This product complies with the RoHS Directive (EU 2002/95/EC).
Transistors
2SA1806G
Silicon PNP epitaxial planar type
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For high speed switching
■ Package
• High speed switching
• Low collector-emitter saturation voltage VCE(sat)
• SS-Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing
• Code
SSMini3-F3
• Marking Symbol: AK
• Pin Name
1. Base
2. Emitter
3. Collector
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■ Features
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
−15
V
Collector-emitter voltage (Base open)
VCEO
−15
V
Emitter-base voltage (Collector open)
VEBO
−4
V
Collector current
IC
−50
mA
Peak collector current
ICP
−100
mA
Collector power dissipation
PC
125
mW
Junction temperature
Tj
125
°C
Storage temperature
Tstg
−55 to +125
°C
■ Electrical Characteristics Ta = 25°C ± 3°C
Symbol
Collector-base cutoff current (Emitter open)
ICBO
IEBO
tin
Emitter-base cutoff current (Collector open)
Conditions
ue
Parameter
nc
Transition frequency
e/
Collector-emitter saturation voltage
Max
Unit
VCB = −8 V, IE = 0
− 0.1
µA
VCE = −3 V, IC = 0
− 0.1
µA
150
VCE = −1 V, IC = −10 mA
50
hFE2
VCE = −1 V, IC = −1 mA
30
VCE(sat)
IC = −10 mA, IB = −1 mA
on
Di
sc
Forward current transfer ratio
Min
hFE1
*
VCB = −10 V, IE = 10 mA, f = 200 MHz
fT
Typ
− 0.1
800
− 0.2
V
1 500
MHz
Cob
VCB = −5 V, IE = 0, f = 1 MHz
1
pF
Turn-on time
ton
Refer to the switching time
12
ns
Turn-off time
toff
measurement circuit
20
ns
Storage time
ts
19
ns
Pl
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Collector output capacitance
(Common base, input open circuited)
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank
Q
R
hFE1
50 to 120
90 to 150
Ranking is not given for any product.
Publication date: May 2007
SJC00381AED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
2SA1806G
Switching time measurement circuit
ton , toff Test circuit
0.1 µF
VBB = −10 V VCC = −3 V
62 Ω
VOUT
2 kΩ
52 Ω
140
508 Ω
0.1 µF
VIN
30 Ω
VOUT
34 Ω
51 Ω
120
100
80
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51 Ω
Collector power dissipation PC (mW)
VCC = −1.5 V
VBB
VIN
PC Ta
tstg Test circuit
10%
VIN
90%
ton
VIN = 9.8 V
VBB = −8.0 V
Collector-emitter saturation voltage VCE(sat) (V)
Collector current IC (mA)
−500 µA
−400 µA
−50
−300 µA
−40
−200 µA
−30
−100 µA
−20
−10
−4
−6
−8
−10
IC / IB = 10
−1.0
Ta = 75°C
−25°C
− 0.1
25°C
− 0.01
−1
nc
Ta = 75°C
te
na
140
25°C
120
−10
−100
−1 000
Collector current IC (mA)
80
−25°C
60
40
20
0
− 0.1
−1
−10
Collector current IC (mA)
2
Cob VCB
10
f = 1 MHz
Ta = 25°C
1
Pl
100
M
ain
Forward current transfer ratio hFE
160
e/
VCE = −1 V
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
on
Di
sc
hFE IC
180
20
40
60
80
100
120 140
VBE(sat) IC
tin
Collector-emitter voltage VCE
−12
(V)
−10
ue
−2
0
VCE(sat) IC
IB = −600 µA
0
0
Ambient temperature Ta (°C)
Ta = 25°C
−60
0
20
VIN = 9.0 V
IC VCE
−80
−70
40
tstg
toff
VIN = −5.8 V
VBB = Ground
90%
90%
VOUT
10%
60
−100
0.1
0
2
4
6
8
10 12 14 16 18
Collector-base voltage VCB (V)
SJC00381AED
−10
Base-emitter saturation voltage VBE(sat) (V)
90%
VOUT
0
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VIN
0
−1
− 0.1
− 0.1
IC / IB = 10
Ta = −25°C
75°C
25°C
−1
−10
−100
Collector current IC (mA)
−1 000
+0.05
−0.03
3
±0.05
+0.05
1
2
(0.50)
(0.50)
0.13 −0.02
+0.05
1.00 ±0.05
±0.05
0.85
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−0.03
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This product complies with the RoHS Directive (EU 2002/95/EC).
SSMini3-F3
Unit: mm
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
Pl
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.