LQP03TN6N8HZ2D

Spec No.: JELF243C_9101E-01 P1/14 CHIP COILS (CHIP INDUCTORS) LQP03TN□□□□Z2□ Murata Standard REFERENCE SPECIFICATION [AEC-Q200] 1. Scope This reference specification applies to chip coils (chip inductors) LQP03TN_Z2 series for automotive electronics based on AEC-Q200 except for power trains and safeties. 2. Part Numbering (Ex.) LQ P 03 Product Structure Dimension ID (L × W) T N 0N6 B Z 2 Application Category Inductance Tolerance Performance Electrode and specification characteristic *B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags). D Packaging D: taping *B: bulk 3. Part Number and Rating Operating temperature range Storage temperature range -55°C to +125°C -55°C to +125°C Inductance Customer Part number Murata Part number Nominal value (nH) Q (Min.) DC resistance (Ω max.) Tolerance Self-resonant frequency (MHz) Lower limit *Typical value Rated ESD current Rank (mA) 1C: 1kV LQP03TN0N6BZ2D 0.6 B: ±0.1 nH 14 0.07 20000 20000 850 1C LQP03TN0N6CZ2D 0.6 C: ±0.2 nH 14 0.07 20000 20000 850 1C LQP03TN0N7BZ2D 0.7 B: ±0.1 nH 14 0.08 20000 20000 800 1C LQP03TN0N7CZ2D 0.7 C: ±0.2 nH 14 0.08 20000 20000 800 1C LQP03TN0N8BZ2D 0.8 B: ±0.1 nH 14 0.08 18000 20000 800 1C LQP03TN0N8CZ2D 0.8 C: ±0.2 nH 14 0.08 18000 20000 800 1C LQP03TN0N9BZ2D 0.9 B: ±0.1 nH 14 0.10 18000 20000 750 1C LQP03TN0N9CZ2D 0.9 C: ±0.2 nH 14 0.10 18000 20000 750 1C LQP03TN1N0BZ2D 1.0 B: ±0.1 nH 14 0.10 17000 20000 750 1C LQP03TN1N0CZ2D 1.0 C: ±0.2 nH 14 0.10 17000 20000 750 1C LQP03TN1N1BZ2D 1.1 B: ±0.1 nH 14 0.10 17000 20000 750 1C LQP03TN1N1CZ2D 1.1 C: ±0.2 nH 14 0.10 17000 20000 750 1C LQP03TN1N2BZ2D 1.2 B: ±0.1 nH 14 0.10 17000 20000 750 1C LQP03TN1N2CZ2D 1.2 C: ±0.2 nH 14 0.10 17000 20000 750 1C LQP03TN1N3BZ2D 1.3 B: ±0.1 nH 14 0.15 17000 20000 600 1C LQP03TN1N3CZ2D 1.3 C: ±0.2 nH 14 0.15 17000 20000 600 1C LQP03TN1N4BZ2D 1.4 B: ±0.1 nH 14 0.15 16000 19600 600 1C LQP03TN1N4CZ2D 1.4 C: ±0.2 nH 14 0.15 16000 19600 600 1C LQP03TN1N5BZ2D 1.5 B: ±0.1 nH 14 0.15 15000 17900 600 1C LQP03TN1N5CZ2D 1.5 C: ±0.2 nH 14 0.15 15000 17900 600 1C LQP03TN1N6BZ2D 1.6 B: ±0.1 nH 14 0.15 15000 20000 600 1C LQP03TN1N6CZ2D 1.6 C: ±0.2 nH 14 0.15 15000 20000 600 1C LQP03TN1N7BZ2D 1.7 B: ±0.1 nH 14 0.15 15000 19100 600 1C LQP03TN1N7CZ2D 1.7 C: ±0.2 nH 14 0.15 15000 19100 600 1C LQP03TN1N8BZ2D 1.8 B: ±0.1 nH 14 0.15 15000 17700 600 1C LQP03TN1N8CZ2D 1.8 C: ±0.2 nH 14 0.15 15000 17700 600 1C LQP03TN1N9BZ2D 1.9 B: ±0.1 nH 14 0.15 12500 15100 600 1C MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 P2/14 Inductance Customer Part number Murata Part number Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz) Rated ESD current Rank (mA) 1C: 1kV Nominal value (nH) Tolerance LQP03TN1N9CZ2D 1.9 C: ±0.2 nH 14 0.15 12500 15100 600 1C LQP03TN2N0BZ2D 2.0 B: ±0.1 nH 14 0.15 12500 14800 600 1C LQP03TN2N0CZ2D 2.0 C: ±0.2 nH 14 0.15 12500 14800 600 1C LQP03TN2N1BZ2D 2.1 B: ±0.1 nH 14 0.15 11000 13900 600 1C LQP03TN2N1CZ2D 2.1 C: ±0.2 nH 14 0.15 11000 13900 600 1C Lower limit *Typical value LQP03TN2N2BZ2D 2.2 B: ±0.1 nH 14 0.15 11000 13400 600 1C LQP03TN2N2CZ2D 2.2 C: ±0.2 nH 14 0.15 11000 13400 600 1C LQP03TN2N3BZ2D 2.3 B: ±0.1 nH 14 0.20 10000 12900 500 1C LQP03TN2N3CZ2D 2.3 C: ±0.2 nH 14 0.20 10000 12900 500 1C LQP03TN2N4BZ2D 2.4 B: ±0.1 nH 14 0.20 10000 12200 500 1C LQP03TN2N4CZ2D 2.4 C: ±0.2 nH 14 0.20 10000 12200 500 1C LQP03TN2N5BZ2D 2.5 B: ±0.1 nH 14 0.20 10000 12200 500 1C LQP03TN2N5CZ2D 2.5 C: ±0.2 nH 14 0.20 10000 12200 500 1C LQP03TN2N6BZ2D 2.6 B: ±0.1 nH 14 0.20 10000 13300 500 1C LQP03TN2N6CZ2D 2.6 C: ±0.2 nH 14 0.20 10000 13300 500 1C LQP03TN2N7BZ2D 2.7 B: ±0.1 nH 14 0.20 10000 13000 500 1C LQP03TN2N7CZ2D 2.7 C: ±0.2 nH 14 0.20 10000 13000 500 1C LQP03TN2N8BZ2D 2.8 B: ±0.1 nH 14 0.20 9500 11800 500 1C LQP03TN2N8CZ2D 2.8 C: ±0.2 nH 14 0.20 9500 11800 500 1C LQP03TN2N9BZ2D 2.9 B: ±0.1 nH 14 0.20 9500 12400 500 1C LQP03TN2N9CZ2D 2.9 C: ±0.2 nH 14 0.20 9500 12400 500 1C LQP03TN3N0BZ2D 3.0 B: ±0.1 nH 14 0.25 9500 11900 450 1C LQP03TN3N0CZ2D 3.0 C: ±0.2 nH 14 0.25 9500 11900 450 1C LQP03TN3N1BZ2D 3.1 B: ±0.1 nH 14 0.25 8000 11300 450 1C LQP03TN3N1CZ2D 3.1 C: ±0.2 nH 14 0.25 8000 11300 450 1C LQP03TN3N2BZ2D 3.2 B: ±0.1 nH 14 0.25 8000 10600 450 1C LQP03TN3N2CZ2D 3.2 C: ±0.2 nH 14 0.25 8000 10600 450 1C LQP03TN3N3BZ2D 3.3 B: ±0.1 nH 14 0.25 8000 10900 450 1C LQP03TN3N3CZ2D 3.3 C: ±0.2 nH 14 0.25 8000 10900 450 1C LQP03TN3N4BZ2D 3.4 B: ±0.1 nH 14 0.25 7000 9400 450 1C LQP03TN3N4CZ2D 3.4 C: ±0.2 nH 14 0.25 7000 9400 450 1C LQP03TN3N5BZ2D 3.5 B: ±0.1 nH 14 0.25 7000 9600 450 1C LQP03TN3N5CZ2D 3.5 C: ±0.2 nH 14 0.25 7000 9600 450 1C LQP03TN3N6BZ2D 3.6 B: ±0.1 nH 14 0.30 6000 9500 400 1C LQP03TN3N6CZ2D 3.6 C: ±0.2 nH 14 0.30 6000 9500 400 1C LQP03TN3N7BZ2D 3.7 B: ±0.1 nH 14 0.30 6000 8200 400 1C LQP03TN3N7CZ2D 3.7 C: ±0.2 nH 14 0.30 6000 8200 400 1C LQP03TN3N8BZ2D 3.8 B: ±0.1 nH 14 0.30 6000 8100 400 1C LQP03TN3N8CZ2D 3.8 C: ±0.2 nH 14 0.30 6000 8100 400 1C LQP03TN3N9BZ2D 3.9 B: ±0.1 nH 14 0.30 5700 7900 400 1C LQP03TN3N9CZ2D 3.9 C: ±0.2 nH 14 0.30 5700 7900 400 1C LQP03TN4N0BZ2D 4.0 B: ±0.1 nH 14 0.40 5300 8600 350 1C LQP03TN4N0CZ2D 4.0 C: ±0.2 nH 14 0.40 5300 8600 350 1C LQP03TN4N1BZ2D 4.1 B: ±0.1 nH 14 0.40 5300 8400 350 1C MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 P3/14 Inductance Customer Part number Murata Part number Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz) Rated ESD current Rank (mA) 1C: 1kV Nominal value (nH) Tolerance LQP03TN4N1CZ2D 4.1 C: ±0.2 nH 14 0.40 5300 8400 350 1C LQP03TN4N2BZ2D 4.2 B: ±0.1 nH 14 0.40 5300 8600 350 1C LQP03TN4N2CZ2D 4.2 C: ±0.2 nH 14 0.40 5300 8600 350 1C LQP03TN4N3HZ2D 4.3 H: ±3% 14 0.40 5300 9800 350 1C LQP03TN4N3JZ2D 4.3 J: ±5% 14 0.40 5300 9800 350 1C LQP03TN4N7HZ2D 4.7 H: ±3% 14 0.40 4400 8800 350 1C LQP03TN4N7JZ2D 4.7 J: ±5% 14 0.40 4400 8800 350 1C LQP03TN5N1HZ2D 5.1 H: ±3% 14 0.40 4200 8600 350 1C LQP03TN5N1JZ2D 5.1 J: ±5% 14 0.40 4200 8600 350 1C LQP03TN5N6HZ2D 5.6 H: ±3% 14 0.40 4000 8000 350 1C Lower limit *Typical value LQP03TN5N6JZ2D 5.6 J: ±5% 14 0.40 4000 8000 350 1C LQP03TN6N2HZ2D 6.2 H: ±3% 14 0.60 4000 7900 300 1C LQP03TN6N2JZ2D 6.2 J: ±5% 14 0.60 4000 7900 300 1C LQP03TN6N8HZ2D 6.8 H: ±3% 14 0.60 3900 8000 300 1C LQP03TN6N8JZ2D 6.8 J: ±5% 14 0.60 3900 8000 300 1C LQP03TN7N5HZ2D 7.5 H: ±3% 14 0.60 3700 6700 300 1C LQP03TN7N5JZ2D 7.5 J: ±5% 14 0.60 3700 6700 300 1C LQP03TN8N2HZ2D 8.2 H: ±3% 14 0.70 3600 6600 250 1C LQP03TN8N2JZ2D 8.2 J: ±5% 14 0.70 3600 6600 250 1C LQP03TN9N1HZ2D 9.1 H: ±3% 14 0.70 3300 5900 250 1C LQP03TN9N1JZ2D 9.1 J: ±5% 14 0.70 3300 5900 250 1C LQP03TN10NHZ2D 10 H: ±3% 14 0.70 3200 5800 250 1C LQP03TN10NJZ2D 10 J: ±5% 14 0.70 3200 5800 250 1C LQP03TN11NHZ2D 11 H: ±3% 14 0.80 2900 5400 250 1C LQP03TN11NJZ2D 11 J: ±5% 14 0.80 2900 5400 250 1C LQP03TN12NHZ2D 12 H: ±3% 12 0.70 2900 4300 250 1C LQP03TN12NJZ2D 12 J: ±5% 12 0.70 2900 4300 250 1C LQP03TN13NHZ2D 13 H: ±3% 12 0.80 2600 4300 250 1C LQP03TN13NJZ2D 13 J: ±5% 12 0.80 2600 4300 250 1C LQP03TN15NHZ2D 15 H: ±3% 12 0.70 2600 3800 250 1C LQP03TN15NJZ2D 15 J: ±5% 12 0.70 2600 3800 250 1C LQP03TN16NHZ2D 16 H: ±3% 12 0.95 2200 3700 200 1C LQP03TN16NJZ2D 16 J: ±5% 12 0.95 2200 3700 200 1C LQP03TN18NHZ2D 18 H: ±3% 12 0.80 2200 3400 200 1C LQP03TN18NJZ2D 18 J: ±5% 12 0.80 2200 3400 200 1C LQP03TN20NHZ2D 20 H: ±3% 12 2.30 2200 3600 150 1C LQP03TN20NJZ2D 20 J: ±5% 12 2.30 2200 3600 150 1C LQP03TN22NHZ2D 22 H: ±3% 12 1.90 2200 3300 150 1C LQP03TN22NJZ2D 22 J: ±5% 12 1.90 2200 3300 150 1C LQP03TN24NHZ2D 24 H: ±3% 12 2.30 2000 3200 140 1C LQP03TN24NJZ2D 24 J: ±5% 12 2.30 2000 3200 140 1C LQP03TN27NHZ2D 27 H: ±3% 12 2.30 2000 2900 140 1C LQP03TN27NJZ2D 27 J: ±5% 12 2.30 2000 2900 140 1C LQP03TN30NHZ2D 30 H: ±3% 9 2.95 1700 2700 120 1C MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 P4/14 Inductance Customer Part number Murata Part number Nominal value (nH) Q (Min.) DC resistance (Ω max.) Tolerance Self-resonant frequency (MHz) Lower limit *Typical value Rated ESD current Rank (mA) 1C: 1kV LQP03TN30NJZ2D 30 J: ±5% 9 2.95 1700 2700 120 1C LQP03TN33NHZ2D 33 H: ±3% 9 2.95 1700 2600 120 1C LQP03TN33NJZ2D 33 J: ±5% 9 2.95 1700 2600 120 1C LQP03TN36NHZ2D 36 H: ±3% 9 3.00 1500 2400 120 1C LQP03TN36NJZ2D 36 J: ±5% 9 3.00 1500 2400 120 1C LQP03TN39NHZ2D 39 H: ±3% 9 3.00 1500 2200 120 1C LQP03TN39NJZ2D 39 J: ±5% 9 3.00 1500 2200 120 1C LQP03TN43NHZ2D 43 H: ±3% 9 3.60 1300 2200 100 1C LQP03TN43NJZ2D 43 J: ±5% 9 3.60 1300 2200 100 1C LQP03TN47NHZ2D 47 H: ±3% 9 3.60 1300 2000 100 1C LQP03TN47NJZ2D 47 J: ±5% 9 3.60 1300 2000 100 1C LQP03TN51NHZ2D 51 H: ±3% 9 3.90 1200 2000 100 1C LQP03TN51NJZ2D 51 J: ±5% 9 3.90 1200 2000 100 1C LQP03TN56NHZ2D 56 H: ±3% 9 3.90 1200 2000 100 1C LQP03TN56NJZ2D 56 J: ±5% 9 3.90 1200 2000 100 1C LQP03TN62NHZ2D 62 H: ±3% 8 8 1100 1800 100 1C LQP03TN62NJZ2D 62 J: ±5% 8 8 1100 1800 100 1C LQP03TN68NHZ2D 68 H: ±3% 8 8 1100 1500 100 1C LQP03TN68NJZ2D 68 J: ±5% 8 8 1100 1500 100 1C LQP03TN75NJZ2D 75 H: ±3% 8 10 1000 1400 100 1C LQP03TN75NHZ2D 75 J: ±5% 8 10 1000 1400 100 1C LQP03TN82NHZ2D 82 H: ±3% 8 10 1000 1400 100 1C LQP03TN82NJZ2D 82 J: ±5% 8 10 1000 1400 100 1C LQP03TN91NHZ2D 91 H: ±3% 8 10 900 1300 80 1C LQP03TN91NJZ2D 91 J: ±5% 8 10 900 1300 80 1C LQP03TNR10HZ2D 100 H: ±3% 8 10 900 1300 80 1C LQP03TNR10JZ2D 100 J: ±5% 8 10 900 1300 80 1C LQP03TNR11HZ2D 110 H: ±3% 8 12 800 1100 80 1C LQP03TNR11JZ2D 110 J: ±5% 8 12 800 1100 80 1C LQP03TNR12HZ2D 120 H: ±3% 8 12 800 1100 80 1C LQP03TNR12JZ2D * Typical value is actual performance. 120 J: ±5% 8 12 800 1100 80 1C 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C) Humidity: ordinary humidity [25% to 85% (RH)] In case of doubt Temperature: 20°C±2°C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 P5/14 5. Appearance and Dimensions Unit mass (typical value): 0.2 mg 6. Marking 7. Electrical Performance No. Item 7.1 Inductance 7.2 Q Specification Meet chapter 3 ratings. Meet chapter 3 ratings. Test method Measuring equipment: Keysight E4991A or the equivalent Measuring frequency: 500 MHz 0.6 nH to 30 nH 300 MHz 33 nH to 120 nH Measuring conditions: Measurement signal level: Approx. 0 dBm Measurement terminal distance: 0.2 mm Electrical length: 10 mm Weight: Approx. 1 N to 5 N Measuring fixture: Keysight 16197A Position the chip coil under test as shown in the measuring example below and connect it to the electrode by applying weight. Measurement example: 7.3 DC resistance 7.4 Self-resonant frequency Meet chapter 3 ratings. Meet chapter 3 ratings. Measuring method: see "Electrical performance: Measuring method for inductance/Q" in the Appendix. Measuring equipment: digital multimeter Measuring equipment: Keysight N5230A or the equivalent MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 No. Item 7.5 Rated current P6/14 Specification Product temperature rise: 25°C max. Test method Apply the rated current specified in chapter 3. 8. AEC-Q200 Requirement 8.1 Performance [based on table 5 for magnetics (inductors/transformer) AEC-Q200 Rev. D issued June 1, 2010] AEC-Q200 No. 3 Stress High temperature exposure Murata specification/deviation Test method 1000 h at 125°C Set for 24 h at room condition, then measured. Meet table A after testing. Table A Appearance No damage Inductance change rate: 0.6 nH to 30 nH (at 500 MHz) 33 nH to 120 nH (at 300MHz) Substrate: 6-layers FR-4 4 Temperature cycling 1000 cycles -40°C to +125°C Set for 24 h at room condition, then measured. 7 Biased humidity 1000 h at 85°C, 85% (RH). Unpowered. Set for 24 h at room condition, then measured. Meet table A after testing. Substrate: 6-layers FR-4 8 Operational life Apply 125°C 1000 h Set for 24 h at room condition, then measured. Meet table A after testing. Substrate: 6-layers FR-4 Within ±10% Meet table A after testing. Substrate: 6-layers FR-4 9 External visual Visual inspection No abnormalities 10 Physical dimension Meet chapter 5, "Appearance and Dimensions". No defects 12 Resistance to solvents Per MIL-STD-202 Method 215 Not applicable 13 Mechanical shock Per MIL-STD-202 Method 213 Condition F: 1500 g’s (14.7 N), 0.5 ms, half sine Meet table A after testing. Substrate: 6-layers FR-4 14 Vibration 5 g's (0.049 N) for 20 min, 12 cycles each Meet table A after testing. of 3 orientations Substrate: 6-layers FR-4 Test from 10 Hz to 2000 Hz 15 Resistance to soldering heat No-heating Solder temperature 260°C±5°C Immersion time 10 s Pre-heating: 150°C±10°C, 60 s to 90 s Meet table A after testing. 17 ESD Per AEC-Q200-002 ESD rank: Refer to chapter 3 ratings. Substrate: 6-layers FR-4 18 Solderbility Per J-STD-002 Method b: not applicable Pre-heating: 150°C±10°C, 60 s to 90 s 90% of the terminations is to be soldered. 19 Electrical Measured: inductance characterization No defects 20 Flammability Per UL-94 Not applicable 21 Board flex Epoxy-PCB (1.6 mm) Deflection 2 mm (min.) Holding time 60 s Meet table B after testing. Murata deviation request: Substrate: FR-4 (0.8 mm_thickness) Holding time: 30 s Table B Appearance No damage DC resistance change rate 22 Terminal strength Per AEC-Q200-006 A force of 17.7 N for 60 s Murata deviation request: 2 N for 5 s Substrate: 6-layers FR-4 No defects MURATA MFG CO., LTD Within ±10% Spec No.: JELF243C_9101E-01 P7/14 9. Specification of Packaging 9.1 Appearance and dimensions of tape (8 mm width/paper tape) A 0.35±0.03 B 0N6 to 62N：0.67±0.03 68N to R12：0.65±0.03 t 0.55 max. (in mm) 9.2 Taping specifications Packing quantity (Standard quantity) 15000 pcs/reel Packing method The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom tape when the cavities of the carrier tape are punched type). Feed hole position The feed holes on the carrier tape are on the right side when the cover tape (top tape when the cavities of the carrier tape are punched type) is pulled toward the user. Joint The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are seamless. Number of missing products Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Break down force of tape Cover tape (or top tape) 5 N min. Bottom tape (only when the cavities of the carrier tape are punched type) 5 N min. 9.4 Peeling off force of tape Speed of peeling off Peeling off force 300 mm/min 0.1 N to 0.6 N (The lower limit is for typical value.) MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 P8/14 9.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.) 9.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  □□ ○○○○ (2) Date First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 9.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 9.8 Specification of outer box Label H D W 10. Dimensions of outer box (mm) W D H 186 186 93 Standard reel quantity in outer box (reel) 5 * Above outer box size is typical. It depends on a quantity of an order. Caution 10.1 Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea (4) Power plant control equipment equipment (5) Medical equipment (6) Transportation equipment (7) Traffic signal (8) Disaster/crime (trains, ships, etc.) equipment prevention equipment (9) Data-processing (10) Applications of similar complexity and/or equipment reliability requirements to the applications listed in the above 10.2 Precautions on rating Avoid using in exceeded the rated temperature range, rated voltage, or rated current. Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault. MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 P9/14 10.3 Inrush current If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious fault. 10.4 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 11. Precautions for Use This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. 11.1. Land dimensions The following diagram shows the recommended land dimensions for reflow soldering: a 0.2 to 0.3 b 0.8 to 0.9 c 0.2 to 0.3 (in mm) 11.2 Flux and solder used Flux • Use a rosin-based flux. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux. Solder • Use Sn-3.0Ag-0.5Cu solder. • Standard thickness of solder paste: 60 μm to 100 μm If you want to use a flux other than the above, please consult our technical department. MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 P10/14 11.3 Soldering conditions (reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Insufficient pre-heating or sudden cooling may cause cracks or other defects on the ceramic body, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Standard profile Limit profile Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s Heating Above 220°C/30 s to 60 s Above 230°C/60 s max. 245°C±3°C 260°C/10 s 2 times 2 times 5°C/sec max. 5°C/sec max. Peak temperature Number of reflow cycles Cooling speed 11.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating 150°C/approx. 1 min Tip temperature of soldering iron 350°C max. Power consumption of soldering iron 80 W max. Tip diameter of soldering iron Soldering time Number of reworking operations ø3 mm max. 3 s (+1 s, -0 s) 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. 11.5 Solder volume Solder shall be used not to be exceeded the upper limits as shown below. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 P11/14 11.6 Product's location The following shall be considered when designing and laying out PCBs. (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (length: a < b) to the mechanical stress. a b 〈 Poor example〉 〈 Good example〉 (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the board separation surface. A>C *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 11.7 Handling of substrate • Do not mount on a flexible substrate. • Contact our technical department in advance if you want to use a multilayer substrate with less than six layers. * When mounting on a flexible substrate or a multi-layered substrate with less than six layers, cracks may occur due to stress on the product. (1) The stress applied to the chip varies depending on the material and construction of the mounted substrate. If the coefficients of thermal expansion for the substrate and chip vary significantly, the difference in thermal expansion and shrinkage could cause cracks to form in the chip. We assume that the products are mounted on glass-epoxy substrate. Assessment has not been conducted on substrates where the coefficient of thermal expansion varies significantly from glass-epoxy substrates. Conduct a thorough assessment before mounting on these substrates. MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 P12/14 (2) After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Also, if mounting on flexible substrates, excessive mechanical stress could be applied to the chip by even slight bending or twisting when handling this substrate, and so please conduct full assessments before use. Bending Twisting 11.8 Cleaning The product shall be cleaned under the following conditions. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in mounted products and the PCB. Item Requirement Power Time 20 W/L max. 5 min max. Frequency 28 kHz to 40 kHz (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, consult our technical department. 11.9 Storage and transportation Storage period Use the product within 12 months after delivery. If you do not use the product for more than 12 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor solderability. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. • Do not keep products in bulk packaging. Bulk storage could result in collisions between the products or between the products and other parts, resulting in chipping or wire breakage. • Avoid storing the product by itself bare (i.e. exposed directly to air). Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. 11.10 Resin coating (including moisture-proof coating) Before applying any resin coating, please consult our technical department. 11.11 Mounting conditions Check the mounting condition before using. Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 11.12 Operating environment Do not use this product under the following environmental conditions as it may cause deterioration of product quality. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc) (2) In the atmosphere where liquid such as organic solvent, may splash on the products. (3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew. MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 P13/14 11.13 Mounting density If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures. If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating temperature for the product. 12. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD Spec No.: JELF243C_9101E-01 P14/14 Appendix Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included in the rating table.) Perform measurement using the method described below. (Perform correction for the error deriving from the measuring terminal.) (1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole terminal as shown in the figure below. (2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using the respective current and voltage for input/output. Zm= V1 I1 Zx= V2 I2 (3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows. Zx=α Zm-β 1-ZmΓ Here, α = D/A = 1 β = B/D = Zsm - (1 - Yom Zsm) Zss Γ = C/A = Yom Zsm: measured impedance of short chip Zss: residual impedance of short chip (0.480 nH) Yom: measured admittance when measuring terminal is open (4) Calculate inductance Lx and Qx using the equations shown below. Im(Zx) Lx: inductance of chip coil Lx= 2πf Qx: Q of chip coil Im(Zx) Qx= f: measuring frequency Re(Zx) MURATA MFG CO., LTD