LXDC3EP12F-151

LXDC3EP TypeF series Micro DC-DC converter 1. Features         2 Low EMI noise and small footprint (11mm )using inductor-imbedded ferrite substrate High efficiency using synchronous rectifier technology at 4MHz operation. Power-Save mode / Forced PWM automatic mode switching function 2% DC output voltage accuracy (PWM mode). 1A maximum load capability Wide input voltage range : 2.5 - 5.5V Fixed output voltage : 1.0V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V Internal soft start, over current protection, thermal shutdown protection 2. Description The LXDC3EP series is a 1A output step-down DCDC converter, which is suitable for a space-limited or a noise-sensitive application. The device utilizes an inductor-embedded ferrite substrate, and the substrate eliminates radiated EMI noise and conduction noise efficiently. By just putting this device, it can be used as a LDO replacement. Its low noise feature and easy to assembly feature assures reliable power supply quality. The LXDC3EP series has a mode pin that allows the user to select Forced PWM mode or Power-Save mode that changes modes between pulse-skip operation and forced PWM operation automatically depending on the load. In Power-Save mode, LXDC3EP series offers superior efficiency under light load condition, and it extends the battery life. When Forced PWM mode is selected, it works at fixed frequency (4MHz) over all load range. The advantages of this mode are easy filtering of switching frequency and better load transient response. The integrated over current protection and the thermal shutdown protection features offer a reliable power supply operation. 3. Typical Application Circuit 1 February 2016 LXDC3EP TypeF series Micro DC-DC converter 4. Mechanical details 4-1 Out line unit (mm) Symbol Dimension Symbol Dimension L 3.5+/- 0.2 a 0.2+/- 0.2 W 3.2+/- 0.2 b 0.8+/- 0.1 T 1.3MAX c 0.4+/- 0.1 d 0.7+/- 0.1 e 0.6+/- 0.1 2 February 2016 LXDC3EP TypeF series Micro DC-DC converter 4-2 Pin function Pin Symbol I/O EN Input 2,3,5,6,9 GND － 4 Vout Output 7 MODE Input Regulated voltage output pin. Apply output load between this pin and GND. This is the operation mode select pin. This pin must not be left floating and must be terminated. Mode=H: Forced PWM mode Mode=L: Power-Save mode 8 Vin Input Vin pin supplies current to the LXDC3EP internal regulator. 1 Function This is the ON/OFF control pin of the device. The device is in shutdown when the voltage to this pin is below 0.4V. Pulling this pin above 1.2V enables the device with soft start. This pin should not be left floating. EN=H: Device ON, EN=L: Device OFF Ground pin 4-3 Functional Block Diagram EN Mode UVLO Clock Soft Start Switching Controller Vin Current Sense Cin OCP EA Embedded L Thermal Shutdown Gate Driver Vout Cout Control IC LXDC3EP GND 3 February 2016 LXDC3EP TypeF series Micro DC-DC converter 5. Ordering Information Part number Output Voltage Device Specific Feature MOQ LXDC3EP10F-208 1.0V Output current derating improvement type T/R,1000pcs/R LXDC3EP12F-151 1.2V Output current derating improvement type T/R,1000pcs/R LXDC3EP15F-263 1.5V Output current derating improvement type T/R,1000pcs/R LXDC3EP18F-264 1.8V Output current derating improvement type T/R,1000pcs/R LXDC3EP25F-265 2.5V Output current derating improvement type T/R,1000pcs/R LXDC3EP33F-204 3.3V Output current derating improvement type T/R,1000pcs/R 6. Electrical Specification 6-1 Absolute maximum ratings Parameter Maximum pin voltage Operating ambient temperature Operating IC temperature Storage temperature symbol rating Unit Vin, EN, MODE 6.0 V Ta -30 to +85 o -30 to +125 o -30 to +85 o TIC TSTO C C C 4 February 2016 LXDC3EP TypeF series Micro DC-DC converter 6-2 Electrical Characteristics (Ta=25 oC) Parameter Symbol Condition Min. Typ. Max. 2.5 3.7 5.5 Unit LXDC3EP10F-208 LXDC3EP12F-151 LXDC3EP15F-263 Input voltage UVLO Voltage Output voltage accuracy Load current range Vin V LXDC3EP18F-264 LXDC3EP25F-265 3.0 3.7 5.5 LXDC3EP33F-204 4.0 5.0 5.5 UVLO Vout 2.2 PWM Mode Vin-Vout>0.7V V LXDC3EP10F-208 0.976 1.0 1.024 LXDC3EP12F-151 1.176 1.2 1.224 LXDC3EP15F-263 1.47 1.5 1.53 LXDC3EP18F-264 1.764 1.8 1.836 LXDC3EP25F-265 2.45 2.5 2.55 LXDC3EP33F-204 3.234 3.3 3.366 0 - 1000 - 15 - Iout V mA LXDC3EP10F-208 Vin=3.7V Io=1000mA BW=100MHz Ripple Voltage Efficiency Vrpl EFF LXDC3EP12F-151 LXDC3EP15F-263 LXDC3EP18F-264 Vin=3.7V Io=1000mA BW=100MHz Vin=5.0V Io=1000mA BW=100MHz Vin=3.7V Io=300mA Vin=5.0V Io=300mA ENon ON; Enable ENoff OFF; Disable mV(p-p) LXDC3EP25F-265 - 20 - LXDC3EP33F-204 - 20 - LXDC3EP10F-208 86 - LXDC3EP12F-151 88 LXDC3EP15F-263 90 - LXDC3EP18F-264 92 - LXDC3EP25F-265 94 - LXDC3EP33F-204 94 - 1.2 - - - - 0.4 1.2 - - - - 0.4 Enable Voltage % V MODE-H High; Forced PWM mode MODE-L Low; Power-Save mode MODE Voltage V 5 February 2016 LXDC3EP TypeF series Micro DC-DC converter Parameter Symbol Condition Min. Typ. Max. Unit SW Frequency Freq - 4 - MHz Over Current Protection OCP 1000 1200 1700 mA Start -up Time Ton - 170 - usec (*1)The above characteristics are tested using the application circuit on section 8 6-3 Thermal and Current De-rating Information The following figure shows the power dissipation and temperature rise characteristics example. These data are measured on Murata’s evaluation board of this device at no air-flow condition. LOSS-ΔT Characteristics(Vin=5.5V,Vo=1.2V) LOSS-ΔT Characteristics(Vin=5.5V,Vo=1.2V) 30 0.35 25 0.3 20 0.25 IΔT[℃ ] Power Dissipation[mW] 0.4 0.2 0.15 15 10 0.1 5 0.05 0 0 0 200 400 600 800 1000 0 1200 0.05 0.1 0.15 0.2 0.25 0.3 Power Dissipation[mW] Iout[mA] The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a continuous power delivering application. The amount of current de-rating is highly dependent on the environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should o especially be taken in applications where the device temperature exceeds 85 C. o The case temperature of the device must be kept lower than the maximum rating of 125 C. It is generally recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for the temperature of semiconductor is 80%. MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress. Higher temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be described by the Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance). The below figure shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out mechanisms in MLCC capacitor is not reversible but cumulative over time. 6 February 2016 0.35 LXDC3EP TypeF series Capacitor B1 Life(Thousand Hours) Micro DC-DC converter Capacitor Case temperature(℃) The following steps should be taken before the design fix of user’s set for a reliable operation. o 1. The ambient temperature of the device should be kept below 85 C 2. The case temperature should be measured on the worst condition of each application. The temperature must o be kept below 125 C. An appropriate de-rating of temperature and/or output current should be taken. 3. The MLCC temperature should be considered as same as the case temperature. Considering the above figure, it should be checked if the expected B1 life of MLCC is acceptable or not. 7 February 2016 LXDC3EP TypeF series Micro DC-DC converter 7. Detailed Description Power-Save Mode / Forced PWM Mode The MODE pin allows selecting the operating mode. If the MODE pin is pulled to logic low voltage (MODE-L), the converter operates automatic pulse-skip and PWM mode. In this mode, the converter operates pulse-skip mode at light load current, and when the load current increases, the operating mode will changes to PWM mode automatically. In this mode, the converter can work in high efficiency over wide load current range. The transition current between PFM and PWM is depend on Vin, Vout and other factors, but the ballpark threshold is about 50-200mA If the MODE pin is pulled to logic high voltage (MODE-H), the device operates in Forced PWM mode. In this mode, the converter operates in PWM mode even at light load current. The advantage of this mode is that the converter operates with a fixed frequency that allows simple filtering of switching frequency. In this mode, the efficiency is lower compared to the PFM mode at light load current. Power-Save mode at light load PWM mode at heavy load Nominal output voltage UVLO (Under Voltage Lock Out) The input voltage (Vin) must reach or exceed the UVLO voltage (2.2Vtyp) before the device begins the start up sequence even when EN pin is kept high. UVLO function keeps away of an unstable operation at low Vin range Soft Start The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because of the function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal soft-start time is 170usec. Enable The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin must be terminated to logic high and must not be left floating. Pulling the EN pin to logic low forces the device shutdown. Over Current Protection When the output current reaches the OCP threshold, the device narrows the switching duty and decrease the output voltage. When the current goes below the threshold, the converter returns to normal operation automatically. Thermal Shutdown The device has a thermal overload protection function. When the internal IC’s junction temperature exceeds o around 150 C, the device goes into thermal shutdown. The device returns to its normal operation when the o Internal IC’s junction temperature falls below 130 C (typ). For reliable operation, the IC temperature should be o kept below 125 C. Prolonged thermal overload condition may damage the device 8 February 2016 LXDC3EP TypeF series Micro DC-DC converter 8. Test Circuit MODE EN Vin LXDC3EP Vout Vin V-MODE (C) (Cout) V-EN RL GND *Optional：Cout: 4.7uF/6.3V (LXDC3EP33F-204) 9 February 2016 LXDC3EP TypeF series Micro DC-DC converter 9. Measurement Data Micro DC-DC Converter evaluation board (P2LX0457B) Measurement setup Enable SW Mode SW GND_S VIN_S GND V VIN A V VOUT_S GND_S Load GND VOUT A The enable switch has three positions. 1. When it is toggled to “ON” side, the device starts operation. 2. When it is toggled to “OFF” side, the device stop operation and keep shut down status. 3. When it is set to middle of “ON” and “OFF”, the EN pin becomes floated and can be applied an external voltage through the EN terminal pin on the EVB. If you don’t apply external voltage to EN pin, the enable switch should not to be set to the middle position. The mode switch has three states (PWM, PFM/PWM and Open). 1. When it is shorted to “PWM” side, the device operates PWM forced mode. 2. When it is shorted to “PFM/PWM” side, the device operates PFM/PWM automatic mode. 3. When it is set to open, the mode pin becomes floated and can be applied an external voltage through the Mode terminal pin on the EVB. If you don’t apply external voltage to Mode pin, the mode switch should not to be set to the middle position. ※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables. 10 February 2016 LXDC3EP TypeF series Micro DC-DC converter Typical Measurement Data (reference purpose only) (Ta=25℃) Efficiency Vin=3.7V, Vout=1.2V 100 100 90 90 80 80 70 70 EFF [%] EFF [%] Vin=3.7V, Vout=1.0V 60 60 50 50 40 40 30 30 1 10 100 1,000 1 10 Iout [mA] 1,000 100 1,000 100 1,000 Vin=3.7V, Vout=1.8V 100 100 90 90 80 80 70 70 EFF [%] EFF [%] Vin=3.7V, Vout=1.5V 60 60 50 50 40 40 30 30 1 10 100 1,000 1 10 Iout [mA] Iout [mA] Vin=3.7V, Vout=2.5V Vin=5.0V, Vout=3.3V 100 100 90 90 80 80 70 70 EFF [%] EFF [%] 100 Iout [mA] 60 60 50 50 40 40 30 30 1 10 100 1 1,000 10 Iout [mA] Iout [mA] 11 February 2016 LXDC3EP TypeF series Micro DC-DC converter Load Requlation Vin=3.7V, Vout=1.2V 1.02 1.224 1.01 1.212 Vout [V] Vout [V] Vin=3.7V, Vout=1.0V 1 1.2 1.188 0.99 1.176 0.98 0 100 200 300 400 500 0 600 100 200 400 500 600 400 500 600 400 500 600 Vin=3.7V, Vout=1.8V 1.53 1.836 1.515 1.818 Vout [V] Vout [V] Vin=3.7V, Vout=1.5V 1.5 1.485 1.8 1.782 1.47 1.764 0 100 200 300 400 500 600 0 100 200 Iout [mA] 300 Iout [mA] Vin=3.7V, Vout=2.5V Vin=5.0V, Vout=3.3V 2.55 3.366 2.525 3.333 Vout [V] Vout [V] 300 Iout [mA] Iout [mA] 2.5 2.475 3.3 3.267 2.45 3.234 0 100 200 300 400 500 600 0 Iout [mA] 100 200 300 Iout [mA] 12 February 2016 LXDC3EP TypeF series Micro DC-DC converter Output Ripple-Noise Vin=3.7V, Vout=1.2V 60 60 50 50 40 40 Vrpl [mVpp] Vrpl [mVpp] Vin=3.7V, Vout=1.0V 30 20 10 30 20 10 0 0 0 200 400 600 800 1000 0 200 400 Iout [mA] 800 1000 Vin=3.7V, Vout=1.8V 60 60 50 50 40 40 Vrpl [mVpp] Vrpl [mVpp] Vin=3.7V, Vout=1.5V 30 20 10 30 20 10 0 0 0 200 400 600 800 1000 0 200 400 Iout [mA] 600 800 1000 600 800 1000 Iout [mA] Vin=3.7V, Vout=2.5V Vin=5.0V, Vout=3.3V 60 60 50 50 40 40 Vrpl [mVpp] Vrpl [mVpp] 600 Iout [mA] 30 20 10 30 20 10 0 0 0 200 400 600 800 1000 0 Iout [mA] 200 400 Iout [mA] 13 February 2016 LXDC3EP TypeF series Micro DC-DC converter Typical Measurement Data (reference purpose only) Load Transient Response ・Vin=2.3V,Vout=1.2V Vin=3.7V,Vout=1.2V 14 February 2016 LXDC3EP TypeF series Micro DC-DC converter Vin=5.5V,Vout=1.2V Vin=5.0V,Vout=3.3V 15 February 2016 LXDC3EP TypeF series Micro DC-DC converter Vin=5.5V,Vout=3.3V 16 February 2016 LXDC3EP TypeF series Micro DC-DC converter 10.Reliability Tests No. 1 2 3 Items Vibration Resistance Result (NG) 18 G (0) Frequency : 10~2000 Hz 2 Acceleration : 196 m/s Direction : X,Y,Z 3 axis Period : 2 h on each direction Total 6 h. Solder specimens on the testing jig (glass epoxy boards) shown in appended Fig.2 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection : 1.6mm Solder specimens onto test jig shown below. Apply pushing force at 0.5mm/s until electrode pads are peeled off or ceramics are broken. Pushing force is applied to longitudinal direction. 18 G (0) Pushing Direction 18 G (0) 18 G (0) 18 G (0) Test Methods Appearance : No severe damages Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection Soldering strength (Push Strength) QTY Specifications 9.8 N Minimum Specimen 4 5 Solderability of Termination Resistance to Soldering Heat (Reflow) 75% of the terminations is to be soldered evenly and continuously. Appearance No severe damages Electrical specifications Satisfy specifications listed in paragraph 6-2. Jig Immerse specimens first an ethanol solution of rosin, then in a Pb free solder solution for 3±0.5 sec. at 245±5 °C. Preheat : 150 °C, 60 sec. Solder Paste : Sn-3.0Ag-0.5Cu Flux : Solution of ethanol and rosin (25 % rosin in weight proportion) Preheat Temperature : 150-180 °C Preheat Period : 90+/-30 sec. High Temperature : 220 °C High Temp. Period : 20sec. Peak Temperature : 260+5/-0 °C Specimens are soldered twice with the above condition, and then kept in room condition for 24 h before measurements. 17 February 2016 LXDC3EP TypeF series Micro DC-DC converter No. 6 7 8 9 Items Specifications Test Methods High Temp. Exposure Temperature：85±2 ℃ Period：1000+48/-0 h Room Condition：2～24h Temperature Cycle Condition：100 cycles in the following table Humidity (Steady State) Appearance No severe damages Electrical specifications Satisfy specifications listed in paragraph 6-2. Step Temp(°C) Time(min) 1 Min. Operating Temp.+0/-3 30±3 2 Max. Operating Temp.+3/-0 30±3 Temperature：85±2 ℃ Humidity：80～90%RH Period：1000+48/-0 h Room Condition：2～24h Temperature：-40±2 ℃ Period：1000+48/-0 h Room Condition：2～24h Low Temp. Exposure QTY Result (NG) 18 G (0) 18 G (0) 18 G (0) 18 G (0) 10 ESD(Machine Model) C：200pF、R：0Ω TEST Voltage ：+/-100V Number of electric discharges：1 5 G (0) ESD(Human Body Model) C：100pF、R：1500Ω TEST Voltage ：+/-1000V Number of electric discharges：1 5 G (0) 11 18 February 2016 LXDC3EP TypeF series Micro DC-DC converter Fig.1 Land Pattern Unit:mm Symbol Dimensions a 0.8 b 0.4 c 0.7 d 0.6 ・Reference purpose only. 19 February 2016 LXDC3EP TypeF series Micro DC-DC converter Fig.2 Testing board 100 Unit：mm 40 ■： Land pattern is same as figure1 Glass-fluorine board t＝1.6mm Copper thickness over 35 m Mounted situation Unit：mm チップ Device 45 45 Test method Unit：mm 20 50 R230 deflection 20 February 2016 LXDC3EP TypeF series Micro DC-DC converter 11. Tape and Reel Packing 1）Dimensions of Tape (Plastic tape) Unit: mm Φ1.5+0.1 0 (0.30) 1.75±0.1 (5.5) (3.8) 12.0±0.2 2.0±0.05 (3.5) (1.35) 4.0±0.1 8.0±0.1 Feeding　direction 2） Dimensions of Reel Unit: mm 2±0.5 φ60 φ180 φ13±0.2 (13.0) 15.4±1.0 21 February 2016 LXDC3EP TypeF series Micro DC-DC converter 3）Taping Diagrams [1] Feeding Hole : [2] Hole for chip : As specified in (1) [3] Cover tape : 50um in thickness [4] Base tape : As specified in (1) [3] [3] As specified in (1) [1] [1] [2] [2] [3] [3] [4] [4] Feeding Hole Feeding Direction Chip 22 February 2016 LXDC3EP TypeF series Micro DC-DC converter 4）Leader and Tail tape A B Components 部品収納部 C Symbol Items Ratings(mm) A No components at trailer min 160 B No components at leader min 100 C Whole leader min 400 5）The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. 6）Packaging unit: 1,000 pcs./ reel 7） Material： Base Tape Reel … Plastic … Plastic Antistatic coating for both base tape and reel 8）Peeling of force 0.7 N max. 0.1~1.3N 165 to 180 ° Cover Tape カバーテープ ベーステープ Base Tape 23 February 2016 LXDC3EP TypeF series Micro DC-DC converter NOTICE 1. Storage Conditions: To avoid damaging the solderability of the external electrodes, be sure to observe the following points. - Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH. (Packing materials, In particular, may be deformed at the temperature over 40 °C.). - Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.). - Stored products should be used within 6 months of receipt. Solderability should be verified if this period is exceeded This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020) 2. Handling Conditions: Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the product because of the nature of ceramics structure. Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor solderability. 3. Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern should be provided between the IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions are shown for a reference purpose only. Electrical, mechanical and thermal characteristics of the product depend on the pattern design and material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set. When using underfill materials, be sure to check the mechanical characteristics in the actual set. 24 February 2016 LXDC3EP TypeF series Micro DC-DC converter 4. Soldering Conditions: Soldering is allowed up through 2 times. Carefully perform preheating ：△ T less than 130 °C. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions (example) Reflow soldering standard conditions (Example) Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 5. Cleaning Conditions: The product is not designed to be cleaned after soldering. 25 February 2016 LXDC3EP TypeF series Micro DC-DC converter 6. Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - In a dusty environment. - Direct sunlight - Water splashing place. - Humid place where water condenses. - In a freezing environment. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. If static electricity is added to this product, degradation and destruction may be produced. Please use it after consideration enough so that neither static electricity nor excess voltage is added at the time of an assembly and measurement. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: (1) Installation of protection circuits or other protective device to improve system safety (2) Installation of redundant circuits in the case of single-circuit failure 7. Input Power Capacity: Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range . 26 February 2016 LXDC3EP TypeF series Micro DC-DC converter 8. Limitation of Applications: The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring extremely high reliability following the application listed below, you should consult with the Murata staff in advance. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment. - Medical equipment. - Transportation equipment (vehicles, trains, ships, etc.). - Automobile equipment which includes the genuine brand of car manufacture, car factory-installed option and dealer-installed option. - Traffic signal equipment. - Disaster prevention / crime prevention equipment. - Data-procession equipment. - Application which malfunction or operational error may endanger human life and property of assets. - Application which related to occurrence the serious damage - Application of similar complexity and/ or reliability requirements to the applications listed in the above. ! Note: Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. Product specifications are subject to change or our products in it may be discontinued without advance notice. This catalog is for reference only and not an official product specification document, therefore, please review and approve our official product specification before ordering this product. 27 February 2016