AYF311515

AYF31 For FPC FPC connectors (0.3mm pitch) Front lock with FPC tabs Y3FT Series FEATURES 1. Low-profile, space-saving design (pitch: 0.3mm) The 0.9mm height, 3.0mm depth contributes to the miniaturization and thickness reduction of target products. * The total depth including the lever is 3.2mm. 3. Soldering terminals for higher mounting strength 4. Easy-to-handle front lock structure 5. Wiring patterns can be placed underneath the connector. 6. Ni barrier with high resistance to solder creep APPLICATIONS .35 (51 pin 0.9 17 co nta cts Mobile devices, such as cellular phones, smartphones, digital still cameras and digital video cameras. 3.0 ) Unit: mm 2. FPC with tabs ensures high reliability through secure connectibility Thanks to a design in which the FPC tab portion attaches to the protruding resin part, depth is reduced making the product more compact. Also makes it possible to securely position the FPC during insertion and prevent diagonal insertion. (Y3F is compatible with FPC without tabs.) FPC tabs to prevent diagonal insertion and ensure reliable holding Soldering terminals resistant to twisting RoHS compliant ORDERING INFORMATION AYF 3 1 1 5 31: FPC Connector 0.3 mm pitch (Front lock, ZIF type with FPC tabs) Number of pins (2 digits) Contact direction 1: Bottom contact Surface treatment (Contact portion / Terminal portion) 5: Au plating/Au flash plating (Ni barrier) ACCTB9E 201204-T Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ AYF31 PRODUCT TYPES Height Number of pins Part number 0.9 mm 11 13 15 17 23 25 27 29 31 33 35 39 41 45 51 AYF311115 AYF311315 AYF311515 AYF311715 AYF312315 AYF312515 AYF312715 AYF312915 AYF313115 AYF313315 AYF313515 AYF313915 AYF314115 AYF314515 AYF315115 Packing Inner carton Outer carton 5,000 pieces 10,000 pieces Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units Samples for mounting check: 50-connector units. Please contact our sales office. 2. Please contact our sales office for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Insulation resistance Specifications 0.2A/pin contact 50V AC/DC Min. 1,000MΩ (initial) Breakdown voltage 150V AC for 1 min. Contact resistance Max. 80mΩ FPC holding force Min. 0.23N/pin contacts × pin contacts (initial) Ambient temperature –55°C to +85°C –55°C to +85°C (product only) –40°C to +50°C (emboss packing) Storage temperature Conditions Using 250V DC megger (applied for 1 min.) No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Based on the contact resistance measurement method specified by JIS C 5402. Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed No freezing at low temperatures. No dew condensation. Conformed to MIL-STD-202F, method 107G Thermal shock resistance (with FPC inserted) Order Temperature (°C) 1 –55 −30 2 3 85 +30 4 –55 −30 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 80mΩ Environmental characteristics Humidity resistance (with FPC inserted) Saltwater spray resistance (with FPC inserted) H2S resistance (with FPC inserted) Soldering heat resistance Lifetime characteristics Unit weight Insertion and removal life 120 hours, insulation resistance min. 100MΩ, contact resistance max. 80mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 80mΩ 48 hours, contact resistance max. 80mΩ Peak temperature: 260°C or less 300°C within 5 sec. 350°C within 3 sec. 30 times Time (minutes) 30 Max. 5 30 Max. 5 Bath temperature 40±2°C, humidity 90 to 95% R.H. Bath temperature 35±2°C, saltwater concentration 5±1% Bath temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Reflow soldering Soldering iron Repeated insertion and removal: min. 10 sec./time 51 pin contact type: 0.09 g 2. Material and surface treatment Part name Molded portion Material Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0) Contact Copper alloy Soldering terminals portion Copper alloy Panasonic Corporation Automation Controls Business Unit Surface treatment — Contact portion; Base: Ni plating, Surface: Au plating Terminal portion; Base: Ni plating, Surface: Au plating Base: Ni plating, Surface: Au plating industrial.panasonic.com/ac/e/ ACCTB9E 201204-T AYF31 DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data A 0.60±0.10 (Terminal pitch) °) (140 (1.50) CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ 0.30±0.10 (Terminal pitch) 0.60±0.10 (Terminal pitch) 3.20 Terminal coplanarity 0.20 5.35 2.40 3.00 4.40 13 15 17 23 25 27 29 31 33 35 39 41 45 51 5.95 6.55 7.15 8.95 9.55 10.15 10.75 11.35 11.95 12.55 13.75 14.35 15.55 17.35 3.00 3.60 4.20 6.00 6.60 7.20 7.80 8.40 9.00 9.60 10.80 11.40 12.60 14.40 3.60 4.20 4.80 6.60 7.20 7.80 8.40 9.00 9.60 10.20 11.40 12.00 13.20 15.00 5.00 5.60 6.20 8.00 8.60 9.20 9.80 10.40 11.00 11.60 12.80 13.40 14.60 16.40 3.00 A B C D (FPC insertion depth) 0.53 D±0.20 C±0.20 Number of pins/ dimension 11 0.30 (2.07) 0.1 (Contact and soldering terminals) 0.90±0.10 1.12 (Suction area) When the lever is opened (0.15) (0.12) 0.30 (0.12) B±0.20 A B C D RECOMMENDED FPC DIMENSIONS (Finished thickness: t = 0.2±0.03) The conductive parts should be based by Ni plating and then Au plating. 0.48±0.15 1.70±0.15 1.60±0.15 1.50±0.15 1.05±0.15 0.85±0.15 R 0. 10 .25 0.60±0.02 0.60±0.07 0.10 max. 0.20±0.02 0.20±0.02 0.30+0.04 –0.03 (Contact width) D±0.03 Number of pins/ dimension 11 4.10 3.60 3.00 2.40 13 15 17 23 25 27 29 31 33 35 39 41 45 51 4.70 5.30 5.90 7.70 8.30 8.90 9.50 10.10 10.70 11.30 12.50 13.10 14.30 16.10 4.20 4.80 5.40 7.20 7.80 8.40 9.00 9.60 10.20 10.80 12.00 12.60 13.80 15.60 3.60 4.20 4.80 6.60 7.20 7.80 8.40 9.00 9.60 10.20 11.40 12.00 13.20 15.00 3.00 3.60 4.20 6.00 6.60 7.20 7.80 8.40 9.00 9.60 10.80 11.40 12.60 14.40 0.20±0.03 3.50 min. (Reinforcing plate) 20 0. C0 2.20±0.30 (Exposed part of the conductor) 0.30±0.07 R 0.20 max. 0.30±0.07 0.60±0.02 0.30±0.02 0.80±0.10 1.53±0.10 A±0.1 B±0.05 C±0.03 0.30+0.04 –0.03 (Contact width) (0.10) Cutting direction Cut FPC from the copper foil side to the reinforcing plate side. 0.60±0.07 EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact type) • Specifications for taping di 0 0. .1 0 50 + (C±1) Taping reel (2.0) (4.0) Top cover tape Embossed carrier tape 380 dia. (2.0) (4.0) 1. 0 0. .1 0 50 + A±0.30 1. A±0.30 (B) Embossed mounting-hole 8.0 8.0 Leading direction after packaging di a. Tape II a. Tape I • Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (1.75) (B) (1.75) 28.40 • Dimension table (Unit: mm) Number of pins Max. 17 23 to 45 51 ACCTB9E 201204-T Type of taping Tape I Tape I Tape II Panasonic Corporation A 16.0 24.0 32.0 B 7.5 11.5 14.2 Automation Controls Business Unit C 17.4 25.4 33.4 Quantity per reel 5,000 5,000 5,000 industrial.panasonic.com/ac/e/ AYF31 • Connector orientation with respect to embossed tape feeding direction Type Y3FT Direction of tape progress NOTES 1. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.3 mm or 0.5 mm. In order to reduce solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. 0.45±0.03 0.70±0.03 Area of exposed soldering terminal 0.30±0.03 0.60±0.03 Area of exposed soldering terminal 3.20±0.03 0.50±0.03 0.60±0.03 0.30±0.03 0.70±0.03 0.60±0.03 0.40 0.10±0.03 Recommended PC board pattern (mounting layout) (TOP VIEW) 2. Precautions for insertion/removal of FPC To open the lever, hold its center and pull it up. An uneven load applied to the lever on one side may deform and break the lever. Do not apply an excessive load to the lever in the opening direction, otherwise, the terminals may be deformed. Don’t further apply an excessive load to the fully opened lever; otherwise, the lever may be deformed. Fully open the lever to insert an FPC. Since this product connects at the bottom, please insert the FPC so that its electrode plane is facing the board to which it will be mounted. Do not insert the FPC in the reverse direction of the contact section; otherwise, operation failures or malfunctions may be caused. (140°) Recommended metal mask pattern 0.45±0.01 0.70±0.01 2.26±0.01 2.94±0.01 (0.29) 0.60±0.01 0.27±0.01 0.27±0.01 0.60±0.01 (0.39) 0.60±0.01 0.055±0.01 Metal mask thickness: Here, 120µm (Front terminal portion opening area ratio: 50%) (Back terminal portion opening area ratio: 51%) (Soldering terminal portion opening area ratio: 100%) This product has a structure to position an inserted FPC using the FPC tabs. Therefore, insert an FPC at an angle to the board. If the FPC is inserted in the direction parallel to the board, the molded positioning parts block the FPC, leading to incomplete insertion. An FPC inserted at an excessive angle to the board may cause the deformation of metal parts, FPC insertion failures, and FPC circuit breakages. FPC FPC positioning part Insert the FPC to the full depth of the connector without altering the angle. When closing the lever, carefuly use the tip of your finger to push the entire lever or both sides of it. If pressure to the lever is applied unevenly, IE: only the edge, it may deform or break the FPC. Make sure that the lever is closed completely. Not doing so will cause a faulty connection. Avoid applying an excessive load to the top of the lever during or after closing the lever. Otherwise, the terminals may be deformed. Remove the FPC at an angle with the lever fully opened. If the lever is closed, or if the FPC is forcedly pulled into a direction parallel to the board, the molded part may break. After an FPC is inserted, carefully handle it so as not to apply excessive stress to the base of the FPC. Please refer to the latest product specifications when designing your product. Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ ACCTB9E 201204-T Notes on Using FPC Connectors (Common)
PC board design Design the recommended foot pattern in order to secure the mechanical strength in the soldered areas of the terminal.
FPC and equipment design Design the FPC based with recommended dimensions to ensure the required connector performance. When back lock type is used, secure enough space for closing the lever and for open-close operation of the lever. Due to the FPC size, weight, or the reaction force of the routed FPC. Carefully check the equipment design and take required measures to prevent the FPC from being removed due to a fall, vibration, or other impact.
Connector mounting Excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied.
Soldering 1) Manual soldering. • Due to the connector’s compact size, if an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. • Make sure that the soldering iron tip is heated within the temperature and time limits indicated in the specifications. • Flux from the solder wire may adhere to the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any flux before use. • Be aware that a load applied to the connector terminals while soldering may displace the contact. • Thoroughly clean the iron tip. 2) Reflow soldering • Screen-printing is recommended for printing paste solder. • To achieve the appropriate soldering state, make sure that the reflow temperature, PC board foot pattern, window size and thickness of metal mask are recommended condition. • Note that excess solder on the terminals prevents complete insertion of the FPC, and that excess solder on the soldering terminals prevents the lever from rotating. Terminal Paste solder • Consult us when using a screen-printing thickness other than that recommended. • Depending on the size of the connector being used, self alignment may not be possible. Accordingly, carefully position the terminal with the PC board pattern. • The recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile Upper limit (Soldering heat resistance) Lower limit (Solder wettability) Temperature 260°C 230°C 180°C Peak temperature Preheating 220°C 200°C 25 sec. 150°C 60 to 120 sec. 70 sec. Time • The temperature is measured on the surface of the PC board near the connector terminal. • Certain solder and flux types may cause serious solder creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions. • When performing reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector using, for example, an adhesive. (Double reflow soldering on the same side is possible) 3) Reworking on a soldered portion • Finish reworking in one operation. • For reworking of the solder bridge, use a soldering iron with a flat tip. Do not add flux, otherwise the flux may creep to the contact parts. • Use a soldering iron whose tip temperature is within the temperature range specified in the specifications.
Do not drop or handle the connector carelessly. Otherwise, the terminals may become deformed due to excessive force or applied solderability may be during reflow degrade.
Don’t open/close the lever or insert/ remove an FPC until the connector is soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. In addition, do not insert an FPC into the connector before soldering the connector.
When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force.
Other Notes When coating the PC board after soldering the connector (to prevent the deterioration of insulation), perform the coating in such a way so that the coating does not get on the connector. The connectors are not meant to be used for switching. Please refer to the latest product specifications when designing your product. PC board foot pattern ACCTB13E 201204-T Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/