AXF6A6412

For board-to-FPC A35P High Current Connectors • Rated current Number of power contacts Max. 4 pins Max. 8 pins New Power contact 1.5 A/pin 1.25 A/pin Rated current Signal contact Total 0.5 A/pin Max. 12 A Number of power contacts: 1.5 A/pin x 4 pins or 1.25 A/pin x 8 pins can be used m Socket 0m 2. m 5m 2. 3. Increased design freedom (pin layout and multiple high current lines) Any pin contact can be used as a power contact. Any layout is possible for the power supply line. Header Sample layout RoHS compliant 1.5A 1.5A FEATURES 1. High current rating 5 A (using 1.25 A/pin × 8 pins) 2. Support of high current means number of pins can be reduced and design with space saving requirements. • Reduced space with decrease in number of pins used for power contacts. Example: Power line Max. 3 A (Pitch: 0.35 mm) Previous product Required number of pins 3 A: 0.25 A/pin × 24 pins 3A (12 pins) A35P 3A (2 pins) Max. 0.25 A/pin 4. Terminal pitch: 0.35 mm, width: 2.5 mm and Mated height: 0.8 mm • Connections between PC boards where there is a tendency for increased number of pins with the increase in charging current. • Connection section of all modules where power consumption increases. Max. 0.5 A/pin Space reduction 3A (2 pins) 1.5A APPLICATIONS Max. 0.25 A/pin 3A (12 pins) 1.5A * For 1.5 A/pin power contact Other pin contacts can be up to max. 0.5 A (total of pin is max. 12 A). Required number of pins 3 A: 1.5 A/pin × 4 pins Max. 0.5 A/pin ORDERING INFORMATION AXF 1 2 5A: Socket 6A: Header Number of pins (2 digits) Mated height / 1: 0.8 mm Functions 2: Without positioning bosses –1– ACCTB81E 201602-T High current connectors A35P (0.35mm pitch) PRODUCT TYPES Mated height Number of pins 0.8mm 10 12 16 20 24 30 34 40 44 50 54 60 64 70 80 100 Part number Socket AXF5A1012 AXF5A1212 AXF5A1612 AXF5A2012 AXF5A2412 AXF5A3012 AXF5A3412 AXF5A4012 AXF5A4412 AXF5A5012 AXF5A5412 AXF5A6012 AXF5A6412 AXF5A7012 AXF5A8012 AXF5A0012 Packing Header AXF6A1012 AXF6A1212 AXF6A1612 AXF6A2012 AXF6A2412 AXF6A3012 AXF6A3412 AXF6A4012 AXF6A4412 AXF6A5012 AXF6A5412 AXF6A6012 AXF6A6412 AXF6A7012 AXF6A8012 AXF6A0012 Inner carton (1-reel) Outer carton 5,000 pieces 10,000 pieces Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Item Rated voltage Specifications 1.5 A/pin contact × 4 pin contacts or 1.25 A/pin contact × 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts) 30V AC/DC Dielectric strength 150V AC for 1 min. Insulation resistance Min. 1,000MΩ (initial) Contact resistance Max. 30mΩ Composite insertion force Composite removal force Contact holding force (Socket contact) Ambient temperature Max. 0.981N/pin contact × pin contacts (initial) Min. 0.165N/pin contact × pin contacts Rated current Electrical characteristics Mechanical characteristics Soldering heat resistance Storage temperature Conditions No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Using 250V DC megger (applied for 1 min.) Based on the contact resistance measurement method specified by JIS C 5402. Measuring the maximum force. As the contact is axially pull out. No icing or condensation. Min. 0.20N/pin contact –55°C to +85°C Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) 300°C within 5 sec. 350°C within 3 sec. –55°C to +85°C (product only) –40°C to +50°C (emboss packing) Infrared reflow soldering Soldering iron No icing or condensation. Conformed to MIL-STD-202F, method 107G Environmental characteristics Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) Lifetime characteristics Unit weight 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 30mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 30mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 30mΩ H2S resistance (header and socket mated) 48 hours, contact resistance max. 30mΩ Insertion and removal life 30 times Order Temperature (°C) 1 –55 −30 2 3 85 +30 4 –55 −30 Time (minutes) 30 Max. 5 30 Max. 5 Conformed to IEC60068-2-78 Bath temperature 40°C±2°C, humidity 90% to 95% R.H. Conformed to IEC60068-2-11 Bath temperature 35°C±2°C, saltwater concentration 5%±1% Bath temperature 40°C±2°C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours 60 pin contact Socket 0.03 g Header 0.02 g –2– ACCTB81E 201602-T High current connectors A35P (0.35mm pitch) 2. Material and surface treatment Part name Molded portion Contact and Post Material LCP resin (UL94V-0) Surface treatment — Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) Copper alloy DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ Socket (Mated height: 0.8 mm) 0.70 (Suction face) CAD Data Terminal coplanarity A 0.77 B±0.1 0.35±0.05 0.08 (Contact and soldering terminals) 2.50 2.20 0.12±0.03 (0.90) 2.50 Y note 1.06 Z note 0.30±0.03 C±0.1 General tolerance: ±0.2 Note: Since the soldering terminals has a single-piece construction, sections Y and Z are electrically connected. Dimension table (mm) Number of pins/ dimension 10 4.10 1.40 3.00 12 16 20 24 30 34 40 44 50 54 60 64 70 80 100 4.45 5.15 5.85 6.55 7.60 8.30 9.35 10.05 11.10 11.80 12.85 13.55 14.60 16.35 19.85 1.75 2.45 3.15 3.85 4.90 5.60 6.65 7.35 8.40 9.10 10.15 10.85 11.90 13.65 17.15 3.35 4.05 4.75 5.45 6.50 7.20 8.25 8.95 10.00 10.70 11.75 12.45 13.50 15.25 18.75 A B C Header (Mated height: 0.8 mm) 0.70 (Suction face) CAD Data Terminal coplanarity 0.65 A B±0.1 0.08 (Post and soldering terminals) 0.35±0.05 0.12±0.03 0.84 0.12±0.03 (0.31) 1.46 Soldering terminals Soldering terminals 1.42 2.00 Dimension table (mm) C±0.1 General tolerance: ±0.2 Number of pins/ dimension 10 A B C 3.40 1.40 2.80 12 16 20 24 30 34 40 44 50 54 60 64 70 80 100 3.75 4.45 5.15 5.85 6.90 7.60 8.65 9.35 10.40 11.10 12.15 12.85 13.90 15.65 19.15 1.75 2.45 3.15 3.85 4.90 5.60 6.65 7.35 8.40 9.10 10.15 10.85 11.90 13.65 17.15 3.15 3.85 4.55 5.25 6.30 7.00 8.05 8.75 9.80 10.50 11.55 12.25 13.30 15.05 18.55 Header 0.80±0.1 • Socket and Header are mated Socket –3– ACCTB81E 201602-T High current connectors A35P (0.35mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) • Specifications for taping (In accordance with JIS C 0806-3:1999. However, not applied to the mounting-hole pitch of some connectors.) (A±0.3) (B) (D±1) Label Top cover tape Embossed carrier tape (2.0) (4.0) (C) (1.75) (2.0) Leading direction after packaging (C) (1.75) 380 dia. Tape II (A +0.3 −0.1 ) (4.0) Tape I • Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) Embossed mounting-hole 8.0 8.0 Taping reel 1. 1. 5 +0 5 +0 0 .1 0 .1 di di a. a. • Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets and headers 0.8mm 10 to 24 30 to 80 100 Tape I Tape I Tape II 16.0 24.0 32.0 — — 28.4 7.5 11.5 14.2 17.4 25.4 33.4 5,000 5,000 5,000 • Connector orientation with respect to embossed tape feeding direction Type Common for A35P Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. –4– ACCTB81E 201602-T High current connectors A35P (0.35mm pitch) NOTES • Header (Mated height: 0.8 mm) 2.40±0.03 (0.65) 1.10±0.03 0.35±0.03 0.20±0.03 (0.53) 0.60±0.03 Recommended PC board pattern (TOP VIEW) 1.66±0.03  Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas.  Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. 0.45±0.03 0.70±0.03 • Socket (Mated height: 0.8 mm) Recommended metal mask pattern 2.40±0.01 (0.61) 0.18±0.01 1.18±0.01 0.35±0.01 (0.53) 1.66±0.01 0.60±0.01 Metal mask thickness: When 100μm (Terminal opening ratio: 84%) (Metal-part opening ratio: 100%) 1.90±0.03 (0.50) 0.35±0.03 0.20±0.03 0.20±0.03 1.06±0.03 (0.92) 2.90±0.03 Recommended PC board pattern (TOP VIEW) C 30 0. 0.90±0.03 1.35±0.03 : insulation area 0.45±0.01 0.70±0.01 Recommended metal mask pattern 2.90±0.01 (0.47) 0.18±0.01 Please refer to the latest product specifications when designing your product. 1.96±0.01 0.35±0.01 (0.49) 1.92±0.01 2.90±0.01 Metal mask thickness: When 100μm (Terminal opening ratio: 85%) (Metal-part opening ratio: 50%) C 30 0. 0.90±0.01 1.35±0.01 –5– ACCTB81E 201602-T For board-to-board/board-to-FPC Notes on Using Narrow pitch Connectors/ High Current Connectors About safety Remarks 1) Do not use these connectors beyond the specification sheets. The usage outside of specified rated current, dielectric strength, and environmental conditions and so on may cause circuitry damage via abnormal heating, smoke, and fire. 2) In order to avoid accidents, your thorough specification review is appreciated. Please contact us if your usage is out of the specifications. Otherwise, Panasonic Corporation cannot guarantee the quality and reliability. 3) Panasonic Corporation is consistently striving to improve quality and reliability. However, the fact remains that electrical components and devices generally cause failures at a given statistical probability. Furthermore, their durability varies with use environments or use conditions. In this respect, please check for actual electrical components and devices under actual conditions before use. Continued usage in a state of degraded condition may cause the deteriorated insulation, thus result in abnormal heat, smoke or firing. Please carry out safety design and periodic maintenance including redundancy design, design for fire spread prevention, and design for malfunction prevention so that no accidents resulting in injury or death, fire accidents, or social damage will be caused as a result of failure of the products or ending life of the products. Regarding the design of devices and PC board patterns 1) When using the board to board connectors, do not connect a pair of board with multiple connectors. Otherwise, misaligned connector positions may cause mating failure or product breakage. 2) With mounting equipment, there may be up to a ±0.2 to 0.3-mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) PC board Control the thicknesses of the coverlay and adhesive to prevent poor soldering. This connector has no stand-off. Therefore, minimize the thickness of the coverlay, etc. so as to prevent the occurrence of poor soldering. 6) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws Screw Connector Spacer PC board Spacer When connecting PC boards, take appropriate measures to prevent the connector from coming off. 7) When mounting connectors on a FPC board: • When the connector soldered to FPC is mated or unmated, solder detachment may occur by the force to the terminals. Connector handling is recommended in the condition when the reinforcing plate is attached to the backside of FPC where the connector is mounted. The external dimension of the reinforcing plate is recommended to be larger than the dimension of “PC board recommended process pattern” (extended dimension of one side is approximately 0.5 to 1.0 mm). The materials and thickness of the reinforcing plate are glass epoxy or polyimide (thickness 0.2 - 0.3 mm) or SUS (thickness 0.1 - 0.2 mm). • As this connector has temporary locking structure, the connector mating may be separated by the dropping impact depend on the size, weight or bending force of the FPC. Please consider the measures at usage to prevent the mating separation. 8) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the chucking force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. –1– 6) In case of dry condition, please note the occurrence of static electricity. The product may be adhered to the embossed carrier tape or the cover tape in dry condition. Recommended humidity is from 40%RH to 60%RH and please remove static electricity by ionizer in manufacturing process. ACCTB48E 201606-T Notes on Using Narrow pitch Connectors/High Current Connectors Regarding soldering Terminal Paste solder PC board foot pattern 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) The condition of solder or flux rise and wettability varies depending on the type of solder and flux. Solder and flux characteristics should be taken into consideration and also set the reflow temperature and oxygen level. 7) Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed. 8) Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact us before using a temperature profile other than that described below (e.g. lead-free solder). 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. Apply the solder wire here Upper limited (Solder heat resistance) Lower limited (Solder wettability) Terminal Temperature Peak temperature 260°C 230°C 180°C 150°C So ld iro erin n g ■ Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (Please refer to the specification for detail because the temperature setting differs by products.) 2) As for cream solder printing, screen printing is recommended. 3) When setting the screen opening area and PC board foot pattern area, refer the recommended PC board pattern and window size of metal mask on the specification sheet, and make sure that the size of board pattern and metal mask at the base of the terminals are not increased. 4) Please pay attentions not to provide too much solder. It makes miss mating because of interference at soldering portion when mating. Small angle as possible up to 45 degrees Peak temperature Preheating 220°C 200°C PC board 25 sec. 60 to 120 sec. 70 sec. Time For products other than the ones above, please refer to the latest product specifications. 9) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector before mounting. 10) Consult us when using a screenprinting thickness other than that recommended. ■ Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. Table A Product name Soldering iron temperature SMD type connectors 300°C within 5 sec. 350°C within 3 sec. Pattern 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) These connector is low profile type. If too much solder is supplied for hand soldering, It makes miss mating because of interference at soldering portion. Please pay attentions. ■ Solder reworking 1) Finish reworking in one operation. 2) In case of soldering rework of bridges. Don’t use supplementary solder flux. Doing so may cause contact problems by flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. Handling Single Components 1) Make sure not to drop or allow parts to fall from work bench. 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. Precautions for mating This product is designed with ease of handling. However, in order to prevent the deformation or damage of contacts and molding, take care and do not mate the connectors as shown right. Press-fitting while the mating inlets of the socket and header are not matched. Strongly pressed and twisted Tilted mating –2– ACCTB48E 201606-T Notes on Using Narrow pitch Connectors/High Current Connectors Cleaning flux from PC board There is no need to clean this product. If cleaning it, pay attention to the following points to prevent the negative effect to the product. 1) Keep the cleaning solvent clean and prevent the connector contacts from contamination. 2) Some cleaning solvents are strong and they may dissolve the molded part and characters, so pure water passed liquid solvent is recommended. Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components alreeady set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Product failures due to condensation are not covered by warranty. Other Notes 1) Do not remove or insert the electrified connector (in the state of carrying current or applying voltage). 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50piece units in the condition given right. Consult a sale representative for ordering sample units. Please refer to the latest product specifications when designing your product. Condition when delivered from manufacturing Reel Embossed tape amount required for the mounting Required number of products for sample production (Delivery can also be made on a reel by customer request.) (Unit 50 pcs.) –3– ACCTB48E 201606-T