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MM5Z5V1ST1G

MM5Z5V1ST1G

  • 厂商:

    MURATA-PS(村田)

  • 封装:

    SOD523(SC-79)

  • 描述:

    二极管配置:独立式;稳压值(标称值):-;稳压值(范围):4.95V~5.2V;精度:-;功率:500mW;反向电流(Ir):2uA@2V;阻抗(Zzt):60Ω;

  • 数据手册
  • 价格&库存
MM5Z5V1ST1G 数据手册
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series Zener Voltage Regulators 500 mW SOD−523 Surface Mount This series of Zener diodes is packaged in a SOD−523 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. http://onsemi.com SOD−523 CASE 502 STYLE 1 Specification Features • Standard Zener Breakdown Voltage Range −2.4 V to 18 V • Steady State Power Rating of 500 mW • Small Body Outline Dimensions: • • • • • 0.047″ x 0.032″ (1.20 mm x 0.80 mm) Low Body Height: 0.028″ (0.7 mm) ESD Rating of Class 3 (> 16 kV) per Human Body Model Tight Tolerance VZ SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant* 1 Cathode 2 Anode MARKING DIAGRAM 1 XX MG G 2 XX = Specific Device Code M Date Code* G = Pb−Free Package (Note: Microdot may be in either location) Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any *Date Code orientation may vary depending upon manufacturing location. QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements ORDERING INFORMATION MAXIMUM RATINGS Rating Total Device Dissipation FR−4 Board, (Note 1) @ TA = 25°C Derate above 25°C Thermal Resistance from Junction−to−Ambient (Note 1) Operating Junction and Storage Temperature Range Symbol Device Package Shipping† MM5ZxxxST1G SOD−523 (Pb−Free) 3,000 / Tape & Reel Max Unit 500 4.0 mW mW/°C SZMM5ZxxxST1G SOD−523 (Pb−Free) 3,000 / Tape & Reel RqJA 250 °C/W SZMM5ZxxxST5G SOD−523 (Pb−Free) 8,000 / Tape & Reel TJ, Tstg −65 to +150 °C PD Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm2. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2014 October, 2014 − Rev. 12 1 Publication Order Number: MM5Z2V4ST1/D MM5ZxxxST1G Series, SZMM5ZxxxST1G Series ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Symbol Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IR Reverse Leakage Current @ VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF C VZ VR V IR VF IZT VR QVZ I IF Figure 1. Zener Voltage Regulator Maximum Temperature Coefficient of VZ Max. Capacitance @VR = 0 and f = 1 MHz ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types) Zener Voltage VZ ZZT IZ = IZT @ 10% Mod W Max mA V Min Max C pF Max @ VR = 0 f = 1 MHz Max IR @ VR dVZ/dt (mV/k) @ IZT1 = 5 mA Min Max ZZK IZ = 1.0 mA W Max 5.0 2.43 2.63 1000 100 120 1.0 −3.5 0 450 T3 5.0 2.67 2.91 1000 100 100 1.0 −3.5 0 450 MM5Z3V3ST1G T5 5.0 3.32 3.53 1000 95 5.0 1.0 −3.5 0 450 MM5Z3V6ST1G T6 5.0 3.60 3.85 1000 90 5.0 1.0 −3.5 0 450 MM5Z3V9ST1G T7 5.0 3.89 4.16 1000 90 3.0 1.0 −3.5 −2.5 450 MM5Z4V3ST1G T8 5.0 4.17 4.43 1000 90 3.0 1.0 −3.5 0 450 MM5Z4V7ST1G/T5G T9 5.0 4.55 4.75 800 80 3.0 2.0 −3.5 0.2 260 MM5Z5V1ST1G TA 5.0 4.98 5.2 500 60 2.0 2.0 −2.7 1.2 225 MM5Z5V6ST1G TC 5.0 5.49 5.73 200 40 1.0 2.0 −2.0 2.5 200 MM5Z6V2ST1G TE 5.0 6.06 6.33 100 10 3.0 4.0 0.4 3.7 185 MM5Z6V8ST1G TF 5.0 6.65 6.93 160 15 2.0 4.0 1.2 4.5 155 MM5Z7V5ST1G TG 5.0 7.28 7.6 160 15 1.0 5.0 2.5 5.3 140 MM5Z8V2ST1G TH 5.0 8.02 8.36 160 15 0.7 5.0 3.2 6.2 135 MM5Z9V1ST1G TK 5.0 8.85 9.23 160 15 0.5 6.0 3.8 7.0 130 MM5Z12VST1G TN 5.0 11.74 12.24 80 25 0.1 8.0 6.0 10 130 MM5Z16VST1G TU 5.0 15.85 16.51 80 40 0.05 11.2 10.4 14 105 MM5Z18VST1G TW 5.0 17.56 18.35 80 45 0.05 12.6 12.4 16 100 Device Marking Test Current Izt mA MM5Z2V4ST1G T2 MM5Z2V7ST1G Device* Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *Include SZ-prefix devices where applicable. http://onsemi.com 2 MM5ZxxxST1G Series, SZMM5ZxxxST1G Series TYPICAL CHARACTERISTICS 100 POWER DISSIPATION (%) 80 60 40 20 0 0 25 50 75 100 125 TEMPERATURE (°C) Figure 2. Steady State Power Derating http://onsemi.com 3 150 MM5ZxxxST1G Series, SZMM5ZxxxST1G Series PACKAGE DIMENSIONS SOD−523 CASE 502 ISSUE E −X− D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. −Y− E 2X b 0.08 1 M 2 X Y DIM A b c D E HE L L2 TOP VIEW A c MILLIMETERS MIN NOM MAX 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 1.10 1.20 1.30 0.70 0.80 0.90 1.50 1.60 1.70 0.30 REF 0.15 0.20 0.25 STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE HE SIDE VIEW 2X RECOMMENDED SOLDERING FOOTPRINT* L 2X 1.80 0.48 2X 0.40 2X L2 BOTTOM VIEW PACKAGE OUTLINE DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MM5Z2V4ST1/D
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