LBEE5HY1MW-230

Wi-Fi®/ Bluetooth® Modules Wi-Fi® modules Wi-Fi® + Bluetooth® modules Type 1FX PN: LBWA1KL1FX-875 CYW43364 Chipset 6.95 x 5.15 x 1.1mm FCC/IC/CE*/Japan Certified 802.11b/g/n Type 1DX PN: LBEE5KL1DX-883 CYW4343W Chipset 6.95 x 5.15 x 1.1 mm FCC/IC/CE*/Japan Certified Type 1LV Type 1MW PN: LBEE59B1LV-278 CYW43012 Chipset 10.0 x 7.2 x 1.4 mm FCC/IC/CE*/Japan Certified PN: LBEE5HY1MW-230 CYW43455 Chipset 7.9 x 7.3 x 1.1 mm FCC/IC/CE*/Japan Certified 5.1 5.0 5.0 (It only supports 20MHz channel bandwidth) Type 1CX Type 1VA PN: LBEE5XV1VA-495 CYW88359 Chipset 11.4 x 8.9 x 1.4 mm FCC/IC/CE*/Japan Certified PN: LBEH5UL1CX-887 CYW4356 Chipset 11.5 x 8.8 x 1.0 mm MIMO RSDB MIMO 5.0 5.0 *Conducted results for CE Marking Conformity Assessment Procedures are available Copyright © Murata Manufacturing Co., Ltd. All rights reserved. 14 April 2020 1 Wi-Fi® MCU Modules ElectricImp modules Type 1GC/Imp005 Type 1MD/Imp004m Type 1CD/Imp003 PN: LBWA1UZ1GC-958 PN: LBWA1UZ1GC-901 (Imp005) CYW43907 Chipset 10.0 x 10.0 x 1.3 mm PN: LBEE5ZZ1MD-011 CYW43438+STM Chipset 21.0 x 17.5 x 2.3 mm PN:LBWA1ZV1CD-716 CYW43362+STM Chipset 10.0 x 7.9 x 1.25 mm WICED, ElectricImp FCC/IC/CE* Reference Certified ElectricImp FCC/IC/CE*/Japan Certified + Ethernet + ARM Cortex- R4 + ARM Cortex- M4 ElectricImp FCC/IC/CE* Reference Certified + ARM Cortex- M4 Ayla modules ElectricImp / Ayla modules Type 1LD Type 1AD PN: LBEE5PA1LD-005 PN: LBEE5PA1LD-222(Ayla) CYW43438+STM Chipset 8.9 x 7.8 x 1.2 mm PN: LBWA1CS1AD-806 CYW4390 Chipset 9.4 x 8.9 x 1.2 mm WICED, Ayla FCC/IC/CE */Japan Certified Ayla FCC/IC/CE* Reference Certified + ARM Cortex- M3 + ARM Cortex- M4 Built-in Cloud Agent *Conducted results for CE Marking Conformity Assessment Procedures are available Copyright © Murata Manufacturing Co., Ltd. All rights reserved. 14 April 2020 2 Wi-Fi® MCU Modules Wi-Fi MCU modules Type 1PS PN: LBWA1UZ1PS-241 CYW54907 Chipset 10.0 x 10.0 x 1.3 mm WICED FCC/IC/CE*/Japan Certified Wi-Fi/BT MCU modules Type 1QP PN: LBEE5WQ1QP-276 CYW43907+CYW20707 Chipset 11.0 x 11.0 x 1.2 mm Built-in Cloud Agent + Ethernet + ARM Cortex- R4 Type 1QX PN: LBEE5WQ1QX-277 CYW54907+CYW20707 Chipset 11.0 x 11.0 x 1.2 mm WICED WICED + ARM Cortex- R4 + ARM Cortex- R4 **Available through Distribution Channels *Conducted results for CE Marking Conformity Assessment Procedures are available Copyright © Murata Manufacturing Co., Ltd. All rights reserved. 14 April 2020 3 Bluetooth®/ BLE Modules Type 1PA Type 1WA Type 1GR PN: LBCA1KU1PA-245 CYW20719 Chipset 5.9 x 5.1 x 1.17mm PN: LBCA1KU1WA CYW20721 Chipset 5.9 x 5.1 x 1.17mm PN: LBCA1ZZ1GR-084 CYW20736 chipset 9.0 x 7.0 x 1.2mm 1WA Bluetooth/BLE WICED Studio Bluetooth/BLE WICED Studio BLE WICED Studio FCC/IC/CE*/Japan Certified *Conducted results for CE Marking Conformity Assessment Procedures are available Copyright © Murata Manufacturing Co., Ltd. All rights reserved. 14 April 2020 4