UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Product Description
MYC0409-NA is an Ultra-thin High Efficiency integrated
power solution which combines a 72W DC-DC converter
with components. This total power solution can be used
in a system without loop compensation and with just three
external components in the minimum case.
This fully integrated module provides up to 96.5%
efficiency despite its small and thin 11.5 x 9.5 x 2.0mm
LGA package. Murata’s easy-to-use module pinout
design allows simple power layout and provides
maximizing efficiency by minimizing routing parasitic
resistance.
Efficiency
TA =25degC
This module is fixed divide-by-4 conversion ratio from
input voltage to output voltage. Input voltage range of 20V
to 60V supports 48V bus systems.
■
■
■
■
■
Wide input voltage
20V to 60V (DIV4)
Suitable for 48V bus systems
Efficiency up to 96.5%
Up to 95.0% Efficiency with 48VIN/6A
Up to 6A
Ultra-thin/small 11.5 x 9.5 x 2.0mm LGA package.
(T=2.1mm(max.))
Features
■
■
■
■
■
Open drain power-good output
Over-current and over-temperature protections
Compensation loop-less charge pump
Synchronizes to an external clock
Stackable up to 4 modules
VIN
VIN
VIN
Output Current IOUT [A]
Figure 1. Efficiency Curve
Simplified Application
Typical Applications
■
■
■
■
■
■
Data center/server
Networking equipment
Base station
Optical equipment
Test equipment
LED signage
Figure 2. Simplified Circuit Diagram
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Copyright ©2023 Murata Manufacturing Co., Ltd. All rights reserved.
Specifications are subject to change without notice.
Document Number: D90DH-00151 / Export Control Code: X0863
MYC0409-NA Rev.A05 (Oct.-2023)
Page 1 of 34
UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Table of Contents
Product Description ............................................................. 1
Features ............................................................................. 1
Typical Applications ............................................................. 1
Efficiency ........................................................................... 1
Simplified Application .......................................................... 1
Performance Specifications Summary and Ordering Information 3
Top Marking Specification ............................................................. 3
Absolute Maximum Ratings .......................................... 4
Recommended Operating Conditions .......................... 4
Package Thermal Characteristics ................................. 4
Application Information....................................................... 17
Charge Pump Architecture Basics .............................................. 17
Application Performance ..................................................... 19
Application Schematic ........................................................ 19
Application Circuit Part List ................................................. 20
Application Board Example ................................................. 20
Component Selection ......................................................... 21
Input Capacitor ............................................................................ 21
Output Capacitor ......................................................................... 21
Input Fuse ................................................................................... 21
Application Schematic with Secondary.................................. 21
Parallel Operation .............................................................. 22
Pin Description .................................................................... 7
Current and Thermal Balance ..................................................... 22
Pin Connections for Parallel Operation ....................................... 22
Charge Pump Architecture and Important Notice ....................... 24
Hard Short Circuit Condition ....................................................... 24
Soft-start and Capacitors Charge Balancing ............................... 24
Reverse Direction Current Flow and Operation .......................... 25
Input Voltage Transient ............................................................... 25
Functional Block Diagram ..................................................... 8
Packaging Information ........................................................ 26
Electrical Characteristics .............................................. 5
Electrical Characteristics Table ................................................. 5
Pin Configuration................................................................. 7
Application Circuit ............................................................... 8
Package Drawing ........................................................................ 26
Recommended Board Land Pattern ........................................... 27
Typical Performance Characteristics ...................................... 9
Tape and Reel Specification................................................. 28
Thermal Deratings (Reference Data) ..................................... 11
Soldering Guidelines .......................................................... 30
Detailed Description ........................................................... 12
Revision History ........................................................... 31
Start-up – EN, VIN Relationship. .................................................. 12
Enable (EN) ................................................................................. 13
Input Under-voltage Lockout (UVLO) .......................................... 13
Pre-charge Operation.................................................................. 13
Soft-start Operation ..................................................................... 13
PGOOD Operation ...................................................................... 13
External/Internal Clock Modes and SYNCSEL Pin ..................... 15
Protections ................................................................... 15
VIN Under-voltage and Thermal Shutdown Faults ....................... 16
IOUT Overcurrent Protection ......................................................... 16
VOUT Under-voltage Protection .................................................... 16
Soft-start Timeout ........................................................................ 16
PGOOD Low Detection ............................................................... 17
Notices ............................................................................. 32
Scope ............................................................................................ 32
Limitation of Applications ................................................................... 32
Fail-safe function .............................................................................. 33
Product Specification .................................................................. 33
Contact Form .................................................................................. 33
Disclaimers ....................................................................... 34
Patent Statement ............................................................................. 34
Copyright and Trademark .................................................... 34
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Copyright ©2023 Murata Manufacturing Co., Ltd. All rights reserved.
Specifications are subject to change without notice.
Document Number: D90DH-00151 / Export Control Code: X0863
MYC0409-NA Rev.A05 (Oct.-2023)
Page 2 of 34
UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Performance Specifications Summary and Ordering Information
Table 1. Performance Specifications Summary and Ordering Information
OUTPUT
INPUT
VIN (typ.)
[V]
RANGE
[V]
IIN
full load
[A]
Efficiency
[%]
EN
Package
[mm]
Making
MSL
PART NUMBER
VOUT
[V]
IOUT
(max.)
[A]
MYC0409-NA
VIN/DIV4
6.0
48
20-60
1.5
95
Yes
(Positive)
11.5 x 9.5 x 2.0
LGA
C409NA
3
MYC0409-NA-D
VIN/DIV4
6.0
48
20-60
1.5
95
Yes
(Positive)
11.5 x 9.5 x 2.0
LGA
C409NA
3
Quantity
400 units
/Tape
&Reel
100 units
/Tape
&Reel
Table 2. Part Numbering
0409
C
MY
Murata Products
Series Name
Internal Code
-
A
N
Product Grade Code
N: High Reliability
-
D
Packaging Code
Blank : Standard Quantity
D: Small Quantity
Control type and
Communication Interface Code
Top Marking Specification
CODES
DESCRIPTION
Pin 1 marking
C409NA
Product code
Internal manufacturing code
C409NA
Figure 3. Top Marking Specification
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SHIPPING
METHOD
UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Absolute Maximum Ratings (1)
Table 3. Absolute Maximum Ratings
VIN
EN
SYNC, SYNCSEL, PGOOD
PARAMETER
MIN
-0.3
-0.3
-0.3
UNITS
V
V
V
-
MAX
61
VIN+0.3
5.5
VIN/4
+0.1
8
125
260
2
1000
MIN
20
-40
-40
0
MAX
60
105
120
6
UNITS
V
degC
degC
A
VOUT
-0.3
Output Current (IOUT)
Storage Temperature (TSTG)
Soldering / Reflow Temperature(2)
Maximum Number of Reflows Allowed(2)
ESD Tolerance, HBM(3)
0
-40
-
V
A
degC
degC
V
Notes:
(1) The application of any stress beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device,
and exposure at any of these ratings for extended periods may reduce the reliability of the device. The above “Absolute Maximum
Ratings” are stress ratings only; the notation of these conditions does not imply functional operation of the device at these or any
other conditions that fall outside of the range identified by the operational sections of this specification.
(2) Recommended reflow profile is written in “Soldering Guidelines”.
(3) Human body model, per the JEDEC standard JS-001-2012.
Recommended Operating Conditions (1)
Table 4. Recommended Operating Conditions
Input Voltage (VIN)
Ambient Temperature (TA) (2)
Junction Temperature (TJ) (2)
Output Current (IOUT)
PARAMETER
Notes:
(1) Device should not be operated outside the operating conditions. The reliability is tested at the maximum voltage of the recommended
operating condition. Above of recommended operation may reduce reliability of the device.
(2) See the temperature derating curves in the thermal deratings. However, do not condensate.
Package Thermal Characteristics (1,2)
PARAMETER
Θjct
Θjcb
Table 5. Package Thermal Characteristics
Junction-case-top at Heat Junction
Junction-case-bottom at Heat Junction
TYPICAL
15.9
4.7
UNITS
degC/W
degC/W
Notes:
(1) Package thermal characteristics and performance are measured and reported in a manner consistent with the JEDEC standards
JESD51-8 and JESD51-12.
(2) Junction-to-Ambient Thermal Resistance (ƟJA) is a function not only of the IC, but it is also extremely sensitive to the environment
which includes, but is not limited to, board thickness, planes, copper weight / routes, and air flow. Attention to the board layout is
necessary to realize expected thermal performance
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UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Electrical Characteristics (1)
Electrical Characteristics Table
VIN = 48V, IOUT = 6A, TA = 25degC, unless otherwise noted
PARAMETER
INPUT SUPPLY
Input Voltage
VIN Start-up Slew Rate(2)
VIN Under Voltage Lockout
Threshold, VIN Rising
VIN Under Voltage Lockout
Hysteresis
VIN Switching Supply Current
VIN Shutdown Supply Current
ENABLE INPUT (EN PIN)
Enable Threshold High(2)
Enable Threshold Low(2)
Enable Input Rising Duration(2)
Enable Pin Input Current
POWER GOOD (PGOOD PIN)
PGOOD Output Pulldown Low
Level(2)
PGOOD Input High Voltage(2)
PGOOD Input Low Voltage(2)
PGOOD Hysteresis
PGOOD VOUT Threshold
PGOOD Released VOUT
Threshold
SYNCSEL PIN
Threshold High(2)
Threshold Low(2)
OUTPUT
Efficiency Peak
Efficiency Full Load
Switching Frequency
Soft Start Input Current Limit(3)
Soft Start Timeout Duration(3)
Output Current (Continuous)(3)
Output Current (Start-up)(3)
Table 6. Electrical Characteristics Table
SYMBOL
CONDITIONS
VIN
VIN_SR
MIN
TYPICAL
MAX
UNITS
20
0.2
48
-
60
-
V
V/ms
VIN_UVH
IOUT=0A
-
18.1
-
V
VIN_UVL
IOUT=0A
-
0.9
-
V
IIN_SW
IIN_SD
VIN=48V, No load
VIN=48V, EN=0V
-
11
0.15
-
mA
uA
2.6
-
-
0.6
1
V
V
ms
-
42
-
uA
-
-
0.25
V
0.9
-
0.4
0.95*
VIN/4
0.8*
VIN/4
0.7
-
V
V
V
-
V
-
V
1.1
-
-
0.4
V
V
-
96.5
95.0
270
134
100
95.5%*
VIN/4
0.086
6
20
%
%
kHz
mA
ms
A
mA
-
V
44
-
400
uF
44*n
-
400
uF
VTH_ENH
VTH_ENL
tR_EN
IEN
VPG_LOW
0V to VTH_ENH
EN=VIN=48V, TA=125degC, No
Load
IPG=20mA
VPGH
VPGL
VPGHYS
VTH_PGH
VOUT rising, No fault
-
VTH_PGL
VOUT falling after PGOOD=H
-
VTH_SYNH
VTH_SYNL
EFF_PK
EFF_FULL
fSW
IIN_SS
tTO_SS
IOUT
IOUT_START
VIN=48V, IOUT=2.4A
VIN=48V, IOUT=6A
Output Voltage
VOUT
VIN=48V, Full load condition, DC
Equivalent Output Resistance(4)
Total External
Output Capacitance(2)
Total External
Output Capacitance
with Parallel Operation(2)
ROUT
VIN=60V, IOUT=6A
Inside recommended OP range
COUT
COUT_P
n=Parallel devices numbers
-
ohm
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UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Electrical Characteristics Table
VIN = 48V, IOUT = 6A, TA = 25degC, unless otherwise noted
PARAMETER
PROTECTION
Thermal Shutdown Threshold(2)
Thermal Shutdown Hysteresis
Over Current Protection
ENVIRONMETAL
Moisture Sensitivity Level
Table 6. Electrical Characteristics Table
SYMBOL
TTH_OTP
THYS_OTP
ITH_OCP
CONDITIONS
Temperature rising
MSL
MIN
TYPICAL
MAX
UNITS
125
-
150
16
10
-
degC
degC
A
3
Notes:
(1) Min/Max specifications are 100% production tested at TA=25degC, unless otherwise noted. Limits over the operating range are guaranteed
by design.
(2) Guaranteed by design.
(3) Load currents may cause start-up failure due to Soft-start timeout fault. Devices supplied power from this device should be started up after
the PGOOD signal becomes high state.
(4) ROUT = (VIN/4-VOUT)/IOUT
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UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Pin Configuration
Figure 4. Module Terminals (Top View)
Pin Description
Table 7. Pin Description
PIN No.
NAME
DESCRIPTION
A1, A3, A7, B1, B2, B5-7, C1-7,
D2-7, E3-8, F5-8, G5-8
GND
Ground for power and thermal.
Please connect ground plane in low impedance.
E1, F1, G1
VIN
Power input terminal
A8, B8, C8, D8
VOUT
G3
EN
A5
SYNC
A6
SYNCSEL
A4
PGOOD
Power good terminal. Connect a 10kohm resistor from PGOOD to an external bus voltage
between 3.3V and 5.5V.
A2, D1, E2, F2, G2, G4
DNC
Do not connect pins electrically. Those pins must connect to the board with solder but must be
left floating electrically each other.
Power output terminal
Part enable terminal. Do not leave this terminal open.
HIGH=ON / LOW=OFF
CLOCK IN / OUT terminal. Direction is configurable by SYNCSEL terminal potential.
SYNC terminal control.
LOW=CLKOUT, HI-Z=CLKIN.
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UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Functional Block Diagram
Figure 5. Functional Block Diagram
Application Circuit
Figure 6. Application Circuit
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UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Typical Performance Characteristics
In this document, all characteristics are measured with the application board which is shown in Figure 26.
The schematic and part list of the board are shown in Figure 25 and Table 11. The board is under TA =25degC
with no airflow unless otherwise noted.
VIN
VIN
VIN
VIN
VIN
VIN
VIN
VIN
Output Current IOUT [A]
Output Current IOUT [A]
Figure 7. Efficiency (Linear, Log scale)
Startup waveform with VIN =48V, IOUT =0A, TA =25degC, COUT =44uF
VIN, 50V/div
EN, 10V/div
PGOOD, 5V/div
VOUT, 10V/div
4ms/div
Figure 8. Start-up Waveform
Shutdown waveform with VIN =48V, IOUT =6A, TA= 25degC, COUT =44uF
VIN, 50V/div
EN, 10V/div
PGOOD, 5V/div
VOUT, 10V/div
200us/div
Figure 9. Shutdown Waveform
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UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
VOUT ripple waveform with VIN=48V, IOUT=6A, TA =25degC, COUT=44uF
VOUT(AC), 50mV/div
1us/div
Figure 10. VOUT Ripple Waveform
VIN ripple waveform with VIN=48V, IOUT=6A, TA =25degC, CIN2=9.4uF
VIN(AC), 100mV/div
1us/div
Figure 11. VIN Ripple Waveform
Load transient response waveform with VIN=48V, IOUT=0 to 6A, 1A/us, TA =25degC, COUT=44uF
VOUT(AC), 500mV/div
VOUT(AC), 500mV/div
IOUT, 5A/div
IOUT, 5A/div
20us/div
20us/div
Figure 12. Load Transient Response Waveform
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UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Thermal Deratings (Reference Data)
Output Current IOUT [A]
Thermal Deratings with VIN=48V
Ambient Temperature TA [degC]
Figure 13. Thermal Deratings (VIN=48V)
Output Current IOUT [A]
Thermal Deratings with VIN=54V
Ambient Temperature TA [degC]
Figure 14. Thermal Deratings (VIN=54V)
The thermal deratings are evaluated in following conditions.
・The product is mounted on 114.5 x 101.5 x 1.6mm (Layer1, 4: 2oz copper / Layer2, 3: 1oz copper) FR-4 board.
Surface temperature of the product: 116degC (max.)
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UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Detailed Description
The MYC0409-NA is a divide-by-4, two-phase charge pump-based DC-DC converter, so any change in input
voltage will be reflected at the output. The MYC0409-NA can be powered from input voltage ranges from 20V to
60V. The output voltage range supported is 5V to 15V with load currents of 6A
The SYNCSEL pin can be tied to ground or by left floating, If tied to ground then the device will use an internal
clock and this clock signal will appear at the SYNC pin. If left floating, then the SYNC pin will act as an input. Please
refer to Table 7 for details. The pin configurations are sampled when the MYC0409-NA starts up and before the
charge pump stage is enabled. The configuration pins are not designed to be driven dynamically, so they should
be in a fixed state at power up.
Start-up – EN, VIN Relationship.
The MYC0409-NA has an enable input pin, EN, which is designed to be compatible with typical low-voltage digital
I/O levels so that it can be easily driven by an external controller. EN can be also connected to the VIN pin. If
external power sequencing or control is not required, EN should be tied to VIN and not left open.
If the EN pin is held low until VIN has reached its nominal voltage, the MYC0409-NA follows the initialization
sequence shown in Figure 15.
Figure 15. Initialization Sequence
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UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Enable (EN)
The MYC0409-NA is enabled by an active-high EN input pin when the voltage higher than 2.6V is applied. The
MYC0409-NA is disabled when the voltage at the EN pin falls below 0.6V. The EN pin can be shorted to the VIN
pin to automatically enable the part with a minimal number of external components and PCB routing. When multiple
MYC0409-NAs are used in parallel, all their EN pins must be connected to a single enable signal. Scope plots
showing the enable and disable behavior are shown in Figure 8 and Figure 9.
Input Under-voltage Lockout (UVLO)
The MYC0409-NA provides continuous monitoring of the VIN input using a fixed under-voltage lockout threshold.
The MYC0409-NA is enabled when the VIN voltage rises above 18.1V typical. When the VIN falls below the fixed
under-voltage lockout threshold minus additional 0.9V hysteresis, charge pump switching is disabled.
Pre-charge Operation
Before enabling the soft-start switching sequence, the MYC0409-NA pre-charges the internal flying capacitors to
make a balanced state based upon the divider ratio. This is done so that when the soft-start phase commences,
the voltage across the capacitors is at their nominal voltage and known state. Note that the adaptive pre-charge
system takes pre-charging time depending on the external voltages present on the circuit.
The output voltage may not rise monotonically during the pre-charge period.
Soft-start Operation
After the pre-charge phase is completed, the device enters soft-start mode and charges the output capacitor at
134mA typical value input current. It exits the state when the VOUT voltage has reached the PGOOD VOUT threshold.
The PGOOD pin can go high at the same time. Figure 8 shows a typical power-up sequence.
As the device goes through a soft-start sequence, a load current should not be applied to the device until the
PGOOD pin is high. If a load is connected before this, the device will not start up. If the output current is loaded,
VOUT may not reach the target during the soft-start phase. As a result, the system detects soft-start timeout, latches
off the device and then requires the EN pin to be toggled to restart. The soft-start timeout is 100ms typical value.
A similar situation can also happen if there is too much COUT capacitance.
PGOOD Operation
The power good pin is a bi-directional open drain pin. When the output voltage is above the PGOOD VOUT threshold,
the PGOOD pull-down FET is turned off to allow the external pull-up resistor to pull up the node. The PGOOD pin
must be pulled up externally. If another device or digital I/O is also pulling down on this pin, the MYC0409-NA
remains in soft-start mode, and high-power mode is not enabled. When MYC0409-NA allows PGOOD to be pulled
high, the charge pump is ready to support the full load current.
When multiple MYC0409-NAs are used in parallel, all their PGOOD pins must be connected. In this case, all
MYC0409-NAs must complete soft-start before PGOOD is asserted and full power operation is allowed. In the
event of a fault at one or more parallel MYC0409-NAs, the PGOOD pin will be pulled low by the faulted MYC0409NAs.
Note that the PGOOD pin of a disabled device will NOT be pulled low if the device is not enabled. In effect, if
EN=0, the PGOOD pin should be ignored. Table 7. Pin Description shows the PGOOD pin table and Figure 16.
PGOOD Sequence Diagram shows in figure.16. VOUT pre-biased condition would enable PGOOD function to pull
low if the part enabled.
VIN
VIN ≦ VTH_UVH
VIN > VTH_UVH
VIN > VTH_UVH
EN
X
LOW
HIGH
Table 8. PGOOD Pin Table
STATE
X
Shutdown
After Start-up and Normal (fault free) operation
Others
PGOOD
X(1)
HIGH(2)(3)(4)
HIGH(5)
LOW
Notes:
(1) If VIN≦ UVLO, the PGOOD should be ignored.
(2) It is pulled HIGH when the module is in stopped state shut-down.
(3) EN signal changes from HIGH to LOW (Shut-down period), it indicates Low for 60ms(Typical). After that, the PGOOD is pulled HIGH.
(4) In the case of PGOOD being pulled up by divided VOUT, it indicates Low.
(5) It indicates LOW during soft-start operation.
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UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Figure 16. PGOOD Sequence Diagram
Figure 17 shows an example of PGOOD Application Circuit. If there is not 3.3-5V rail, PGOOD can be pulled up
by divided VOUT. Using 100kohm and 47kohm with 1% tolerance to the VOUT dividing resistors can support wide VIN
range. Note that PGOOD voltage varies with VOUT voltage in this case.
Figure 17. PGOOD Application Circuit
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UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
External/Internal Clock Modes and SYNCSEL Pin
In most applications, the MYC0409-NA operates using an internal oscillator. Table 9 shows the SYNC pin table.
DETECTOR
GND
OPEN
(HI-Z)
Output
Table 9. SYNC Pin Table
SYNC
EFFECT OF FAULT
The internal clock is sent to the SYNC pin as an output.
An external clock can be applied to the sync input.
If no clock in, the internal clock is used.
Input
The charge pump is operated at a half frequency of the SYNC pin input/output clock. Because MYC0409-NA
internal components are optimized for efficiency with the internal oscillator frequency, injecting an external clock is
not recommended for single-unit applications. If configured to use an external clock (SYNCSEL=open circuit), and
the external clock stops or is not present for some reason, an internal watchdog detects the missing clock and
causes MYC0409-NA to swap back to use of the internal clock source. When the expected external clock source
resumes, the MYC0409-NA reverts to using the external clock.
When the SYNCSEL pin is tied to GND, the internal clock is present on the SYNC pin.
Since the SYNC pin is high impedance and can be affected by external noise, in the event that an external clock
out function is not being used in the application, it is recommended that the SYNCSEL pin is left to float, and the
SYNC pin is tied to GND by a resistor.
For parallel operation, SYNCSEL pin on one of the paralleled modules should be GND to provide the clock for the
others, the other paralleled modules should be left floating to receive the shared clock to get all synced up.
Protections (1)
MYC0409-NA is a high power device. To protect both systems, and the internal circuitry of MYC0409-NA, there
are multiple fault detection circuits built in. Table 10 shows a summary of the various protection modes.
Table 10. Protections
LATCHED OFF OR
AUTOMATIC RETRY
RESPONSE
TIME UNIT
Over temperature
Automatic retry
us
VIN under-voltage
Automatic retry
us
IOUT overcurrent
Automatic retry
us
IOUT short circuit
Latched off
us
Soft-start timeout
Latched off
us
PGOOD held low
Automatic retry
us
VOUT under-voltage
Automatic retry
us
DETECTOR
EFFECT OF FAULT
PGOOD goes low and the power stage switches off until the
temperature reduces under the hysteresis threshold. At this point,
the device automatically restarts. The device needs to restart into
no load to automatically restart.
PGOOD goes low and the charge pump is disabled until VIN returns
above the UVLO threshold and enabled. The device needs to
restart into no load to automatically restart.
If the load current exceeds the over-current limit, PGOOD goes low
and the charge pump is disabled for a certain period to cool down.
If the device is still over current after the cooldown period, after the
cooldown period it automatically restarts.
If the load current exceeds the short-current limit, the device is
immediately latched off and shuts down. EN must be toggled to
restart the device.
If VOUT does not reach the target voltage of VIN divided by 4 within
the soft start timeout period, the device shuts down and EN must
be toggled to restart it.
If the charge pump is operating at full power and if PGOOD is
pulled down externally, the device enters soft-start mode. If the
PGOOD pin is held low for less than the soft-start period, the
charge pump returns to full power operation. If the PGOOD pin is
held low for longer than the soft-start duration, the charge pump
completes a soft-start cycle before returning to normal operation
and should not be loaded during this period.
If the output of the device is under the VOUT threshold, the
PGOOD pin is pulled low. The device will switch off and enter a
cooldown period. After the cool down period the charge pump will
restart into soft start mode.
Note: (1) Protections are designed to prevent any damages or issues on the module as a best effort service. This will not guarantee safety or
no damages in your system. Murata highly recommends having the primary protection like adding Fuse and regarding those protections as
supportive functions in your systems.
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VIN Under-voltage and Thermal Shutdown Faults
The VIN under-voltage and thermal shutdown faults are grouped purely because the effect they have on the charge
pump is similar. If either of these faults is present when the charge pump is first enabled, the charge pump cannot
start up.
The charge pump holds in this state until both faults are clear, regardless of how long this takes.
VIN under-voltage and thermal shutdown faults are considered “persistent” as they will hold the charge pump
disabled until the fault clears.
In the case of VIN under-voltage, it is unlikely that the charge pump will be able to support the full load current
when VIN (and therefore VOUT too) is too low. Because it is not desirable for MYC0409-NA or for the load to operate
in this condition, the charge pump will hold off waiting for VIN to improve/recover.
An over-temperature fault is likely to occur only when MYC0409-NA is dissipating too much internal power, which
normally results from some other fault conditions such an overload condition. In the event of over-temperature,
MYC0409-NA may start to drift out of guaranteed performance specifications, which would be undesirable for the
system. To recover from over-temperature, the power dissipation in MYC0409-NA must be reduced to reduce the
internal temperature.
When VIN under-voltage or over-temperature fault is detected during normal operation, MYC0409-NA enters a
controlled shutdown sequence with an unlimited cool-down period. When the faults clear, the MYC0409-NA enters
a soft-start sequence.
IOUT Overcurrent Protection
Over-current protection operates by sensing the current being drawn from VIN. The over-current protection trips
when MYC0409-NA is operated outside the recommended operating conditions. Typically, the device trips when
the output current exceeds 10A typical. The over-current protection has two separate protection methods.
-
If the current exceeds the over current protection threshold of 10A typical, then when triggered, the device will
enter a cool-down period and after this automatically restart. During this time the PGOOD pin is pulled low.
-
If the current exceeds 15A typical, the device immediately shuts down and latches off. During this time, the
PGOOD pin is pulled low. To restart the device, the EN pin must be toggled.
MYC0409-NA reacts to over-current fault by entering a controlled shutdown sequence. The device is then latched
off until EN is toggled. After enable is toggled and the pre-charge is complete, MYC0409-NA enters a normal softstart sequence and attempts to restart. Note that some persistent fault conditions may prevent the charge pump
from restarting successfully, for example, in the event of a hard fault to GND at VOUT.
VOUT Under-voltage Protection
The VOUT under-voltage fault detector measures value at VOUT with the expected value derived from VIN/4. The
VOUT under-voltage fault is designed to be slow and represents an averaged value. The VOUT under-voltage flag
trips when VOUT goes below 80% of the target (VOUT_UVP).
The VOUT under-voltage detector trips when VOUT goes below 80% of the target voltage. It is important that external
components are chosen so that expected transient loads do not trip the VOUT_UVP threshold. In effect, the application
should ensure that the load dependency causes a less than 20% deviation from the nominal VOUT.
Soft-start Timeout
When MYC0409-NA first tries to supply power to the load, the power is limited by soft-start circuit. Using soft-start
has no significant side effects if the start-up is “normal”.
If MYC0409-NA starts up into a fault, the soft-start helps to manage the power being supplied to the fault as well
as limiting the power dissipation in MYC0409-NA. In normal, fault-free operation, the soft-start timeout should be
invisible if the soft-start current is able to ramp VOUT to the target voltage inside 100ms. In the event of a fault, the
soft-start timeout occurs when VOUT does not ramp to the target voltage in the expected time. In this case, the softstart timeout causes power to the load to be stopped and MYC0409-NA to enter a controlled shutdown sequence.
The device then latches off, and EN must be toggled to restart it.
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PGOOD Low Detection
In a stand-alone MYC0409-NA implementation, the PGOOD signal will likely have only one driver. When
MYC0409-NA is ready for full power, PGOOD goes high and stays high for as long as the single MYC0409-NA
remains enabled and fault-free.
In parallel operation, the PGOOD signal must be connected in a wired OR configuration with the other devices.
When all devices are ready for full power, the PGOOD signal goes high. In the event of a fault, the PGOOD signal
is pulled low and switches off all the parallel devices. EN must then be toggled to restart the devices.
Application Information
Charge Pump based DCDC converter is the high efficiency bus converter which doesn’t have the regulation
capability. Because of its architecture, there are some differences from conventional inductive buck converters.
And some of the behaviors may cause critical issues if you use inappropriate way although it is as same way as
the conventional buck converters.
Charge Pump Architecture Basics
Charge Pump is a capacitive voltage converter which is configured by plural of switches and capacitors like shown
in Figure 18. The drawing shows divide by four configurations.
Figure 18. Divide by Four Charge Pump Configuration
Charge pump usually has two main switch states. Our UltraCPTM series also have the two main switch states
shown in Figure 19-A and Figure 19-B.
Figure 19-A. Divide by Four Charge Pump Phase One Configuration
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Figure 19-B. Divide by Four Charge Pump Phase Two Configuration
During phase one, flying capacitor of C1 will be connected between VIN and VOUT. And the C2 and C3 will be
connected between VOUT and GND. In phase two, C1 and C2 will be connected between VOUT and GND. And the
C3 will be connected between VOUT and GND. Figure 20 shows these two states of capacitor connection and
charged voltage relationship. Once the charge pump finishing soft-start, each capacitor will have VIN/4, VIN*2/4 and
VIN*3/4 voltage. This voltage will be maintained to keep switching between the phase one and the phase two. To
improve the charge pump efficiency, increase of the flying capacitor capacitance works well. Also, minimize of
switch resistance and parasitic resistance works, too. Our UltraCPTM series has optimized CFLY, power switch
resistance and routing parasitic. Therefore, users wouldn’t need to care about such a detail.
Figure 20. Divide by Four Charge Pump Capacitor Connection
MYC0409-NA is based around a high efficiency, charge pump based DC-DC converter with an unregulated output
voltage. Because of the architecture, there are some important characteristics which are different from conventional
inductive buck converters. To avoid damage to the system, or the device, it is important to understand some of the
key architecture differences compared to conventional buck converters. For the details, please refer the section of
Charge Pump Architecture and Important Notice.
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Application Performance
Typical performance with the application board of Figure 26 are shown in Figure 21 to Figure 24. TA =25degC
VIN
VIN
VIN
VIN
VIN
VIN
VIN
VIN
Output Current IOUT [A]
Output Current IOUT [A]
VIN
VIN
Figure 22. Power Dissipation
VIN
VIN
(VOUT-VIN/4)/(VIN/4) [%]
Output Voltage VOUT [V]
Figure 21. Efficiency
VIN
VIN
VIN
VIN
Output Current IOUT [A]
Figure 23. VOUT Load Regulation
Output Current IOUT [A]
Figure 24. VOUT Drop Ratio
Application Schematic
An example of MYC0409-NA standalone schematic is shown in Figure 25. Please refer recommended circuit part
list shown in Table 1.
Figure 25. Application Schematic
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Application Circuit Part List
An Example of the standard components are shown in Table 11. Components must be chosen referring the system
requirement like Voltage, Temperature, etc.
REFERENCE
VALUE
CIN2
4.7uF
COUT
22uF x 2pcs
RPG
10kohm
CIN1
Table 11. Application Circuit Part List
DESCRIPTION
100uF
Electrolysis Capacitor (Optional)(1)
Input Capacitor
Ceramic capacitor, 4.7uF, 100V, ±10%, X7S
Output Capacitor
Ceramic capacitor, 22uF, 25V, ±20%, X7S
Pull-up Resistor for Power Good Indication
Chip resistor, 1/10W, ±5%
-
PART NUMBER
GRM31CC72A475KE11 (Murata)
GRM31CC71E226ME15 (Murata)
RK73B1ETTP103J (KOA)
(1) If there is a non-negligible parasitic impedance between the power supply and the converter, such as during
evaluation, the optional input capacitor "CIN1" may be required to reduce the impedance. The recommended
optional capacitor is an example. Please consider the optimum value for the case. This capacitor is usually an
aluminum electrolytic type. It isn't necessary to place the capacitor near the input terminal of the converter.
Application Board Example
All reference data on this datasheet are taken with this board.
Figure 26. Application Board Example
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Component Selection
Input Capacitor
The input capacitor is connected between VIN and GND. It is used to reduce the ripple on VIN. The input capacitor
should be placed as close to the module as possible to reduce any parasitic inductance effects. The voltage rating
of the capacitor needs to be as high as the absolute maximum voltage rating for the system and the effect of the
capacitor voltage coefficient should be considered to determine the effective capacitance value at the applied VIN.
Since the charge pump isn’t a regulator, ripple voltage on VIN will affect the output voltage.
Output Capacitor
The output capacitor is used to reduce the ripple on VOUT. The higher the capacitor values, the lower the ripple at
VOUT becomes. Increasing the output capacitor value will increase the soft-start duration and might push the module
to time out during soft-start. Please take account into this to consider additional COUT value of your system.
Following system’s input capacitance would be the COUT of MYC0409-NA.
Input Fuse
Certain applications and/or safety agencies may require fuses at the inputs of power conversion components.
Fuses should be also used when there is possibility of sustained input voltage reversal which is not current- limited.
For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer
must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in
compliance with the end-user safety standard.
Application Schematic with Secondary
An example of MYC0409-NA with secondary schematic is shown in Figure 27.
Figure 27. Application Schematic with Secondary
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Parallel Operation
MYC0409-NA can be run in parallel in a multi-device configuration to increase output power as shown in Figure 28.
In parallel operation mode, care and attention must be paid to some important things.
Current and Thermal Balance
As with standard inductive DC-DC converters, a paralleled charge pump also must be taken care of the
current/thermal balance. The MYC0409-NA provides divided voltage of the input voltage to its output. The output
voltage relates the input voltage and the output voltage isn’t regulated. Therefore, the charge pump provides natural
droop based on the equivalent output resistance (ROUT).
When the load applied to the paralleled charge pump modules, each output voltage of the modules starts to droop.
The voltage drop from the ideal output voltage (VIN/DIV) is decided by (ROUT + parasitic resistance)*IOUT. And the
load current of each module is decided by the relationship of the (ROUT + parasitic resistance). For the charge
pumps to load-share effectively, attention should be paid to the layout to reduce the parasitic resistance variation
of the input/output power tracks.
The MYC0409-NA is capable of up to 6A unless limited by other factors. Therefore, when in parallel operation
imbalance in the load sharing caused by parasitic impedances can result in one module current limiting before
another. This effect can restrict the total amount of power available to the system.
The power loss generated by the module results in heat rise in the module to maintain load sharing so that the
modules should share the same thermal structure.
Figure 28. Multi-module Current Sharing
Pin Connections for Parallel Operation
Pin connection limitation is slightly different from the single module operation. Please follow below instruction and
refer the Figure 29.
PGOOD output must be pulled up together and combined in a wire OR configuration. The load following the
charge pump should not be switched on until all PGOOD are high and the load should immediately be switched off
if any of the PGOOD outputs switch low after start up.
The SYNCSEL pin on one of the paralleled modules should be GND to provide the clock for the others, the other
paralleled modules should be left floating to receive the shared clock to get all synced up.
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Figure 29. Multi-module Application Circuit
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Charge Pump Architecture and Important Notice
MYC0409-NA uses multiple, low impedance, switches to take advantage of the higher energy density available in
capacitors (compared to inductors) to transfer power. The keys to optimize charge pump efficiency include (i)
reducing charge redistribution losses and (ii) minimizing thermal losses. MYC0409-NA reduce the charge
redistribution loss with patented ‘almost loss-less’ architectures. The thermal losses are minimized by using lower
voltage rated (internal) power FETs which take advantage of the reduced voltage as the input supply gets divided.
These two key features make MYC0409-NA very efficient. In exchange for the high efficiency, some of the
differences to conventional buck converters need to be recognized to avoid permanent damage to the device.
Figure 30(A) shows an inductive regulator called a buck converter. There is an inductor between switching node
to VOUT, so it would be prevented transient change of current when a hard short happened.
For Figure 30(B), it would be high di/dt condition with a hard short because MYC0409-NA does not have a large
inductor but has low impedance of power FETs. In general, inductance would be reduced the current slope of
inductor and impedance of power FETs would be reduced peak current. Therefore, “Hard Short Circuit Condition”
is written as bellow.
VIN
VIN
VOUT
VOUT
(A) Inductive Regulator
(B)
Charge Pump
Figure 30. Inductive Regulator and Charge Pump
Hard Short Circuit Condition
MYC0409-NA is a capacitive DC-DC converter and has low inductance at the output to optimize its efficiency. As
a result of the low output inductance, a hard short at this product output can result in a di/dt condition which can be
much higher than a conventional, inductive, buck converter would allow.
MYC0409-NA has a built-in output current protection. However, hard output short circuits with very low impedance
may cause permanent damage to the device and should be avoided. If such faults needed to be considered, it may
be necessary to add primary protection (external to the device) to ensure adequate protection of the device and
the condition might be varied over environment and use cases.
Soft-start and Capacitors Charge Balancing
The charge pump is an open-loop capacitive DC-DC converter. The output voltage is generated using “flying”
capacitors (“CFLY") which move charge from one voltage level to another. The voltage across the flying capacitors
in normal operation will be limited to VOUT. The voltage balancing between and across the flying capacitors is
important to maintain stability. Murata’s charge pump has several internal states which specifically enhance stability
including “pre-charge” and “soft-start”. During pre-charge, each of the CFLY capacitors is charged to the
appropriate DC voltage bias level (depending on VOUT) to ensure a balanced state at start-up. During soft-start, the
charge pump starts switching with a controlled current (134mA typical input current) to ramp VOUT to the target
voltage (depending on VIN). The controlled start-up avoids inrush current and EMI issues during turn on and ensures
VOUT reaches the PGOOD VOUT threshold before full power operation is enabled. As a further safety measure the
soft-start time is also monitored to ensure the system does not contain any unexpected leakage paths (like VOUT or
CFLY shorts). As a result of the limited soft-start current, the system will not support starting up into a full power
load. The PGOOD pin will indicate the system is ready for full load (when soft-start has finished, and VOUT has
reached the PGOOD VOUT threshold). The soft-start timeout protection also means that the maximum output
capacitance should be limited for reliable startup. Increasing COUT beyond the recommended level may mean that
the charge pump fails to start-up.
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Current limited soft-start consumes larger power than standard operation. Therefore, temperature rising during the
soft-start condition needs to be cared.
Reverse Direction Current Flow and Operation
MYC0409-NA is designed to divide the input voltage by Four. Parasitic diodes, which are parts of the internal
power switches, are based on power flow from VIN to VOUT. To avoid forward bias of the internal diodes, and
potentially damaging high current levels, reverse power flow (from VOUT to VIN) must be avoided. Inductive buck
converters are protected from very high di/dt conditions by the filtering effect of the power inductor. MYC0409-NA
has much lower inductance (to optimize efficiency) and has very low impedance internal switches (and reverse
diodes). Reverse power flow may be triggered when VOUT is greater than VIN/4.
MYC0409-NA is designed to safely start up into a pre-biased output if the condition VOUT VIN/4.
One condition which could cause reverse power flow is a rapid decrease in the VIN voltage level while MYC0409NA remains enabled. It may also result in an unexpected shut-down. To avoid them, VIN should not be reduced
rapidly while MYC0409-NA is enabled. Similarly reducing VIN (while EN=0) and then re-enabling again with lower
VIN could result in reverse power flow if the VOUT capacitor still holds the previous VOUT level.
Input Voltage Transient
MYC0409-NA over-current protection operates by sensing the current being drawn from VIN. A rapid increase in
VIN generates voltage difference between the input and the CFLY, resulting in excessive input inrush current. It
may result in an unexpected shut-down. To avoid it, VIN should not be increased rapidly while MYC0409-NA is
enabled.
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Packaging Information
This section provides packaging data including the moisture sensitivity level, package drawing, package marking
and tape-and-reel information.
Package Drawing
9.5
11.5
TOP VIEW
BOTTOM VIEW
Unit: mm
Tolerances
±0.15 mm
2.1max.
SIDE VIEW
Figure 31. Package Overview
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Figure 32. Package Foot Print and The Dimension (Top View)
Recommended Board Land Pattern
Figure 33. Recommended Board Land Pattern and The Dimension (Top View)
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Tape and Reel Specification
Tape Dimension
Figure 34. Tape Dimension
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Reel Dimension
25.5±1.0
φ100±1
φ330±2
A
2.0±0.5
Indication
φ21.0±0.8
φ13.0±0.5
Portion A
Unit:mm
Figure 35. Reel Dimension
Module Orientation in Tape
Figure 36. Module Orientation in Tape
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Taping Specification
Figure 37. Taping Specification
1. The adhesive strength of the protective tape is within 0.3-1.0N.
2. Each reel contains 400 or 100pcs.
3. Each reel set in moisture-proof packaging because of MSL 3.
4. No vacant pocket in “Module on tape” section.
5. The reel is labeled with Murata part number and quantity.
6. The color of reel is not specified.
Soldering Guidelines
Murata recommends the specifications below when installing the converter. These specifications vary depending
on solder types. Exceeding these specifications may cause damage to the product. Your production environment
may differ therefore please thoroughly review these guidelines with your process engineers. This product can be
reflowed twice.
Table 12. Reflow Solder Operations for Surface-mount Products
For Sn/Ag/Cu based solders:
Preheat Temperature
Time Over Liquidus.
Maximum Peak Temperature
Cooling Rate
For Sn/Pb based solders
Preheat Temperature
Time Over Liquidus.
Maximum Peak Temperature
Cooling Rate
Less than 1degC per second
45 to 75 seconds
260degC
Less than 3degC per second
Less than 1degC per second
60 to 75 seconds
235degC
Less than 3degC per second
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Specifications are subject to change without notice.
Document Number: D90DH-00151 / Export Control Code: X0863
MYC0409-NA Rev.A05 (Oct.-2023)
Page 30 of 34
UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Figure 38. Reflow Profile for Sn/Ag/Cu Solder
Revision History
REV
DATE
A02
APR-2022
A03
JUL-2022
A04
OCT-2022
A05
OCT-2023
DESCRIPTION
Updated Notes (3).
Updated Pre-charge Operation.
Updated External/Internal Clock Modes and SYNCSEL Pin.
Updated Parallel Operation.
Updated Electrical Characteristics Table.
Updated Enable (EN).
Add Performance Specifications Summary
Add Part Number Structure
Add Soldering Guidelines
Add Scope
Add Fail-safe function
Updated Limitation of Applications
Update Top Marking Specification
Add Output Current (Start-up) in Electrical Characteristics Table
PAGE NUMBER
P6
P13
P15
P22
P5
P13
P3
P3
P31
P33
P34
P33
P3
P5
http://www.murata.com/products/power
Copyright ©2023 Murata Manufacturing Co., Ltd. All rights reserved.
Specifications are subject to change without notice.
Document Number: D90DH-00151 / Export Control Code: X0863
MYC0409-NA Rev.A05 (Oct.-2023)
Page 31 of 34
UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Notices
Scope
This specification (or This datasheet) is applied to MYC0409-NA.
- Specific applications: Consumer Electronics, Industrial Equipment
CAUTION
Limitation of Applications
The products listed in the datasheet (hereinafter the product is called the “Product”) are designed and
manufactured for applications specified in the specification or the datasheet. (hereinafter called the “Specific
Application”). We shall not warrant anything in connection with Products including fitness, performance,
adequateness, safety, or quality, in the case of applications listed in from (1) to (11) written at the end of this
precautions, which may generally require high performance, function, quality, management of production or
safety. Therefore, Product shall be applied in compliance with the specific application.
We disclaim any loss and damages arising from or in connection with the products including but not limited
to the case such loss and damages caused by the unexpected accident, in event that (i) the product is applied
for the purpose which is not specified as the specific application for the product, and/or (ii) the product is
applied for any following application purposes from (1) to (11) (except that such application purpose is
unambiguously specified as specific application for the product in our catalog specification forms, datasheets,
or other documents officially issued by us*).
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (such as vehicles, trains, ships)
(7) Traffic control equipment
(8) Disaster prevention/security equipment
(9) Industrial data-processing equipment
(10) Combustion/explosion control equipment
(11) Equipment with complexity and required reliability equivalent to the applications listed in the above
For exploring information of the Products which will be compatible with the particular purpose other than
those specified in the datasheet, please contact our sales offices, distribution agents, or trading
companies with which you make a deal, or via our web contact form.
Contact form: https://www.murata.com/contactform
*We may design and manufacture particular Products for applications listed in (1) to (11). Provided that,
in such case we shall unambiguously specify such Specific Application in the specification or the
datasheet without any exception. Therefore, any other documents and/or performances, whether exist
or non-exist, shall not be deemed as the evidence to imply that we accept the applications listed in (1)
to (11).
http://www.murata.com/products/power
Copyright ©2023 Murata Manufacturing Co., Ltd. All rights reserved.
Specifications are subject to change without notice.
Document Number: D90DH-00151 / Export Control Code: X0863
MYC0409-NA Rev.A05 (Oct.-2023)
Page 32 of 34
UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Fail-safe function
Be sure to add an appropriate fail-safe function to your finished product to prevent secondary damage
in the unlikely event of an abnormality function or malfunction in our product.
Please connect the input terminal by right polarity. If you mistake the connection, it may break the DCDC converter. In the case of destruction of the DC-DC converter inside, input over-current may flow.
Please add a diode and fuse as following to protect them.
fuse
+
diode
+
+
IN
OUT
+
Load
-
-
Please select diode and fuse after confirming the operation.
Figure 39. Circuit example with a diode and fuse
Note
1. Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2. You are requested not to use our product deviating from the reference specifications.
3. If you have any concerns about materials other than those listed in the RoHS directive, please
contact us.
4. Be sure to provide an appropriate fail-safe function on your product to prevent a second damage
that may be caused by the abnormal function or the failure of our product.
5. Please don’t wash this product under any conditions.
Product Specification
Product Specification in this datasheet are as of Sep. 2023. Specifications and features may change in any
manner without notice. Please check with our sales representatives.
Contact Form
https://www.murata.com/contactform?Product=Power%20Device
http://www.murata.com/products/power
Copyright ©2023 Murata Manufacturing Co., Ltd. All rights reserved.
Specifications are subject to change without notice.
Document Number: D90DH-00151 / Export Control Code: X0863
MYC0409-NA Rev.A05 (Oct.-2023)
Page 33 of 34
UltraCP™ MYC0409-NA
Document Category: Datasheet
Ultra-thin High Efficiency 72W DCDC Converter Module
Disclaimers
The information described in this data sheet was carefully crafted for accuracy. However this product is based
on the assumption that it will be used after thoroughly verifying and confirming the characteristics and system
compatibility. Therefore, Murata is not responsible for any damages caused by errors in the description of the
datasheet.
Murata constantly strives to improve the quality and reliability of our products, but it is inevitable that
semiconductor products will fail with a certain probability. Therefore, regardless of whether the use conditions
are within the range of this data sheet, Murata is not responsible for any damage caused by the failure of this
product., (for example, secondary damage, compensation for accidents, punitive damage, loss of opportunity,
and etc.) Also, regardless of whether Murata can foresee the events caused by the failure of our product,
Murata has no obligations or responsibilities.
The buyer of this product and developer of systems incorporating this product must analyze, evaluate, and
make judgements at their own risk in designing applications using this product. The buyer and the developer
are responsible for verifying the safety of this product and the applications, and complying with all applicable
laws, regulations, and other requirements.
Furthermore, the buyer and developer are responsible for predicting hazards and taking adequate safeguards
against potential events at your own risk in order to prevent personal accidents, fire accidents, or other social
damage. When using this product, perform thorough evaluation and verification of the safety design designed
at your own risk for this product and the application.
Murata assumes that the buyer and developer have the expertise to verify all necessary issues for proper use
of the product as described above and to take corrective action. Therefore, Murata has no liability arising out
of the use of the product. The buyer and developer should take all necessary evaluations, verifications,
corrective actions and etc., in your own responsibility and judgment.
This data sheet does not guarantee or grant any license to the information, including patents, copyrights, and
other intellectual property rights, of the Murata or third parties. Regardless of whether the information
described in this datasheet is express or implied, Murata does not take any responsibility or liability for any
claims, damages, costs, losses, etc. relating to intellectual property rights or other rights from third parties due
to the use of these information.
Patent Statement
Murata products are protected under one or more of the U.S. patents.
Copyright and Trademark
©2023 Murata Manufacturing Co., Ltd. All rights reserved.
!
This product is subject to the following operating requirements
and the Life and Safety Critical Application Sales Policy:
Refer to: https://power.murata.com/en/requirements
Murata Manufacturing Co., Ltd makes no representation that the use of its products in the circuits described
herein, or the use of other technical information contained herein, will not infringe upon existing or future
patent rights. The descriptions contained herein do not imply the granting of licenses to make, use,
or sell equipment constructed in accordance therewith. Spec and cautions are subject to change
without notice.
http://www.murata.com/products/power
Copyright ©2023 Murata Manufacturing Co., Ltd. All rights reserved.
Specifications are subject to change without notice.
Document Number: D90DH-00151 / Export Control Code: X0863
MYC0409-NA Rev.A05 (Oct.-2023)
Page 34 of 34