LQH32CH100K33L

Reference Only SpecNo.JELF243A-9121A-01 P1/7 CHIP COIL（CHIP INDUCTORS）LQH32CH□□□□33L Murata Standard Reference Specification【AEC-Q200】 1.Scope This Reference specification applies to LQH32CH_33L series, Chip coil (Chip Inductors) for automotive Electronics based on AEC-Q200. 2.Part Numbering (ex) LQ H 32 C H 1R0 M 3 3 L Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and (For Automotive) L:Taping Characteristics 3.Rating Operating Temperature Range. Storage Temperature Range. –40 to +85°C –40 to +105°C LQH32CHR15M33L 0.15 0.028±30% Self Resonant Frequency (MHz min) 400 LQH32CHR27M33L 0.27 0.034±30% 250 1250 LQH32CHR47M33L 0.47 0.042±30% 150 1100 LQH32CH1R0M33L 1.0 0.060±30% 100 1000 LQH32CH2R2M33L 2.2 0.097±30% 64 790 LQH32CH4R7M33L 4.7 0.15±30% 43 650 LQH32CH100K33L 10 0.30±30% 26 450 Customer Part Number Inductance MURATA Part Number (µH) Tolerance ±20% ±10% DC Resistance (Ω) Rated Current (mA) ESD Rank 5A: 8kV 1450 5A ∗When applied Rated current to the Products , self temperature rise shall be limited to 20℃ max and Inductance will be within ±10% of initial Inductance value. 4.Testing Conditions Temperature : Ordinary Temperature (15 to 35°C) Humidity : Ordinary Humidity (25 to 85 %(RH)) Temperature : 20 ± 2°C Humidity : 60 to 70 %(RH) Atmospheric Pressure : 86 to 106 kPa 5.Appearance and Dimensions 2.5±0.2 Fig.1 2.0±0.2 2.5±0.2 2.5±0.2 A 2.5±0.2 2.5±0.2 A : 2.8 max. 3.2±0.3 * Please refer to the dimention A for 2R2M,4R7M,100K types. (See Fig.1) * No marking. (in mm) 0.9±0.3 0.9±0.3 1.3±0.2 MURATA MFG.CO., LTD ■Unit Mass (Typical value) 0.060g Reference Only SpecNo.JELF243A-9121A-01 P2/7 6.Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. Test Method Measuring Equipment : KEYSIGHT 4192A or equivalent Measuring Frequency : 1MHz 6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment : Digital multi meter 6.3 Self Resonant Frequency(S.R.F) S.R.F shall meet item 3. Measuring Equipment : KEYSIGHT E4991A or equivalent 7. AEC-Q200 Requirement 7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 Murata Specification / Deviation No Stress Test Method 3 High 1000hours at 85 deg C Meet Table A after testing. Temperature Set for 24hours at room Table A Appearance No damage Exposure temperature, then measured. Inductance change Within ±5% DC Resistance Change 4 Temperature Cycling 1000cycles -40 deg C to + 85deg C Set for 24hours at room temperature,then measured. Meet Table A after testing. 7 Biased Humidity 1000hours at 85 deg C, 85%RH unpowered. Meet Table A after testing. 8 Operational Life Apply 85 deg C 1000 hours Meet Table A after testing. Set for 24hours at room temperature, then measured 9 External Visual Visual inspection No abnormalities 10 Physical Dimension Meet ITEM 5 （Style and Dimensions） No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Condition C: 100g’s/6ms/Half sine 14 Vibration Meet Table A after testing. 5g's for 20 minutes, No defects 12cycles eah of 3 orientations Test from 10-2000Hz. No-heating 15 Resistance to Soldering Heat Solder temperature 260C+/-5 deg C Immersion time 10s Murata deviation request : Pre-heating: 150C+/-5C, 60s+/-5s Meet Table A after testing. MURATA MFG.CO., LTD Within ±5% Reference Only SpecNo.JELF243A-9121A-01 AEC-Q200 Test Method Per AEC-Q200-002 No Stress 17 ESD P3/7 Murata Specification / Deviation ESD Rank: Refer to Item 3. Rating. No defects 18 Solderbility Per J-STD-002 Method b : Not Applicable 90% of the terminations is to be soldered. (Except exposed wire) 19 Electrical Characterization Measured : Inductance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Murata deviation request: 30s No defects No defects 22 Terminal Strength Per AEC-Q200-006 A force of 17.7N for 60s 8.Specification of Packaging 3.5±0.05 3.6±0.2 (0.2) 0.2 ※ The packing directions of the chip coil in taping are unified with the in/out positions of the lead wire. 8.0±0.2 ※ Lead- in/out wire +0.1 φ 1.5 -0 1.75±0.1 8.1 Appearance and Dimensions of plastic tape Dimension of the Cavity is measured at the bottom side. 4.0±0.1 2.9±0.2 4.0±0.1 2.0±0.05 Direction of feed (in mm) 2.1±0.1 8.2 Specification of Taping (1) Packing quantity (standard quantity) 2,000 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8.3 Pull Strength Embossed carrier tape 10N min. Cover tape 5N min. 8.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 300mm/min 0.2 to 0.7N (minimum value is typical) 165 to 180 degree F Cover tape Plastic tape MURATA MFG.CO., LTD Reference Only SpecNo.JELF243A-9121A-01 P4/7 8.5 Dimensions of Leader-tape,Trailer and Reel There shall be leader-tape ( cover tape) and trailer-tape (empty tape) as follows Leader Trailer 2.0±0.5 160 min. 190 min. Label Empty tape 210 min. Cover tape φ 13.0±0.2 1 φ 60± 0 φ 21.0±0.8 9± 10 Direction of feed 13±1.4 0 φ 180± 3 8.6 Marking for reel Customer part number; MURATA part number; Inspection number(∗1) , RoHS marking(∗2); Quantity etc ･･･ □□ OOOO ××× ∗1) (1) Factory Code (2) Date (1) First digit Second digit Third, Fourth digit (2) (3) : Year / Last digit of year : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 8.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,Quantity, etc ･･･ 8.8. Specification of Outer Case Label H Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5 D W 9. ∗Above Outer Case size is typical. It depends on a quantity of an order. Caution 9.1Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (7) Traffic signal equipment (2) Aerospace equipment (8) Disaster prevention / crime prevention equipment (3) Undersea equipment (9) Data-processing equipment (4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above (5) Medical equipment (6) Transportation equipment (vehicles, trains, ships, etc.) 9.2 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 9.3 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. MURATA MFG.CO., LTD SpecNo.JELF243A-9121A-01 Reference Only P5/7 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10.1 Land pattern designing Recommended land patterns for flow and reflow soldering are as follows: These have been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. Reflow Soldering ∗ Flow Soldering 5.5 Land 5.5 Chip Coil 2.0 1.0 1.0 Solder Resist 1.0 1.3 1.3 1.0 (in mm) ∗ Applicable to flow soldering. 10.2 Flux, Solder Flux Solder ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder ・Standard thickness of solder paste : 200μm to 300μm Other flux (except above) Please contact us for details, then use. 10.3 Flow soldering conditions / Reflow soldering conditions ･Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ･Soldering profile (1)Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Time. (s) Standard Profile Limit Profile Pre-heating Heating Cycle of flow Standard Profile 150℃、60s min. 250℃、4s～6s 265℃±3℃、5s 2 times 1 time MURATA MFG.CO., LTD SpecNo.JELF243A-9121A-01 Reference Only P6/7 (2)Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard Profile Pre-heating Heating Limit Profile 150～180°C 、90s±30s above 220°C、30s～60s above 230°C、60s max. 245±3°C 260°C,10s 2 times 1 time Peak temperature Cycle of reflow 10.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)s Times 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 10.5 Solder Volume ･ Solder shall be used not to be exceeded the upper limits as shown below. ･ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable T t 1/3T≦ t ≦T (T: Lower flange thickness) 10.6 Product's location The following shall be considered when designing and laying out P.C.B.’s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 Products shall be located in the sideways direction (Length:aC>B ≅ D. MURATA MFG.CO., LTD Seam b A a C B D Slit Length:a< b SpecNo.JELF243A-9121A-01 Reference Only P7/7 10.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Alternative cleaner ・Isopropyl alcohol (IPA) 2. Aqueous agent ・PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 10.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 10.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 10.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10.11 Storage and Handling Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature : -10 ~ 40°C Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering MURATA MFG.CO., LTD