AXT850124

Automation Controls Catalog To Be Discontinued Last time buy:September 30, 2014 For board-to-FPC F35S Series Narrow pitch connectors (0.35mm pitch) FEATURES 1. Space-saving (0.35 mm pitch) When mated, the footprint is reduced by approx. 12% from F4S series (40 pin contacts). Suction face 0.8mm m 6m 2. m 4m 3. Socket Header 3.4 F4 RoHS compliant S 3 mm .6 mm 2. Strong resistance to adverse environments! Utilizes “ ” construction for high contact reliability. Ni barrier construction Bellows contact construction (Against solder rise!) (Against dropping!) ts) s) tac act on ont c c pin pin (40 (40 m m m m 5 9.3 0.50 Socket S1 F4 Porosity treatment (Against corrosive gases!) Soldering terminals at each corner V notch and Double contact constructions (Against foreign particles and flux!) Suction face 0.8mm 2.6 mm 3. Soldering terminals at each corner enhance mounting strength. 4. Simple lock structure provides tactile feedback to ensure excellent mating/unmating operation feel. 5. Gull-wing-shaped terminals to facilitate visual inspections. ) cts ts) nta ntac o c co pin in (40 (40 p m 2 m mm 8.6 9.80 Header S 4 F Soldering terminals at each corner APPLICATIONS Ideal for board-to-FPC connections in mobile equipment that requires size and thickness reduction and functionality enhancement. ORDERING INFORMATION AXT 1 2 4 7: Narrow Pitch Connector F35S (0.35 mm pitch) Socket 8: Narrow Pitch Connector F35S (0.35 mm pitch) Header Number of pins (2 digits) Mated height / 1: For mated height 1.0 mm Functions 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) 4: Base: Ni plating, Surface: Au plating (for Ni barrier available) 4: Base: Ni plating, Surface: Au plating 2013.09 industrial.panasonic.com/ac/e/ –1– © Panasonic Corporation 2013 ACCTB27E 201309-T To Be Discontinued Last time buy:September 30, 2014 AXT7, 8 PRODUCT TYPES Mated height Number of pins 1.0mm 40 50 60 70 80 Part number Socket AXT740124 AXT750124 AXT760124 AXT770124 AXT780124 Packing Header AXT840124 AXT850124 AXT860124 AXT870124 AXT880124 Inner carton Outer carton 3,000 pieces 6,000 pieces Notes: 1. Order unit: For volume production: 1-inner-box (1-reel) units Samples for mounting check: 50-connector units. Please contact our sales office. 2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office. 3. Please contact us for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Specifications 0.25A/pin contact (Max. 4 A at total pin contacts) 60V AC/DC Breakdown voltage 150V AC for 1 min. Insulation resistance Min. 1,000MΩ (initial) Contact resistance Max. 100mΩ Composite insertion force Composite removal force Contact holding force (Socket contact) Ambient temperature Max. 0.981N/pin contacts × pin contacts (initial) Min. 0.165N/pin contacts × pin contacts Soldering heat resistance Storage temperature Conditions No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Using 250V DC megger (applied for 1 min.) Based on the contact resistance measurement method specified by JIS C 5402. Measuring the maximum force. As the contact is axially pull out. No freezing at low temperatures. No dew condensation. Min. 0.49N/pin contacts –55°C to +85°C Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) 300°C within 5 sec. 350°C within 3 sec. –55°C to +85°C (product only) –40°C to +50°C (emboss packing) Infrared reflow soldering Soldering iron No freezing at low temperatures. No dew condensation. Conformed to MIL-STD-202F, method 107G Environmental characteristics Thermal shock resistance (header and socket mated) H2S resistance (header and socket mated) 120 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 48 hours, contact resistance max. 100mΩ Insertion and removal life 50 times Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) Lifetime characteristics Unit weight Order Temperature (°C) 1 –55 −30 2 3 85 +30 4 –55 −30 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 100mΩ Time (minutes) 30 Max. 5 30 Max. 5 Bath temperature 40±2°C, humidity 90 to 95% R.H. Bath temperature 35±2°C, saltwater concentration 5±1% Bath temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours 40 pin contact type: Socket: 0.04 g Header: 0.02 g 2. Material and surface treatment Part name Molded portion Contact and Post Material LCP resin (UL94V-0) Copper alloy Surface treatment — Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) Panasonic Corporation Automation Controls Buisiness Division industrial.panasonic.com/ac/e/ –2– © Panasonic Corporation 2013 ACCTB27E 201309-T To Be Discontinued Last time buy:September 30, 2014 AXT7, 8 DIMENSIONS (Unit: mm) Socket (Mated height: 1.0 mm) 0.80 (Suction face) A B±0.1 Terminal coplanarity 0.35±0.05 0.97 0.08 0.12±0.03 3.40 3.00 (Contact and soldering terminals) C0.15 Dimension table (mm) 2.00 3.40 Y note Number of pins/ dimension 40 9.35 6.65 8.25 50 60 70 80 11.10 12.85 14.60 16.35 8.40 10.15 11.90 13.65 10.00 11.75 13.50 15.25 B C 0.30±0.03 C±0.1 0.35 (0.70) Z note General tolerance: ±0.2 A B C Note: Since the soldering terminals are built into the body, the sections Y and Z are electrically connected. Header (Mated height: 1.0 mm) 0.80 (Suction face) A B±0.1 Terminal coplanarity 0.35±0.05 0.83 0.08 0. 15 0.12±0.03 C 0. 13 1.86 2.60 R (Post and soldering terminals) C 13 0. C±0.1 Dimension table (mm) 1.90 Soldering terminals 0.12±0.03 (0.48) 0.94 Soldering terminals Number of pins/ dimension 40 8.62 6.65 8.05 50 60 70 80 10.37 12.12 13.87 15.62 8.40 10.15 11.90 13.65 9.80 11.55 13.30 15.05 General tolerance: ±0.2 A Header Socket 1.00±0.15 • Socket and Header are mated Panasonic Corporation Automation Controls Buisiness Division industrial.panasonic.com/ac/e/ –3– © Panasonic Corporation 2013 ACCTB27E 201309-T To Be Discontinued Last time buy:September 30, 2014 AXT7, 8 EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common to all sockets and headers) • Specifications for taping (In accordance with JIS C 0806-1990. However, not applied to the mounting-hole pitch of some connectors.) Tape I Tape II (A±0.3) (A±0.3) (B) Label Embossed carrier tape (2.0) 380 dia. (4.0) Top cover tape Embossed mounting-hole 8.0 Taping reel .1 +0 0 .1 +0 0 5 1. Leading direction after packaging (4.0) (2.0) 8.0 (D±1) (C) (1.75) 5 1. Leading direction after packaging (C) (1.75) • Specifications for the plastic reel (In accordance with EIAJET-7200B.) a. di a. di • Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets and headers: 1.0mm 40 to 70 80 Tape I Tape II 24.0 32.0 — 28.4 11.5 14.2 25.4 33.4 3,000 3,000 • Connector orientation with respect to embossed tape feeding direction Type Common for F35S Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. NOTES (0.75) 1.70±0.03 3.20±0.03 0.45±0.03 : Insulatin area 0.70±0.03 0.80±0.03 0.20±0.03 1.00 or less 0.35±0.03 (0.655) 2.06±0.03 (0.72) (1.00) 3.80±0.03 1.80±0.03 0.20±0.03 0.75±0.03 Recommended PC board pattern (TOP VIEW) 0.35±0.03 0.60 or less • Header (Mated height: 1.0 mm) Recommended PC board pattern (TOP VIEW) 2.36±0.03 • Socket (Mated height: 1.0 mm) : Insulation area (0.50) 0.18±0.01 2.00±0.01 (0.655) 0.35±0.01 3.00±0.01 3.60±0.01 0.18±0.01 0.75±0.01 (0.52) (1.00) 0.35±0.01 2.06±0.01 Metal mask thickness: When 120µm (Terminal opening ratio: 60%) (Metal-part opening ratio: 100%) 2.56±0.01 Recommended metal mask opening pattern Metal mask thickness: When 120µm (Terminal opening ratio: 65%) (Metal-part opening ratio: 100%) 1.80±0.01 Recommended metal mask opening pattern 3.80±0.01 1. Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. 2. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. 0.45±0.01 0.70±0.01 0.70±0.01 0.80±0.01 Please refer to the latest product specifications when designing your product. Panasonic Corporation Automation Controls Buisiness Division industrial.panasonic.com/ac/e/ –4– © Panasonic Corporation 2013 ACCTB27E 201309-T Notes on Using Narrow pitch Connectors Notes on Using Narrow pitch Connectors Regarding the design of devices and PC board patterns 1) When connecting several connectors together by stacking, make sure to maintain proper accuracy in the design of structure and mounting equipment so that the connectors are not subjected to twisting and torsional forces. 2) With mounting equipment, there may be up to a ±0.2 to 0.3-mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws Screw Connector Spacer PC board Spacer When connecting PC boards, take appropriate measures to prevent the connector from coming off. 6) Notes when using a FPC. (1) When the connector is soldered to an FPC board, during its insertion and removal procedures, forces may be applied to the terminals and cause the soldering to come off. It is recommended to use a reinforcement board on the backside of the FPC board to which the connector is being connected. Please make the reinforcement board dimensions bigger than the outer limits of the recommended PC board pattern (should be approximately 1 mm greater than the outer limit). Material should be glass epoxy or polyimide, and the thickness should be between 0.2 and 0.3 mm. (2) Collisions, impacts, or turning of FPC boards, may apply forces on the connector and cause it to come loose. Therefore, make to design retaining plates or screws that will fix the connector in place. 7) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the catching force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. Panasonic Corporation Automation Controls Buisiness Division industrial.panasonic.com/ac/e/ –5– 6) Excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied. © Panasonic Corporation 2013 ACCTB48E 201303-T Notes on Using Narrow pitch Connectors Regarding soldering Terminal Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact us before using a temperature profile other than that described below (e.g. lead-free solder). • Narrow pitch connectors (except P8 type) Temperature Peak temperature 25 sec. 60 to 120 sec. • Narrow pitch connector (P8) Soldering iron temperature 300°C within 5 sec. 350°C within 3 sec. Apply the solder wire here Peak temperature 245°C max. 200°C Preheating Terminal 60 to 120 sec. Small angle as possible up to 45 degrees Within 30 sec. Time For products other than the ones above, please refer to the latest product specifications. 7) The temperatures are measured at the surface of the PC board near the connector terminals. (The setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 8) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector beforehand and then begin mounting. 9) Consult us when using a screenprinting thickness other than that recommended. 10) Some solder and flux types may cause serious solder or flux creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions. Panasonic Corporation Automation Controls Buisiness Division industrial.panasonic.com/ac/e/ Product name SMD type connectors Temperature Paste solder 4) Consult us when using a screenprinting thickness other than that recommended. 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) N2 reflow, conducting reflow soldering in a nitrogen atmosphere, increases the solder flow too greatly, enabling wicking to occur. Make sure that the solder feed rate and temperature profile are appropriate. 70 sec. Time 155 to 165°C PC board foot pattern 220°C 200°C Preheating 180°C 150°C Table A 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. Upper limited (Solder heat resistance) Lower limited (Solder wettability) Peak temperature 260°C 230°C 2. Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. So ld iro erin n g 1. Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (The setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 2) As for cream solder printing, screen printing is recommended. 3) To determine the relationship between the screen opening area and the PCboard foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks. Make sure to use the terminal tip as a reference position when setting. Avoid an excessive amount of solder from being applied, otherwise, interference by the solder will cause an imperfect contact. –6– PC board Pattern 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) For soldering of prototype devices during product development, you can perform soldering at the necessary locations by heating with a hot-air gun by applying cream solder to the foot pattern beforehand. However, at this time, make sure that the air pressure does not move connectors by carefully holding them down with tweezers or other similar tool. Also, be careful not to go too close to the connectors and melt any of the molded components. 8) If an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. 3. Solder reworking 1) Finish reworking in one operation. 2) For reworking of the solder bridge, use a soldering iron with a flat tip. To prevent flux from climbing up to the contact surfaces, do not add more flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. © Panasonic Corporation 2013 ACCTB48E 201303-T Notes on Using Narrow pitch Connectors Handling Single Components 1) Make sure not to drop or allow parts to fall from work bench 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Repeated bending of the terminals may cause terminals to break. 4) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. 5) Excessive prying-force applied to one end may cause product breakage and separation of the solder joints at the terminal. Excessive force applied for insertion in a pivot action as shown may also cause product breakage. Align the header and socket positions before connecting them. Cleaning flux from PC board 3) Since some powerful cleaning solutions may dissolve molded components of the connector and wipe off or discolor printed letters, we recommend aqua pura electronic parts cleaners. Please consult us if you wish to use other types of cleaning fluids. 4) Please note that the surfaces of molded parts may whiten when cleaned with alcohol. Handling the PC board Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components alreeady set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Be sure not to allow external pressure to act on connectors when assembling PCBs or moving in block assemblies. 1) To increase the cleanliness of the cleaning fluid and cleaning operations, prepare equipment for cleaning process beginning with boil cleaning, ultrasonic cleaning, and then vapor cleaning. 2) Carefully oversee the cleanliness of the cleaning fluids to make sure that the contact surfaces do not become dirty from the cleaning fluid itself. • Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. When storing the connectors for more than six months, be sure to consider storage area where the humidity is properly controlled. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Other Notes 1) These products are made for the design of compact and lightweight devices and therefore the thickness of the molded components has been made very thin. Therefore, be careful during insertion and removal operations for excessive forces applied may damage the products. 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. Panasonic Corporation Automation Controls Buisiness Division industrial.panasonic.com/ac/e/ –7– © Panasonic Corporation 2013 ACCTB48E 201303-T Notes on Using Narrow pitch Connectors Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50piece units in the condition given right. Consult a sale representative for ordering sample units. Please refer to the latest product specifications when designing your product. Condition when delivered from manufacturing Reel Embossed tape amount required for the mounting Required number of products for sample production (Delivery can also be made on a reel by customer request.) (Unit 50 pcs.) Panasonic Corporation Automation Controls Buisiness Division industrial.panasonic.com/ac/e/ –8– © Panasonic Corporation 2013 ACCTB48E 201303-T