUT Battery connection. Ground INPUT. Crystal input for the 32.768 kHz XTAL OUTPUT. Crystal output for the 32.768 kHz XTAL INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. RF input/output. Refer to reference schematic Ground Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 6/22 19 Terminal Name NC Connection to IC Terminal - 20 GND GND 21 GND GND 22 P0_1 P0_1 23 P0_0 P0_0 24 P0_4 P0_4 25 RST RST 26 GND GND 27 GND GND 28 GND GND 29 GND GND No. 30 P1_1 P1_1 31 VPP VPP 32 GND GND 33 GND GND 34 GND GND Description No connection Ground INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. INPUT. Reset signal (Active High, Internally Pulled Down). It can be open or connected to GND if not used. Ground INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. INPUT. This pin is used while OTP programming. Should be left open when not programming. Ground 35 P1_0 36 NC INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. No Connection 37 NC No Connection P1_0 Marking Information Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 7/22 6. Absolute Maximum Ratings Item Storage Temperature VBAT supply voltage Min -40 -0.1 Max 85 3.6 Unit degC V VPP supply voltage -0.1 6.8 V Remarks Supply only during OTP programming Input voltage for -0.2 Min(1.2,VBAT+0.2) V XTAL32KM Input voltage for -0.2 Min(1.5,VBAT+0.2) V XTAL32KP Input voltage for -0.1 Min(3.6,VBAT+0.2) V all other pins Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all other parameters are set within operating condition. 7. Recommend Operating Condition Item Operating Temperature*1 VBAT supply voltage VBAT supply voltage for cold boot Min -40 2.35 VPP supply voltage 6.6 Typ 2.5 6.7 Max 85 3.3 Unit degC V 3.3 V 6.8 V Remarks Supply only during OTP programming. Input voltage for 0 Min(3.3,VBAT+0.2) V all other pins RF Load Impedance 50 Ω Output current for 4.8 mA Each I/O pin *1: Please keep derating / margin as much as possible at extreme temperature. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 8/22 8. DC Characteristics Parameters VIH VIL VOH VOL IIH(PD) IIL(PU) Description HIGH level input voltage LOW level input voltage HIGH level output voltage LOW level output voltage HIGH level input current with internal pull down enabled LOW level input current with internal pull up enabled Conditions Active mode Active mode Active mode Active mode Vin = VBAT = 2.5V Vin = GND = 0V Min 0.84 Typ Max 0.47 Unit V V V V 50 150 uA -150 -50 uA Max Unit kHz kohm pF pF ppm uW 0.36 1.88 9. Sleep Clock: Recommended Operating Conditions For 32kHz Crystal Parameters fXTAL ESR CL C0 dfXTAL DLmax Description Crystal frequency Equivalent Series Resistance Load Capacitance Shunt Capacitance Crystal frequency tolerance Maximum drive level Conditions Min Typ 32.768 6 7 1 -250 0.1 100 9 2 250 For 32kHz Crystal Oscillator Parameters fXO AXO dfXO Description Oscillator frequency Amplitude Frequency tolerance Conditions Min Typ 32.768 100 -250 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Max 1500 250 Unit kHz mVpp ppm Preliminary Specification Number: SP-HNZY-N 9/22 10. Power Sequence Power Up / Down Sequence Power Up Power Down Td H VBAT V1 L Ta Tb H GPIO L Reset and Power Cycle Sequence Symbol Description Typ Unit Ta > 500 us Ta Time between VCC valid and GPIO enabled Tb Time between GPIO invalid and VCC invalid Tb > 0 us Tc Length of RST pulse Tc > 10 us Td Required VBAT ramp-up time Td < 50 ms V1 Threshold voltage of VBAT rise up V1 > 2.35 V Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 10/22 11. RF Characteristics Normal Condition: VBAT=3.0V, +25deg.C, (otherwise notified) Item / Conditions Center frequency Channel Spacing Number of RF Channels Output power (Measured at ANT pin) Modulation characteristics 1) Δf1avg 2) Δf2max (at 99.9%) 3) Δf2avg / Δf1avg Carrier frequency offset and drift 1) Frequency offset: | fn – fTX | 2) Frequency drift: | f0 – fn | 3) Drift rate #0: | f1 – f0 | 4) Drift rate #n: | fn – fn-5 | Receiver sensitivity (Ideal transmitter PER Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 12/22 3. Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62μm in thickness [4] Base tape : As specified in (1) [3] [1] [2] [3] [4] Feeding Hole Feeding Direction Pin 1 Marking Chip 4. Leader and Tail tape Feeding direction Tail tape (No components) 40 to 200mm Components No components Leader tape (Cover tape alone) 150mm min. 250mm min. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 5. Preliminary Specification Number: SP-HNZY-N 13/22 The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. 6. The cover tape and base tape are not adhered at no components area for 250 mm min. 7. Tear off strength against pulling of cover tape : 5 N min. 8. Packaging unit : 1000 pcs./ reel 9. material : Base tape : Plastic Reel : Plastic Cover tape , cavity tape and reel are made the anti-static processing. 10. Peeling of force : 1.1 N max. in the direction of peeling as shown below. 1.3 1.1 N max. 165 to 180 ° Cover tape Base tape 11. PACKAGE (Humidity proof Packing) Label 表示ラべル Desiccant 乾燥剤 Humidity 　湿度 Indicator インジケ－タ 表示ラベル Label 防湿梱包袋 Anti-humidity Plastic Bag Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 14/22 13. Recommended Land Pattern (Unit : mm) Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 15/22 14. Application Circuit (1) Configuration using internal OTP *4) *2) *1) *3) *1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible. *2) Connection is necessary for writing program to the OTP via UART. Other GPIO pin can be used for VPP_CONTROL instead of P0_7. Please see the document "Hardware setup Guide for OTP Programming". Other pairs of GPIO can be used for UART instead of P0_4 and P0_5. Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins". *3) Connection is necessary for software debugging in your product via J-Link. OTP writing can also be done using J-Link. Please see the document "Hardware Setup for Software Debugging". RST input logic should be inverted externally if J-Link reset is enabled. *4) 10 GPIOs (P0_0 to P0_7, P1_0 and P1_1) are available for multipurpose use. P0_0 to P0_3 can be used for analog input. Note: XTAL32K_DISABLE_AMPREG register should be ‘1’ for using external OSC. See DA14580 datasheet for more details. Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC under some limitations noted below: - Environment temperature change is flat, connection interval < 2sec. - Confirmation in actual condition should be done enough by the customer’s responsibility. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 16/22 (2) Configuration using external Flash ROM *2) *1) *3) *1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible. *2) 6 GPIOs (P0_1, P0_2, P0_4, P0_7, P1_0 and P1_1) are available for multipurpose use. P0_1 and P0_2 can be used for analog input. Please do NOT toggle those pins by external devices during starting up. Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins". *3) Connection is necessary for software debugging in your product via J-Link. Please see the document "Hardware Setup for Software Debugging". RST input logic should be inverted externally if J-Link reset is enabled. Note: XTAL32K_DISABLE_AMPREG register should be ‘1’ for using external OSC. See DA14580 datasheet for more details. Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC under some limitations noted below: - Environment temperature change is flat, connection interval < 2sec. - Confirmation in actual condition should be done enough by the customer’s responsibility. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 17/22 (3) Configuration using external I2C EEPROM *2) *1) *3) *1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible. *2) 8 GPIOs (P0_0, P0_1, P0_4 to P0_7, P1_0 and P1_1) are available for multipurpose use. P0_0 and P0_1 can be used for analog input. Please do NOT toggle those pins by external devices during starting up. Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins". *3) Connection is necessary for software debugging in your product via J-Link. Please see the document "Hardware Setup for Software Debugging". RST input logic should be inverted externally if J-Link reset is enabled. Note: XTAL32K_DISABLE_AMPREG register should be ‘1’ for using external OSC. See DA14580 datasheet for more details. Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC under some limitations noted below: - Environment temperature change is flat, connection interval < 2sec. - Confirmation in actual condition should be done enough by the customer’s responsibility. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 18/22 15. Other Attentions This product is not confirmed connectivity to all Bluetooth(R) Smart Ready devices, so the connectivity to all devices in actual use is not guaranteed. Also the Bluetooth(R) Low Energy wireless technology sometimes fails connections depending on surrounding environment (radio interference, noise, disturbance etc.), so it is highly recommended to implement connection-retry scheme in the customer’s application software. When starting design the device, please refer to following application notes provided by Murata. - Hardware Setup Guide for OTP Programming - Hardware Setup Guide for Software Debugging - Overview of OTP Header Structure - Overview of DA1458X Initial Boot Sequence and Available Interface Pins. - TypeZY/ZS What should you do for Wireless Certification? - TypeZY/ZS Antenna Performance Layout Guide 16. Wireless / BT Certification Numbers This product is certified by following regulation bodies. - Japanese Radio Law （日本電波法） Type certification （工事設計認証） R001-P00500 - FCC (United States) FCC Part 15 subpart C Limited Modular Approval FCC ID: VPYLBZY - IC (Canada) RSS-210 Limited Modular Approval IC: 772C-LBZY - CE (Europe) EN 300328 V.2.2.2 Conducted Test Report available Note: CE marking and declaration should be done by customer as a final product. - Bluetooth(R) SIG Qualifications For Bluetooth Specification 4.1 QDID: 56016 (Controller Subsystem by Murata) QDID: 52696 (Host Subsystem by Dialog) QDID: 56907 (Profile Subsystem by Dialog) For Bluetooth Specification 4.2 QDID: 83573 (Controller Subsystem by Dialog) QDID: 83565 (Host Subsystem by Dialog) QDID: Ask Dialog or S/W 3rd Party (Profile Subsystem by Dialog) Note: Profile subsystem QDID is needed only if SIG standard profile is used. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-N 19/22 17. NOTICE 1.Storage Conditions: Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40deg.C.) - The product left more than 6months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020) - After the packing opened, the product shall be stored at Murata Manufacturing Co., Ltd.