This product complies with the RoHS Directive (EU 2002/95/EC).
Transistors
2SD2345G
Silicon NPN epitaxial planar type
For low-frequency amplification
■ Package
• High forward current transfer ratio hFE
• Low collector-emitter saturation voltage VCE(sat)
• High emitter-base voltage (Collector open) VEBO
• Low noise voltage NV
• Code
SSMini3-F3
• Marking Symbol: 1Z
• Pin Name
1: Base
2: Emitter
3: Collector
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■ Features
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
50
V
Collector-emitter voltage (Base open)
VCEO
40
V
Emitter-base voltage (Collector open)
VEBO
Collector current
IC
Peak collector current
ICP
Collector power dissipation
PC
Junction temperature
Tj
Storage temperature
Tstg
15
V
50
mA
100
mA
125
mW
125
°C
−55 to +125
°C
Parameter
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■ Electrical Characteristics Ta = 25°C ± 3°C
Symbol
Conditions
Min
Typ
Max
Unit
VCBO
IC = 10 µA, IE = 0
Collector-emitter voltage (Base open)
VCEO
IC = 1 mA, IB = 0
40
V
Emitter-base voltage (Collector open)
VEBO
IE = 10 µA, IC = 0
15
V
ICBO
VCB = 20 V, IE = 0
100
nA
ICEO
VCE = 20 V, IB = 0
1
µA
hFE
VCE = 10 V, IC = 2 mA
2 000
VCE(sat)
IC = 10 mA, IB = 1 mA
0.05
0.20
V
VCB = 10 V, IE = −2 mA, f = 200 MHz
120
an
Collector-base voltage (Emitter open)
en
Collector-base cutoff current (Emitter open)
int
Collector-emitter cutoff current (Base open)
Ma
Forward current transfer ratio *
Collector-emitter saturation voltage
Transition frequency
fT
50
V
400
MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank
R
S
T
hFE
400 to 800
600 to 1 200
1 000 to 2 000
Publication date: June 2007
SJC00408AED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
2SD2345G
PC Ta
IC VCE
150
IC VBE
160
120
VCE = 10 V
125
25°C
100
75
Collector current IC (mA)
Collector current IC (mA)
100
120
IB = 100 µA
90 µA
80 µA
70 µA
60 µA
50 µA
100
80
Ta = 75°C
50
30 µA
20 µA
20
60
60
0
80 100 120 140 160
Forward current transfer ratio hFE
Ta = 75°C
−25°C
1
10
100
an
en
Noise voltage NV (mV)
int
Ma
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
5
0
900
−25°C
600
300
4
3
2
10
0.8
1.2
200
150
100
50
0
− 0.1
100
Collector current IC (mA)
−1
−10
10
Collector-base voltage VCB (V)
100
NV IC
NV VCE
100
Rg = 100 kΩ
80
Rg = 100 kΩ
60
22 kΩ
40
5 kΩ
0
0.01
−100
Emitter current IE (mA)
60
22 kΩ
40
5 kΩ
20
20
1
2.0
VCB = 10 V
Ta = 25°C
IC = 1 mA
GV = 80 dB
Function = FLAT
Ta = 25°C
1
0
1.6
fT I E
250
25°C
1
0.4
Base-emitter voltage VBE (V)
VCE = 10 V
100 V = 10 V
CE
GV = 80 dB
Function = FLAT
T = 25°C
80 a
IE = 0
f = 1 MHz
Ta = 25°C
6
0
12
Ta = 75°C
0
0.1
Cob VCB
7
10
1 200
ce
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Collector current IC (mA)
8
8
1 500
ue
1
0.01
0.1
6
hFE IC
10
25°C
4
1 800
IC / IB = 10
0.1
2
Collector-emitter voltage VCE (V)
VCE(sat) IC
100
0
Transition frequency fT (MHz)
40
20
10 µA
Noise voltage NV (mV)
20
40
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Ambient temperature Ta (°C)
Collector-emitter saturation voltage VCE(sat) (V)
40 µA
40
25
0
2
60
−25°C
80
M
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Collector power dissipation PC (mW)
Ta = 25°C
140
0.1
Collector current IC (mA)
SJC00408AED
1
0
1
10
100
Collector-emitter voltage VCE (V)
+0.05
0.85 −0.03
3
±0.05
0.26 −0.02
+0.05
2
(0.50)
0.13 −0.02
1.00 ±0.05
ea
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(0.50)
0.70 −0.03
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1.60 −0.03
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This product complies with the RoHS Directive (EU 2002/95/EC).
SSMini3-F3
Unit: mm
+0.05
+0.05
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.