LXES03BAA1-131

Silicon ESD protection device LXESxxB series Document No. LX–1-1122 Rev1.0 p1/30 1. Application This specification shall be applied to the ESD Protection Device. LXES1UBAB1-007 LXES1UBAA1-096 LXES1TBCC2-004 LXES1TBBB2-013 LXES2SBAA4-016 LXES2SBBB4-026 LXES2SBAA4-114 LXES2TBCC4-028 LXES4XBAA6-027 2. Part Number Configuration LXES ① ① ② 1U B AB 1 – 007 ② ③ ④ ⑤ ⑥ Product ID （LXES = ESD Protection device） Dimension Code Unit : mm Code Dimension 1U 1.0 x 0.6 1T 1.6 x 1.6 2S 2.9 x 2.8 ③ ④ ⑤ ⑥ package (serial number) DFN1006P2E (007) DFN1006P2X (096) QFN1616P6E (004/013) SOT23-6L (016/026) SOT23-5L (114) Type(B:Silicon ESD) Control Code Number of channel Serial Number ※RoHS Compliant Halogen free T/R only. Code Dimension package (serial number) 2T 2.5 x 1.0 DFN2510P10E (028) 4X 4.9 x 3.0 MSOP-8L (027) p2/30 3. CHARACTERISTICS 3-1 Ratings Parameter Package Symbol Operating Temperature Storage Temperature T OP T STO 0 Unit 0 C C LXES1UBAB1-007 DFN1006P2E -40 to +85 -40 to +125 LXES1UBAA1-096 DFN1006P2X -40 to +85 -40 to +125 -40 to +85 -40 to +125 -40 to +85 -40 to +125 -40 to +85 -40 to +125 LXES1TBCC2-004 LXES1TBBB2-013 LXES2SBAA4-016 LXES2SBBB4-026 QFN1616P6E SOT23-6L -40 to +85 -40 to +125 LXES2SBAA4-114 SOT23-5L -40 to +85 -40 to +125 LXES2TBCC4-028 DFN2510P10E -40 to +85 -40 to +125 LXES4XBAA6-027 MSOP-8L -40 to +85 -40 to +125 3-2 Electrical Characteristics (T=25℃) Parameter Reverse W orking Voltage Channel Leakage Current Break down voltage ESD per IEC 61000-4-2(air) ESD per IEC 61000-4-2 (contact) Capacitance Symbol V RWM Ileak V br V esd Vesd C Unit V uA V kV kV VP in1=5V, VP in2=0V Ibr=1mA, Pin1 to P in2 Condition Ta=25℃ Ta=25℃ pF VP in1,2=0V, f = 1MHz, Between Channel pins LXES1UBAB1-007 +/-17.5 1.0 (max) 18 (min) +/- 15 +/- 8 0.5 LXES1UBAA1-096 +/-5.5 1.0 (max) 5.8 (min) +/- 15 +/- 12 8 Parameter Reverse W orking Voltage Channel Leakage Current Break down voltage ESD per IEC 61000-4-2(air) ESD per IEC 61000-4-2 (contact) Symbol V RWM Ileak V br Vesd V esd C Unit V uA V kV kV pF V pin5=5V, V pin2=0V, V CH=0-5V Ibr=1mA Ta=25℃ Ta=25℃ Vpin5 = 5V, V pin2 = 0V, V IN = 2.5V, f = 1MHz, Any I/O pin to Ground Condition Capacitance LXES1TBCC2-004 +/-5.5 1.0 (max) 6 (min) +/- 15 +/- 12 0.55 Parameter Reverse W orking Voltage Channel Leakage Current Break down voltage ESD per IEC 61000-4-2(air) ESD per IEC 61000-4-2 (contact) Capacitance Symbol V RWM Ileak V br Vesd V esd C Unit V uA V kV kV pF V pin5=5V, V pin2=0V, V CH=0-5V Ibr=1mA Ta=25℃ Ta=25℃ Vpin2 = 5V, V pin5 = 0V, V IN = 2.5V, f = 1MHz, Any I/O pin to Ground 1.0 (max) 6 (min) +/- 15 +/- 12 0.55 Condition LXES1TBBB2-013 +/-5.5 MURATA MFG. CO., LTD. p3/30 Parameter Reverse W orking Voltage Channel Leakage Current Break down voltage ESD per IEC 61000-4-2(air) ESD per IEC 61000-4-2 (contact) Capacitance Symbol VRW M Ileak Vbr Vesd Vesd C Unit V uA V kV kV pF Condition Vpin5=5V, Vpin2=0V, VCH=0-5V Ibr=1mA Ta=25℃ Ta=25℃ V pin5 = 5V, V pin2 = 0V, VIN = 2.5V, f = 1MHz, Any I/O pin to Ground LXES2SBAA4-016 +/-5.5 1.0 (max) 6 (min) +/- 15 +/- 10 0.55 LXES2SBBB4-026 +/-5.5 1.0 (max) 6 (min) +/- 15 +/- 10 1.0 Parameter Reverse W orking Voltage Channel Leakage Current Break down voltage ESD per IEC 61000-4-2(air) ESD per IEC 61000-4-2 (contact) Capacitance Symbol V RWM Ileak V br V esd V esd C Unit V uA V kV kV pF Vpin1,3,4,5=5V, V pin2=0V Ibr=1mA Ta=25℃ Ta=25℃ V R =0V, f=1MHz +/- 22 +/- 15 12 Condition LXES2SBAA4-114 +/-5.0 2.5 (max) 6.1 (min) Parameter Reverse W orking Voltage Channel Leakage Current Break down voltage ESD per IEC 61000-4-2(air) ESD per IEC 61000-4-2 (contact) Capacitance Symbol V RWM Ileak V br V esd V esd C Unit V uA V kV kV pF V pin3,8=0V, V pin1,2,4,5=0-5V Ibr=1mA Ta=25℃ Ta=25℃ V pin3,8=0V, V in=2.5V, f=1MHz Condition LXES2TBCC4-028 +/-5.5 1.5 (max) 6 (min) +/- 15 +/- 10 0.5 Parameter Reverse W orking Voltage Channel Leakage Current Break down voltage ESD per IEC 61000-4-2(air) ESD per IEC 61000-4-2 (contact) Capacitance Symbol V RWM Ileak V br V esd V esd C Unit V uA V kV kV pF V pin8=5V, V pin7=0V, V CH=0-5V Ibr=1mA Ta=25℃ Ta=25℃ V pin8=5V, V pin7=0V, V in=2.5V, f=1MHz 1.0 (max) 6 (min) +/- 15 +/- 8 0.27 Condition LXES4XBAA6-027 +/-5.5 MURATA MFG. CO., LTD. p4/30 3-3 Typical Characteristics 1.0 80 0.8 Capacitan ce [pF] Voltage [V] LXES1UBAB1-007 100 60 40 20 0 10 20 30 40 0.4 0.2 0.0 0 -10 0.6 50 -5 Time [nsec] -4 -3 -2 -1 0 1 2 3 4 5 Voltage [V] ESD Waveform(IEC61000-4-2：8kV Contact) Voltage－Capacitance Characteristic LXES1UBAA1-096 100 10.0 C apacitan ce [pF] Voltage [V] 80 60 40 20 8.0 6.0 4.0 2.0 0.0 0 -10 0 10 20 30 40 -5 50 -4 -3 -2 -1 0 1 2 3 4 5 Voltage [V] Time [nsec] ESD Waveform(IEC61000-4-2：8kV Contact) Voltage－Capacitance Characteristic 1.0 80 0.8 Capacitan ce [pF] Voltage [V] LXES1TBCC2-004 100 60 40 20 0 -10 0 10 20 30 40 50 Time [nsec] 0.6 0.4 0.2 0.0 0 1 2 3 4 Voltage [V] ESD Waveform(IEC61000-4-2：8kV Contact) Voltage－Capacitance Characteristic MURATA MFG. CO., LTD. 5 p5/30 100 1.0 80 0.8 Capacitan ce [pF] Voltage [V] LXES1TBBB2-013 60 40 20 0 10 20 30 40 0.4 0.2 0.0 0 -10 0.6 50 0 Time [nsec] 1 2 3 4 5 Voltage [V] ESD Waveform(IEC61000-4-2：8kV Contact) Voltage－Capacitance Characteristic 1.0 80 0.8 Capacitan ce [pF] Voltage [V] LXES2SBAA4-016 100 60 40 20 0 10 20 30 40 0.4 0.2 0.0 0 -10 0.6 50 0 Time [nsec] 1 2 3 4 5 Voltage [V] ESD Waveform(IEC61000-4-2：8kV Contact) Voltage－Capacitance Characteristic 2.0 80 1.6 Capacitance [pF] Voltage [V] LXES2SBBB4-026 100 60 40 20 1.2 0.8 0.4 0.0 0 -10 0 10 20 30 40 50 Time [nsec] 0 1 2 3 4 Voltage [V] ESD Waveform(IEC61000-4-2：8kV Contact) Voltage－Capacitance Characteristic MURATA MFG. CO., LTD. 5 p6/30 100 15.0 80 12.0 Capacitan ce [pF] Voltage [V] LXES2SBAA4-114 60 40 20 0 -10 0 10 20 30 40 9.0 6.0 3.0 0.0 50 -5 Time [nsec] -4 -3 -2 -1 0 1 2 3 4 5 Voltage [V] ESD Waveform(IEC61000-4-2：8kV Contact) Voltage－Capacitance Characteristic 100 1.0 80 0.8 Capacitance [pF] Voltage [V] LXES2TBCC4-028 60 40 20 0 10 20 30 40 0.4 0.2 0.0 0 -10 0.6 50 0 Time [n sec] ESD Waveform(IEC61000-4-2：8kV Contact) 1 2 3 4 Voltage [V] Voltage－Capacitance Characteristic 1 2 5 100 1.0 80 0.8 Capacitan ce [pF] Voltage [V] LXES4XBAA6-027 60 40 20 0 -10 0 10 20 30 40 Time [nsec] 50 0.6 0.4 0.2 0.0 0 3 4 Voltage [V] ESD Waveform(IEC61000-4-2：8kV Contact) MURATA MFG. CO., LTD. Voltage－Capacitance Characteristic 5 p7/30 4. CONSTRUCTION, DIMENSIONS (1) DFN1006P2E 4 - 1 -1 DIMENSIONS Top View Side View Ｔ Marking Bottom View Unit : mm symbol size symbol size L 1.0+/-0.05 b 0.5+/-0.05 W 0.6+/-0.05 c 0.25+/-0.05 T 0.6 max d (0.125) a (0.65) 4 - 1 - 2 Pin Configuration No. Terminal Name 1 Line-1/GND 2 GND/Line-1 4 - 1 - 3 Circuit Diagram MURATA MFG. CO., LTD. p8/30 (2) DFN1006P2X 4 - 2 - 1 DIMENSIONS Top View Bottom View Marking Side View Ｔ symbol size symbol size L 1.0+/-0.05 b 0.25+/-0.05 W 0.6+/-0.05 c 0.50+/-0.05 T 0.5 max d (0.125) a (0.65) 4 - 2 - 2 Pin Configuration No. Terminal Name 1 Line-1/GND 2 GND/Line-1 4 - 2 - 3 Circuit Diagram MURATA MFG. CO., LTD. p9/30 (3) QFN1616P6E 4 - 3 - 1 DIMENSIONS Top View Bottom View L (6) a (4) (4) ×× b (5) (6) d Device code e (7) W f c (1) (3) (1) (2) (3) Side View Unit : mm symbol size symbol size L 1.6+/-0.05 c 0.275+/-0.05 W 1.6+/-0.05 d (1.0) T 0.6 max e (0.6) a 0.25+/-0.05 f R0.2 b (0.5) 4 - 3 - 2 Pin Configuration LXES1TBCC2-004 No. Terminal Name No. Terminal Name 1 I/O 1 5 VDD 2 GND 6 NC 3 I/O 2 7 NC 4 NC LXES1TBBB2-013 No. Terminal Name No. Terminal Name 1 I/O 1 5 GND 2 VDD 6 NC 3 I/O 2 7 NC 4 NC 4 - 3 - 3 Circuit Diagram LXES1TBCC2-004 LXES1TBBB2-013 MURATA MFG. CO., LTD. p10/30 (4) SOT23-6L 4 - 4 - 1 DIMENSIONS Top View Bottom View L a (6) (5) (4) ×× XY W Device Code (1) b g Trace Code (2) (3) Unit : mm c Side View symbol size symbol size L 2.9 typ c (1.9) W 2.8 typ d 1.3 max T 1.45 max e 0.15 max a 0.4±0.10 f 0.14±0.06 b (0.95) g (0.6) 4 - 4 - 2 Pin Configuration No. Terminal Name No. Terminal Name 1 I/O 1 4 I/O 3 2 GND 5 VDD 3 I/O 2 6 I/O 4 4 - 4 - 3 Circuit Diagram MURATA MFG. CO., LTD. p11/30 (5) SOT23-5L 4 - 5 - 1 DIMENSIONS Top View Bottom View Unit : mm Side View symbol size Terminal Name No. Terminal Name 1 I/O 1 4 I/O 3 2 GND 5 I/O 4 3 I/O 2 size L 2.9±0.2 c (1.9) W 2.8±0.2 d (0.45) T 1.45 max e (0.6) a 0.4±0.10 f 0.21 max b (0.95) g 1.8 max 4 - 5 - 2 Pin Configuration No. symbol 4 - 5 - 3 Circuit Diagram MURATA MFG. CO., LTD. p12/30 (6) DFN2510P10E 4 - 6 - 1 DIMENSIONS Top View Bottom View Side View a ×× XY e b c 単位: mm d Unit : mm symbol size symbol size L 2.5+/-0.05 c (0.5) W 1.0+/-0.05 d 0.40+/-0.05 T 0.60 max e (1.95) a 0.20+/-0.05 f 0.05 max b 0.40+/-0.05 4 - 6 - 2 Pin Configuration No Terminal Name No Terminal Name 1 Line-1 6 NC 2 Line-2 7 NC 3 GND 8 GND 4 Line-3 9 NC 5 Line-4 10 NC 4 - 6 - 3 Circuit Diagram MURATA MFG. CO., LTD. p13/30 (7) MSOP-8L 4 - 7 - 1 DIMENSIONS Top View Side View 1 Unit : mm symbol size symbol size L 4.9+/-0.15 d 0.95 max W 3.0+/-0.10 e 0.15 max T 1.1 max f 0.15+0.08/-0.02 a 0.30+0.08/-0.02 g (0.25) b (0.65) h (0.55) c 3.0+/-0.10 4 - 7 - 2 Pin Configuration No. Terminal Name No Terminal Name 1 I/O 1 5 I/O 5 2 I/O 2 6 I/O 6 3 I/O 3 7 GND 4 I/O 4 8 VDD 4 - 7 - 3 Circuit Diagram MURATA MFG. CO., LTD. Side View 2 p14/30 5. Reliability Test No. Items Specifications No severe damages Satisfy dimension specifications 1 2 Vibration Resistance Test Methods Result (Fail) 22 G (0) 22 G (0) 22 G (0) 22 G (0) 22 G (0) 22 G (0) Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Frequency : 10~2000 Hz Acceleration : 196 m/s2 Direction : X,Y,Z 3 axis Period : 2 h on each directionTotal 6 h. Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock Shock Number Acceleration : 14,700 m/s2 Period : 0.3 ms. Cycle : 3 times 3 Solder specimens on the testing jig (glass epoxy boards) shown in appended Fig.2 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection DFN0603P2Y 2N Minimum 4 Soldering strength (Push Strength) DFN1006P2E , DFN1006P2X 3N Minimum No damage with 1.6mm deflection Solder specimens onto test jig shown below. Apply pushing force at 0.5m m/s until electrode pads are peeled off or product is broken. Pushing force is applied to longitudinal direction. Pushing Direction Specimen Jig Others 5N Minimum 5 Solderability of Termination Appearance Resistance to Soldering Heat 6 (Reflow) Electrical specifications 75% of the terminations is to be soldered evenly and continuously. No severe damages Satisfy specifications listed in paragraph 3-2 over operational temperature range Immerse specimens first an ethanol solution of rosin, then in a Pb free solder solution for 3±0.5 sec. at 245±5 °C. Preheat : 150 °C, 60 sec. Solder Paste : Sn-3.0Ag-0.5Cu Flux : Solution of ethanol and rosin (25 % rosin in weight proportion) Preheat Temperature Preheat Period High Temperature High Temp. Period Peak Temperature : 150-180 °C : 90+/ -30 s : 220 ℃ : 30+/ -10 s : 260+5/ -0 °C Specimens are soldered twice with the above condition, and then kept in room condition for 24 h before measurements. MURATA MFG. CO., LTD. p15/30 No. 7 8 9 10 Items High Temp. Exposure Temperature Cycle Humidity (Steady State) Low Temp. Exposure Number Result (Fail) 22 G (0) 22 G (0) Temperature：85±2 ℃ Humidity：80～90 %RH Period：1000+48/-0 h Room Condition：2 ～ 24 h 22 G (0) Temperature：-40±2 ℃ Period：1000+48/-0 h Room Condition：2 ～ 24 h 22 G (0) Specifications Appeara nce Electrical Specifica tions No severe damages Test Methods Temperature : 85+2/-0 °C Period : 1000+48/ -0 h Room Condition : 2 ~ 24 h Satisfy specifications listed in paragraph 3-2 over operational temperature range Set the specimens to the supporting jig in the same manner and under the same conditions as Fig.1 and conduct the 100 cycles according to the temperatures and time shown in the following table. Set it for 2 to 24 h at room temperature, then measure. Step Temp(°C) 1 Min. Operating Temp.+0/-3 30±3 2 Max. Operating Temp.+3/-0 30±3 MURATA MFG. CO., LTD. Time(min) p16/30 Fig. 1 Land Pattern Package : DFN1006P2E , DFN1006P2X Unit : mm ※Reference purpose only. Package : QFN1616P6E Unit : mm ※Reference purpose only. MURATA MFG. CO., LTD. p17/30 Package : SOT23-6L Unit : mm 0.95 3.6 2.5 1.4 1.1 0.6 ※Reference purpose only. Package : SOT23-5L Unit : mm ※Reference purpose only. Package : DFN2510P10E Unit : mm 0.875 0.2 1.0 0.4 0.5 0.675 ※Reference purpose only. MURATA MFG. CO., LTD. p18/30 Package : MSOP-8L Unit : mm 4.80 0.41 0.65 1.02 ※Reference purpose only. MURATA MFG. CO., LTD. p19/30 Fig. 2 Testing board (Unit : mm) 100 40 Mounted situation Land Land pattern is same as figure1 Glass-fluorine board t＝1.6ｍｍ Copper thickness over 35 m (Unit : mm) CHIP 45 45 Test method (Unit : mm) 20 50 R230 deflection MURATA MFG. CO., LTD. p20/30 6.Tape and Reel Packing (1) Dimensions of Tape (Plastic tape) Not in scale Unit : mm package DFN1006P2E DFN1006P2X L (1.10) (1.15) W (0.70) (0.70) T (0.65) (0.52) a 2.00+/-0.05 2.00+/-0.05 b 4.00+/-0.10 4.00+/-0.10 c 3.50+/-0.05 3.50+/-0.05 d 1.75+/-0.1 1.75+/-0.1 e 8.00+0.30/-0.10 8.00+/-0.10 f φ1.55+/-0.05 φ1.55+/-0.05 MURATA MFG. CO., LTD. p21/30 (2) Dimensions of Tape (Plastic tape) Not in scale Unit : mm package QFN1616P6E SOT23-6L SOT23-5L DFN2510P10E MSOP-8L L 1.80+/-0.05 3.23+/-0.10 3.23+/-0.10 2.70+/-0.05 3.40+/-0.10 W 1.80+/-0.05 3.17+/-0.10 3.17+/-0.10 1.23+/-0.05 5.30+/-0.10 T 0.69+/-0.05 1.37+/-0.10 1.37+/-0.10 0.70+/-0.05 1.40+/-0.10 a 2.00+/-0.05 2.00+/-0.05 2.00+/-0.05 2.00+/-0.05 2.00+/-0.05 b 4.00+/-0.10 4.00+/-0.10 4.00+/-0.20 4.00+/-0.10 8.00+/-0.10 c 4.00+/-0.10 4.00+/-0.10 4.00+/-0.10 4.00+/-0.10 4.00+/-0.10 d 3.50+/-0.05 3.50+/-0.05 3.50+/-0.05 3.50+/-0.05 5.50+/-0.05 e 1.75+/-0.1 1.75+/-0.1 1.75+/-0.1 1.75+/-0.1 1.75+/-0.10 f 8.00+/-0.10 8.00+0.30/-0.10 8.00+0.30/-0.10 8.00+0.30/-0.20 12.0+/-0.30 g φ1.55+/-0.05 φ1.55+/-0.05 φ1.55+/-0.05 φ1.55+/-0.05 φ1.55+/-0.05 MURATA MFG. CO., LTD. p22/30 (3) Dimensions of Reel Not in scale a d e b c Unit : mm package DFN1006P2E DFN1006P2X QFN1616P6E SOT23-6L a 1.5 min 1.5 min 2.3+/-0.1 2.3+/-0.1 b φ13.0+/-0.2 φ13.0+/-0.2 φ13.0+/-0.2 φ13.0+/-0.2 c 9.2+2.0/-0 9.2+2.0/-0 9.5+/-1.0 9.5+/-1.0 d φ60 φ60 φ54.4 φ60 e φ180 φ180 φ180 φ180 package SOT23-5L DFN2510P10E MSOP-8L a 2.0+0.5/-0 2.3+/-0.1 2.0+/-0.5 b φ13.0+0.5/-0.3 φ13.0+/-0.2 φ13.0+0.5/-0.2 c 8.6+1.0/-0 9.5+/-0.2 12.8+0.3/-0.2 d φ54.4 φ60 φ100 e φ180 φ180 φ330 (4) PACKAGE Diagrams (Humidity proof Packing) Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Label 表示ラべル Desiccant 乾燥剤 Humidity 　湿度 Indicator インジケ－タ 表示ラベル Label Anti-humidity 防湿梱包袋 Aluminum foil pack bag MURATA MFG. CO., LTD. p23/30 (5) Taping Diagrams [1] Feeding Hole : As specified in (1),(2) [2] Hole for chip : As specified in (1),(2) [3] Cover tape : 50  m in thickness [4] Base tape : As specified in (1),(2) [3] [1] [2] [3] Feeding hole [4] A Feedeng Direction A Marking Chip Marking Direction LXES1UBAA1-096 2 LXES1UBAB1-007 LXES1TBCC2-004/LXES1TBBB2-013 PIN1 MURATA MFG. CO., LTD. p24/30 LXES2SBAA4-016/LXES2SBBB4-026 LXES4XBAA6-027/ LXES2TBCC4-028/ PIN1 PIN1 LXES2SBAA4-114 PIN1 MURATA MFG. CO., LTD. p25/30 (6) Leader and Tail tape Tail tape (No components) Component No components Leader tape (Cover tape alone) Over100mm Over160m Over400mm Feeding direction (7) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. (8) Packaging unit: Unit : pcs / reel package DFN1006P2E DFN1006P2X QFN1616P6E SOT23-6L quantity 3000 12000 3000 3000 package SOT23-5L DFN2510P10E MSOP-8L DFN4120P10E quantity 3000 3000 3000 3000 (9) Material : Base tape ...... Plastic Reel ......Plastic Base tape, Reel and Top tape have an anti-ESD function. (10) Peeling of force : 0.1～1.0 N in the direction of peeling as shown below. 0.1~1.0N 0.7 N max. 165 ~ 180 ° Cover tape Base tape MURATA MFG. CO., LTD. p26/30 NOTICE １．Storage Conditions: ・The product shall be stored without opening the packing under the ambient temperature from 5 to 35 deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40 deg.C.) ・The product left more than 6 months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. ・After the packing opened, the product shall be stored at < 30 deg.C / < 60 %RH and the product shall be used within 168 hours. When the color of the indicator in the packing changed, the product shall be baked before soldering. This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020) 2. Handling Conditions: Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability. 3. Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 4. Notice for Chip Placer: When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. MURATA MFG. CO., LTD. p27/30 5. Soldering Conditions: Carefully perform preheating so that the temperature difference (T) between the solder and products surface should be in the following range. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Contact Murata before use if concerning other soldering conditions. Soldering method Soldering iron method Reflow method Temperature 