NFM21PC105B1A3D

Chip EMIFIL®Chip 3-terminal Capacitor for Large Current for General NFM21PC105B1A3_ (0805, 1uF, DC10V) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip EMIFIL®Chip 3-terminal Capacitor for Large Current used for General Electronic equipment. 　　 2.MURATA Part NO. System (Ex.) NFM 21 (1)L/W Dimensions PC (2)Features 105 B (3)Nominal Capacitance 1A (4)Temperature (5)DC Rated Characteristics Voltage 3 (6)Electrode D (7)Packaging Code 3. Type & Dimensions a)Equivalent Circuit (1)-1 L (1)-2 W i j 2.0±0.2 1.25±0.1 0.6±0.2 0.25±0.2 T e 0.85±0.1 0.3±0.2 (Unit:mm) g 0.4±0.2 4.Rated value (3) Nominal Capacitance Capacitance Tolerance 1 uF ±20 % (5) DC Rated Voltage Rated Current (mA) DC Resistance DC 10 V 4A(DC) 20mΩmax. 500MΩmin. Insulation Resistance Specifications and Test Methods (Operating /Storage Temp. Range) -40 to 85 °C / -55 to 125 °C 5.Package mark (7) Packaging Packaging Unit D f180mm Reel PAPER W8P4 4000 pcs./Reel Product specifications in this catalog are as of Mar.3,2016,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and !Cautions first. NFM21PC105B1A3-01 1 ■SPECIFICATIONS AND TEST METHODS Electrical Performance No Item 1 Capacitance (Cap.) Specification Shown in Rated value. Test Method Frequency : 1.0±0.1kHz Voltage : 1±0.2V(rms) Voltage : Rated Voltage Time : 2 minutes max. 2 Insulation Resistance(I.R.) 3 DC Resistance 4 Withstanding Voltage Measured with 100mA max. Products shall not be damaged. Test Voltage : Rated Voltage x 300% Time : 1 to 5 s Charge Current : 50 mA max. 5 Operating Temperature Shown in Rated value. 6 Storage Temperature Includes self-heating Standard Testing Condition < Unless otherwise specified > Temperature : Ordinary Temp. / 15 °C to 35 °C Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH) JEMCPS-02215C 2 < In case of doubt > Temperature: 20 °C ± 2 °C Humidity: 60 %(RH) to 70 %(RH) Atmospheric pressure: 86 kPa to 106 kPa ■SPECIFICATIONS AND TEST METHODS Mechanical Performance No Item 1 Appearance and Dimensions Specification Appearance:No defects or abnormalities. Dimensions:Within the specified dimensions. Test Method Appearance:Visual inspection. Dimensions:Using calipers. 2 Solderability Electrodes shall be at least 90% covered with new solder coating. Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150±10°C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 ± 3°C Immersion Time : 3±1 s Immersion and emersion rates : 25mm / s 3 Resistance to soldering heat Meet Table 1. Table 1 Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150±10°C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 ± 5°C Immersion Time : 10 ± 1 s Immersion and emersion rates : 25mm / s Initial values : measured after heat treatment (150+0 / -10 °C,1hour) and exposure in the room condition for 48±4 hours. Then measured after exposure in the room condition for 48± 4 hours. Appearance Cap. Change I.R. DC Resistance 4 Bending Strength No damaged Within ±7.5% Meet the initial rated value. 0.05 max. Meet Table 2. It shall be soldered on the glass-epoxy substrate (100×40×1.0mm). Deflection : 2 mm Keeping Time : 30 s Pressure jig Table 2 Appearance Cap. Change DC Resistance No damaged Within ±7.5% R230 0.05max. F Deflection 45 45 Product (in mm) 5 Drop Products shall be no failure after tested. It shall be dropped on concrete or steel board. Height : 75 cm Method : Free fall Attitude from which the product is dropped : 3 directions The Number of Time : 3 times for each direction (Total 9 times) 6 Bonding Strength The electrodes shall be no failure after tested. It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 9.8 N Applying Time : 30 s 1.0 0.8 0.6 7 Vibration Meet Table 3. Table 3 Appearance Capacitance DC Resistance JEMCPS-02215C No damaged Meet the initial rated value. 0.05max. 3 1.6 (in mm) It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 55 to 10Hz for 1 minute Double Amplitude : 1.5 mm Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) Preconditioning : Heat treatment (150+0 / -10 °C,1hour) ■SPECIFICATIONS AND TEST METHODS Environment Performance It shall be soldered on the glass-epoxy substrate. No Item Specification 1 Temperature Cycling Meet Table 1. 2 Humidity Meet Table 4. Table 4 Appearance Cap. Change I.R. DC Resistance Test Method 1 Cycle 　 1 step : Minimum Operating Temperature +0 / -3 °C / 30+3 / -0 min 　 2 step : Room Temperature / within 3 min 　 3 step : Maximum Operating Temperature +3 / -0 °C / 30 +3 / -0 min 　 4 step : Room Temperature / within 3 min Total of 10 cycles Initial values : measured after heat treatment(150+0 / -10°C ,1hour) and exposure in the room condition for 48±4 hours. Then measured after exposure in the room condition for 48± 4 hours. If it’s doubt, the mesuring has to be done after 1 hours curing at 150+0 / -10°C and 48±4 hours storage. Temperature : 40±2°C Humidity : 90 to 95%(RH) Time : 500+24 / -0 hours Initial values: measured after heat treatment (150+0 / -10 °C , 1hour) and exposure in the room condition for 48±4 hours. Then measured after exposure in the room condition for 48±4 hours. If it’s doubt, the mesuring has to be done after 1 hours curing at 150+0 / -10°C and 48±4 hours storage. No damaged Within ±12.5% 50·F min. 0.05max. 3 Heat Life JEMCPS-02215C Temperature : Maximum Operating Temperature ± 2 °C Test Voltage : Rated Voltage x 200% Charge Current : 50 mA max. Time : 1000+48 / -0 hours Initial values: measured after heat treatment (150+0 / -10 °C , 1hour) and exposure in the room condition for 48±4 hours. Only NFM21PC475B1A3, measured after voltage treatment(Maximum Operating Temperature±3°C, Rated Voltage ×200%, 1hour) and exposure in the room condition 48±4 hours. Then measured after exposure in the room condition for 48±4 hours. If it’s doubt, the mesuring has to be done after 1 hour curing at 150+0 / -10°C and 48±4 hours storage. 4 PACKAGING NFM21 Type 1. Appearance and Dimensions (8mm-wide paper tape) (in mm) 2. Specification of Taping (1) Packing quantity (standard quantity) 4000 pcs. / reel (2) Packing Method Products shall be packaged in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Base tape and Top tape The base tape and top tape have no spliced point. (5) Cavity There shall not be burr in the cavity. (6) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 3. Pull Strength of Top Tape and Bottom Tape 5N min. 4. Peeling off force of top tape 0.1N to 0.6N (minimum value is typical) Speed of Peeling off : 300 mm / min Top tape 165 to 180 degree F Bottom tape Base tape 5. Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. Leader Trailer 2.0±0.5 160 min. Label 190 min. 210 min. Empty tape Top tape f 13.0±0.2 1 f 60± 0 f 21.0±0.8 9± 10 Direction of feed 13±1.4 (in mm) 0 f 180± 3 JEMCPP-02232A 5 ! NOTE 1. Mounting density Add special attention to radiating heat of products when mounting this product near the products with heating. The excessive heat by other products may cause deterioration of insulation resistance and excessive heat at this product, resulting in a fire. 2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. 　(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment 　 (5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment 　 (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment 　 (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above JEMCPC-02250A 6 Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 1. Flux and Solder Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water-soluble flux. Other flux (except above) Please contact us for details, then use. Use Sn-3.0Ag-0.5Cu solder Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance. Solder 2. Note for Assembling < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. 3. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. [Products direction] a b Products shall be located in the sideways 　 direction (Length:aC>B≒D. D Slit Length:a b a 4. Pre-heating Temperature Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be limited to 100°C max. to avoid the heat stress for the products. 1.9 0.8 0.6 5. Reflow Soldering 　　　　　　　　　　　　　　　• Standard printing pattern of solder paste. 1) Soldering paste printing for reflow • Standard thickness of solder paste: 100µm to 150µm. • Use the solder paste printing pattern of the right pattern. • For the resist and copper foil pattern, use standard land dimensions. 0.6 1.4 2.6 (in mm) 2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (°C) 260°C 245°C±3°C 220°C 230°C Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile JEMCPC-02250A Limit Profile Pre-heating 150°C ~ 180°C , 90s ± 30s Heating above 220°C , 30s ~ 60s above 230°C , 60s max. Peak temperature 245°C ± 3°C 260°C , 10s Cycle of reflow 2 times 2 times 7 Notice 6. Reworking with Soldering iron The following conditions shall be strictly followed when using a soldering iron. • Pre-heating : 150°C, 1 min • Soldering iron output : 30W max. • Tip temperature : 350°C max. • Tip diameter : φ3mm max. • Soldering time : 3(+1,-0) s • Times : 2times max. Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic material due to the thermal shock. 7. Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Upper Limit Recommendable Recommendable t 1/3T  t T(T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Excessive solder volume may cause the failure of mechanical or electrical performance. 8. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA)) (2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Cleaner 　　Isopropyl alcohol (IPA) 2. Aqueous agent 　　PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 9. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 10. Resin coating The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 11. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. 　　　　　　Bending JEMCPC-02250A 　　　　　　　　　　　　　　　　 　　　　　Twisting 8 Notice 12. Standard Land Dimensions The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground. Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged according to the figure to reinforce the ground-pattern. < Standard land dimensions for reflow > ･Side on which chips are mounted 2.3 1.9 0.6 0.8 Small diameter thru hole f 0.4 0.6 Resist 1.4 Copper foil pattern 2.6 No pattern (in mm) 13. Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition ・Products should be stored in the warehouse on the following conditions. Temperature: -10 to +40°C Humidity: 15 to 85% relative humidity No rapid change on temperature and humidity ・Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ・Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. JEMCPC-02250A 9 ! NOTE (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the agreed specifications. (3) We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents. Therefore, if your technical documents as above include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement liability clause, they will be deemed to be invalid. JEMCPC-02250A 10